Excess Si concentration dependence of the photoluminescence of Si nanoclusters in SiO2 fabricated by ion implantation

A method for the fabrication of luminescent Si nanoclusters in an amorphous SiO₂ matrix by ion implantation and annealing, and the detailed mechanisms for the photoluminescence are reported. We have measured the implanted ion dose, annealing time and excitation energy dependence of the photoluminescence from implanted layers. The samples were fabricated by Si ion implantation into SiO₂ and subsequent high-temperature annealing. After annealing, a photoluminescence band below 1.7 eV has been observed. The peak energy of the photoluminescence is found to be independent of annealing time and excitation energy, while the intensity of the luminescence increases as the annealing time and excitation energy increase. Moreover, we found that the peak energy of the luminescence is strongly affected by the dose of implanted Si ions especially in the high dose range. These results indicate that the photons are absorbed by Si nanoclusters, for which the band-gap energy is modified by the quantum confinement effects, and the emission is not simply due to direct electron–hole recombination inside Si nanoclusters, but is related to defects probably at the interface between Si nanoclusters and SiO₂, for which the energy state is affected by Si cluster–cluster interactions. It seems that Si nanoclusters react via a thin oxide interface and the local concentrations of Si nanoclusters play an important role in the peak energy of the photoluminescence.     

Oxidation of Sc at a SiO2/Si structure: a high resolution Auger study

The oxidation of Sc deposited on ultra thin SiO₂ layers on Si(111) under UHV conditions is monitored by changes in the Auger spectra of Si, O and Sc. At room temperature SiO₂ is reduced by the metal with evidence for the presence of both metal oxide and silicide, while at elevated temperatures further surface reaction results in the formation of a silicate phase.     

Defect versus nanocrystal luminescence emitted from room temperature and hot-implanted SiO2 layers

Silicon nanocrystals have been synthesized in SiO₂ matrix using Si ion implantation. Si ions were implanted into 300-nm-thick SiO₂ films grown on crystalline Si at energies of 30–55 keV, and with doses of 5×10¹⁵, 3×10¹⁶, and 1×10¹⁷ cm⁻². Implanted samples were subsequently annealed in an N₂ ambient at 500–1100°C during various periods. Photoluminescence spectra for the sample implanted with 1×10¹⁷ cm⁻² at 55 keV show that red luminescence (750 nm) related to Si-nanocrystals clearly increases with annealing temperature and time in intensity, and that weak orange luminescence (600 nm) is observed after annealing at low temperatures of 500°C and 800°C. The luminescence around 600 nm becomes very intense when a thin SiO₂ sample is implanted at a substrate temperature of 400°C with an energy of 30 keV and a low dose of 5×10¹⁵ cm⁻². It vanishes after annealing at 800°C for 30 min. We conclude that this luminescence observed around 600 nm is caused by some radiative defects formed in Si-implanted SiO₂.     

Substrate temperature dependence of the photoluminescence efficiency of co-sputtered Si/SiO2 layers

Si particles embedded in an SiO₂ matrix were obtained by co-sputtering of Si and SiO₂ at various deposition temperatures T_d (200–700°C) and annealing at different temperatures T_a (900–1100°C). The systems were characterized by X-ray photoelectron, Raman scattering, infrared absorption and photoluminescence spectroscopy techniques. The results show that the photoluminescence efficiency is strongly dependent on the degree of phase separation between the Si nanocrystals and the SiO₂ matrix. This is likely connected with the Si/SiO₂ interface characteristics, together with the features indicating the involvement of quantum confinement.     

MoO_3/Si界面区钼掺杂非晶氧化硅层形成的第一性原理研究

采用基于密度泛函理论的第一性原理计算方法,通过模拟MoO_3/Si界面反应,研究了MoO_x薄膜沉积中原子、分子的吸附、扩散和成核过程,从原子尺度阐明了缓冲层钼掺杂非晶氧化硅(a-SiO_x(Mo))物质的形成和机理.结果表明,在1500 K温度下, MoO_3/Si界面区由Mo, O, Si三种原子混合,可形成新的稳定的物相.热蒸发沉积初始时, MoO_3中的两个O原子和Si成键更加稳定,同时伴随着电子从Si到O的转移,钝化了硅表面的悬挂键. MoO_3中氧空位的形成能小于SiO_2中氧空位的形成能,使得O原子容易从MoO_3中迁移至Si衬底一侧,从而形成氧化硅层;替位缺陷中, Si替位MoO_3中的Mo的形成能远远大于Mo替位SiO_2中的Si的形成能,使得Mo容易掺杂进入氧化硅中.因此,在晶硅(100)面上沉积MoO_3薄膜时, MoO_3中的O原子先与Si成键,形成氧化硅层,随后部分Mo原子替位氧化硅中的Si原子,最终形成含有钼掺杂的非晶氧化硅层.     

