用分子束外延技术在GaAs(110)衬底上生长AlGaAs材料

采用分子束外延技术在GaAs(110)衬底上制备了一系列生长温度和As2/Ga束流等效压强比不同的样品,通过室温光致发光谱、高分辨X射线衍射仪和低温光致发光谱对这些样品进行了分析,找到了在GaAs(110)衬底上生长高质量高Al组分的Al0.4Ga0.6As生长条件.     

在砷化镓衬底上用分子束外延法生长锑化铟薄膜

用分子束外延方法在ＧａＡｓ上生长ＩｎＳｂ薄膜。方法是先在温度３８０℃生长ＩｎＳｂ有源层。然后低温（３００℃）生长一层约０．０３μｍ厚的ＩｎＳｂ缓冲层。Ｓｂ＿４与Ｉｎ的束流等效压强比为４：１时，可获得温度７７Ｋ最大霍尔迁移率的材料。在２～５μｍ厚度的薄膜中，温度７７Ｋ的霍尔迁移率大于３５０００ｃｍ￣２Ｖ￣（－１）·ｓ￣（－１）和Ｘ射线半峰宽小于２５０（″）。温度７７Ｋ的霍尔迁移率比最近报导的结果大３倍。Ｘ射线半峰宽也相对小。对可改进薄膜性能的几种可能性作了探讨。     

在含有InSb非晶过渡层的GaAs衬底上用分子束外延生长InSb薄膜

在（１００）取向半绝缘ＧａＡｓ衬底上，采用独特的含有ＩｎＳｂ非晶过渡层的两步分子束外延（ＭＢＥ）生长了异质外延ＩｎＳｂ薄膜。ＩｎＳｂ外延层表面为平滑镜面，外延层厚度约为６μｍ，导电类型为ｎ型，室温（３００Ｋ）和液氮（７７Ｋ）霍尔载流子浓度分别为ｎ＿（３００Ｋ）：２．０×１０￣（１６）ｃｍ￣（－３）和ｎ＿（７７Ｋ）：２．４×１０￣（１５）ｃｍ￣（－３）；电子迁移率分别为μ＿（３００Ｋ）：４１０００ｃｍ￣２Ｖ￣（－１）Ｓ＿（－１）和μ＿（７７Ｋ）：５１２００ｃｍ￣２Ｖ￣（－１）Ｓ￣（－１）。ＩｎＳｂ外延层双晶衍射半峰宽为１９８ａｒｃｓ，最好的ＩｎＳｂ外延层的半峰宽小于１５０ａｒｃｓ。采用ＩｎＳｂ非晶过渡层有效地降低了外延层中的位错密度，改善了ＩｎＳｂ外延层的质量。     

在Si和Ge衬底上用分子束外延生长HgCdTe

在当前大规模红外焦平面器件的研制中,高性能器件的制备需要高质量、大面积、组分均匀的碲镉汞材料。衬底和外延材料的晶格失配导致了大量的位错增殖,严重影响红外焦平面器件的工作性能。本文对各种衬底进行了比较,并对Si基和Ge基上的外延碲镉汞材料的生长工艺及性能进行了调研和评价。     

高质量GaAs—AlGaAs材料MBE生长研究及其应用

通过对分子束外延中影响ＧａＡｓ、ＡｌＧａＡｓ材料生长的一些关键因素的分析，实验与研究，得到了具有很好晶格完整性和高质量电学，光学特性的ＧａＡｓ、ＡｌＧａＡｓ单昌材料，实现了７５ｍｍ大面积范围内的厚度，组分和掺杂等的很好均匀性。研制了高质量的ＧａＡｓ／ＡｌＧａＡｓ量子阱超晶格材料，并应用于量子阱激光器材料的研制，获得了具有极低值电流密度低内损耗，高量子效率的高质量量子阱激光器外延材料。     

GaAs衬底上分子束外延ZnTe_(1-x)S_x合金的光学声子散射研究

用分子束外延方法在GaAs（100）衬底上外延生长了不同组分的ZnTe1-xSx（0＜x＜1）合金．用X射线衍射和喇曼散射对该合金的晶体结构和光学声子散射性能进行了研究．通过对其光学声子频率随x的变化研究发现，ZnTe1-xSx合金呈现典型的双模特性．其中，ZnTe1-xSx合金中类ZnTe模和类ZnS模的长波光学声子频率随组分x呈线性变化．用改进了的随机元等位移（MREI）模型计算了该合金的长波光学声子频率和x的关系，并与测量结果作了比较，理论和实验符合很好．     

