Local atomic and electronic structures of equiatomic liquid alloy KSb from 923 to 1773 K

The local atomic and electronic structures of equiatomic liquid alloy KSb have been investigated using ab initio molecular dynamics simulations. There is a small peak located at about 62° in the covalent SbSb bond-angle distribution function. The height of 62° peak increases with temperature. The further analysis show that this peak attributes to the triangular structures with each Sb atom covalently bonded to the other two in the liquid KSb and their number increases with temperature. Therefore, there exist isolated Sb atoms, covalently bonded Sb dimers, triangles with three covalent SbSb bonds and short covalently bonded Sb chains in the liquid KSb. Upon temperature increasing the covalent Sb chains tend to break into short pieces so that the isolated Sb atoms, covalently bonded Sb dimers and triangles with three covalent SbSb bonds increase in numbers. The obtained total electronic densities of states at different temperatures give a reasonable explanation of the electronic conductivity increasing with temperature.     

Study of elastic moduli of lithium borobismuthate glasses using ultrasonic technique

Ultrasonic studies on x B₂O₃25 Li₂O(75 − x) Bi₂O₃, (0 ≤ x ≤ 75 mol%) glasses have been carried out. The elastic moduli of glasses have been investigated using ultrasonic velocity measurements at 4 MHz. The results revealed an increase of the ultrasonic velocity and Debye temperature with the increase of the B₂O₃ content which was attributed to the increase in the packing density, the local contraction of the network around the Bi and Li cations and the increase of the number of bonds per unit volume. Also, the increase of the elastic moduli with the increase in the B₂O₃ content is affected with the increase in the dissociation energy, the average cross-link density, the increase in the number of bridging oxygen atoms, and the substitution of high bond strength BO with low bond strength BiO. The optical properties such as the refractive index, the energy gap and the optical polarizability were evaluated from the values of the elastic moduli. It was observed that as the bulk modulus increases, the optical energy gap increases and both the refractive index and the optical basicity decrease.     

Point defect formation and annihilation in silica glass by heat-treatment: Role of water and stress

It was discovered that E′ centers were created by heat-treatment when silica glass contains water and has residual stress. Silica glass samples were heat-treated at 1000 °C for various lengths of time in 355 torr (47 000 Pa) water vapor pressure and dry nitrogen gas atmospheres. The electron paramagnetic resonance (EPR) signal of E′ centers increased initially with heat-treatment time in both atmospheres but then decreased afterwards in the wet atmosphere. It is known that water molecules eliminate paramagnetic defects, such as E′ centers and non-bridging oxygen hole centers (NBOHCs) by reacting with these defects in the glass, transforming them to non-paramagnetic species such as Si-OH or Si-H. The present study indicates that water molecules are also capable of initially creating paramagnetic defects in the glass structure by breaking the silica network structure in the presence of stress. The present observation may be relevant to mechanical strength reduction of silica glasses, which is commonly observed in the presence of water and stress.     

Properties and structure of copper ultraphosphate glasses

The structures of xCuO · (1 − x)P₂O₅ glasses (0 ? x ? 0.50) prepared in vacuum sealed silica ampoules were investigated using vibrational spectroscopies. With the addition of CuO, both infrared and Raman spectra indicate a systematic transformation from a three-dimensional ultraphosphate network dominated by Q³ tetrahedra into a chain-like metaphosphate structure dominated by Q² tetrahedra. IR spectra clearly show two distinct Q³ sites with bands at 1378 and 1306 cm⁻¹, assigned to PO bonds on isolated Q³ tetrahedra and PO bonds on tetrahedra that participate in the coordination environments of the Cu-octahedra, respectively. As CuO content increases, the intensity of the PO band associated with the tetrahedra increases to a maximum x ∼ 0.33, then decreases with a concomitant increase of the intensity of the band at 1265 cm⁻¹, due to the asymmetric vibration of the PO₂ groups on Q² tetrahedra. When x > 0.33 the isolated Cu-octahedra begin to share common oxygens to form a sub-network in the phosphate matrix. The effects of glass structure on the glass properties, including density, refractive index, and glass transition temperature, are discussed.     

Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

Fourier Transform Infrared (FTIR) Spectroscopy has long been utilized as an analytical technique for qualitatively determining the presence of various different chemical bonds in gasses, liquids, solids, and on surfaces. Most recently, FTIR has been proven to be extremely useful for understanding the different types of bonding present in low dielectric constant “low-k” organosilicate materials. These low-k materials are predominantly utilized in the nanoelectronics industry as the interlayer dielectric material in advanced Cu interconnect structures. In this article, we utilize FTIR to perform a detailed analysis of the changes in chemical bonding that occur in Plasma Enhanced Chemically Vapor Deposited (PECVD) low-k a-SiC:H thin films. PECVD low-k a-SiC:H materials are equally important in advanced Cu interconnects and are utilized as both etch stop and Cu diffusion barrier layers. We specifically investigate the changes that occur in low-k a-SiC:H films as the dielectric constant and mass density of these films are decreased from > 7 to < 3 and from 2.5 to 1 g/cm³ respectively. We show that decreases in mass density and dielectric constant are accompanied by both an increase in terminal SiH_x and CH_x bonding and a decrease in SiC network bonding. At densities of 1.85 g/cm³, the concentration of terminal SiH_x bonding peaks and subsequent hydrogen incorporation are achieved predominantly via terminal CH₃ groups. Low-k a-SiC:H films with k < 3.5 and density < 1.3 g/cm³ can be achieved via incorporating larger organic phenyl groups but result in non-stoichiometric carbon rich films. Electron beam curing of these lower density a-SiC:H films results in volatilization of the phenyl groups leaving behind nanoporous regions and production of some CCC chain linkages in the network.     

Thermal dissolution of Ag(Cu) in amorphous Ge(Sx Se1 − x)2 system

Thermally induced solid state reaction of Ag(Cu) into thin Ge(S_x Se_1 − x)₂ films with x = 0, 0.1, 0.4 and 1.0 was investigated using a step by step technique in order to design films with exact Ag(Cu) concentrations for applications in integrated IR optical devices. A thin film of Ag(Cu) was deposited on top of the host Ge(S_x Se_1 − x)₂ films followed by annealing in vacuum at constant temperature, which resulted in homogeneous films of good optical quality. The variation in Ag(Cu) concentration in the films ranged between 5 and 35 at.%. The kinetics of the diffusion and dissolution of metal in the host films was measured by optically monitoring the change in thickness of doped chalcogenide during consecutive thermal annealing steps. The kinetics studies revealed that the thermal dissolution rate of the Cu is greater than that of Ag. Optical UV-VIS transmission spectra of chalcogenide glass layers, undoped and thermal doped by Ag(Cu), were measured to establish the optical properties of the films. The spectra were analyzed using the technique proposed by Swanepoel and the results show that the addition of metal increases the absorption coefficient in the power-law regime and consequently the optical gap decreases and the refractive index increases. The amorphous character of the films was checked by X-ray diffraction which confirmed the amorphous structure of all Ag(Cu)GeSSe thin films.     

Consolidation mechanism of materials obtained from sodium silicate solution and silica-based aggregates

A study based on the use of sodium silicate gels as binder for cold consolidation of silica-based aggregates has been investigated. The gels used as precursor of binder were synthesized by adding hydrochloric acid to a concentrated sodium silicate solution. Consolidated materials were obtained by mixing the previous solution before gelation with granular materials (fine silica powder and sand). The study of the gel-silica-sand ternary system shows that the existence domain of materials depends on the sand size distribution. The microstructure of gel-silica-sand ternary samples reveals the presence of the three components with a partial attack of grain surface. This was confirmed by FTIR experiments during the monitoring of the synthesis. Actually, the ν_asSiOSi broad band resulting from the average of the contribution of the set of Q⁴, Q³ and Q² units with a sharp peak located around 1078 cm^− 1, firstly shifts to lower wavenumber until 21 days and then to higher wavenumber characteristic of dissolution/precipitation reactions. On the other hand, the consolidation of the material is strong when the amount of fine silica in the material is high leading to efficient mechanical properties. Therefore, consolidation could be explained by the dissolution of small particles of silica and their precipitation into the grain boundary of sand.     

Influence of the deposition parameters on the microstructure and opto-electrical properties of hydrogenated nanocrystalline silicon films by HW-CVD

Hydrogenated nanocrystalline silicon (nc-Si:H) films were prepared at high deposition rates (> 13 Å/s) from pure silane without hydrogen dilution by hot wire deposition method by varying filament-to-substrate distance (d_s-f). In this study we have systematically and carefully investigated the effect of filament-to-substrate distance on structural, optical and electrical properties of the Si:H films. A variety of characterization techniques, including Raman spectroscopy, low angle X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, Atomic Force Microscopy (AFM), Field Emission Scanning Electron Microscopy (FE-SEM), UV-Visible-NIR spectroscopy and electrical dark and photoconductivity measurement were used to characterize these films. Films deposited at d_s-f > 5 cm are amorphous while those deposited at d_s-f < 5 cm are biphasic; a crystalline phase and an amorphous phase with nano-sized crystallites embedded in it. Low angle X-ray diffraction analysis showed that the crystallites in the films have preferential orientation along (111) directions. Decrease in d_s-f, the crystallinity and crystalline size increases whereas hydrogen bonding shifts from mono-hydride (SiH) to di-hydride (SiH₂) and poly-hydride (SiH₂)_n complexes. The band gaps of nc-Si:H films (~ 1.9-2.0 eV) are high compared to the a-Si:H films, while hydrogen content remains < 10 at.%. We attribute the high band gap to the quantum size effect. A correlation between electrical and structural properties has been established. Finally, from the present study it has been concluded that the filament-to-substrate distance is a key process parameter to induce the crystallinity in the films by hot wire method. The ease of depositing films with variable crystallite size and its volume fraction, and tunable band gap is useful for fabrication of tandem/micro-morph solar cells.     

