聚合物光波导的等离子体刻蚀工艺研究

等离子体干法刻蚀是聚合物光波导制备过程中一项关键工艺.利用感应耦合等离子体各向异性刻蚀工艺制备了聚合物脊形结构波导,研究了不同工艺参量(源功率、偏置功率、刻蚀腔室压强以及气体组分)对脊形波导刻蚀速率的影响.利用扫描电子显微镜对刻蚀后波导高度、侧壁垂直度及表面粗糙度进行分析,得到了高刻蚀速率和低粗糙度的优化工艺条件.实验...     

干法刻蚀影响应变量子阱发光的机理研究

采用感应耦合等离子体刻蚀技术对InAsP/InP应变多量子阱和InAsP/InGaAsP应变单量子阱材料的覆盖层进行了不同厚度的干法刻蚀. 实验结果表明，干法刻蚀后量子阱光致荧光强度得到了不同程度的增强. 干法刻蚀过程不仅增加了材料表面粗糙度，同时使其内部微结构发生变化. 采用湿法腐蚀方法去除表面变粗糙对量子阱发光特性的影响，得到干法刻蚀覆盖层20 nm后应变单量子阱微结构变化和其表面粗糙度变化两个因素分别使荧光强度提高1.8倍和1.2倍的结果. 关键词： 干法刻蚀 应变多量子阱 光致发光谱 损伤     

GaN基光栅的干法刻蚀工艺

研究了基于BCl_3/Cl_2电感耦合等离子体(ICP)刻蚀对氮化镓基分布式反馈激光器中光栅的刻蚀,详细研究了刻蚀气体BCl_3/Cl_2流量比和压强对刻蚀台面侧壁的粗糙度、陡直度以及刻蚀速率的影响,发现以SiO_2作为硬掩膜,刻蚀速率、台面侧壁粗糙度以及陡直度随着刻蚀气体BCl_3/Cl_2流量比以及压强变化有着显著变化。保持ICP功率和射频功率分别为300 W和100 W,当刻蚀气体BCl_3/Cl_2流量比为1、压强为1.33 Pa(10 mTorr),最终得到200.6 nm/min的可控刻蚀速率、倾角85.3°且光滑的台面侧壁,实现了在保证光栅侧壁光滑的同时提升侧壁倾角。陡直且光滑的光栅对于提升氮化镓基分布式反馈激光器的器件性能及其稳定性非常重要。     

同步辐射光激励的二氧化硅薄膜刻蚀研究

利用热氧化法在硅晶片上生长SiO₂薄膜，结合光刻和磁控溅射技术在SiO₂薄膜表面制备接触型钴掩模，通过掩模方法在硅表面开展了同步辐射光激励的表面刻蚀研究，在室温下制备了SiO₂薄膜的刻蚀图样.实验结果表明：在同步辐射光照射下，通入SF₆气体可以有效地对SiO₂薄膜进行各向异性刻蚀，并在一定的气压范围内，刻蚀率随SF₆气体浓度的增加而增加，随样品温度的下降而升高；如果在同步辐射光照射下，用SF₆和O₂的混合气体作为反应气体，刻蚀过程将停止在SiO₂/Si界面，即不对硅刻蚀，实现了同步辐射对硅和二氧化硅两种材料的选择性刻蚀；另外，钴表现出强的抗刻蚀能力，是一种理想的同步辐射光掩模材料. 关键词： 同步辐射刻蚀 接触型钴掩模 二氧化硅薄膜     

基于电感耦合等离子体的InP基半导体材料干法刻蚀的研究

研究了基于电感耦合等离子体(ICP)刻蚀系统的InP基半导体材料的干法刻蚀.采用Cl2/Ar/H:混合刻蚀气体,分别研究了氯气体积分数和ICP功率与刻蚀速率之间的关系,及镍、二氧化硅和二者结合型掩膜版的适用范围.获得有效的刻蚀速率为450～1 200 nm/min,InP对金属镍的选择性刻蚀比值为175～190.掩膜版...     

带有射频偏压源的感性耦合Ar/O2/Cl2等离子体放电的混合模拟研究

在刻蚀工艺中,通常会在感性耦合等离子体源的下极板上施加偏压源,以实现对离子能量和离子通量的独立调控.本文采用整体模型双向耦合一维流体鞘层模型,在Ar/O₂/Cl₂放电中,研究了偏压幅值和频率对等离子体特性及离子能量角度分布的影响.研究结果表明:当偏压频率为2.26 MHz时,随着偏压的增加,除了Cl^-离子和ClO⁺离子的密度先增加后降低最后再增加外,其余带电粒子、O原子和Cl原子的密度都是先增加后基本保持不变最后再增加.当偏压频率为13.56和27.12 MHz时,除了Cl^-离子和Cl₂⁺离子外,其余粒子密度随偏压的演化趋势与低频结果相似.随着偏压频率的提高,在低偏压范围内(<200 V),由于偏压源对等离子体加热显著增加,导致了带电粒子、O原子和Cl原子的密度增加;而在高偏压范围内(>300 V),由于偏压源对等离子体加热先减弱后增强,导致除了Cl₂⁺离子和Cl^-     

