恒压下Bi2223/Ag带材失超规律研究

高温超导材料的实际应用中其装置两端的电压保持恒定,而现有的研究都是建立在恒流的基础上。基于此,通过建立恒压下Bi2223/Ag高温超导带材的一维失超传播模型,用数值模拟方法研究了Bi2223/Ag高温超导带在恒压作用下的失超传播行为。通过计算给出了Bi2223/Ag带材在恒压下的最小失超能(MQE)、失超传播速度(NZPV)及其变化规律,同时对恒流和恒压两种条件下的失超行为进行了对比,发现恒压下的最小失超能明显小于恒流下的最小失超能,同时恒压下的失超传播比恒流更慢。     

基于LabVIEW平台的YBCO超导带材失超传播特性测试系统

基于LabVIEW软件平台,搭建了高温超导带材失超传播特性测试系统。在77K、自场环境下,能够通过上位机控制超导电源,并通过4个PT100铂电阻温度计、TM208温度监视器和keithly2000数字电压表测量YBCO超导带材失超以后的电压和温度数据。系统通过虚拟仪器软件架构(VISA)完成数据采集后,绘制出沿带材样品纵方向的电压和温度变化曲线,计算出YBCO带材的失超传播速度、最小触发能等参数,实验结果与一维热流方程模型计算结果一致。所设计的测试系统可操作性高,自动化程度高,人机交互界面友好,为超导带材失超传播特性的研究提供了方便可靠的具体实验方案。     

双根堆叠YBCO超导带材缺陷状态下失超传播规律研究

因双根并绕堆叠结构的YBCO带材能够进一步增加设备承载电流密度,被广泛应用于大型超导设备线圈绕制中.本文研究了外层有包绕绝缘的双根并绕堆叠YBCO带材有缺陷情况下的失超传播特性,应用有限元法方法,建立了双根YBCO带材堆叠状态下失超仿真模型,研究了存在不同缺陷的情况下双根堆叠超导带材的失超传播特性,探索了堆叠带材在不同工作电流下传播速度(NZPV)等参数的变化趋势,同时探究了不同铜稳定层厚度下并绕堆叠带材失超传播规律.结果表明缺陷区域面积增加以及铜稳定层厚度减小,都将导致双根并绕堆叠结构的二代高温超导带材失超传播速度增加,在带材上的温升增加,增加失超的风险.研究结果可以为超导设备安全稳定运行参数设置提供支持.     

液氮浸泡式高性能ReBCO超导带材失超传播特性研究

高性能高温超导带材在大型超导磁体装置上的应用已成为一种趋势,由于存在失超传播速度缓慢、失超检测信号微弱等不足,对失超保护设计提出很大挑战。本文基于液氮浸泡式双保护层的高性能ReBCO带材失超传播特性,采用一维热平衡方程建立失超传播速度的数学模型,通过增加失超源,检测热点温度与电压信号,探究液氮浴环境下的ReBCO带材在传输电流等不同参数下失超传播速度和最小失超能量的变化规律。结果显示:相同条件下,高温超导带材的失超传播速度与传输电流成正相关,最小失超能量与传输电流成负相关,且相比无保护层的普通高温超导带材,具有双保护层的高性能ReBCO临界电流和触发裕度均有提升。     

Bi2223/Ag超导带材的超低频交流损耗

鉴于银包套的铋系高温超导带材作为电工商品化材料的前景己十分看好，我们利用直流电输运的四引线（DCE）和交流磁化率（ACS）两种方法从实验和理论上研究了银包套的铋系高温超导带材Bi2223/Ag的超低频和低频交流损耗（Q）及数值模拟，测量频率范围从0.001到200Hz。在超低频和低频范围内，也就是低的磁场和电流扫描速度时，两种方法的结果相一致，Q随频率增加，但是在较高一点的频率下ACS方法测量到Q随频率增加而关小。然而，DCE方法却发现Q随电流扫描速度增加而单调地增加。数值模拟研究的结果证明，上述两种实验方法所得到的结果可以用巨磁通蠕动理论予以解释，我们的研究结果说明了电输运方法和磁测量方法各有一定的特征。     

几种Bi-2223/Ag超导带材层状复合结构的制备及性能研究

本文利用Bi-2223/Ag高温超导带材与抗拉强度σb为700MPa的铜带进行组合,带材宽度面间采用低熔点的Sn-Ag-Cu无铅焊料进行连接,制备了C-SC-C型、SC-C-SC型(C代表铜带,SC代表高温超导带)等四种层状复合结构.研究和考察了四种结构样品在室温下的拉伸性能和弯曲性能,以及电性能等.测试结果表明:与高温超导带材相比,复合后结构的拉伸性能得到了提高;复合结构中采用两根高温超导带材后,提高了传输电流的能力.研究结果为Bi-2223/Ag高温超导带材的实际应用以及新应用结构的设计提供了参考数据和实验依据.     

