Investigation of an InGaP/GaAs heterostructure-emitter bipolar transistor (HEBT) with reduced potential spike

In this work, an improved InGaP/GaAs heterostructure-emitter bipolar transistor (HEBT) with an InGaP wide-bandgap collector is investigated. In the emitter–base region, the thin narrow bandgap n-type GaAs layer is sandwiched between a wide-bandgap N-type InGaP confinement layer and a narrow-bandgap p-type GaAs base layer. In the collector–base structure, an undoped 30 Å-thick GaAs spacer and a heavily doped 30 Å-thick GaAs are inserted between the base and collector. Due to the absence of a potential spike both at the base–emitter and base–collector junctions, the studied device shows lower offset and saturation voltages. In addition, not only are the excellent current–voltage characteristics observed, but also the undesired effects, e.g. the electron blocking effect, are completely eliminated.     

Optical and electrical characteristics of InGaP/AlGaAs/GaAs composite emitter heterojunction bipolar/phototransistors (CEHBTs/CEHPTs)

We report on new InGaP/AlGaAs/GaAs composite emitter heterojunction bipolar and phototransistors (CEHBTs/CEHPTs) with a low turn-on voltage. The composite emitter comprised of the digital graded superlattice emitter and the InGaP sub-emitter is used to smooth out potential spike associated with the emitter–base heterojunction and to obtain a low emitter–base turn-on voltage. A fabricated CEHBT exhibits a small offset voltage of 55 mV and a low turn-on voltage of 0.83 V with a dc current gain as high as 150. In case of a CEHPT’s collector–emitter characteristics with base floating, optical gains increase with increasing input optical power. Furthermore, the collector current saturation voltage is small due to a low turn-on voltage. We obtain an optical gain larger than 6.83 with a collector current saturation voltage smaller than 0.5 V. On the other hand, performance results of a CEHPT with two- and three-terminal configuration were investigated and compared.     

Detecting spin-polarized currents in ballistic nanostructures

We demonstrate a mesoscopic spin polarizer/analyzer system that allows the spin polarization of current from a quantum point contact in a large in-plane magnetic field to be measured. A transverse electron focusing geometry is used to couple current from an emitter point contact into a collector point contact. At large in-plane fields, with the point contacts biased to transmit only a single spin (g70% are found for both emitter and collector at 300 mK and 7 T in-plane field.     

Frequency converter based on a field electron emitter

An electron field emitter based on a carbon nanotube is considered as a frequency converter of the voltage applied to its electrodes. This property of the emitter relates to the nonlinear form of the current-voltage characteristic described by the classical Fowler-Nordheim expression. Calculations show that the number of higher harmonics in the spectrum of the emission current increases upon a decrease in the applied voltage and with increasing relative amplitude of the ac signal.     

High-gain and oscillatory transconductance by InGaAs/InAlAs multiple-quantum-well emitter bipolar transistor

We report an InGaAs/InAlAs multiple-quantum-well (MQW) emitter bipolar transistor prepared by molecular beam epitaxy. There are three distinct operating regimes to be observed in the studied structure. At small input base currents, low field band-type conduction provides the output current. The device exhibits a small gain and works as a normal transistor. With further increase in the base current, the high field starts appearing in the MQW superlattice. We observe that both the output current and transconductance exhibit an oscillatory behaviour in terms of sequential resonant-tunnelling through an expanding high field MQW domain. Beyond the condition of expansion of high field domain, the electron current increases rapidly by tunnelling through the triangular barrier and emitting over the base layer. The MQW superlattice now works as a barrier to hole minority carriers within this region. We obtain a common-emitter current gain as high as 240 with a small offset voltage of about 80 mV.     

Effect of the space charge of emitted electrons on field electron emission

It is shown that the conventional technique of substituting the field strength at the space charge-emitter interface that is calculated with the Poisson equation into the Fowler-Nordheim formula considerably overestimates the effect of space charge on field electron emission. In this work, the space-charge-induced field attenuation as a function of the emission current density and radius of curvature of the emitter surface is derived using the model of a planar space-charge layer. It is argued that field electron emission cannot be studied in terms of the spherical diode model, since it assumes the presence of a space charge on the back (nonemitting) emitter surface, which is in fact absent. It is stated that one should consider the discrete character of the charges when investigating the space charge in field electron emission, because the mean spacing between the electrons emitted far exceeds the emission barrier width.     

