新型硅基IV族合金材料生长及光电器件研究进展(特邀)

硅基IV族锗锡和锗铅合金材料带隙随组分可调,并可转变成直接带隙半导体材料,是研制硅基红外探测和发光器件的理想材料。本文首先介绍锗锡和锗铅材料外延生长工作,然后对锗锡光电器件的研究进展进行回顾和讨论。其中,随着锗锡合金中锡组分增加,锗锡光电探测器往高响应度和长探测截止波长方向发展;锗锡激光器的研究则集中在降低激射阈值、提高激射温度和电泵浦方面。本文还对锗铅材料和光电器件的研究进展进行简要介绍和展望。随着硅基高效光源和探测器研究的不断深入,IV族合金材料在硅基红外光电集成领域将继续展现重要的应用价值。     

外延单晶薄膜的制备

一、引言由于外延单晶薄膜制备的成功,给器件制造提供了新的有用工艺技术。近年来用这一技术已制造出一些电子器件,他们具有独特的优越性能,例如饱和压降小,开关时间短等。这是外延生长单晶对器件的促进。但是由于器件的需要,对外延生长单晶薄膜又提出新的要求,例如不在锗上外延锗、硅上外延硅,而是在GaAs上外延锗,制成异质结,这样也促进了外延更广     

硅基混合集成技术的研究进展

硅基光电子集成技术(PICs)为高速宽带光互连和光通信的发展提供了一种低成本的有效方案,受到人们的高度重视.目前将III-V族和锗等半导体化合物集成到硅衬底的方法主要分为两类:异质结外延生长和异质材料的键合.低温下晶片键合的方法克服了异质结外延生长中的生长温度高、晶格失配和材料热膨胀系数非共容性的缺点,为大规模的异质(不同半导体材料)集成提供了可能.文章综述了近几年来一些常用的键合方法,并对低温键合方法的发展动向做了展望.     

硅基混合集成技术的研究进展

硅基光电子集成技术(PICs)为高速宽带光互连和光通信的发展提供了一种低成本的有效方案,受到人们的高度重视.目前将III-V族和锗等半导体化合物集成到硅衬底的方法主要分为两类：异质结外延生长和异质材料的键合.低温下晶片键合的方法克服了异质结外延生长中的生长温度高、晶格失配和材料热膨胀系数非共容性的缺点,为大规模的异质（不同半导体材料）集成提供了可能.文章综述了近几年来一些常用的键合方法,并对低温键合方法的发展动向做了展望.     

硅基III-V族量子点激光器的发展现状和前景

本文简要综述了硅基III-V族量子点激光器的研究进展. 在介绍了量子点激光器的优势和发展后, 重点介绍了近年来硅基、锗基III-V族量子点材料生长上的突破性进展及所带来的器件性能的大幅提高, 如实现了锗基和硅基1.3 μm InAs/GaAs量子点激光器的室温激射, 锗基量子点激光器的阈值电流低至55.2 A/cm²并可达60 ℃以上的连续激射, 通过锗硅虚拟衬底, 在硅基上实现了30 ℃下以16.6 mW的输出功率达到4600 h的激光寿命, 这些突破性的进展为硅基光电子集成打开了新的大门.     

700℃退火下铝调制镍硅锗薄膜的外延生长机理

文章研究了在700℃退火下,铝插入层调制镍和硅锗合金反应形成单相镍硅锗化物的生长机理.透射电镜测试结果表明,镍硅锗薄膜和硅锗衬底基本达到赝晶生长;二次质谱仪和卢瑟福沟道背散射测试结果表明,在镍硅锗薄膜形成的过程中,铝原子大部分移动到镍硅锗薄膜的表面.研究结果表明,铝原子的存在延迟了镍和硅锗合金的反应,镍硅锗薄膜的热稳定性和均匀性都得到了提高.最后,基于上述实验结果给出了铝原子调制形成外延镍硅锗薄膜的生长机理.     