用离子集团束技术在Si上外延生长GaAs

本文描述了用一种新的离子集团束技术在较低的温度下在Ｓｉ衬底上外延生长ＧａＡｓ的初步实验结果．实验表明：Ａｓ＋离子束轰击对于去除Ｓｉ上自然氧化层是有效的，在衬底温度为５５０℃得到ＧａＡｓ单晶．     

分子束外延低温生长GaAs缓冲层

<正>在低的衬底温度(约300℃)下生长的GaAs层具有较高的电阻率,较小的光敏特性。低温生长的GaAs层用于MESFET作缓冲层,能够消除背栅效应,改善光敏特性等。国外研究结果表明,低温GaAs缓冲层为富砷结。 用国产MBE—Ⅲ型分子束外延设备进行低温生长GaAs层的研究。半绝缘GaAs衬底温度约580℃,生长约50nm GaAs层。反射高能电子衍射(RHEED)的衍射图样为(2×4)结构。然     

S钝化GaAs(100)衬底上分子束外延ZnSe薄膜的喇曼光谱研究

用分子束外延法（ＭＢＥ）分别在经（ＮＨ４）２Ｓｘ溶液和Ｓ２Ｃｌ２溶液钝化的ＧａＡｓ（１００）衬底上生长了ＺｎＳｅ薄膜．用室温喇曼光谱对不同处理方法的ＧａＡｓ上所长ＺｎＳｅ薄膜的晶体质量和ＺｎＳｅ／ＧａＡｓ界面进行对比研究．用喇曼散射的空间相关模型定量分析了一级喇曼散射的空间相关长度与晶体质量间的关系．根据ＧａＡｓ的ＬＯ－等离子激元耦合模喇曼散射强度的变化，分析了不同Ｓ钝化方法对ＺｎＳｅ／ＧａＡｓ界面以及ＺｎＳｅ薄膜质量的影响．结果表明，Ｓ２Ｃｌ２溶液钝化的ＺｎＳｅ／ＧａＡｓ样品具有较低的界面态密度和较好的     

ZnCl2掺杂n型ZnSe的分子束外延生长

利用分子束外延(MBE)技术,以5N的ZnCl2作为掺杂源,在半绝缘GaAs (001)衬底上异质外延生长ZnSe:Cl单晶薄膜.研究发现,掺入ZnCl2后,ZnSe外延层的结晶质量和表面形貌与本征ZnSe外延层相比变差,双晶X射线摇摆曲线(DCXRC)的ZnSe (004)衍射峰半峰宽(FWHM)从432 arcsec增大到529 arcsec,表面均方根粗糙度(RMS)从3.00 nm增大到3.70nm.当ZnCl2掺杂源炉的温度为170℃时,ZnSe样品的载流子浓度达到1.238×1019 cm-3,可以满足结型器件制作和隧道结材料设计的要求.     

Microstructure of Heteroepitaxial ZnTe Grown on GaAs(211)B by Molecular Beam Epitaxy

ZnTe was grown on GaAs(211)B by molecular beam epitaxy (MBE). Structural properties and strain relaxation at the ZnTe/GaAs(211)B interface were investigated by high resolution transmission electron microscopy (HRTEM) and scanning transmission electron microscopy (STEM). Application of digital image processing involving a filtered inverse fast Fourier transformation revealed an array of misfit dislocations at the interface and allowed strain relaxation to be estimated. Only one twin defect was observed in the HRTEM images, and details of this twin defect were investigated by STEM.     

