Electric and ferroelectric properties of PZT/BLT multilayer films prepared by photochemical metal-organic deposition

The electric and ferroelectric properties of lead zirconate titanate (PZT) and lanthanum-substituted bismuth titanate (BLT) multilayer films prepared using photosensitive precursors were characterized. The electric and ferroelectric properties were investigated by studying the effect of the stacking order of four ferroelectric layers of PZT or BLT in 4-PZT, PZT/2-BLT/PZT, BLT/2-PZT/BLT, and 4-BLT multilayer films. The remnant polarization values of the 4-BLT and BLT/2-PZT/BLT multilayer films were 12 and 17 μC/cm², respectively. Improved ferroelectric properties of the PZT/BLT multilayer films were obtained by using a PZT intermediate layer. The films which contained a BLT layer on the Pt substrate had improved leakage currents of approximately two orders of magnitude and enhanced fatigue resistances compared to the films with a PZT layer on the Pt substrate. These improvements are due to the reduced number of defects and space charges near the Pt electrodes. The PZT/BLT multilayer films prepared by photochemical metal-organic deposition (PMOD) possessed enhanced electric and ferroelectric properties, and allow direct patterning to fabricate micro-patterned systems without dry etching.     

不同衬底上Pb(Zr0.52Ti0.48)O3择优取向铁电薄膜的制备和研究

通过MOD法在Si(100)和Pt(111)/Ti/SiO₂/Si基片上制备出LaNiO₃ ( LNO)薄膜.再通过修 正的Sol-gel法，在Pt(111)/Ti/SiO₂/Si,LNO/Si(100)和LNO/Pt/Ti/SiO_{2< /sub>/Si三种衬底上 制备出具有择优取向的Pb(Zr0.52Ti0.48)O3铁电薄膜. 经XRD分析表明，L NO薄膜具有(100)择优取向的类钙钛矿结构；PZT薄膜均具有钙钛矿结构，且在Pt(111)/Ti/S iO2/Si衬底上的薄膜以(110)择优取向，在LNO/Pt/Ti/SiO2/Si和LN O/Si(100)衬底上的 薄膜以(100)择优取向.经场发射SEM分析和介电、铁电性能测试表明，在LNO/Si和LNO/Pt/Ti /SiO2/Si衬底上的PZT薄膜的平均粒径、介电常数以及剩余极化强度均比以Pt/T i/SiO2/Si为衬底的薄膜大. 关键词： 3}薄膜')" href="#">LaNiO₃薄膜 PZT铁电薄膜 择优取向 剩余极化强度     

Study of elemental and phase composition of PZT thin films by auger depth profiling

The composition of PZT thin films deposited by diode HF sputtering of a ceramic target on Pt/Ti/SiO₂/Si substrates was studied. The remanent polarization of grown films was to 22 μC/cm². A technique for verifying the adequacy of elemental and phase composition of thin films to the ferroelectric phase composition was proposed. The problems of reliable contact of Pt electrodes with the PZT layer were considered.     

不同晶化工艺对非晶PZT纳米薄膜形核取向生长机理的影响

射频磁控溅射法室温下在Pt/Ti/SiO2/Si上制备非晶Pb(Zr048Ti052)O3薄膜，非晶PZT薄膜分别经常规炉退火(CFA)处理和快速热退火(RTA)处理晶化为（100），（111）不同择优取向的多晶薄膜. 采用x射线衍射测定了薄膜相组分、择优取向度；用原子力显微镜和压电响应力显微镜观察了薄膜表面形貌，以及对应区域由自发极化形成的铁电畴像，观察了不同取向薄膜的电畴分布特征. 结果表明，RTA晶化过程钙钛矿结构PZT结晶主要以PZT/Pt界面处的PtPb化合物为成核点异质形核并类似外延的结晶生长，沿界面结晶速率远大于垂直膜面结晶速率，而CFA晶化样品成核发生在膜内杂质缺陷处，以同质成核为主. 不同的成核机理导致了不同晶面择优取向生长. 关键词： PZT薄膜 结晶 形核 力显微技术     