长波长大应变InGaAs/InGaAsP分布反馈激光器的材料生长与器件制备

采用低压金属有机化合物气相沉积法(LP-MOCVD)生长并制作了1.6—1.7μm大应变InGaAs/InGaAsP分布反馈激光器.采用应变缓冲层技术，得到质量良好的大应变InGaAs/InP体材料.器件采用了4个大应变的量子阱，加入了载流子阻挡层改善器件的温度特性.1.66μm和1.74μm未镀膜的3μm脊型波导器件阈值电流低(小于15mA)，输出功率高(100mA时大于14mW).从10—40℃，1.74μm激光器的特征温度T₀=57K，和1.55μm InGaAsP分布反馈激光器的特征温度相当. 关键词： MOCVD InGaAs/InGaAsP 应变量子阱 分布反馈激光器     

CHF3双频电容耦合放电等离子体特性研究

研究了用于SiCOH 低介电常数薄膜刻蚀的CHF₃气体在1356 MHz/2 MHz,2712 MHz/2 MHz和60 MHz/2 MHz双频电容耦合放电时的等离子体性质.发现2 MHz低频源功率的增大主要导致F基团密度的增大;而高频频率从1356,2712增大到60 MHz,导致CF₂基团的密度增大和电极之间F基团密度的轴向空间不均匀性增加.根据电子温度的分布规律及离子能量随高频源频率的变化关系,提出CF₂基团的产生主要通过电子-中性气体碰撞,而F基团的产生是离子-中性气体碰撞的结果. 关键词： 双频电容耦合放电 3等离子体')" href="#">CHF₃等离子体     

等离子体增强化学气相沉积法制备立方氮化硼薄膜过程中的表面生长机理

利用感应耦合等离子体增强化学气相沉积法以Ar，He，N₂和B₂H₆为反应气体制备了高纯立方氮化硼薄膜.用四极质谱仪对等离子体状况进行了系统的分析，发现B₂H₆完全被电离而N₂只是部分被电离.H₂和过量的N₂在等离子体中生成大量中性的H原子和活化的N^*₂，它们与表面的相互作用严重地阻碍了立方 关键词： 立方氮化硼薄膜 等离子体 质谱     

强红外激光引起BCl3可见荧光的动力学研究

用TEA CO₂激光辐照纯BCl₃气体,观察到可见荧光具有多种过程。系统地测量了可见荧光的空间、时间、光谱结构,以及它们随激光能量、BCl₃气压等参数的依赖关系。用简化碰撞动力学模型讨论了BCl₃可见荧光过程,得到有效振动温度、可见荧光强度的分析表达式和ρτ_延≌C/K(T_ν)的简单关系。理论与实验结果一致。 关键词：     

Optimized ICP etching process for fabrication of oblique GaN sidewall and its application in LED

Inductively coupled plasma (ICP) etching of GaN is systemically investigated by changing ICP power/RF bias power, operating pressure, and Cl₂/BCl₃ gas mixing ratio. The hexagonal etch pits related to screw dislocation existing along GaN epitaxial layer were observed on the etched GaN surface after ICP etching. The intensity of band-edge emission is significantly reduced from the etched n-GaN surface, which reveals that plasma-induced damage are generated after ICP etching. The oblique sidewall is transferred into GaN using a combination of Cl₂/BCl₃ plasma chemistry and hard mask SiO₂. By adjusting ICP etching process parameters, oblique sidewalls with various oblique angles can be formed, allowing for conformal metal lines coverage across the mesa structures, which can play an important role in the interconnection of multiple microchips for light emitting diodes (LEDs) fabrication.     

High-Q factor single mode circular photonic crystal nano-resonator

In this work, the analysis, fabrication and optical characterization of a two-dimensional circular photonic crystal (2D-CPC) nano-resonator based on an air/GaAs/air slab waveguide are presented. Four InAs/InGaAs quantum dots (QDs) stacked layers emitting around 1300 nm at room temperature were embedded in a GaAs waveguide layer grown on an Al_0.7Ga_0.3As layer and GaAs substrate. The patterning of the structure and the membrane release were achieved by using electron beam lithography, ICP plasma etching and selective wet etching of the AlGaAs sacrificial layer. The micro-luminescence spectrum recorded from the fabricated nano-cavity shows a narrow optical transition at the resonance wavelength of about 1282 nm with a FWHM and Q-factor of 6.2 Å and more than 2000, respectively.     

