Three-dimensional interconnected microporous poly(dimethylsiloxane) microfluidic devices

This technical note presents a fabrication method and applications of three-dimensional (3D) interconnected microporous poly(dimethylsiloxane) (PDMS) microfluidic devices. Based on soft lithography, the microporous PDMS microfluidic devices were fabricated by molding a mixture of PDMS pre-polymer and sugar particles in a microstructured mold. After curing and demolding, the sugar particles were dissolved and washed away from the microstructured PDMS replica revealing 3D interconnected microporous structures. Other than introducing microporous structures into the PDMS replica, different sizes of sugar particles can be used to alter the surface wettability of the microporous PDMS replica. Oxygen plasma assisted bonding was used to enclose the microstructured microporous PDMS replica using a non-porous PDMS with inlet and outlet holes. A gas absorption reaction using carbon dioxide (CO(2)) gas acidified water was used to demonstrate the advantages and potential applications of the microporous PDMS microfluidic devices. We demonstrated that the acidification rate in the microporous PDMS microfluidic device was approximately 10 times faster than the non-porous PDMS microfluidic device under similar experimental conditions. The microporous PDMS microfluidic devices can also be used in cell culture applications where gas perfusion can improve cell survival and functions.     

Fabrication of hybrid nanostructured arrays using a PDMS/PDMS replication process

In the study, a novel and low cost nanofabrication process is proposed for producing hybrid polydimethylsiloxane (PDMS) nanostructured arrays. The proposed process involves monolayer self-assembly of polystyrene (PS) spheres, PDMS nanoreplication, thin film coating, and PDMS to PDMS (PDMS/PDMS) replication. A self-assembled monolayer of PS spheres is used as the first template. Second, a PDMS template is achieved by replica moulding. Third, the PDMS template is coated with a platinum or gold layer. Finally, a PDMS nanostructured array is developed by casting PDMS slurry on top of the coated PDMS. The cured PDMS is peeled off and used as a replica surface. In this study, the influences of the coating on the PDMS topography, contact angle of the PDMS slurry and the peeling off ability are discussed in detail. From experimental evaluation, a thickness of at least 20 nm gold layer or 40 nm platinum layer on the surface of the PDMS template improves the contact angle and eases peeling off. The coated PDMS surface is successfully used as a template to achieve the replica with a uniform array via PDMS/PDMS replication process. Both the PDMS template and the replica are free of defects and also undistorted after demoulding with a highly ordered hexagonal arrangement. In addition, the geometry of the nanostructured PDMS can be controlled by changing the thickness of the deposited layer. The simplicity and the controllability of the process show great promise as a robust nanoreplication method for functional applications.     

CF4 plasma treatment of poly(dimethylsiloxane): effect of fillers and its application to high-aspect-ratio UV embossing

Surface modification of poly(dimethylsiloxane) (PDMS) was carried out via CF4 plasma treatment. The test PDMS used contains significant amounts of quartz and silica fillers, while the control material is the same PDMS with quartz removed by centrifugation. Fluorination accompanied with roughening was produced on both PDMS surfaces. With short plasma times (15 min or less), a macromolecular fluorocarbon layer was formed on the PDMS surfaces because of the dominant fluorination, leading to significant increase in F concentration, decrease of surface energy, and some roughening. With intermediate plasma times (15-30 min), dynamic balance between fluorination and ablation was achieved, leading to a plateau of the surface roughness, fluorine content, and [F-Si]/[F-C] ratio. At our longest investigated plasma time of 45 min, the plasma ablated the fluorinated covering layer on the PDMS surfaces, leading to significant increase in roughness and [F-Si]/[F-C] ratio and decrease of surface F concentration. The effect of additional quartz in the test PDMS on surface F concentration, [F-Si]/[F-C] ratio, and roughness was dramatic only when ablation was significant (i.e., 45 min). The obtained Teflon-like surface displays long-term stability as opposed to hydrophobic recovery of other plasma-treated PDMS surfaces to increase hydrophilicity. On the basis of the optimized plasma treatment time of 15 min, a microstructured PDMS mold was plasma treated and successfully used for multiple high-aspect-ratio (about 8) UV embossing of nonpolar polypropylene glycol diacrylate (PPGDA) resin.     