力学性能对Bi-2223/Ag超导带材临界电流影响实验研究

本文主要研究了在77K温度下,拉伸应变和弯曲应变对Bi-2223/Ag超导带材临界电流的影响,得到了超导带材的临界电流随拉伸强度、曲率半径变化规律.实验结果显明,拉伸作用在超导带材上产生的形变对其临界电流(Ic)的影响存在一个临界值εirr=0.3%.形变小于此临界值,Ic变化较小,超过此临界值,临界电流急剧下降.弯曲实验同样存在类似关系.同步辐射光源对超导带材检测表明,在形变情况下,超导氧化物陶瓷芯的微裂纹迅速增加和交织是Ic降低的主要原因.     

准绝热环境下Bi-2223/Ag带材在工频过电流冲击下的失超及恢复特性实验研究

本文对工频过电流冲击下准绝热环境中的Bi-2223/Ag不锈钢加强多芯带的失超及恢复特性进行了实验研究.通过实验测量了在液氮温度(77K)、自场下Bi-2223/Ag超导带在幅值为100 A至1 015 A,时间为300 ms的工频电流冲击下,超导带材两端的电压,电流及带材表面温度的变化,得到冲击期间各参量的变化规律.另外,还比较了冲击电流相同、正常载流不同时,带材的温升及失超恢复时间,结果表明正常载流大时,则带材温升较高,失超恢复时间长.正常载流为60A＜0.5Ic时,带材失超恢复时间为冲击时间的21倍.     

MgB_2超导线材失超传播速度与最小触发能的影响因素研究

通过有限元方法(FEM)计算系统的一维热传导方程来研究MgB2超导线材的失超行为,由数值计算得到的MgB2超导线材失超传播规律与实验测得值相吻合.在实验上和理论上分析了铜超比、热导率、热容、电阻率等参数对MgB2超导线材失超行为的影响.通过数值计算给出了失超传播速度和最小触发能随工作温度、热导率、热容、铜超比的变化规律.     

C掺杂MgB2超导线材的失超特性研究

研究了不同芯数(单芯、6芯和12芯)的C掺杂MgB2超导线材的失超特性.在制冷机环境(20K)下测量了C掺杂MgB2超导线材样品在自场下的最小触发能及失超传播速度.实验结果表明,失超传播速度随着工作电流的增大而线性增加.失超传播速度的大小跟测量位置有关,离触发区越近的传播速度越大.单芯样品的最小触发能最小,6芯和12芯线的最小触发能相差不大.最小触发能随工作电流的增加成指数形式衰减.     

Study of air heat treatment on Bi-2223/Ag superconducting tapes

Heat treatment has been carried out on commercially available Bi-2223/Ag superconducting tape under various temperature conditions in air. The critical currents (I_C) of tape after heat treatment at different annealing temperatures were tested at the liquid-nitrogen temperature. The microstructures and phase constituents of the tapes were investigated by SEM and XRD, respectively. The results indicate that annealing temperature has a very important influence on the superconducting properties of the tapes. When the temperature is above 840 °C, I_C value drops dramatically. Furthermore, when the temperature reaches up to 860 °C, the tape loses most of its superconducting property because of the decomposition of the superconducting phase Bi-2223.     

Bi2223/Ag和YBCO高温超导带材在交流过电流冲击下的失超及恢复特性研究

采用交流冲击实验装置测量了在不同交流过电流、持续交流工作电流及冲击时间情况下,不同散热条件下Bi2223/Ag和YBCO高温超导带材的电压、电流和温度随时间变化曲线,分析了冲击期间和冲击后带材各参数变化及失超恢复时间与散热条件和冲击参数的关系。研究结果表明:带材在交流过电流冲击下的失超和恢复过程主要取决于冲击能量和冲击过后带材内发热与散热的竞争效应。     