分子束外延GaAs/Si应变层的光致发光和光反射谱研究

研究了分子束外延GaAs/Si光致发光谱的激发强度和温度依赖关系。确定出2个本征发光峰,分别对应于导带至m_J=±3/2和m_J=±1/2价带的复合。这种价带的移动和分裂归因于由GaAs和Si的热膨胀系数不同所引起的GaAs层双轴张应力。还观测到4个非本征发光峰,分别为导带至m_J=±1/2碳受主态发光、可能与缺陷有关的发光以及可能由Mn和Cu受主杂质引起的发光。室温下将GaAs/Si和GaAs/GaAs材料的光反射谱进行比较,前者明显向低能移动约8meV,观测到3个特征谱结构,与光致发光结果相一致。     

High-Gain Low Turn-On Voltage AlGaAs/GaAsNSb/GaAs Heterojunction Bipolar Transistors Grown by Molecular Beam Epitaxy

AlGaAs/GaAsNSb heterojunction bipolar transistors (HBTs) with low turn-on voltage have been fabricated. The turn-on voltage of the device fabricated from an as-grown sample is ~180 mV lower than that of a conventional AlGaAs/GaAs HBT. The effect of rapid thermal annealing on device performance is an increase in the gain from ~8.5 to ~20. However, the knee voltage of the annealed sample (~3 V), as well as the turn-on voltage, is also higher compared with that of the as-grown sample (~1.5 V).     

Growth of ZnSnN2 by Molecular Beam Epitaxy

The Zn-IV-N₂ family of materials represents a potential earth abundant element alternative to conventional compound semiconductor materials that are based on gallium and indium. While both ZnSiN₂ and ZnGeN₂ have been studied to some degree, very little is known about the narrow-gap member ZnSnN₂. Here, we investigate the growth dynamics of crystalline ZnSnN₂ through plasma-assisted molecular beam epitaxy. All films exhibit some degree of crystalline order regardless of growth conditions, although significant tin coverage was observed for films grown with low Zn:Sn flux ratio; Zn flux in particular became increasingly problematic at increased substrate temperatures designed to improve crystallinity. Single-crystal material was achieved through careful optimization of growth parameters. Regardless of deposition conditions or substrate choice, however, all films exhibit a monoclinic structure as opposed to the predicted orthorhombic lattice; this can be directly attributed to sublattice disorder.     

Surface Structure of Molecular Beam Epitaxy (211)B HgCdTe

The as-grown molecular beam epitaxy (MBE) (211)B HgCdTe surface has variable surface topography, which is primarily dependent on substrate temperature and substrate/epilayer mismatch. Nano-ripple formation and cross-hatch patterning are the predominant structural features observed. Nano-ripples preferentially form parallel to the \( [\bar {1}11] \) and are from 0 Å to 100 Å in height with a wavelength between 0.1 μm and 0.8 μm. Cross-hatch patterns result from slip dislocations in the three {111} planes intersecting the (211) growth surface. The cross-hatch step height is 4 ± 1 Å (limited data set). This indicates that only a bi-layer slip (Hg/Cd + Te) in the {111} slip plane occurs. For the deposition of MBE (211)B HgCdTe/CdTe/Si, the reorientation of multiple nano-ripples coalesced into “packets” forms cross-hatch patterns. The as-grown MBE (211)B CdTe/Si surface is highly variable but displays nano-ripples and no cross-hatch pattern. Three types of defects were observed by atomic force microscopy (AFM): needle, void/hillock, and voids.     

Demonstration of AlGaN/GaN High-Electron-Mobility Transistors Grown by Molecular Beam Epitaxy on Si(110)

The growth of AlGaN/GaN-based heterostructure on Si(110) substrates by molecular beam epitaxy using ammonia as the nitrogen precursor is reported. The structural, optical, and electrical properties of such heterostructure are assessed and are quite similar to the ones obtained on Si(111). A 2-D electron gas is formed at the $hbox{Al}_{0.3}hbox{Ga}_{0.7}hbox{N/GaN}$ interface with a sheet carrier density of $hbox{9.6} times hbox{10}^{12} hbox{cm}^{-2}$ and a mobility of 1980 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$ at room temperature. Preliminary results concerning high-electron-mobility-transistor static characteristics are presented and compared with that of devices realized on other orientations of silicon.      

Growth of GaN Layers on Si(111) Substrates by Plasma-Assisted Molecular Beam Epitaxy

Semiconductors - The studies of the growth kinetics of GaN layers grown on nitridated Si(111) substrates by plasmaassisted molecular beam epitaxy are presented. The nucleation and overgrowth of the...