共查询到19条相似文献,搜索用时 62 毫秒
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采用苯胺,过(二)硫酸铵(NH4)2S2O8、硝酸银AgNO3、甲醛、十二烷基苯磺酸钠等为原料,合成了银-DBSA掺杂的聚苯胺。最佳合成的具体条件:反应温度在0~5℃下,苯胺、(NH4)2S2O8和十二烷基本磺酸钠摩尔比为4:4:1,加入的AgNO3的物质的量为苯胺的10%,反应4.5小时后,再加适量的甲醛还原得到银-DBSA掺杂聚苯胺。样品的IR光谱表明,通过还原后峰型和峰位都发生了明显的变化。样品的XRD分析知,银-DBSA掺杂聚苯胺有很强的金属元素银的峰,样品的SEM表明,还原得到的银-DBSA掺杂聚苯胺的颗粒度更小,且有许多银白色的银粒分散在高聚物大分子中。样品的TG热分析表明,银-DBSA掺杂聚苯胺在420℃以下是很稳定的,说明掺入银后的聚苯胺的热稳定性得到了显著的增强。用四探针电阻仪测试样品的电导率约为14S/cm,因此它是很有希望用于全印制电路技术的新材料。 相似文献
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聚苯胺导电纤维对电磁屏蔽效能的影响 总被引:1,自引:0,他引:1
张瑞刚 《电子材料与电子技术》2009,(1)
本文介绍了聚苯胺导电纤维对电磁屏蔽效能的影响。聚苯胺(PANI)是最重要的导电聚合物之一,金属材料与导电聚苯胺复合形成屏蔽组分有效提高了复合电磁屏蔽材料的高频电磁屏蔽效能,从而扩展了屏蔽材料的屏蔽带宽。本文分析了复合电磁屏蔽材料中聚苯胺导电纤维对屏蔽效能的贡献及作用机理。结果表明聚苯胺与基体树脂相溶形成基体导电网络,有效阻碍了高频电磁波的穿透,是提高高频电磁屏蔽效能的主要原因。 相似文献
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详细介绍了聚苯胺纳米材料的结构和各种合成方法,并进行了分类,如化学氧化聚合法、电化学聚合法、辐射合成法、声化学聚合法、物理聚合法和酶催化聚合法等。分析了各种合成方法的起源、发展以及最新的研究成果。总结了不同制备方法的优点和不足。综述了聚苯胺纳米材料在传感器、电磁屏蔽和金属防腐等领域的应用。同时,对聚苯胺合成研究的发展方向进行了展望:常用的化学氧化合成法虽能通过控制反应条件,合成多种具有独特形貌的聚苯胺纳米材料,但产量较小,不利于其应用性能研究。因此,优化化学氧化聚合法的反应条件,使其能够大规模生产具有特定形貌的聚苯胺纳米材料必将成为研究热点。 相似文献
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基于电子标签天线对导电性要求较高的特性,实验以自制Ag作为导电填料。论文采用液相化学还原法,以次磷酸钠为还原剂,还原硝酸银制备纳米银胶。通过控制反应条件(温度、pH值等)、反应物的量(六偏磷酸钠、PVP),制备出粒径分布均匀、分散稳定性优良的纳米银胶。通过向银胶中添加电解质,析出纳米银粉,加上适量的助剂、溶剂和分散剂,制备了水性丙烯酸树脂和水性聚氨酯基导电油墨。分析了影响油墨导电性能的各影响因素。 相似文献
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本文介绍了导电胶的组成和特点及其在印制板中的应用,如用于在多层板内层埋入电阻,多层板层间互连,在底板上印刷线路等.阐述了银导电胶和铜导电胶在印制电路板应用中各自的优缺点及其应用的可能性. 相似文献
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Jongjang Park Hyungsoo Yoon Geonhee Kim Byeongmoon Lee Seunghwan Lee Sujin Jeong Taehoon Kim Jiseok Seo Seungjun Chung Yongtaek Hong 《Advanced functional materials》2019,29(34)
Inkjet and transfer printing processes are combined to easily form patterned poly(3,4‐ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) films as top anodes of all solution–processed inverted polymer light emitting diodes (PLEDs) on rigid glass and flexible plastic substrates. An adhesive PEDOT:PSS ink is formulated and fully customizable patterns are obtained using the inkjet printing process. In order to transfer the patterned PEDOT:PSS films, adhesion properties at interfaces during multistep transfer printing processes are carefully adjusted. The transferred PEDOT:PSS film on the plastic substrates shows not only a sheet resistance of 260.6 Ω/□ and a transmittance of 92.1% at 550 nm wavelength but also excellent mechanical flexibility. The PLEDs with spin‐coated functional layers sandwiched between the transferred PEDOT:PSS top anodes and inkjet‐printed Ag bottom cathodes are fabricated. The fabricated PLEDs on the plastic substrates show a high current efficiency of 10.4 cd A?1 and high mechanical stability. It is noted that because both Ag and PEDOT:PSS electrodes can be patterned with a high degree of freedom via the inkjet printing process, highly customizable PLEDs with various pattern sizes and shapes are demonstrated on the glass and plastic substrates. Finally, with all solution process, a 5 × 7 passive matrix PLED array is demonstrated. 相似文献
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Ohmic heating was demonstrated as a novel curing method (or curing enhancement) useful in decreasing the resistivity of conductive traces printed with both micro- and nanoparticle-loaded inks while (1) only locally heating the substrate and (2) curing in a matter of seconds compared with the range of 30?min to 1?h required by traditional oven-curing. In one experiment using traces composed of microparticle ink, which required initial air-drying as a preprocess step, application of an ohmic curing cycle resulted in resistivity of 80?n???m, roughly six times that of bulk silver. In a second experiment employing nanoparticle inks, which required an initial thermal cure as a preprocess, a resistivity of 43?n???m, roughly three times that of bulk silver, was attained after the application of an ohmic curing cycle. Electrical characterization of the ohmic curing process was performed in real time to understand the impact of cycling and duration on the resulting conductivity. Finally, the effect of printed trace length on the ohmic curing process was explored and found to have a near-linear relationship with the reduction in resistance when the applied electrical current was normalized to measured resistance. The microstructural changes which occurred as a result of ohmic curing such as particle sintering and grain growth were characterized by scanning electron microscopy. The results presented in this work demonstrate the use of ohmic heating to overcome temperature limitations imposed on a thermal curing process by substrate material properties or other sources. 相似文献
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中国印制电路行业协会CPCA是国家工业和信息化部领导的,由国家民政部批准的国家一级行业协会,行业涵盖印制电路板、覆铜箔板及原辅材料、专用设备和电子贴装装连SMT、电子服务EMS。日本的JPCA、美国的IPC、欧洲的EIPC、印度的IPCA、韩国的KPCA都已更名为电子电路行业协会。 相似文献
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离心清洗在印制电路板清洗中的应用 总被引:1,自引:0,他引:1
良好的清洗方法对产品的长期可靠性有具非常关键的作用。离心清洗的作用力可作用于元器件和电路板之间的任何空间,清洗作用力均匀,清洗洁净度高,清洗效果好,有效去除PCB残留物。离心清洗对元器件无损伤,满足高精度高可靠性PCB清洗要求。主要介绍了新型的离心清洗方法。 相似文献
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主要从元器件在PCB上的布局、PCB上导带的布置两个方面阐述了印制电路板在设计时应遵循的原则,并进行了分析。 相似文献