Interference photoelectromagnetic effect in graded-gap semiconductors

Numerical calculations describing the influence of the interference of internally-reflected radiation on the photoelectromagnetic (PEM) effect in graded energy-gap Cd_xHg_1−xTe structures are presented. The spectral voltage responsivities of graded-gap IR-PEM detectors are reported as functions of the semiconductor structure thickness, composition profile of the structure, doping level, surface recombination velocity and reflection coefficient from the structure substrate. The thickness of graded-gap PEM detectors is one of the more important parameters which can affect their performance.     

Comparative study of InGaP/GaAs heterojunction bipolar transistors (HBTs) with different base surface treatments

The interesting InGaP/GaAs heterojunction bipolar transistors (HBTs) with different surface passivations on the base surface are fabricated and studied. Experimentally, the HBT device with sulfur treatment passivation displays the lowest offset voltage. However, the device with a 0.02 μm-thick emitter ledge structure reveals better transistor behaviors such as higher current gain and lower base surface recombination current. In addition, it also exhibits improved thermal stability. For the reliability test, the device with a 0.02 μm-thick emitter ledge structure shows the best performance. Therefore, from experimental results, the HBT device performance could be improved by appropriate base surface treatments, e.g., sulfur passivation and emitter ledge structure.     

碳纳米管场致发射中的空间电荷效应

采用微波等离子体化学气相沉积(MWPCVD)方法成功制备以碳纳米管束为单元的场致发射阵列,获得很好的场致发射电流发射特性,在电流密度较大时,发现I-V特性偏离由Fowler-Nordheim公式计算出的结果。采用Electron Beam Simulation(EBS)软件进行模拟分析发现:在电流密度较低时,I-V特性能很好与F-N公式吻合。但碳纳米管尖端电流密度大于106A/cm2时,碳纳米管尖端处的有效电场强度受空间电荷的影响比较明显,进而对碳纳米管的场致发射特性显现出不可忽略的影响,此时碳纳米管的发射电流密度开始受到空间电荷的限制。     

The effect of the crystal structure of the field emitter on field ion energy distributions

The field ionization probability of an atom as a function of distance from the field emitter is discussed in terms of the atomic arrangement and the electron scattering properties of the ion cores of the emitter in the immediate neighborhood of the atom to be ionized, and the electron transmission properties of the potential barrier between the emitter and that atom. This approach to field ionization calculations is somewhat similar to field ionization calculations based on low energy electron diffraction (LEED) procedure in that it takes into account electron scattering from the first few atomic layers of the emitter. It differs from LEED type calculations, because it considers the highly localized nature of the ionization near a surface atom. This localization makes the ionization probability relatively insensitive to the two-dimensional periodicity of the emitter surface. A one-dimensional calculation, in which only the potential barrier and three ion core scatterers in line with the field are considered, shows secondary structure in the predicted field ion energy distributions near the critical energy deficit, as well as the well known, primary field induced resonance peaks. The surface orientation dependence of these distributions arises naturally from this model because the secondary structure depends strongly upon the crystal parameter along a line parallel to the field. This one-dimensional calculation can be no more than an approximation to a complete calculation. It is interesting, however, that such a simple physical model, in which scattering from the image potential and only two or three ion cores is considered, rather than scattering from a complete crystal, can give prodicted field ion onergy distributions which are similar to those experimentally observed.     

双极型晶体管在强电磁脉冲作用下的瞬态响应

 利用时域有限差分法,对双极型晶体管在强电磁脉冲作用下的瞬态响应进行了2维数值模拟,分析了器件烧毁过程中电场、电流密度、温度等参数的分布及变化情况,分别观察了低电压和高电压脉冲作用下烧毁过程中热点的形成过程,并得到了器件烧毁所需时间以及能量与脉冲电压幅度之间的关系。在电压脉冲较低时,烧毁点位于通道中靠近集电极的位置,当脉冲电压达到一定幅度的时候,由于发射极与集电极之间发生雪崩击穿,基极和发射极之间电势会抬高,从而引起基极和发射极之间的击穿,形成新的热点,并在电压幅度约高于100 V的情况下会率先达到烧毁温度。随着脉冲电压幅度的增高,晶体管烧毁所需时间呈负指数减少,而所需能量在55~100 V之间接近于线性增长,直到电压幅度约高于100 V时才开始减少。     