硅(001)图形衬底上锗硅纳米线的定位生长

纳米线的定位生长是实现纳米线量子器件寻址和集成的前提.结合自上而下的纳米加工和自下而上的自组装技术,通过分子束外延生长方法,在具有周期性凹槽结构的硅(001)图形衬底上首先低温生长硅锗薄膜然后升温退火,实现了有序锗硅纳米线在凹槽中的定位生长,锗硅纳米线的表面晶面为(105)晶面.详细研究了退火温度、硅锗的比例及图形周期对纳米线形成与否,以及纳米线尺寸的影响.     

基于选区外延技术的单片集成阵列波导光栅与单载流子探测器的端对接设计

选区外延技术是实现有源与无源光器件单片集成的一种有效的工艺手段,但同时对两种器件在异质生长界面处的对接结构提出了更高的设计要求.本文通过选区外延技术实现了InP基O波段4通道阵列波导光栅与单载流子探测器的单片集成.通过光学仿真重点研究了选区外延后界面处形貌对无源波导结构与有源光探测器间光耦合效率的影响,包括伸长的光学匹配层、二次外延生长边界位置、波导刻蚀边界位置等因素.研究结果表明,在保证二次外延生长边界对准异质对接界面时,将光学匹配层伸出探测器前端10μm并与外延边界无缝对接既可以保证高效的光传输效率(或探测器量子效率),又可以避免外延界面处的异常生长对器件制备工艺的影响,保证生长工艺与器件制备工艺的兼容性.成功制备的单片集成芯片具有高达76%的探测器量子效率,证明了对接方案的有效性.同时,集成芯片的低串扰(-22 dB)与解复用特性展示出其作为解复用光接收芯片具有巨大潜力.     

新型硅基异质结和量子阱红外探测器

介绍了近年来新发展起来的几种硅基远红外探测器件，其中包括硅化物／Ｇｅｘｓｉ１－ｘ肖特基势垒型探测器，锗硅异质结内光电发射探测器，锗硅／硅多量子阱型探测器和δ掺杂阱型探测器，并就这些器件的工作原理及影响其响应率，截止波长和工作温度的因素分别进行了讨论和比较。     

椭圆偏振光谱表征单晶硅衬底上生长的非晶硅和外延硅薄膜

本文采用射频等离子体增强化学气相沉积(rf-PECVD)技术在单晶硅衬底上沉积了两个系列的硅薄膜. 通过对样品进行固定角度椭圆偏振测试, 结果表明第一个系列硅薄膜为非晶硅, 形成了突变的a-Si:H/c-Si异质结构, 此结构在HIT电池中有利于形成好的界面特性, 对于非晶硅薄膜采用通常的Tauc-Lorentz摇摆模型(Genosc)拟合结果很好; 第二个系列硅薄膜为外延硅, 对于外延硅薄膜, 随着膜厚增加晶化率降低, 当外延硅薄膜厚度为46 nm时开始非晶硅生长. 对于外延硅通常采用EMA模型(即将硅薄膜体层看成由非晶硅和c-Si构成的混合层)拟合结果较好, 当硅薄膜中出现非晶硅生长时, 将体层分成混合层和非晶硅两层, 采用三层模型拟合结果很好. 本文证实了椭偏光谱分析采用不同的模型可对单晶硅衬底上不同结构的硅薄膜进行有效表征.     

Interface effect on structural and electronic properties of graphdiyne adsorbed on SiO_2 and h-BN substrates:A first-principles study

We use the first-principles calculation method to study the interface effect on the structure and electronic properties of graphdiyne adsorbed on the conventional substrates of rough SiO2 and flat h-BN. For the SiO2 substrate, we consider all possible surface terminations, including Si termination with dangling bond, Si terminations with full and partial hydrogenation, and oxygen terminations with dimerization and hydrogenation. We find that graphdiyne can maintain a flat geometry when absorbed on both h-BN and SiO2 substrates except for the Si termination with partial hydrogenation(Si-H) SiO2 substrate. A lack of surface corrugation in graphdiyne on the substrates, which may help maintain its electronic band character, is due to the weak Van der Waals interaction between graphdiyne and the substrate. Si-H SiO2 should be avoided in applications since a covalent type bonding between graphdiyne and SiO2 will totally vary the band structure of graphdiyne.Interestingly, the oxygen termination with dimerization SiO2 substrate has spontaneous p-type doping on graphdiyne via interlayer charge transfer even in the absence of extrinsic impurities in the substrate. Our result may provide a stimulus for future experiments to unveil its potential in electronic device applications.     

