二维红外相关光谱在双氰胺固化环氧树脂体系中的应用

利用原位红外加热炉模拟双氰胺固化环氧树脂体系的固化反应过程,实时测试并记录反应过程中官能团结构的变化;将一维红外光谱和二维红外光谱相结合进行分析,给出固化过程中各官能团的变化顺序和趋势。 在双氰胺固化环氧树脂体系中,双氰胺首先分解成氰基胺,然后再和环氧树脂发生开环加成反应,生成亚胺结构,通过重排生成酰胺结构。 双氰胺分解为氰基胺的反应是可逆反应。 将原位红外、一维红外与二维红外三者结合是阐明热固性树脂固化反应机理的非常有效的手段。     

取代脲促进环氧树脂／双氰胺固化体系反应机理

双氰胺作为环氧树脂的固化剂，由于固化产物具有优良的机械和电性能，广泛应用在汽车、航天及电子等领域中．但由于其固化温度高达180C以上，使应用范围受到很大限制．专利文献曾报道晚衍生物作为环氧树脂／双氰胺固化体系的促进剂，可以使体系的固化温度降低到130～140oC，并且在室温下仍保持一定的潜伏性［‘，’］．在以往的研究中，认为取代脉的促进作用在于其与环氧发生反应生成环状化合物2一心竣烷酮和仲胺，仲胺与环氧基进一步反应生成的叔胺可以催化环氧发生阴离子聚合［’～’］．实验表明，环氧树脂／双氰胺／取代脉体系的固化温…     

DAIP改性环氧树脂研究

采用共固化的方法,得到酚醛环氧树脂(F-51)和间苯二甲酸二烯丙基酯(DAIP)的共固化树脂。实验结果表明:DAIP的加入降低了F-51环氧树脂的粘度[体系粘度为150～350mPa·s(25℃)],利于工艺操作;提高了F-51环氧树脂的耐热性,热变形温度达200℃。研究了F-51环氧树脂和DAIP共固化的固化行为、不同配比对共固化物形态结构的影响;并研究了不同配比对固化物耐热性的影响。     

氨酯键扩链改性的669稀释剂对环氧树脂力学性能影响研究

制备了氨酯键扩链改性的669稀释剂UE6M,考察了加入不同用量的UE6M对环氧树脂进行稀释后环氧树脂混合体系的粘度变化。使用氰乙基化三乙烯四胺作为固化剂对环氧树脂混合体系进行固化,研究了UE6M的用量对环氧树脂混合体系固化物性能的影响。研究结果表明,UE6M对E51环氧树脂具有较好的稀释效果,且混合体系固化产物的韧性较纯环氧树脂固化物明显增强:UE6M用量为30%和40%的混合体系粘度仅为纯E51环氧树脂粘度的6.35%和1.43%,但其固化物的拉伸强度均在60MPa以上,分别为纯E51环氧树脂固化物的87.9%和80.9%。断裂伸长率均为纯环氧树脂固化物的8倍以上,弯曲应变为纯环氧树脂固化物2倍以上,弯曲强度及弯曲模量等未出现大幅下降,UE6M稀释剂加入环氧树脂后固化产物的韧性得到明显增强。     

动态固化聚丙烯/环氧树脂共混物的研究

将动态硫化技术应用于热塑性树脂 热固性树脂体系 ,制备了动态固化聚丙烯 (PP) 环氧树脂共混物 .研究了动态固化PP 环氧树脂共混物中两组分的相容性、力学性能、热性能和动态力学性能 .实验结果表明 ,马来酸酐接枝的聚丙烯 (PP g MAH)作为PP和环氧树脂体系的增容剂 ,使分散相环氧树脂颗粒变细 ,增加了两组分的界面作用力 ,改善了共混物的力学性能 .与PP相比 ,动态固化PP 环氧树脂共混物具有较高的强度和模量 ,含 5 %环氧树脂的共混物拉伸强度和弯曲模量分别提高了 30 %和 5 0 % ,冲击强度增加了 15 % ,但断裂伸长率却明显降低 .继续增加环氧树脂的含量 ,共混物的拉伸强度和弯曲模量增加缓慢 ,冲击强度无明显变化 ,断裂伸长率进一步降低 .动态力学性能分析 (DMTA)表明动态固化PP 环氧树脂共混物是两相结构 ,具有较高的储能模量 (E′)     