钙钛矿/硅叠层太阳电池中平面a-Si:H/c-Si异质结底电池的钝化优化及性能提高

最近,旋涂法制备的钙钛矿/平面硅异质结高效叠层太阳电池引起人们广泛关注,主要原因是相比于绒面硅衬底制备的钙钛矿/硅叠层太阳电池,其制备工艺简单、制备成本低且效率高.对于平面a-Si:H/c-Si异质结电池, a-Si:H/c-Si界面的良好钝化是获得高转换效率的关键,进而决定了钙钛矿/硅异质结叠层太阳电池的性能.本文主要从硅片表面处理、a-Si:H钝化层和P型发射极等方面展开研究,通过对硅片表面的氢氟酸(HF)浸泡时间和氢等离子体预处理气体流量、a-Si:H钝化层沉积参数、钝化层与P型发射极(I/P)界面富氢等离子体处理的综合调控,获得了相应的优化工艺参数.对比研究了p-a-Si:H和p-nc-Si:H两种缓冲层材料对I/P界面的影响,其中高电导、宽带隙的p-nc-Si:H缓冲层既能够降低I/P界面的缺陷态,又可以增强P型发射层的暗电导率,提高了前表面场效应钝化效果.通过上述优化,制备出最佳的P-type emitter layer/aSi:H(i)/c-Si/a-Si:H(i)/N-type layer (inip)结构样品的少子寿命与implied-Voc分别达到2855μs和709 mV,表现出良好的钝化效果.应用于平面a-Si:H/c-Si异质结太阳电池,转换效率达到18.76%,其中开路电压达到681.5 mV,相对于未优化的电池提升了34.3 mV.将上述平面a-Si:H/c-Si异质结太阳电池作为底电池,对应的钙钛矿/硅异质结叠层太阳电池的开路电压达到1780 mV,转换效率达到21.24%,证明了上述工艺优化能够有效地改善叠层太阳电池中的硅异质结底电池的钝化及电池性能.     

2D planar field emission devices based on individual ZnO nanowires

2D planar field emission devices based on individual ZnO nanowires were achieved on Si/SiO₂ substrate via a standard e-beam lithography method. The anode, cathode and ZnO nanowires were on the same substrate; so the electron field emission is changed to 2D. Using e-beam lithography, the emitter (cathode) to anode distance could be precisely controlled. Real time, in situ observation of the planar field emission was realized in a scanning electron microscope. For individual ZnO nanowires, an onset voltage of 200 V was obtained at 1 nA. This innovative approach provides a viable and practical methodology to directly implement into the integrated field emission electrical devices for achieving “on-chip” fabrication.     

Evaluations of carbon nanotube field emitters for electron microscopy

Brightness of carbon nanotube (CNT) emitters was already reported elsewhere. However, brightness of electron emitter is affected by a virtual source size of the emitter, which strongly depends on electron optical configuration around the emitter. In this work, I-V characteristics and brightness of a CNT emitter are measured under a practical field emission electron gun (e-gun) configuration to investigate availability of CNT for electron microscopy. As a result, it is obtained that an emission area of MWNT is smaller than its tip surface area, and the emission area corresponds to a five-membered-ring with 2nd nearest six-membered-rings on the MWNT cap surface. Reduced brightness of MWNT is measured as at least 2.6×10⁹ A/m² sr V. It is concluded that even a thick MWNT has enough brightness under a practical e-gun electrode configuration and suitable for electron microscopy.     

Control of the Interface Between Electron‐Hole and Electron‐Ion Plasmas: Hybrid Semiconductor‐Gas Phase Devices as a Gateway for Plasma Science

Coupling electron‐hole (e^–‐ h⁺) and electron‐ion plasmas across a narrow potential barrier with a strong electric field provides an interface between the two plasma genres and a pathway to electronic and photonic device functionality. The magnitude of the electric field present in the sheath of a low temperature, nonequilibrium microplasma is sufficient to influence the band structure of a semiconductor region in immediate proximity to the solid‐gas phase interface. Optoelectronic devices demonstrated by leveraging this interaction are described here. A hybrid microplasma/semiconductor photodetector, having a Si cathode in the form of an inverted square pyramid encompassing a neon microplasma, exhibits a photosensitivity in the ～420–1100 nm region as high as 3.5 A/W. Direct tunneling of electrons into the collector and the Auger neutralization of ions arriving at the Si surface appear to be facilitated by an n ‐type inversion layer at the cathode surface resulting from bandbending by the microplasma sheath electric field. Recently, an npn plasma bipolar junction transistor (PBJT), in which a low temperature plasma serves as the collector in an otherwise Si device, has also been demonstrated. Having a measured small signal current gain h_fe as large as 10, this phototransistor is capable of modulat‐ing and extinguishing the collector plasma with emitter‐base bias voltages <1 V. Electrons injected into the base when the emitter‐base junction is forward‐biased serve primarily to replace conduction band electrons lost to the collector plasma by secondary emission and ion‐enhanced field emission in which ions arriving at the base‐collector junction deform the electrostatic potential near the base surface, narrowing the potential barrier and thereby facilitating the tunneling of electrons into the collector. Of greatest significance, therefore, are the implications of active, plasma/solid state interfaces as a new frontier for plasma science. Specifically, the PBJT provides the first opportunity to control the electronic properties of a material at the boundary of, and interacting with, a plasma. By specifying the relative number densities of free (conduction band) and bound (valence band) electrons at the base‐collector interface, the PBJT's emitter‐base junction is able to dictate the rates of secondary electron emission (including Auger neutralization) at the semiconductor‐plasma interface, thereby offering the ability to vary at will the effective secondary electron emission coefficient for the base surface (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Observation of the current－voltage plateau-like structure of resonant tunnelling diode with prewells under different magnetic fields