First principles study of oxygen-deficient centers in pure and Ge-doped silica

Using ab initio calculations on 108 atoms pure- and Ge-doped (2.8 mol%) silica-based supercells, we performed a statistical study on the electronic structure and energetic contribution of neutral oxygen vacancies, also named Oxygen Deficient Centers (ODCs). All the 72 oxygen sites in the amorphous silica (a-SiO₂) cell were considered as possible candidates for the formation of the vacancies leading to study 72 different Si-ODCs (SiSi bond) and 144 Ge-ODCs (GeSi bond). The distributions of structural parameters and formation energies of the ODCs were evaluated through Density Functional Theory calculations. The obtained parameters showed a wide distribution that can be mainly associated with the differences in the local environments surrounding the point defects. We show that the formation energies of Si and Ge-ODCs generated from the same oxygen site of our supercell are correlated. Moreover, the local asymmetry around the SiGe or GeSi bond can also affect their formation energies, providing a strong evidence for the influence of short-range environment on the ODC generation efficiency.     

Chemical bonding and optical properties of germanium–carbon alloy films prepared by magnetron co-sputtering as a function of substrate temperature

Amorphous non-hydrogenated germanium carbide (a-Ge_{1 − x}C_x) films have been prepared by magnetron co-sputtering system designed by ourselves. The chemical bonding and microstructure have been analyzed using X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy (FTIR) and Raman spectroscopy. The optical properties of the films have been investigated by means of spectroscopic ellipsometry. The relationship between the chemical bonding and the optical properties has been explored. It has been found that all films with the constant carbon content are amorphous. The sp² CC and sp³ GeC bonds increase with T_s, and some sp² CC bonds gain infrared activity. The fraction of sp³ GeC bonds rises with T_s, but the fraction of sp³ GeGe bonds gradually drops down. In addition, the refractive index and extinction coefficient increase with T_s. The film optical gap is seen to reach 1.15 eV when T_s is 200 °C. However, the optical properties of a-Ge_{1 − x}C_x films almost remain stable with the substrate temperature.     

Growth and characterization of pendeo-epitaxial GaN on 4H–SiC substrates

Growth on AlN/4H–SiC substrates of coalesced, non-polar GaN films having volumes of material with reduced densities of dislocations and stacking faults has been achieved from etched stripes via the statistical and experimental determination of the effect of temperature and V/III ratio on the lateral and vertical growth rates of the GaN{0 0 0 1} faces combined with pendeo-epitaxy. AFM of the uncoalesced GaN(0 0 0 1) and GaN vertical faces revealed growth steps with some steps terminating at dislocations on the former and a pitted surface without growth steps, indicative of decomposition, on the latter. Coalescence was achieved via (a) a two-step route and the parameters of (1) and V/III=1323 for 40 min and (2) 1020 °C and V/III=660 for 40 min and (b) a one-step route that employed and a V/III ratio=660 for 6 h. The densities of dislocations in the GaN grown vertically over and laterally from the stripes were 4×10¹⁰ cm⁻² and 2×10⁸ cm⁻², respectively; the densities of stacking fault in these volumes were 1×10⁶ cm⁻¹ and 2×10⁴ cm⁻¹, respectively. The defects in the wing material were observed primarily at the bottom of the film where lateral growth of the GaN occurred from the AlN and the SiC. Plan view AFM also revealed different microstructures and a reduction in the RMS roughness values from 1.2 to 0.95 nm in these respective regions.     

Surface smoothing of sputter deposited amorphous CNx films by silicon addition

Amorphous carbon nitride (CN_x) films with silicon addition up to 16 at.% are sputter deposited on Si(1 0 0) substrate, and the surface morphology is studied with scaling method based on atomic force microscopy. The surface roughness σ, the roughness exponent α, and the lateral correlation length ξ decrease with silicon content of the films, reaching 0.33 nm, 0.80 and 50 nm, respectively, for the film with [Si] = 16 at.%. The addition of silicon in the films leads to additional Si-N, Si-C-N and CN bonds revealed by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The films undergo a structural transition from columnar to smooth morphology in cross-section with silicon addition demonstrated by field emission scanning electron microscopy. Nano-sized clusters sparsely dispersed in amorphous matrix of the film with [Si] = 16 at.% are observed by high-resolution transmission microscopy. According to the surface growth mechanism in which surface diffusion and geometrical shadowing drive structural and morphological evolution of the sputter deposited films, surface smoothing of the amorphous CN_x films by silicon addition is explained by the formation of Si-N and Si-C-N bonds that impede surface diffusion of the adsorbed species during film growth, which leads to the reduced size of the columnar structures.