Massive transfer of vertically aligned Si nanowire array onto alien substrates and their characteristics

Si nanowires (NWs) are promising materials for future electronic, photovoltaic, and sensor applications. So far the Si NWs are mainly formed on particular substrates or at high temperatures, greatly limiting their application flexibility. Here we report a low temperature process for forming and massively transferring vertically aligned Si NWs on alien substrates with a large density of about (3-5) × 10⁷ NWs/mm². The X-ray diffraction spectrum reveals that the transferred NWs exhibit almost the same crystal property as the bulk Si. Our investigation further shows that the transferred NWs have exceptional optical characteristics. The transferred Si NWs of 12.14 μm exhibit the transmittance as low as 0.3% in the near infrared region and 0.07% in the visible region. The extracted absorption coefficient of Si NWs in the near infrared region is about 3 × 10³ cm⁻¹, over 30 times larger than that of the bulk Si. Because of the low temperature process, it enables a large variety of alien substrates such as glass and plastics to be used. In addition, the exceptional properties of the transferred NWs offer potential applications for photovoltaic, photo-detectors, sensors, and flexible electronics.     

Al-Induced Crystallization Growth of Si Films by Inductively Coupled Plasma Chemical Vapour Deposition

Polycrystalline Si （poly-Si） films are in situ grown on Al-coated glass substrates by inductively coupled plasma chemical vapour deposition at a temperature as low as 350℃. Compared to the traditional annealing crystalliza- tion of amorphous Si/Al-layer structures, no layer exchange is observed and the resultant poly-Si film is much thicker than Al layer. By analysing the depth profiles of the elemental composition, no remains of A1 atoms are detected in Si layer within the limit （〈0.01 at.%） of the used evaluations. It is indicated that the poly-Si material obtained by Al-induced crystallization growth has more potential applications than that prepared by annealing the amorphous Si/Al-layer structures.     

不同厚度衬底上矩形孔金属结构的太赫兹透射特性数值分析

利用时域有限差分法对不同材料和厚度衬底上矩形孔金属结构太赫兹（THz）波的透射特性进行了数值分析。研究表明：矩形孔金属阵列对THz光谱具有频率选择特性,这为太赫兹滤波功能器件的开发提供了基础。在实际应用中,这种金属微结构常常需要制备在某种衬底上,而衬底材料及厚度无疑会对其太赫兹透射特性带来影响。研究了不同衬底材料和衬底厚度的矩形孔金属结构太赫兹透射性质,通过数值模拟研究发现,对于同一种衬底材料,随着衬底厚度的增加,矩形孔金属结构的透射峰峰位向低频移动。比较高阻硅和聚四氟乙烯两种衬底材料发现,高介电常数的硅衬底引起的透射峰移动更为明显。     

Si衬底GaN基LED的结温特性

结温是发光二极管的重要参数之一,它对器件的内量子效率、输出功率、可靠性及LED的其他一些性能有很大的影响。首次报道Si衬底GaN基LED的结温特性。利用正向压降法测量Si衬底上GaN基LED的结温,通过与蓝宝石衬底上GaNLED的结温比较,发现Si衬底GaNLED有更低的结温,原因归结为Si有更好的导热性。同时也表明:用Si作GaNLED的衬底在大功率LED方面具有更大的应用潜力。     