We have grown resonant tunnelling diodes (RTDs) with different sized emitter prewells and without a prewell. The current－voltage (I－V) characteristics of them in different magnetic fields were investigated. Two important phenomena were observed. First, a high magnetic field can destroy the plateau-like structure in the I－V curves of the RTD. This phenomenon is ascribed to the fact that the high magnetic field will demolish the coupling between the energy level in the main quantum well and that in the emitter quantum well or in the prewell. Secondly, the existence and size of the prewell are also important factors influencing the plateau-like structure.     

双极晶体管在强电磁脉冲作用下的损伤效应与机理

针对典型n⁺-p-n-n⁺结构的双极晶体管,从器件内部电场强度、电流密度和温度分布变化的分析出发,研究了在强电磁脉冲(electromagnetic pulse,EMP)作用下其内在损伤过程与机理.研究表明,双极晶体管损伤部位在不同幅度的注入电压作用下是不同的,注入电压幅度较低时,发射区中心下方的集电区附近首先烧毁,而在高幅度注入电压作用下,由于基区-外延层-衬底构成的PIN结构发生击穿,导致靠近发射极一侧的基极边缘处首先发生烧毁.利用数据分析软件,对不同注入电 关键词： 双极晶体管 强电磁脉冲 器件损伤 损伤功率     

Degradation of a carbon nanotube-based field-emission cathode during ion sputtering

The degradation rate of carbon nanotubes (CNTs) in an electron field emitter is calculated. The degradation mechanism is taken to be the sputtering of the CNT surface by the ions that result from the ionization of residual gas molecules by an electron impact. The degradation rate and the corresponding CNT lifetime are calculated as a function of the nanotube geometry, the applied voltage, the pressure and kind of a residual gas, the interelectrode gap, and the nanotube array density. The obtained strong dependence of the degradation rate on the applied voltage is caused by a sharp character of the I?CV emission characteristic determined by the Fowler-Nordheim relationship. The dependence of the degradation rate on the interelectrode gap is induced by the corresponding dependence of the probability of reaching the CNT surface.     

Electron emission characteristics of Al-AlN granular films

An electron conduction emitter of Al-AlN granular films was proposed for surface conduction electron emission device in this paper. The Al-AlN granular films with thickness of 30 nm were prepared between two co-planar electrodes with gap of 10 μm by magnetron sputtering. After electroforming the Al-AlN granular films, the films’ structure could be recovered by applying the periodic device voltage (V_f). Stable and uniform electron emission was observed with turn-on voltage of 5.3 V and threshold voltage of 9 V. The emitter emission current (I_e) of 4.84 μA for 36 cells was obtained with the anode voltage of 2.5 kV and the device voltage of 12 V. In addition, Fowler-Nordheim plots for I_e-V_f properties showed that the electron emission mechanism should be field emission.     

Integration of ZnO nanowires in gated field emitter arrays for large-area vacuum microelectronics applications

Addressable field emitter arrays (FEAs) have important applications in vacuum electronic devices. However, it is important to integrate nanowire emitters into a gated structure without influencing the device structure and maintain the excellent field emission properties of nanowire emitters in the FEAs after the fabrication process. In this study, gate-structure ZnO nanowire FEAs were fabricated by a microfabrication process. The structure combines a planar gate and an under-gate, which is compatible with the preparation of ZnO nanowire emitters. The effect of electrode materials on the field emission properties of ZnO nanowires was studied using a diode structure, and it was found that ZnO nanowire pads on indium-tin-oxide (ITO) electrode showed better field emission performance compared with chromium (Cr) electrode. In addition, effective emission current modulation by the gate voltage was achieved and the addressing capability was demonstrated by integrating the ZnO nanowire FEAs in a vacuum-encapsulated field emission display. The reported technique could be a promising route to achieve large area addressable FEAs.