Formation of silver colloids in silver ion-exchanged soda-lime glasses during annealing

The structural and compositional changes of the soda-lime glasses during the formation of the silver colloids were analyzed by the X-ray Photoelectron Spectroscopy (XPS) in order to examine the silver colloid formation mechanism. The in situ behavior of silver and SiO₂ networks on the surfaces of silver ion-exchanged soda-lime glasses during heating and cooling processes in ultra-high vaccum was monitored. The results showed that silver diffuses toward the surface, precipitates, and crystallizes during heating and the total silver surface concentration is slowly increased during cooling. The concentration changes of oxidized and neutral Ag, a new non-bridging oxygen species (NBO^*), and a new silicon species (Si[a]) were applied to deduce a disappropriation reaction mechanism of Ag⁺ on the surface during annealing. The SiO₂ network is modified at temperatures below 350°C to accommodate more silver on the surface and to balance the extra charge carried by the Ag⁺. That the SiO₂ network polymerizes during annealing was deduced from the results of the higher binding energies of Si2p and O1s after annealing. This observation suggests that the reduction of the Gibbs free energies and the relaxation of tensile stress result in the formation of the silver colloids under thermal annealing.     

Band bending at the Si(1 1 1)–SiO2 interface induced by low-energy ion bombardment

Experiments employing photoreflectance spectroscopy have uncovered band bending due to electrically active defects at the Si(1 1 1)–SiO₂ interface after sub-keV Ar⁺ ion bombardment. The band bending of about 0.5 eV resembles that for Si(1 0 0)–SiO₂, and both interfaces exhibit two kinetic regimes for the evolution of band bending upon annealing due to defects healing. The healing takes place about an order of magnitude more quickly at the (1 1 1) interface, however, probably because of less fully saturated bonding and higher compressive stress.     

Evolution of step-terrace structure at Si–SiO2 interface in SIMOX substrate during annealing

The step-terrace structures at the interface between the Si layer and the buried SiO₂ layer of a Separation by IMplanted OXygen substrate has been observed by using atomic force microscopy (AFM) after removing the SiO₂ and Si layers. The time evolution of the Si–SiO₂ interface roughness during high-temperature annealing was analyzed by the scaling analysis of AFM data. The correlation length exhibited a nice correspondence to the size of square domain structures. Decreasing in the index of the length scale indicates that the growth mechanism changes as the annealing proceeds.     

Structural changes in thin SiO2 on Si after RIE-like nitrogen plasma action

Reactive ion etching (RIE) damage effects on thin (13 nm) thermal SiO₂ on Si have been studied using X-ray photoelectron spectroscopy. It is found that 5 min exposure of the oxide to N₂ plasma operating in RIE-mode causes structural modifications which manifest only as a deterioration of the oxide quality but without actual nitridation of the oxide. The presence of a small (<10%) constant amount of SiO species through the oxide and a broadening of Si---SiO₂ interface transition region are detected as consequences from the RIE process.     

Amorphous Si/insulator multilayers grown by vacuum deposition and electron cyclotron resonance plasma treatment

a-Si/insulator multilayers have been deposited on (0 0 1) Si by electron gun Si evaporation and periodic electron cyclotron resonance plasma oxidation or nitridation. Exposure to an O or N plasma resulted in the formation of a thin SiO₂ and SiN_x layer whose thickness was self-limited and controlled by process parameters. For thin-layer (2 nm) Si/SiO₂ and Si/SiN_x multilayers no visible photoluminescence (PL) was observed in most samples, although all exhibited weak “blue” PL. For the nitride multilayers, annealing at 750°C or 850°C induced visible PL that varied in peak energy with Si layer thickness. Depth profiling of a-Si caps on thin insulating layers revealed no detectable contamination for the SiN_x layers, but substantial O contamination for the SiO₂ films.     