Texture control of Pb(Zr, Ti)O3 thin films with different post-annealing processes

The non-crystalline Pb(Zr, Ti)O₃ thin films sputtered on Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates at room temperature were crystallized by conventional furnace annealing (CFA) and rapid thermal annealing (RTA), respectively. It was found that the RTA process favored the (1 1 1)-preferred orientation in lead zirconate titanate (PZT) thin films while the CFA process favored the (1 0 0)-preferred orientation. The origin of the different orientation selection might be due to the different epitaxial nucleation mechanism. The long heating duration would lead to the aggregation of Pb and the formation of PbO(1 0 0) on film surface; therefore, the nucleation at the PbO(1 0 0)/PZT interface on film surface might lead to the (1 0 0)-preferred orientation. However, the nucleation at the PZT/Pt(1 1 1) electrode interface by RTA process would result in the formation of (1 1 1)-preferred orientation. The RTA-derived (1 1 1)-preferentially oriented PZT thin films exhibited a high remnant polarization of 35 μC/cm².     

(111)取向生长Pb(Zr0:95Ti0:05)O3纳米晶薄膜的铁电与热释电特性

" 在Pt/Ti/SiO2/Si基片上用溶胶-凝胶法与快速退火工艺制备了300 nm厚的锆钛酸铅Pb(Zr0:95Ti0:05)O3 (PZT95/5)反铁电薄膜．结果显示600~700 ℃晶化处理的钙钛矿PZT95/5薄膜具有高度(111)取向生长特性．薄膜的电性能测量采用金属-铁电-金属电容器结构．在20 V电压作用下,600~700 ℃晶化处理的PZT95/5薄膜显示出饱和电滞回线．在1 kHz下,600、650和700 ℃晶化的薄膜介电常数与损耗分别为519与0.028、677与0.029、987     

溶胶-凝胶法制备Pb(Zr1?xTix)O3复合梯度薄摸以及介电与热释电特性

"在Pt/Ti/SiO2/Si基片上用溶胶-凝胶法生长制备了PZT(Pb(Zr1-xTix)O3)复合梯度铁电薄膜． 薄膜最终结构由6层组成,"向上"梯度薄膜在Pt底电极上的第一层从PbZrO3开始,顶层是PZT(50/50),即第一层是PbZrO3,第二层PZT90/10 (10%Ti),第三层是PZT80/20,第四层PZT70/30,第五层PZT60/40,第六层PZT50/50．每一层与此相反的是"向下"梯度PZT薄膜．用X射线衍射、俄歇电子能谱和阻抗分析来研究梯度薄膜的结构与介电特性．600     

Low-temperature laser processes for synthesizing (100)-textured Pb(Zr,Ti)O3 thin films on Si substrate

High-performance Pb(Zr,Ti)O₃, PZT, thin films were synthesized on Si substrates by using low-temperature laser-assisted processes, which combine pulsed laser deposition (PLD), laser lift-off (LLO) and laser-annealing (LA) processes. The PZT films were first grown on sapphire substrates at 400 °C, using Ba(Mg_1/3Ta_2/3)O₃, BMT, as seeding layer, by the PLD process, and were then transferred to Si substrates at room temperature by a LLO transferring process. Utilization of the BMT layer is of critical importance in those processes, since it acted as a nucleation layer for the synthesis of the PZT thin films on the sapphire substrates and, at the same time, served as a sacrificial layer during laser irradiation in the LLO process. After the LLO process, the surfaces of the PZT films were recovered by the LA process for removing the damage induced by the LLO process. A thin BMT (∼30 nm) layer is randomly oriented, resulting in non-textured PZT films with good ferroelectric properties, viz. P_r=20.6 μC/cm² and E_c=126 kV/cm, whereas a thick BMT (∼100 nm) layer is (100) preferentially oriented, leading to (100)-textured PZT films with markedly better ferroelectric properties, viz. P_r=34.4 μC/cm² and E_c=360 kV/cm. PACS 81.15.Fg; 77.84.-s     