Superconducting joint of Bi-2223/Ag superconducting tapes by diffusion bonding

61-Filaments Bi-2223/Ag superconducting tapes have been joined by diffusion bonding. The critical currents (I_Cs) of the joints are obtained by using standard four probe method under no magnetic field in the liquid nitrogen. The microstructures of the joints are evaluated by the electron microscope in electron backscatter diffraction mode and the phase compositions of the superconducting cores of the joint and the original tape are determined by X-ray diffraction (XRD). The results show diffusion bonding is effective bonding technique for HTS tapes, and the bonding time is reduced greatly from hundreds of hours to a few hours, and the bonding pressure also changes from 140–4000 MPa to 3 MPa. Furthermore, the diffusion bonding joints sustain superconducting properties, and the critical current ratios (CCR_O) of the joints are in the range of 35%–80%. Microstructures of the typical joint display a good bonding and some defects existed in traditional method are avoided. XRD results show that the phase compositions of the superconducting cores have no obvious changes before and after diffusion bonding, which offers physical and material bases for high superconducting property of the joints.     

拉伸应变对Bi2223/Ag带材Ic不均匀性的影响

研究了Bi2223/Ag带材的Ic和n值沿带长方向的不均匀性在拉伸应变下的变化。结果表明,Ic和n值的大小并不是逐点一一对应的;当应变小于不可逆拉伸应变时,Ic随应变增加缓慢下降,n值随应变增加缓慢下降并有小幅震荡;Ic的均匀度随应变增加基本上没有变化,n值的均匀度随应变增加变好并有小幅振荡,而且变化范围很小。     

Addition of nanometer SiC in the silver-sheathed Bi2223 superconducting tapes

Nanometer SiC particles were added to (Bi,Pb)₂Sr₂Ca₂Cu₃O_x (Bi2223) precursor powders and the powders were transformed into silver-sheathed superconducting tapes by the standard powder-in-tube (PIT) technique. The influence of SiC on the melting temperature, high-T_c (Bi2223) phase formation, microstructure and transport property of the tapes was studied by means of DTA, XRD, SEM/EDX, electrical and magnetic measurements. The results showed that SiC addition lowered the melting temperature of the superconductor powders and consequently, decreased the optimum sintering temperature of the tapes. However, the addition did not affect the Bi2223 phase formation and critical temperature (T_c) of the tapes up to 1.00 wt.% of SiC. Most importantly, the addition of a small amount of SiC (0.15 wt.%) improved the critical current (I_c) and I_c behavior in magnetic field as a result of the enhancement in density, grain alignment, grain connectivity and flux pinning of the tapes.     

高温超导带材YBCO涂层导体的失超传播特性研究

在液氮(77K)环境下对YBCO涂层导体的交、直流失超传播特性进行了研究。测量了交、直流情况下的失超传播速度以及最小失超能量;分析了超导带材的失超传播速度与传输电流的关系;推导了一维模型下的失超传播速度计算公式。结果表明,当带材的传输电流交流(有效值)与直流相同时,交、直流失超传播速度基本一致,交流的最小失超能略小,且随着传输电流的增大最小失超能间的差距加大。     

高温超导带材Bi-2223/Ag的焊接接头电阻研究

针对高温超导带材Bi-2223/Ag的焊接问题进行了研究.利用ANSYS建立焊接接头电阻特性的有限元计算模型,仿真和计算分析了焊料材料、搭接长度和焊锡层厚度对接头电阻值的影响,并进行了实验验证.实验表明:可通过减少焊料厚度,增加焊接搭接长度来减少接头电阻,当焊接长度在2～5cm,焊料厚度为0.5mm时,Bi-2223/...     

Fabrication of joint Bi-2223/Ag superconducting tapes with BSCCO superconducting powders by diffusion bonding

61-Filaments Bi-2223/Ag superconducting tapes have been successfully joined with BSCCO superconducting powder interlayer by diffusion bonding. The electrical properties of the diffusion bonding joints were tested by standard four probe method and the microstructures of the joints were also examined by SEM. Additionally, the phase constituents of the superconducting powders between the tapes before and after bonding process were evaluated by XRD analysis. The result shows that the diffusion bonding joints are superconductive. The microstructures of the joint display a good bonding with no cracks and discontinuities. The joining zones are mainly composed of Bi-2223 phase, Bi-2212 phase and a small amount of CuO, Ca₂PbO₄. At last, the phase transformations of the superconducting powders in the bonding process are discussed.     

The frequency dependence of AC transport losses in stacked Bi—2223／Ag superconducting tapes

AC transport losses in a single superconducting tape, double-and triple-stacked Bi-2223/Ag superconducting tapes were measured by use of electrical method. The measurements were carried out at 77K with the frequency of AC transport currents ranging from 50 to 100Hz. The dependence of AC losses on frequency and the number of tapes in the stack were presented and analysed.