含羧基硅氧烷的制备及其固化动力学研究

通过氯丙基甲基硅氧烷与过量的对苯二甲酸的缩合反应制备了一种新型的含羧基硅氧烷(CCS),CCS可以同双酚A型环氧树脂固化,根据Kissinger和Crane方程,用差热分析(DSC)对CCS和环氧树脂组合物的固化性能进行了分析。分析结果表明组合物固化反应的表观活化能为71.41 kJ.mol-1,反应级数为0.911;还给出了加热速度为10℃.min-1时的固化反应方程。     

环氧树脂/聚碳酸酯固化共混物的结构及性能

相结构;酯交换反应;力学性能;环氧树脂/聚碳酸酯固化共混物的结构及性能     

环氧树脂共混物相结构的调控方法研究

研究了环氧树脂(E51)/聚砜(PSF)共混物相结构的控制方法.通过抑制相分离、控制预固化的反应程度控制环氧树脂的分子量,固化后可获得不同的共混物相结构.依据红外测定的固化反应程度设定固化程序,可有效控制共混物的相结构.加入促进剂三氟化硼-乙基胺(BTF-EA)可提高固化反应速度,使相分离结构在早期被抑制,以获得小微区的相结构.     

氨基聚硅氧烷对改性环氧树脂的形态与性能的影响

将带有Ｎ－（β－氨乙基）－γ－氨丙基侧基的聚二甲基硅氧烷与环氧树脂共混,制备了聚硅氧烷改性环氧树脂固化物。研究了氨基聚硅氧烷的氨基含量对改性环氧树脂的形态和性能的影响。结果表明,改性环氧树脂固化物的形态与性能主要依赖于氨基聚硅氧烷的氨基含量,在环氧树脂中引入适宜氨基含量的氨基聚硅氧烷,可在一定程度上降低其模量,提高其柔性,并可明显改善环氧树脂的表面性能。     

电子束辐射固化环氧树脂的动态力学分析——树脂化学结构、分子量及其分布的影响

应用不同化学结构、分子量及其分布的环氧树脂进行了电子束辐射固化实验 ,对固化物进行了动态力学分析 ,研究了不同样品凝胶含量、内耗tanδ及动态模量的变化规律 .分析结果表明环氧树脂辐射反应活性与其化学结构有很大关系 ,酚醛型环氧树脂的辐射反应活性高 ,固化后高温模量及玻璃化温度较高 ,而脂环族环氧树脂反应活性小 .在低辐射剂量下 ,环氧树脂的固化度随分子量增大略有下降 ,但固化物的玻璃化温度随分子量增加而升高 .增大辐射剂量 ,树脂固化度的提高受分子量大小的影响很小 ,分子量较大样品的网络均匀程度有所提高 ,在较高反应程度下 ,玻璃化温度主要受固化度影响 .树脂固化程度也是决定其模量高低的主要因素 ,而在固化程度相近的情况下 ,分子量的影响作用很大 .在同样辐射剂量下 ,分子量分布宽的树脂固化反应程度高 ,但交联网络均匀性低 .     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

基于可逆动态共价化学的新型可修复、可回收、可加工环氧树脂

利用生物来源的二聚脂肪酸为原料,合成了二聚酸酰肼和二聚酸酰腙两种衍生物,并进一步以其作为环氧E-44树脂固化剂,得到了新型的含动态共价连接的热固性环氧树脂。采用傅里叶红外光谱(FT-IR)、差式扫描量热(DSC)、扫描电子显微镜(SEM)、热重(TG)和动态力学分析(DMA)等多种测试手段对环氧树脂固化过程以及固化后材料的结构与性能关系进行了详细表征,特别研究了动态亚胺键对热固性环氧树脂性能的独特影响。结果表明:与传统环氧树脂相比,改性后的环氧树脂有更好的韧性,且其玻璃化转变温度及热稳定性没有明显下降。在升温和加压的条件下,酸可催化亚胺键的动态交换反应,赋予传统环氧树脂以全新的可修复、可回收与可多次加工性能。     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Mechanism of the tertiary amine-catalyzed dicyandiamide cure of epoxy resins

Infrared and NMR data on tertiary amine-catalyzed, dicyandiamide—epoxy resin (and model compound) systems have been utilized to elucidate the mechanism of the curing process. The early exothermic curing reaction is shown to be ring opening of the resin epoxy groups by dicyandiamide imino and amino anionic species, giving rise to N-alkyl cyanoguanidines; a minor amount of polyether formation also occurs at this time. After the exothermic reaction is essentially complete at <90°C., a slow, high temperature (110–200°C.) addition of hydroxyl hydrogen across the nitrile triple bond occurs, giving rise to an imino ether which then rearranges to the guanyl urea.     