Formation of microstructures on silicon surface in a fluorinated plasma via the cyclic etching-passivation process

The conditions and causes of formation of microneedles and columnar structures on the surface of silicon during deep anisotropic etching in an SF₆/C₄F₈ plasma in the two-stage cyclic mode were determined. The appearance of microstructures is accelerated with an increase in the thickness of the fluorocarbon film formed on the silicon surface at the step of passivation in a C₄F₈ plasma and with an increase is the rate of etching the film in an SF₆ plasma. By means of X-ray photoelectron spectroscopy, it was shown that the formation of carbon residues of fluorocarbon film etching on the Si surface is enhanced under these conditions. Building-up on the surface in the cyclic process, the residues as a micromasking coating lead to the formation of microneedles and columnar structures.     

Polybenzoxazine as a mold-release agent for nanoimprint lithography

One of the most important tasks remaining to be resolved in nanoimprint lithography is the elimination of the resist sticking to the mold during demolding. Previously, the main approach was to apply a thin layer of fluorinated alkyl silane mold-release agent on the surface on the mold; however, this involves complicated steps and high costs. The low surface free energy material polybenzoxazine provides an efficient mold-release agent for silicon molds that is easier to process, costs less, and has no side reactions.     

Influence of Pressure on SiNx:H Film by LF-PECVD

Hydrogenated silicon nitride films as an effective antireflection and passivation coating of silicon solar cell were prepared on p-type polished silicon substrate (1.0 Ωcm) by direct LF-PECVD (low frequency plasma enhanced chemical vapor deposition) of Centrotherm. The preferable passivation effect was obtained and the refractive index was in the range of 2.017-2.082. The refractive index of the hydrogenated silicon nitride films became larger with the increase of the pressure. Fourier transform infrared spectroscopy was used to study the pressure influence on the film structural properties. The results highlighted highhydrogen bond and high Si-N bonds density in the film, which were greatly influenced by the pressure. The passivation effect of the films was influenced by the Si dangling bonds density. Finally the effective minority liftetime degradation with time was shown and discussed by considering the relationship between the structural properties and passivation.     

Changes in silicon elastomeric surface properties under stretching induced by three surface treatments

Poly(dimethylsiloxane) (PDMS) substrates are used in many applications where the substrates need to be elongated and various treatments are used to regulate their surface properties. In this article, we compare the effect of three of such treatments, namely, UV irradiation, water plasma, and plasma polymerization, both from a molecular and from a macroscopic point of view. We focus our attention in particular on the behavior of the treated surfaces under mechanical stretching. UV irradiation induces the substitution of methyl groups by hydroxyl and acid groups, water plasma leads to a silicate-like layer, and plasma polymerization causes the formation of an organic thin film with a major content of anhydride and acid groups. Stretching induces cracks on the surface both for silicate-like layers and for plasma polymer thin coatings. This is not the case for the UV irradiated PDMS substrates. We then analyzed the chemical composition of these cracks. In the case of water plasma, the cracks reveal native PDMS. In the case of plasma polymerization, the cracks reveal modified PDMS. The contact angles of plasma polymer and UV treated surfaces vary only very slightly under stretching, whereas large variations are observed for water plasma treatments. The small variation in the contact angle values observed on the plasma polymer thin film under stretching even when cracks appear on the surface are explained by the specific chemistry of the PDMS in the cracks. We find that it is very different from native PDMS and that its structure is somewhere between Si(O2) and Si(O3). This is, to our knowledge, the first study where different surface treatments of PDMS are compared for films under stretching.     

Parylene C coating for high-performance replica molding

This paper presents an improvement to the soft lithography fabrication process that uses chemical vapor deposition of poly(chloro-p-xylylene) (parylene C) to protect microfabricated masters and to improve the release of polymer devices following replica molding. Chemical vapor deposition creates nanometre thick conformal coatings of parylene C on silicon wafers having arrays of 30 μm high SU8 pillars with densities ranging from 278 to 10,040 features per mm(2) and aspect ratios (height : width) from 1 : 1 to 6 : 1. A single coating of parylene C was sufficient to permanently promote poly(dimethyl)siloxane (PDMS) mold release and to protect masters for an indefinite number of molding cycles. We also show that the improved release properties of parylene treated masters allow for fabrication with hard polymers, such as poly(urethane), that would otherwise not be compatible with SU8 on silicon masters. Parylene C provides a robust and high performance mold release coating for soft lithography microfabrication that extends the life of microfabricated masters and improves the achievable density and aspect ratio of replicated features.     

