Investigation of phosphorus surface segregation by X-ray scattering measurements

The surface segregation of phosphorus in silicon at low temperatures is studied by using δ doping structures grown by molecular beam epitaxy. The samples are characterized by X-ray crystal truncation rod (CTR) scattering using synchrotron radiation as the light source. The 1/e decay length of P segregation and segregation barrier energy are obtained by fitting the CTR curves within kinematical approximation of X-ray diffraction theory. The surface segregation of P is strong at a growth temperature of 450 °C, with a 1/e decay length of 14 nm, while for growth temperatures below 350 °C, P segregation is negligible with a 1/e decay length not larger than 4 nm. The segregation barrier energy is determined to be 0.43 eV.     

Sharp n-type doping profiles in Si/SiGe heterostructures produced by atomic hydrogen etching

Surface segregation of group V dopant during thin film epitaxy of Si/SiGe heterostructures causes severe limitation on the sharpness of n-type doping profiles in pn junctions. Existing techniques for removal of surface segregated arsenic suffer from either high thermal budget or aggressive (ex situ) wet chemical etching. An in situ low temperature method is clearly desirable, particularly for device structures with high Ge content such as resonant tunnelling diodes, in order to minimize diffusion of the matrix elements as well as maintain structural integrity. In situ etching by atomic hydrogen is shown to be ideal for this purpose. The reaction mechanism ensures that this can only be a low temperature process and the method is shown to be highly effective and selective in the removal of surface segregated As. In comparison with other techniques, atomic hydrogen etching is also shown to be less aggressive and has a smaller impact on the surface/interface quality.     

Mechanism for coarsening of P-mediated Ge quantum dots during in-situ annealing

The coarsening of phosphorus-mediated Ge quantum dots (QDs) on Si(0 0 1) during in-situ annealing at 550 °C is studied. In-situ annealing makes the as-grown sample morphology be remarkably changed: the larger dots are formed and the dot density is greatly reduced. The results of chemical etching and Raman spectra reveal that the incorporation of Ge atoms which originate from the diminishing dots, rather than substrate Si atom incorporation is responsible for the dot coarsening at the incipient stage of in-situ annealing. Besides, Raman spectra suggest that the larger dots formed during in-situ annealing are dislocated, which was confirmed by cross-sectional high-resolution electron microscopy observation. Through the generation of dislocations, the strain in the dots is relaxed by about 50%.     

Inhibition of initial surface oxidation by strongly bound hydroxyl species and Cr segregation: H2O and O2 adsorption on Fe-17Cr

The initial stages of surface oxidation of Fe-17Cr (ferritic stainless steel) were investigated at 323 K by X-ray photoelectron spectroscopy (XPS) and inelastic electron background analysis. The results indicated the formation of a mixed iron-chromium oxide layer upon O₂ exposure and the formation of a thin chromium oxyhydroxide layer upon H₂O exposure. The oxidation of Fe did not occur in the latter case. Moreover, it was found that pre-exposing the Fe-17Cr surface to H₂O significantly hinders subsequent oxidation by O₂, thus providing a way to control the formation of nanoscale oxides on stainless steel materials. It was concluded that the formation of strongly bound hydroxyl species together with adsorbate-induced segregation of Cr severely limits the reaction between O₂/H₂O and Fe from the alloy.     

Size-shrinkage effect of InAs quantum dots during a GaAs capping growth

The modification of the InAs quantum dots (QDs) by the GaAs capping growth was studied by using cross-sectional STEM and atomic force microscopy. In case of the GaAs capping growth at 450 °C, it was found that the lateral size of the InAs QDs significantly decreases rather than the height and that this size-shrinkage effect is enhanced for the large QDs. The shrinkage behavior is mainly attributed to the indium surface segregation, strongly depending on the surface strain of the QDs. The growth process of the GaAs capping layer plays an important role for achieving the size ordering of the embedded QDs.     

The interaction of ultrathin Cr layers with SrTiO3(1 0 0)

The growth of ultrathin Cr overlayers on SrTiO₃(1 0 0) was studied by X-ray photoelectron spectroscopy, scanning tunneling microscopy, and transmission electron microscopy. It is found that the metal-oxide interaction strongly depends on the deposition temperature. At T < 600 °C, the interfaces are atomically sharp. Local charge transfer happens between the interfacial Cr adatoms and the topmost substrate atoms. The binding energy shift of Cr 2p is dominated by the final state effects. In case of T > 600 °C, bulk diffusion of oxygen in the oxide substrate may occur, which results in a redox reaction and the formation of new reaction phases at the interfaces. In this temperature regime, the binding energy shift of Cr 2p is mainly controlled by the initial state effects.     