Study on the properties of Pb(Zr,Ti)O3 thin films grown alternately by pulsed laser deposition and sol-gel method

In order to prepare good quality Pb(Zr,Ti)O₃ (PZT) thin films, we consider the method of alternately growing PZT thin films on Pt (111)/Ti/SiO₂/Si (100) substrates by pulsed laser deposition (PLD) and sol-gel. In this work, we conducted comparative experiments on different film preparation methods, and 1.0 um thick PZT film was grown on platinized silicon wafers by an alternate PLD and sol-gel method. The microstructure and electrical properties of the films is analyzed. Through the study of X-ray diffraction, SEM, AFM, PFM, and ferroelectric testing, it is found that the alternating growth of a film by the alternate PLD and sol-gel method has good compactness, excellent ferroelectric properties, and smaller leakage current compared to film prepared by the sol-gel method alone.     

Platinum film patterning by laser lift-off using hydrocarbon film on insulating substrates

We achieved a successful laser lift-off of Pt films on fused quartz substrate, employing novel technique using a laser-patterned Apiezon wax, successive uniform Pt deposition, and final laser lift-off. The successful laser lift-off of the Pt film on fused quartz substrate using the wax suggests that the much lower decomposition temperature of the wax than that of the fused quartz is important as well as the difference in the thermal conductivity. PACS 78.66.Qn; 81.65.Cf; 42.62.Cf     

Electroless deposition of copper and fabrication of copper micropatterns on CVD diamond film surfaces

Electroless deposition of copper on as-grown and amino-modification diamond substrates was investigated. The compact and uniform copper films were successfully electrolessly deposited on as-grown and amino-modification diamond substrates after activation by Pd/Sn colloid nanoparticles. The adhesion interaction between copper films and diamond substrates was roughly estimated by the ultrasonic treatment. The results showed the higher adhesion interaction between copper films and amino-modification diamond substrates than that between the copper films and as-grown diamond substrates due to the greater attractive force between the Pd/Sn colloid nanoparticles and amino-modified diamond surface. The favorable copper micropatterns were successfully constructed on diamond film surfaces by means of the catalyst lift-off method and the copper lift-off method. Furthermore, the electrochemical behavior of copper-modified boron-doped diamond (BDD) was studied for glucose oxidation in 0.2 M sodium hydroxide solution by using cyclic voltammetry, and the result indicated that copper-modified BDD exhibited high catalytic activity to electrochemical oxidation of glucose in alkaline media.     

Controllable microstructures and multiferroic properties of Pb(Zr0.53Ti0.47)O3-CoFe2O4 composite films

1-3 and 2-2 types Pb(Zr_0.53Ti_0.47)O₃-CoFe₂O₄ (PZT-CFO) composite films with controllable microstructures, consisted by CFO nanopillar embedded in PZT matrix and PZT-CFO gratings respectively, have been fabricated on Pt/Ti/SiO₂/Si substrates by combining lithography technology and pulsed laser deposition. X-ray diffraction confirms that the films are well crystallized under optimized postannealing conditions. Scanning electron microscope reveals that the periodic microstructures can be well controlled. Especially, intrinsic room temperature ferroelectric and ferrimagnetic behaviors are observed simultaneously. The structure-properties relationship is discussed. Our results may provide an alternative method to design and prepare multiferroic composite films with controllable microstructures.     

Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition

A hydrophobic/super-hydrophilic pattern was prepared on a TiO₂ thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag⁺ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/super-hydrophilic pattern with 500-μm² hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process.     