Competing thermal relaxation processes in response to intrinsic defects produced by exposing SiO2 to synchrotron radiation

Irradiation of SiO₂ with soft X-ray photons (hν>100 eV) produces a variety of defects, of which E₁′ centers and neutral Si–Si bonds are mainly responsible for the dielectric response change. The thermal processes that modify the structures around the defect sites have been investigated by in situ spectroscopic ellipsometry. Annealing the irradiated SiO₂ film diminishes the number of defects which are assigned to E₁′ centers by about half. The competing channels for annihilation of E₁′ centers are the recovery of the Si–O–Si bonding configuration and, in the opposite direction, the decomposition of the material into volatile products until the network is completely restructured. The other half of the defects are converted to Si–Si bond units and precipitates as nanocrystalline particles of Si.     

Visible and infrared photoluminescence from Er-doped SiOx

The annealing behaviors of photoluminescence of SiO_x and Er-doped SiO_x grown by molecular beam epitaxy in the wavelength range of visible and infrared light are studied. For SiO_x, four PL bands located at 510, 600, 716 and 810 nm, respectively, are observed. For Er-doped SiO_x, the 716 nm band, which is believed to be originated from the electron–hole recombination at the interface between crystalline Si and amorphous SiO₂, disappears in the annealing temperature range of 500–900°C. It is suggested the enhancement of Er luminescence is partially due to the energy transfer from the recombination at the interface between crystalline Si and SiO₂ to Er ions.     

Ion implantation induced stoichiometric imbalance in SiO2

Carrier trapping was studied to understand the displacement damage caused by ion implantation in SiO₂. Implantation causes local departures from stoichiometry due to different recoil behavior of Si and O atoms. To avoid chemical interaction with the oxide network noble gas implants were used. It is shown that a fraction of the defects is not removed even after extended high temperature treatment. Data on isochronal annealing steps and on the spatial distribution of the non-stoichiometry are given.     

THE INTERACTION OF Au AND THE Si/SiO2 INTERFACE DEFECT Hit(0.494)

The defects at the Si/SiO₂ interface have been studied by the deep-level transient spectroscopy (DLTS) technique in p-type MOS structures with and without gold diffusion. The experimental results show that the interaction of gold and Si/SiO₂ interface defect,H_it(0.494), results in the formation of a new interface de-fect, Au-H_it(0.445). Just like the interface defect, H_it(0.494), the new interface defect possesses a few interesting properties, for example, when the gate voltage applied across the MOS structure reduces the energy interval between Fermi-level and Si valence band of the Si surface to values smaller than the hole ionization Gibbs free energy of the defect, a sharp DLTS peak is still observable; and the hole apparent activation energy increases with the decrease of the Si surface potential barrier height. These properties can be successfully explained with the transition energy band model of the Si/SiO₂ interface.     

High field phenomena in thin plasma nitrided SiO2 films

The effects of high field tunnel electron injection on the electrical properties of Al - thin plasma nitrided SiO₂ films - Si (p-type) structures are studied. Under high field injection, it has been observed that electron trapping, positive charge generation near the Si-SiO₂ interface (slow states) and fast state generation at the Si-SiO₂ interface have taken place. After high temperature N₂ annealing, the nitridation induced electron trap density is considerably decreased. Furthermore, under high field injection the generation rate of both the slow states and the interface states and consequently, the degradation rate of the nitrided oxide films have been also decreased after annealing.     

Nanoparticle-induced multi-functionalization of silicon: A plug and play approach

Here, we demonstrate a “plug and play” approach to achieve multi-functionalization of Si. In this approach, externally synthesized functional nanoparticles are introduced onto device quality Si wafers and the surface chemical bonds are manipulated. Sonochemically synthesized Fe₂O₃ nanoparticles are introduced onto Si from an alcohol suspension. On annealing this sample in ultra-high vacuum, the oxygen atoms change the bonding partner from Fe to Si and desorb as SiO at 750 °C. This results in the formation of nanoparticles of Fe on the surface and exhibits ferromagnetic behavior. Deposition of a thin layer (2 nm) of Si onto the sample containing the metallic Fe nanoparticles followed by annealing at 560 °C leads to optically active Si. Photoluminescence measurements show that this sample emits light at three different wavelengths, namely 1.57, 1.61 and 1.63 μm, when excited by He–Ne or Ar lasers. Oxidation of this material results in the formation of a selective capping layer of SiO₂. Thus we obtain multi-functional Si in an “all in one” form and we believe that this approach is universal.     