Influence of chemistry and topology effects on superhydrophobic CF(4)-plasma-treated poly(dimethylsiloxane) (PDMS)

Superhydrophobic surfaces are gaining considerable interest in a lot of different applications, and nonetheless, precise control over the wettability properties of such surfaces is still a challenge due to difficulties when controlling the effects independently induced on superhydrophobicity by the chemical and topological surface characteristics. We have fabricated engineered superhydrophobic surfaces onto poly(dimethylsiloxane) (PDMS) substrates by means of suitable CF4-plasma treatments. These treatments allowed the modification of both the morphological properties of the PDMS surface, due to a preferential etching of certain components of its macromolecules, and the chemical ones, by the deposition of a fluorinated layer. Chemical effects were separated from topological ones by performing a double replica molding process of the CF4-plasma-treated surfaces. This allowed us to obtain positive copies of the structured surfaces without the overlaying fluorinated coating affecting the surface chemistry. Such replicated surfaces showed a decrease of the contact angle if compared to the treated ones and therefore evidenced chemistry's weight in superhydrophobicity effects. In particular, we found that, for highly dense columnar-like PDMS microstructures, the effect of the plasma-deposited fluorinated layer covering surfaces produces an enhancement of the contact angle of about 20 degrees .     

Benchtop micromolding of polystyrene by soft lithography

Polystyrene (PS), a standard material for cell culture consumable labware, was molded into microstructures with high fidelity of replication by an elastomeric polydimethylsiloxane (PDMS) mold. The process was a simple, benchtop method based on soft lithography using readily available materials. The key to successful replica molding by this simple procedure relies on the use of a solvent, for example, gamma-butyrolactone, which dissolves PS without swelling the PDMS mold. PS solution was added to the PDMS mold, and evaporation of the solvent was accomplished by baking the mold on a hotplate. Microstructures with feature sizes as small as 3 μm and aspect ratios as large as 7 were readily molded. Prototypes of microfluidic chips made from PS were prepared by thermal bonding of a microchannel molded in PS with a flat PS substrate. The PS microfluidic chip displayed much lower adsorption and absorption of hydrophobic molecules (e.g. rhodamine B) compared to a comparable chip created from PDMS. The molded PS surface exhibited stable surface properties after plasma oxidation as assessed by contact angle measurement. The molded, oxidized PS surface remained an excellent surface for cell culture based on cell adhesion and proliferation. To demonstrate the application of this process for cell biology research, PS was micromolded into two different microarray formats, microwells and microposts, for segregation and tracking of non-adherent and adherent cells, respectively. The micromolded PS possessed properties that were ideal for biological and bioanalytical needs, thus making it an alternative material to PDMS and suitable for building lab-on-a-chip devices by soft lithography methods.     

nc-Si:H/c-Si硅异质结太阳电池中本征硅薄膜钝化层的优化

采用射频等离子体增强化学气相沉积(RF-PECVD)法在低温、低功率的条件下制备了一系列本征硅薄膜, 研究了硅烷浓度(C_S)对薄膜微结构、光电特性及表面钝化性能的影响. 将本征硅薄膜作为钝化层应用到氢化纳米晶硅/晶硅(nc-Si:H/c-Si)硅异质结(SHJ)太阳电池中, 研究了硅烷浓度和薄膜厚度对电池性能的影响. 实验发现: 随着硅烷浓度的降低, 本征硅薄膜的晶化率、氢含量、结构因子、光学带隙和光敏性等都在过渡区急剧变化; 本征硅薄膜的钝化性能由薄膜的氢含量及氢的成键方式决定. 靠近过渡区的薄膜具有较好的致密性和光敏性, 氢含量最高, 带隙态密度低, 且主要以SiH 形式成键, 对硅片表现出优异的钝化性能, 使电池的开路电压大幅提高. 但是, 当薄膜的厚度过小时, 会严重影响其钝化质量. 本实验中, 沉积本征硅薄膜的最优硅烷浓度为6% (摩尔分数), 且当薄膜厚度为~8 nm时, 所制备电池的性能最好. 实验最终获得了开路电压为672 mV, 短路电流密度为35.1 mA·cm^-2, 填充因子为0.73, 效率为17.3%的nc-Si:H/c-Si SHJ太阳电池     