Comparison of the effect of PLT and PZT buffer layers on PZT thin films for ferroelectric materials applications

In order to study the effect of different buffer layers on the Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin films, 10-nm thick (Pb_0.72La_0.28)Ti_0.93O₃ (PLT) and Pb(Zr_0.52Ti_0.48)O₃ buffer layers have been deposited on the Pt(1 1 1)/Ti/SiO₂/Si substrates by pulsed laser deposition, respectively. The top buffer layers were also deposited on PZT thin films with the same thickness of the seed layers in order to enhance the fatigue characteristics of PZT thin films. We compared the results of dielectric constant, hysteresis loops and fatigue resistance characteristics. It was found that the dielectric properties of PZT thin films with PLT buffer layers were improved by comparing with PZT thin films with PZT buffer layers. The polarization characteristics of PZT thin films with PLT buffer layers were observed to be superior to those of PZT thin films using PZT buffer layers. The remanent polarization of PZT thin films showed 36.3 μC/cm² and 2.6 μC/cm² each in the case of use PLT and PZT buffer layers. For the switching polarization endurance analysis, PZT thin films with PLT buffer layers showed more excellent result than that of PZT thin films with PZT buffer layers.     

Effect of Pb2Ru2O7-x (PRO) conductive interfacial layers on ferroelectric properties of Pt/Pb(Zr0.35Ti0.65)O3/Pt capacitors for nonvolatile memory applications

A conductive material, Pb₂Ru₂O_7-x (PRO), containing Pb in a cubic structure was introduced into a Pt/PZT interface in an attempt to improve the ferroelectric properties of PZT films. PRO and PZT films were prepared by rf magnetron sputtering and chemical solution deposition, respectively. The resistivity of PRO thin films in a hybrid-type electrode (PRO/Pt) structure was approximately 35–45 μΩ·cm and the surface roughness remained constant with increasing annealing temperature. The PRO interlayers suppressed the loss of Pb in PZT layers by diffusion to the Pt/PZT interface. The increase in remanent polarization was largely dependent on the PRO interlayers inserted at the bottom-Pt/PZT interface rather than at the top-Pt/PZT interface. In addition, the leakage-current behavior of PZT films in a sandwich structure was improved substantially compared to the case of PRO interlayers only at the bottom-Pt/PZT interface. Thus, the PRO interlayers play an important role in improving the ferroelectric properties of PZT thin films for use in nonvolatile memory device applications. PACS 68.55.-a; 73.40.Rw; 73.61.Ng; 77.55.+f; 81.15.Cd     

Enhancement of in-plane magnetic anisotropy in (111)-oriented Co0.8Fe2.2O4 thin film by deposition of PZT top layer

The CoFe₂O₄ and Co_0.8Fe_2.2O₄ single layer (CFO) as well as PZT/CoFe₂O₄ and PZT/Co_0.8Fe_2.2O₄ bilayer thin films were grown using the pulsed laser deposition technique on Pt(111)/Si substrates at 600 °C. All films had a perfect (111)-orientation and the degree of orientation of CFO films was improved by the deposition of a PZT top layer. Precision X-ray diffraction analysis (avoiding the shift of peaks due to sample misalignment) revealed that the CFO films on Pt(111)/Si substrate were under an out-of-plane contraction and the deposition of a PZT top layer led to the increase in the out-of-plane contraction. The (111)-oriented CFO single layer films had a strong in-plane magnetic anisotropy as a result of orientation as well as the stress-induced magnetic anisotropy. The magnetic properties of CFO film were altered by the deposition of a PZT top layer leading to the enhancement of in-plane magnetic anisotropy. The enhanced in-plane magnetic anisotropy was more detectable in PZT/Co_0.8Fe_2.2O₄ rather than PZT/CoFe₂O₄ bilayer film, which could be expected from its higher magnetocrystalline as well as magnetostriction constants.     