Photoemission studies of the surfactant-aided growth of Ge on Te-terminated Si(100)

The interactions of Ge adatoms with a Si(100) surface terminated by an ordered layer of Te have been studied in detail using XPS, SXPS, STM and LEED. It has been demonstrated that the Te layer has a surfactant action on the growth mode of the Ge in that the two dimensional growth regime is extended to at least 200 Å and the Te is seen to segregate to the growing Ge surface. The surface reconstruction of the Ge layer changes from (1 × 1) in the initial stages to (2 × 2) as growth proceeds and the surface population of Te is reduced. SXPS line shape analysis has indicated that the initial stages of Ge incorporation are characterised by the formation of small islands above those surface Si sites not fully coordinated with Te. Continued growth of such islands is, however, restricted due to their high surface free energy with respect to the surrounding Te-terminated areas. Ge atoms therefore site-exchange with Te atoms in bridge sites, thus becoming incorporated onto the Si lattice and displacing the Te to bridge sites on the growing surface. In this manner islanding is prevented and two-dimensional growth continues beyond the critical thickness. No evidence is seen for any significant incorporation of the Te within the growing Ge layer.     

Surface segregation of Al substrate metal on Zr film surface

Segregation of substrate Al on thin Zr film, Zr/Al/Al system was investigated by heating the specimen in a UHV chamber. Dual-cathode magnetron-sputtering source was used for deposition of Zr film as well as thin Al film to avoid aluminum oxide formation at Zr/Al interface. Al segregates on Zr film surface at 730 K. It was found that oxide-free interface between film and substrate is important for segregation in Al system. The diffusion coefficient calculated for surface segregation and inter-metallic compound showed that the grain boundary diffusion and bulk diffusion are very close in Zr/Al/Al system. Hence, it is important to control specimen heating to cause surface segregation by grain boundary diffusion.     

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

We report on the precise location of Cl atoms chemisorbed on a Cu(0 0 1) surface and the interlayer relaxations of the metal surface. Previous studies have shown that chlorine dissociates on Cu(0 0 1) to form a c(2 × 2) chemisorbed layer with Cl atoms occupying four-fold hollow sites. A Cu-Cl interlayer spacing of 1.60 Å and a slightly expanded Cu-Cu first interlayer spacing of 1.85 Å (1.807 Å for bulk Cu) was determined by LEED. The resulting Cu-Cl bond length, 2.41 Å, is very similar to the SEXAFS value of 2.37 Å. Contradictory results were obtained by angle-resolved photoemission extended fine structure: while confirming the Cu-Cl interlayer spacing of 1.60 Å, no first Cu-Cu interlayer relaxation has been observed. On the other hand, a small corrugation of the second Cu layer was pointed out. We carried out a detailed structural determination of the Cu(0 0 1)-c(2 × 2)-Cl system using surface X-ray diffraction technique with synchrotron radiation. We find a Cu-Cl interlayer spacing of 1.584(5) Å and confirm the expansion of the first Cu-Cu interlayer, with an average spacing of 1.840(5) Å. In addition, we observe a small corrugation of the second Cu layer, with Cu atoms just below Cl atoms more tightly bound to the surface layer, and even a second Cu-Cu interlayer expansion.     

Hydroxylated α-Al2O3 (0 0 0 1) surfaces and metal/α-Al2O3 (0 0 0 1) interfaces

X-ray photoelectron spectroscopy was applied to study the hydroxylation of α-Al₂O₃ (0 0 0 1) surfaces and the stability of surface OH groups. The evolution of interfacial chemistry of the α-Al₂O₃ (0 0 0 1) surfaces and metal/α-Al₂O₃ (0 0 0 1) interfaces are well illustrated via modifications of the surface O1s spectra. Clean hydroxylated surfaces are obtained through water- and oxygen plasma treatment at room temperature. The surface OH groups of the hydroxylated surface are very sensitive to electron beam illumination, Ar⁺ sputtering, UHV heating, and adsorption of reactive metals. The transformation of a hydroxylated surface to an Al-terminated surface occurs by high temperature annealing or Al deposition.     

In situ measurements of InAs and InP (0 0 1) surface stress changes induced by surface reconstruction transitions

The anisotropic surface stress changes associated with the transition between different surface reconstructions of InAs and InP (0 0 1) surfaces are measured in situ and in real time in a molecular beam epitaxy (MBE) system. Reflectivity anisotropy of the surface measured at 1.96 eV, together with reflection high energy electron diffraction (RHEED) pattern, are used in order to identify the surface reconstructions, and the monitoring of the substrate curvature evolution to determine the variations in surface stress. Our results show the important contribution to the surface stress of the dimers present in these reconstructed surfaces. Furthermore, we provide for the first time quantitative values of the surface stress changes due to the transition between surface reconstructions for these III-V semiconductors compounds. We obtain values for these changes up to 0.7 Nm⁻¹, that is, of the same magnitude as the stress induced by deposition of one monolayer during growth of lattice-mismatched III-V semiconductor heteroepitaxial systems. This points out the great importance of surface stress evolution in this kind of processes.     