On the importance of ions and ion-molecule reactions to plasma-surface interface reactions

Ions are known to be key players in many plasma processes, including anisotropic etching, film deposition and surface modification. The relationship between plasma ions, film properties, and surface interactions of other plasma species is not, however, well known. Using our Imaging of Radicals Interacting with Surfaces (IRIS) technique, along with plasma ion mass spectrometry (PI-MS), and surface analysis data, we have measured the effects of ion bombardment on the surface interactions of SiF2 in SiF4 plasmas and of CF2 in C3F8 and C4F8 plasmas. SiF2 is a known product of F-atom etching of Si, and CF2 has also been cited as a product of fluorocarbon etching of Si. With both molecules, we measure surface generation when the surface is bombarded by all the plasma species. Removal of ions from the plasma molecular beam results in a net decrease in surface generation for both molecules at all powers. Results in both systems are compared with the gas-phase ion-molecule reaction data of Armentrout and coworkers. Preliminary guided-ion beam mass spectrometry results taken in the Armentrout laboratories for the Ar+ + C3F8 reaction system are also presented.     

聚二甲基硅氧烷微流控芯片的紫外光照射表面处理研究

研究了紫外光化学表面改性对聚二甲基硅氧烷(PDMS)微流控芯片的片基间粘接力及毛细管通道电渗流性能的影响.PDMS片基经紫外光射照后,粘接力增强,可实现PDMS芯片的永久性封合,同时亲水性得到改善,通道中的电渗流增大.与文献报道的等离子体表面处理方法比较,采用紫外光表面处理,设备简单,操作方便,耗费少,是一种简单易行的聚二甲基硅氧烷芯片表面处理方法.     

三维有序多孔图案化SiC陶瓷的制备

结合毛细管微模塑技术、模板技术和先驱体转化技术, 以图案化聚二甲基硅氧烷(PDMS)弹性体为模具,以氧化硅凝胶小球为模板, 以液态聚碳硅烷(PCS)为先驱体, 经过氧化硅凝胶小球图案化模板的形成, 先驱体的渗入, 模板中先驱体的交联, 弹性模具的去除, 图案化先驱体的无机化和模板的去除, 制备了图案化多孔SiC 陶瓷.研究结果表明：所制备的图案化多孔陶瓷中, 图案的尺寸受图案化PDMS 弹性模具的控制, 球形孔的孔径可由氧化硅凝胶小球来调节. 图案化陶瓷中球形孔不仅三维有序排列, 而且由于模板中小球的相互接触形成的“窗 口”使球形孔三维贯通.     

扫描速率对硅表面分子沉积膜纳米摩擦特性的影响

本研究小组曾简要报道过扫描速率对Au衬底表面分子沉积膜(MD)的纳米摩擦特性的影响[1],本文利用原子力显微镜(AFM)研究了硅表面、羟基化硅表面、氨丙基硅烷(aminopropylsilanized简称APS)化硅表面及硅衬底上磺化酞菁铜(CuT sPc)单层MD膜表面的摩擦力随针尖扫描速率变化的规律。1　实验方法1 1　仪器与试剂TMX2000型原子力显微镜(TopoMetrix公司)。甲苯、二甲苯、丙酮、无水乙醇、氯仿、浓硫酸、过氧化氢、浓盐酸(以上均为分析纯),3 氨丙基 三乙氧基硅烷(KH 550,ACROS产品),磺化酞菁铜(ALDRICH产品),去离子水(电阻率大于10…     

沉积温度对等离子增强化学气相沉积法制备的SiNx:H薄膜特性的影响

利用Centrotherm公司生产的管式等离子增强化学气相沉积(PECVD)设备在p型抛光硅片表面沉积SiN_x:H薄膜, 研究沉积温度对SiN_x:H薄膜的组成及光学特性、结构及表面钝化特性的影响. 然后采用工业化的单晶硅太阳电池制作设备和工艺制作太阳电池, 研究不同温度制备的薄膜对电池电性能的影响. 测试结果表明: SiN_x:H薄膜的折射率随着沉积温度的升高而变大, 分布在1.926-2.231之间, 这表明Si/N摩尔比随着沉积温度的增加而增加; 当沉积温度增加时, 薄膜中Si－H键和N－H键浓度呈现减小趋势, 而Si－N键浓度逐渐升高, 薄膜致密度增加; 随着沉积温度的升高, SiN_x:H薄膜中的氢析出导致了钝化硅片的有效少子寿命先升高后降低, 并且有效少子寿命出现明显的时间衰减特性. 当沉积温度为450 °C时, 薄膜具有最优的减反射和表面钝化效果. 采用不同温度PECVD制备的5组电池的电性能测试结果也验证了这一结果.     