Enhanced fatigue property of PZT thin films using LaNiO3 thin layer as bottom electrode

A highly (100)-oriented metallic LaNiO₃ film was prepared directly on a Si substrate by a simple metalorganic decomposition (MOD) technique using lanthanum nitrate and nickel acetate as the starting sources. Subsequent Pb(Zr,Ti)O₃ (PZT) thin films deposited on the LaNiO₃-coated Si substrate were obtained by a modified sol–gel method. It was found that the PZT thin films began to form a single perovskite phase at a low annealing temperature of 530 °C, and exhibited highly (100) orientation. A ferroelectric capacitor of Pt/Pb(Zr,Ti)O₃/LaNiO₃/Si annealed at 600 °C displayed a good P-E hysteresis characteristic and was fatigue-free even after 10¹¹ switching cycles. Received: 25 May 2000 / Accepted: 9 August 2000 / Published online: 30 November 2000     

Structural and electrical properties of polycrystalline PbZr0.5Ti0.5O3 films deposited on La0.5Sr0.5CoO3 coated silicon by sol-gel process

La_0.5Sr_0.5CoO₃ (LSCO) films have been grown on Si (100) by a metalorganic chemical liquid deposition (MOCLD) technique using lanthanum acetate, strontium acetate and cobalt acetate as the starting materials. Subsequent PbZr_0.5Ti_0.5O₃ (PZT) films were deposited onto LSCO films by a modified sol-gel method. Field-emission scanning electron microscopy and X-ray diffraction analysis show that PZT and LSCO films are polycrystalline and entirely perovskite phase. At an applied electric field of 250 kV/cm, the Pt/PZT/LSCO capacitor shows no polarization fatigue after 3×10⁹ switching cycles and an internal electric field; the remnant polarization P_r and the coercive field E_c are about 22 μC/cm² and 73 kV/cm, respectively. The dielectric constant of PZT films is 650 at a frequency of 1 kHz. Received: 20 February 2001 / Accepted: 6 June 2001 / Published online: 30 August 2001     

Characterization of Ohmic contacts on GaN/AlGaN heterostructures

The surface morphology and electrical resistance of the contacts on semiconductor devices are strongly influenced by metallization scheme and annealing conditions. In this work is presented an investigation of Ohmic contacts formed by metal-semiconductor alloying on epitaxial GaN/AlGaN heterostructures. After the deposition of metallic multi-layers (Ti, Al, Au and Pt), the process of rapid thermal annealing was carried out in nitrogen, argon and forming gas atmosphere.A series of the samples with different sequences of metallic layers and diverse thicknesses was prepared by employing electron beam evaporation and lift-off deposition techniques. The chemical composition of the samples before and after annealing was studied by means of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) techniques combined with low energy Ar⁺ ion sputtering. The sputtering has been carried out in two different modes: by using constant (square) or gradually narrowed sputtered area. The changes in the chemical state of constituent elements and compositional profiles of the contacts after thermal annealing were revealed from the obtained results. Among the technological problems, influencing on the quality of the contact, were found to be the oxidation and nitridation of the contact surface during thermal annealing, as well as the intermediate sub-layers of Al and Ti oxides, formed during the deposition of metallic multi-layered structure.     

Femtosecond laser patterning of Ta0.1W0.9Ox/ITO thin film stack

Selective laser patterning of thin films in a multilayered structure is an emerging technology for process development and fabrication of optoelectronics and microelectronics devices. In this work, femtosecond laser patterning of electrochromic Ta_0.1W_0.9O_x film coated on ITO glass has been studied to understand the selective removal mechanism and to determine the optimal parameters for patterning process. A 775 nm Ti:sapphire laser with a pulse duration of 150 fs operating at 1 kHz was used to irradiate the thin film stacks with variations in process parameters such as laser fluence, feedrate and numerical aperture of objective lens. The surface morphologies of the laser irradiated regions have been examined using a scanning electron microscopy and an optical surface profiler. Morphological analysis indicates that the mechanism responsible for the removal of Ta_0.1W_0.9O_x thin films from the ITO glass is a combination of blistering and explosive fracture induced by abrupt thermal expansion. Although the pattern quality is divided into partial removal, complete removal, and ITO film damage, the ITO film surface is slightly melted even at the complete removal condition. Optimal process window, which results in complete removal of Ta_0.1W_0.9O_x thin film without ablation damage in the ITO layer, have been established. From this study, it is found that focusing lens with longer focal length is preferable for damage-free pattern generation and shorter machining time.