Influence of the surface-termination of hexagonal SiC(0 0 0 1) on the temperature dependences of Ge growth modes and desorption

With the aim of comparing initial Ge adsorption and desorption modes on different surface terminations of 4H-SiC(0 0 0 1) faces, 3 × 3, √3×√3R30° (R3) and 6√3×6√3R30° (6R3) reconstructions, of decreasing Si surface richness, have been prepared by standard surface preparation procedures. They are controlled by reflection high energy electron diffraction (RHEED), low energy electron diffraction and photoemission. One monolayer of Ge has been deposited similarly at room temperature on each of these three surfaces, followed by the same set of isochronal heatings at increasing temperatures up to complete Ge desorption. At each step of heating, the structural and chemical status of the Ge ad-layer has been probed. Marked differences between the Si- (3 × 3 and R3) and C-rich (6R3) terminations have been obtained. Ge wetting layers are only obtained up to 400 °C on 3 × 3 and R3 surfaces in the form of a 4 × 4 reconstruction. The wetting is more complete on the R3 surface, whose atomic structure is the closest to an ideally Si-terminated 1 × 1 SiC surface. At higher temperatures, the wetting layer stage transiets in Ge polycrystallites followed by the unexpected appearance on the 3 × 3 surface of a more ordered Si island structure. It denotes a Si clustering of the initial Si 3 × 3 excess, induced by the presence of Ge. A phase separation mechanism between Si and Ge prevails therefore over alloying by Ge supply onto a such Si-terminated 3 × 3 surface. Conversely, no wetting is obtained on the 6R3 surface and island formation of exclusively pure Ge takes place already at low temperature. These islands exhibit a better epitaxial relationship characterized by Ge(1 1 1)//SiC(0 0 0 1) and Ge〈1 1 −2〉//SiC〈1 −1 0 0〉, ascertained by a clear RHEED spot pattern. The absence of any Ge-C bond signature in the X-ray photoelectron spectroscopy Ge core lines indicates a dominant island nucleation on heterogeneous regions of the surface denuded by the 6R3 graphite pavings. Owing to the used annealing cycles, the deposited Ge amount desorbs on the three surfaces at differentiated temperatures ranging from 950 to 1200 °C. These differences probably reflect the varying morphologies formed at lower temperature on the different surfaces. Considering all these results, the use of imperfect 6R3 surfaces appears to be suited to promote the formation of pure and coherent Ge islands on SiC.     

Optical transitions of InAs/In0.36Ga0.64As/GaAs(311B) surface quantum dots clearly identified by the piezoreflectance technique

The bilayer InAs/In_0.36Ga_0.64As/GaAs(311B) quantum dots (QDs), including one InAs buried quantum dot (BQD) layer and the other InAs surface quantum dot (SQD) layer, have been grown by molecular beam epitaxy (MBE). The optical properties of these three samples have been studied by the piezoreflectance (PzR) spectroscopy. The PzR spectra do not exhibit only the optical transitions originated from the InAs BQDs, but the features originated from the InAs SQDs. After the InAs SQDs have been removed chemically, those optical transitions from InAs SQDs have been demonstrated clearly by investigating the PzR spectra of the residual InAs BQDs in these samples. The great redshift of these interband transitions of InAs SQDs has been well discussed. Due to the suitable InAs SQD sizes and the thickness of In_0.36Ga_0.64As layer, the interband transition of InAs SQDs has been shifted to ∼1.55 μm at 77 K.     

Raman study of the segregation of GaAs/AlAs heterostructures grown by molecular beam epitaxy

The Raman spectra of the optical confined phonons in the GaAs/AlAs ultra-thin layer superlattices grown with different growth conditions were used to determine the compositional profiles and to study the process of segregation at the heterointerfaces. A modified kinetic model was developed in order to calculate the compositional profiles in the samples under investigation. The comparison between the experimentally obtained compositional profiles and those calculated by the kinetic model allowed us to determine the parameters characterizing the segregation. It was shown that the increase of pressure of As acts equivalently to the decrease of the growth temperature, resulting in a more abrupt compositional profile.     