A quantum chemical study of ZrO2 atomic layer deposition growth reactions on the SiO2 surface

Zirconium oxide (ZrO₂) is one of the leading candidates to replace silicon oxide (SiO₂) as the gate dielectric for future generation metal-oxide-semiconductor (MOS) based nanoelectronic devices. Experimental studies have shown that a 1–3 monolayer SiO₂ film between the high permittivity metal oxide and the substrate silicon is needed to minimize electrical degradation. This study uses density functional theory (DFT) to investigate the initial growth reactions of ZrO₂ on hydroxylated SiO₂ by atomic layer deposition (ALD). The reactants investigated in this study are zirconium tetrachloride (ZrCl₄) and water (H₂O). Exchange reaction mechanisms for the two reaction half-cycles were investigated. For the first half-reaction, reaction of gaseous ZrCl₄ with the hydroxylated SiO₂ surface was studied. Upon adsorption, ZrCl₄ forms a stable intermediate complex with the surface SiO₂–OH^* site, followed by formation of SiO₂–O–Zr–Cl^* surface sites and HCl. For the second half-reaction, reaction of H₂O on SiO₂–O–Zr–Cl^* surface sites was investigated. The reaction pathway is analogous to that of the first half-reaction; water first forms a stable intermediate complex followed by evolution of HCl through combination of a Cl atom from the surface site and an H atom from H₂O. The results reveal that the stable intermediate complexes formed in both half-reactions can lead to a slow film growth rate unless process parameters are adjusted to lower the stability of the complex. The energetics of the two half-reactions are similar to those of ZrO₂ ALD on ZrO₂ and as well as the energetics of ZrO₂ ALD on hydroxylated silicon. The energetics of the growth reactions with two surface hydroxyl sites are also described.     

Tetrakis(diethylamido) titanium (TDEAT) interactions with SiO2 and Cu substrates

X-ray photoelectron spectroscopy (XPS) is used to characterize the chemical interactions of tetrakis(diethylamido) titanium (TDEAT) with SiO₂ and Cu surfaces under ultrahigh vacuum (UHV) conditions. XPS studies show that TDEAT dissociatively chemisorbs on SiO₂ at room temperature or above, resulting in Ti---N bond scission, and Ti---O bond formation. No Ti carbide or Si carbide formation is observed. In the presence of co-adsorbed NH₃, Ti---N bond formation is enhanced and is stable at temperature up to 900 K in UHV. Continuous exposures of TDEAT on SiO₂ at 500 K produce both Ti oxides and nitride formation. The presence of an overpressure of NH₃ enhances Ti nitride formation. In contrast, TDEAT physisorbed on Cu at 120 K and annealed to 500 K results in desorption of Ti-containing species from the surface. Successive exposures of TDEAT on Cu at 500 K yield a Ti-alkyl reaction product. The presence of NH₃ does not significantly alter TDEAT interaction with Cu.     

Photoluminescence and paramagnetic defects in silicon-implanted silicon dioxide layers

Thermally grown SiO₂ layers on Si substrates implanted with Si⁺ ions with a dose of 6×10¹⁶ cm⁻² were studied by the techniques of photoluminescence, electron paramagnetic resonance (EPR), and low-frequency Raman scattering. Distinct oxygen-vacancy associated defects in SiO₂ and non-bridging oxygen hole centers were identified by EPR. The luminescence intensity in the 620 nm range was found to correlate with the number of these defects. The low-frequency Raman scattering technique was used to estimate the average size of the Si nanocrystallites formed after the implantation and thermal annealing at T>1100°C, which are responsible for the photoluminescence band with a maximum at 740 nm. The intensity of this band can be significantly enhanced by an additional treatment of the samples in a low-temperature RF plasma.