Growth of carbon nanotubes on stainless steel substrates by DC-PECVD

We report on the fabrication of carbon nanotubes (CNTs) on Ni-coated stainless steel (SUS) substrates by using dc plasma enhanced chemical vapor deposition. The synthesized CNTs have the diameter of about 30 nm and the length of about 1.2 μm. To verify the effects of SUS substrates on the growth of CNTs, CNTs had also been grown on Ni-coated Si substrates. CNTs grown on the SUS substrates were more uniform compared with those grown on the Si substrates. Field emission properties of the CNT films were measured in the diode configuration, and the turn-on electric field of 3.87 V/μm and field enhancement factor β of about 1737 were obtained from the synthesized CNTs at the gap of 500 μm between the SUS substrate and the anode. These results have not only clarified the effects of the substrate on the growth of CNTs, but also shown the potential of CNTs in field emission applications, especially CNT-based cold-cathode X-ray tubes.     

Characteristics of AlGaN/GaN high electron mobility transistors on metallic substrate

We have successfully prepared GaN based high electron mobility transistors(HEMTs)on metallic substrates transferred from silicon substrates by electroplating technique.GaN HEMTs on Cu substrates are demonstrated to basically have the same good electric characteristics as the chips on Si substrates.Furthermore,the better heat dissipation of HEMTs on Cu substrates compared to HEMTs on Si substrates is clearly observed by thermoreflectance imaging,showing the promising potential for very high-power and high-temperature operation.This work shows the outstanding ability of HEMT chips on Cu substrates for solving the self-heating effect with the advantages of process simplicity,high yield,and low production requirement.     

SiC based Si/SiC heterojunction and its rectifying characteristics

The Si on SiC heterojunction is still poorly understood, although it has a number of potential applications in electronic and optoelectronic devices, for example, light-activated SiC power switches where Si may play the role of an light absorbing layer. This paper reports on Si films heteroepitaxially grown on the Si face of (0001) n-type 6H-SiC substrates and the use of B₂H_6 as a dopant for p-Si grown at temperatures in a range of 700--950~\du. X-ray diffraction (XRD) analysis and transmission electron microscopy (TEM) tests have demonstrated that the samples prepared at the temperatures ranged from 850~℃ to 900~℃ are characterized as monocrystalline silicon. The rocking XRD curves show a well symmetry with FWHM of 0.4339° Omega. Twin crystals and stacking faults observed in the epitaxial layers might be responsible for widening of the rocking curves. Dependence of the crystal structure and surface topography on growth temperature is discussed based on the experimental results. The energy band structure and rectifying characteristics of the Si/SiC heterojunctions are also preliminarily tested.     

Room-temperature pulsed laser deposition and dielectric properties of amorphous Bi3.95Er0.05Ti3O12 thin films on conductive substrates

Bi_3.95Er_0.05Ti₃O₁₂ (BErT) thin films were prepared on Pt/Ti/SiO₂/Si and indium-tin-oxide (ITO)-coated glass substrates at room temperature by pulsed laser deposition. These thin films were amorphous with uniform thickness. Excellent dielectric characteristics have been confirmed. The amorphous BErT thin films deposited on the Pt/Ti/SiO₂/Si and ITO-coated glass substrates exhibited almost the same dielectric constant of 52 with a low dielectric loss of less than 0.02 at 1 kHz. Meanwhile, the dielectric properties of the thin films had an excellent bias voltage stability and thermal stability. The amorphous BErT thin films might have potential applications in microelectronic and optoelectronic devices.     

A complete Raman mapping of phase transitions in Si under indentation

Crystalline Si substrates are studied for pressure‐induced phase transformation under indentation at room temperature (RT) using a Berkovich tip. Raman spectroscopy, as a nondestructive tool, is used for the identification of the transformed phases. Raman lines as well as area mapping are used for locating the phases in the indented region. Calculation of pressure contours in the indented region is used for understanding the phase distribution. We report here a comprehensive study of all the phases of Si, reported so far, leading to possible understanding of material properties useful for possible electromechanical applications. As a major finding, distribution of the amorphous phase in the indented region deviates from the conventional wisdom of being in the central region alone. We present phase mapping results for both Si(100) and Si(111) substrates. Copyright © 2009 John Wiley & Sons, Ltd.