Ge quantum dots on a large band gap semiconductor: the first growth stages on 4H–SiC(0 0 0 1)

The Ge growth on SiC(0 0 0 1) follows a Stranski–Krastanov mode for Si-rich (3×3) and reconstructed surfaces. For Ge deposit in particular temperature conditions, a new (4×4) superstructure takes place and the reflection high energy electron diffraction (RHEED) specular spot intensity presents one oscillation proving a wetting layer formation. An island nucleation is then ascertained by the oscillation vanishing and by the appearance of a k-modulated RHEED pattern. On the other hand, on a C-rich surface, a direct Ge island nucleation is observed from the first growth stage. Indeed, for 1 ML Ge, the RHEED diagram consists in spots and rings, and the atomic force microscopy analysis indicates a high density (8×10¹⁰ cm⁻²) of small islands (30 nm, h3 nm). The RHEED spot analysis shows a preferential epitaxial relationship with the substrate Ge(1 1 1)//SiC(0 0 0 1). The Ge–C bonding being energetically unfavourable, Ge tends to form islands immediately rather than wetting the graphite-terminated surface. The Ge growth mode on C-rich surface is thus of Volmer–Weber type.     

Formation of micro-crystals on the (100) surface of SrTiO3 at elevated temperatures

Droplet-like features and regularly shaped micro-crystals appear on the (100) surface of single-crystals of stoichiometric and doped SrTiO₃ as a result of heat treatment around 1000–1100°C under ambient pressure. Secondary ion mass spectrometry, atomic force microscopy and X-ray photoemission are employed to characterize the morphology of the modified surface. The results provide evidence of an accumulation of SrO_x on the surface in a liquid form and subsequent recrystallization as SrO on prolonged annealing. The phenomena are discussed in relation to the restructuring in the near-surface region and the loss of material at the temperatures employed, as evident from thermogravimetrical measurements.     

Reaction of 1,3-cyclohexadiene with the Ge(100) surface

The adsorption and reaction of 1,3-cyclohexadiene with the Ge(100)-(2×1) surface are investigated. The possibility of a surface Diels–Alder reaction ([4+2] cycloaddition), as well as a [2+2] cycloaddition reaction are explored. The surface reactions are followed by ultraviolet photoelectron and high-resolution electron energy loss spectroscopies. The vibrational spectroscopy results are compared with theoretically predicted frequencies for each of the possible surface reactions.     

Evolution of Si0.8Ge0.2 quantum dots during Si encapsulation

Surface structure, determined by scanning tunneling microscopy (STM), surface morphology, determined by atomic force microscopy (AFM), and surface composition, determined by X-ray photoelectron spectroscopy (XPS) of 20.0 nm Si_0.8Ge_0.2 quantum dots formed at 800 °C and encapsulated with 0-10 nm of Si at 500 °C and 800 °C are presented. It is observed that the quantum dot surface morphology changes during the Si encapsulation at 800 °C by the smoothing of the quantum dots. The height of the quantum dots decreases faster than can be accounted for from the amount of Si deposited, indicating that there is movement of material out of the quantum dots during the encapsulation process. Encapsulation at 500 °C results in a retention of the quantum dot surface morphology with increased Ge segregation compared to Si encapsulation at 800 °C. We conclude that the changing surface morphology at 800 °C is not the result of Ge segregation but due to intermixing resulting from the tensile strain of Si depositing on SiGe.     

Photoemission from α and β phases of the GaAs(0 0 1)-c(4 × 4) surface

We prepared α- and β surface phases of GaAs(0 0 1)-c(4 × 4) reconstruction by molecular beam epitaxy (MBE) using As₄ and As₂ molecular beams, respectively, and examined them by angle-resolved ultraviolet photoelectron spectroscopy (UPS) and X-ray photoelectron spectroscopy (XPS) with synchrotron radiation as an excitation source. The UPS valence band spectra and the XPS 3d core level data show pronounced differences corresponding to the surface composition and the atomic structure of the two phases, as proposed in the literature. In UPS, the β phase is characterized by an intensive surface state 0.5 eV below the top of the valence band at low photon energy, while an analogous peak in the α phase spectra is missing. The surface state is interpreted in terms of dangling bonds on As dimers. The As3d and Ga3d core level photoelectron lines exhibit phase-specific shapes as well as differences in the number, position and intensity of their deconvoluted components. The location of various atoms in the surface and subsurface layers is discussed; our photoemission results support models of the β phase and the α phase with As-As dimers and Ga-As heterodimers, respectively.     

Energy levels in doped SiGe quantum well studied by admittance spectroscopy

SiGe/Si quantum wells (QWs) with different Boron doping concentrations were grown by molecular beam epitaxy (MBE) on p-type Si(1 0 0) substrate. The activation energies of the heavily holes in ground states of QWs, which correspond to the energy differences between the heavy hole ground states and Si valence band, were measured by admittance spectroscopy. It is found that the activation energy in a heavily doped QW increases with doping concentration, which can be understood by the band alignment changes due to the doping in the QWs. Also, it is found that the activation energy in a QW with a doping concentration of 2 × 10²⁰ cm⁻³ becomes larger after annealing at a temperature of 685 °C, which is attributed to more Boron atoms activation in the QW by annealing.