Fabrication of complex multilevel microchannels in PDMS by using three-dimensional photoresist masters

This paper demonstrates a new method of implementing complex microchannels in PDMS, which is simply constructed using three-dimensional photoresist structures as a master mold for the PDMS replica process. The process utilizes UV-insensitive LOR resist as a sacrificial layer to levitate the structural photoresist. In addition, the thickness of photoresist structures can be controlled by multi-step UV exposure. By using these techniques, various three-dimensional photoresist structures were successfully implemented, including the recessed cantilevers, suspended bridges, and the complex plates with micro-pits or micro-villi. We demonstrate that the three-dimensional photoresist structures are applicable to implementing complex multiple microchannels in PDMS by using the PDMS replica method.     

钇系超导体有机硅保护膜的磁控等离子体聚合

A new method of deposition of organic silicon film by magnetic-controlling plasma polymerization was used to protect Y-Ba-Cu-O superconductor from corrosion. The deposition rate of plasma polymer film with magnetic-controlling is 20 times over that without magnetic-controlling. The relation between the deposition rate of film and the process factors of magnetic-controlling plasma were studied. The Y-Ba-Cu-O superconductor covered with organic silicon film was formed by magnetic-controlling plasma polymerization had been protected from corrosion in water over 48 hours.     

Functionalization of hydrogen-terminated silicon via surface-initiated atom-transfer radical polymerization and derivatization of the polymer brushes

Surface-initiated atom-transfer radical polymerization (ATRP) of poly(ethylene glycol) monomethacrylate (PEGMA) was carried out on the hydrogen-terminated Si(100) substrates with surface-tethered alpha-bromoester initiator. Kinetic studies confirmed an approximately linear increase in polymer film thickness with reaction time, indicating that chain growth from the surface was a controlled "living" process. The "living" character of the surface-grafted PEGMA chains was further ascertained by the subsequent extension of these graft chains, and thus the graft layer. Well-defined polymer brushes of near 100 nm in thickness were grafted on the Si(100) surface in 8 h under ambient temperature in an aqueous medium. The hydroxyl end groups of the poly(ethylene glycol) (PEG) side chains of the grafted PEGMA polymer were derivatized into various functional groups, including chloride, amine, aldehyde, and carboxylic acid groups. The surface-functionalized silicon substrates were characterized by reflectance FT-IR spectroscopy and X-ray photoelectron spectroscopy (XPS). Covalent attachment and derivatization of the well-defined PEGMA polymer brushes can broaden considerably the functionality of single-crystal silicon surfaces.     

Growth of novel polythiophene and polyphenyl films via surface polymerization by ion-assisted deposition

Surface polymerization by ion-assisted deposition (SPIAD) is used here to grow novel polythiophene and polyphenyl thin films on a silicon surface by hyperthermal, mass-selected thiophene cations coincident with a thermal beam of alpha-terthiophene or p-terphenyl neutrals. X-ray photoelectron spectroscopy (XPS) observes a large enhancement in film growth for SPIAD compared with either thiophene ions or alpha-terthiophene exposure alone. Changes in S/Si and C/Si ratios from XPS, direct observation of higher polymerization products by mass spectrometry, characteristic vibrations in the Raman data, and enhanced stability in a vacuum all indicate that 200 eV SPIAD polythiophene films are most efficiently polymerized at a 1/150 ion/neutral ratio. Other ion/neutral ratios are less efficient at film growth, in the order 1/150 > 1/450 > 1/900 > direct ion deposition > 1/50. Changes in C/Si ratios and higher polymerization products indicate polymerization occurs in SPIAD polyphenyl films grown with a 1/100 ion/neutral ratio. Furthermore, thiophene ions are found to incorporate into some, but not all, of the polymerization products observed in mass spectrometry.