Study on the chemical modification of epoxy/anhydride thermosets using a hydroxyl terminated hyperbranched polymer

Mixtures of diglycidylether of bisphenol A (DGEBA) resin and commercially available hyperbranched polyester (HBP) Boltorn H30 were cured by anhydride to covalently bond the hydroxyl end groups in HBP with the epoxy resin. The curing mixtures were investigated by Differential Scanning Calorimetry (DSC) to study the curing evolution and to evaluate the kinetic parameters. DSC studies suggested that HBP could increase the curing rate of epoxy/anhydride systems at low conversions, but it produced a decelerative effect in the last stages of the curing. The influence of the HBP content and the proportion of anhydride on the curing conversions were discussed in detail. The addition of a tertiary amine was proved to decrease the curing temperatures. By Fourier Transform Infrared Spectroscopy (FTIR) the reaction of hydroxyl groups during the whole process was confirmed. By the determination of the conversion at the gelation, we could prove that it increased on increasing the proportion of HBP in the reactive mixture. By Thermomechanical Analysis (TMA) we could determine a reduction of the shrinkage after gelation.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

Morphologic and kinetic study of an epoxy-poly(ethyleneoxide) system. The fluorescence to predict miscibility

The kinetic of the curing process in the ethylenediamine (EDA)-poly (bisphenol A-co-epichlorohydrin) glycidyl end-capped (DGEBA) mixture modified with poly(ethylene oxide) (PEO) was studied. The epoxy component was labeled with a fluorescence group (dansyl) treating the DGEBA with the reactive dansyl derivative DNS-EDA. Dynamic DSC experiments were carried out and from their results the effect of the PEO composition on the epoxy curing was discussed. Furthermore, the effect of cure temperature and PEO composition on the morphology and crystallinity of the blend were studied as well. The morphologic study was carried out using complementarily optical transmission (TOM) and epifluorescence (EFM) microscopy. It was observed that: i) the addition of a non-reactive thermoplastic leads to a dilution effect of the reactive groups and therefore a decrease of the epoxy amine reaction rate; ii) the PEO composition does not seem to affect the non catalyzed process of the epoxy curing, while an increase in the PEO fraction within the epoxy/PEO mixture seems to change the mechanism of the cure reaction; iii) dynamic DSC scans, TOM and EFM images and steady state fluorescence spectra of the cured samples suggest that when the curing temperature increases there is an increase in the miscibility between PEO and the epoxy-amine reaction mixture; and iv) a reduction in the PEO/cured epoxy miscibility as the fraction of PEO increases was observed.     

Modified epoxy coatings on mild steel: Tribology and surface energy

A commercial epoxy diglycidylether of bisphenol-A (DGEBA) was modified by adding fluorinated poly(aryl ether ketone) fluoropolymer and in turn metal micro powders (Ni, Al, Zn, and Ag) and coated on mild steel. Two curing agents were used; triethylenetetramine (a low temperature curing agent) and hexamethylenediamine (a high temperature curing agent) for understanding the curing temperature effect on the properties. Variations in tribological properties (dynamic friction and wear) and surface energies with varying amounts of metal powders and curing agents were evaluated. When cured at 30 °C, dynamic friction and wear decrease significantly due to phase separation reaction being favored between the fluoropolymer and the epoxy. However, when cured at 80 °C, friction and wear increase; this can be explained in terms of a crosslinking reaction favored at that temperature. There is a significant decrease in surface energies with the addition of modifiers.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

Synthesis of raspberry-like monodisperse magnetic hollow hybrid nanospheres by coating polystyrene template with Fe(3)O(4)@SiO(2) particles

A new inorganic/organic hybrid material containing silsesquioxane was prepared by the reaction of caged octa (aminopropyl silsesquioxane) (POSS-NH(2)) with n-butyl glycidyl ether (nBGE) and 1,4-butanediol diglycidyl ether (BDGE). The copolymers of POSS, nBGE, and BDGE could be obtained with varied feed ratio of POSS-NH(2), nBGE, and BDGE in the preparation. The hybrid material was added into an epoxy resin (E51) for enhancing the toughening and thermal properties of the epoxy resin. The results showed that the toughening and the thermal properties of the cured epoxy resin were greatly improved by the addition of the hybrid. The enhancement was ascribed to nano-scale effect of the POSS structure and the formation of anchor structure in the cured network. The investigation of kinetics for the curing process of the hybrid-modified epoxy resin revealed that two kinds of curing reactions occurred in different temperature ranges. They were attributed to the reactions between amino groups of the curing agent with epoxy groups of E51 and with residue epoxy groups in the hybrid. The reacting activation energies were calculated based on Kissinger's and Flynn-Wall-Ozawa's methods, respectively.