Dry etching of ITO by magnetic pole enhanced inductively coupled plasma for display and biosensing devices

The dry etching of indium tin oxide (ITO) layers deposited on glass substrates was investigated in a high density inductively coupled plasma (ICP) source. This innovative low pressure plasma source uses a magnetic core in order to concentrate the electromagnetic energy on the plasma and thus provides for higher plasma density and better uniformity. Different gas mixtures were tested containing mainly hydrogen, argon and methane. In Ar/H₂ mixtures and at constant bias voltage (−100 V), the etch rate shows a linear dependence with input power varying the same way as the ion density, which confirms the hypothesis that the etching process is mainly physical. In CH₄/H₂ mixtures, the etch rate goes through a maximum for 10% CH₄ indicating a participation of the radicals to the etching process. However, the etch rate remains quite low with this type of gas mixture (around 10 nm/min) because the etching mechanism appears to be competing with a deposition process. With CH₄/Ar mixtures, a similar feature appeared but the etch rate was much higher, reaching 130 nm/min at 10% of CH₄ in Ar. The increase in etch rate with the addition of a small quantity of methane indicates that the physical etching process is enhanced by a chemical mechanism. The etching process was monitored by optical emission spectroscopy that appeared to be a valuable tool for endpoint detection.     

Etching and oxidation of InAs in planar inductively coupled plasma

The surface of InAs (1 1 1)A was investigated under plasmachemical etching in the gas mixture CH₄/H₂/Ar. Etching was performed using the RF (13.56 MHz) and ICP plasma with the power 30–150 and 50–300 W, respectively; gas pressure in the reactor was 3–10 mTorr. It was demonstrated that the composition of the subsurface layer less than 5 nm thick changes during plasmachemical etching.A method of deep etching of InAs involving ICP plasma and hydrocarbon based chemistry providing the conservation of the surface relief is proposed. Optimal conditions and the composition of the gas phase for plasmachemical etching ensuring acceptable etch rates were selected.     

Surface chemistry and optimization of focused ion beam iodine-enhanced etching of indium phosphide

Focused ion beam physical sputtering and iodine-enhanced etching of indium phosphide (InP) were performed. Up to 15× enhanced etching rates over sputtering were measured at room temperature, due to the addition of iodine to the sputter-process. Reaction mechanisms and products are discussed and characterized. The reaction is limited by the desorption of indium triiodide (InI₃) at room temperature. InI₃ has to be removed by sputtering, which simultaneously amorphizes the underlying substrate. Surface roughness and stoichiometry of InP are compared for sputtering and etching. Gallium-contamination and the damaged zone in InP are significantly reduced by iodine-enhanced etching. Based on the reaction mechanisms, an optimum beam scanning strategy is proposed which allows precise microfabrication in reduced time and minimizes damage to the substrate. The method is also applicable for other halide gas etching processes of III-V semiconductors.     

Electrical characteristics of Pt/Au Schottky contacts to plasma-etched Al0.45Ga0.55N

The effects of inductively coupled plasma (ICP) etching on electrical properties of Pt/Au–Al_0.45Ga_0.55N Schottky contacts are investigated. There are two linear parts in the ln I–V curves of ICP-etched Schottky contacts at small forward currents at 198–298 K. Thermionic field emission (TFE) theory analysis shows that Schottky contact with ICP etching has much lower barrier height and higher tunnel transmission probability than that without ICP etching, which could be attributed to plasma damage introduced on the ICP-etched surface. The down linear part is probably connected to surface tunneling component originated from plasma-etched surface which joins Schottky area to Ohmic area.     

Optical characteristics of one-dimensional photonic crystals composed of high-aspect-ratio Si walls fabricated on V-grooved wafer

We demonstrate optical properties of one-dimensional photonic crystals (PC), which are fabricated using high-aspect-ratio etching on a V-grooved silicon wafer. The measured transmission spectrum has an obvious band gap; the suppression is over 30 dB. The quite small insertion loss of 1.9 dB is achieved by induced coupled plasma (ICP) cryogenic etching and direct coupling to the optical fiber aligned in the V-groove. We also successfully observed peaks originating from a localized cavity mode. Such a microcavity enables control of the light, which qualifies photonic crystal as a fundamental structure of optical functional devices. These results lead to achievement of integrated Si-based photonic circuits.     

Design and fabrication of optical filters with very large stopband (≈500 nm) and small passband (1 nm) in silicon-on-insulator

In this paper, we report on the design, fabrication and characterization of a broadband photonic crystal filter. Modeling with a genetic algorithm (GA) was used to investigate the effect of changing the number of periods and thickness ratios of a photonic crystal filter structure with two alternating materials. Theoretical optimized parameters were obtained as a function of wavelength for a photonic crystal filter with a very broad filter bandwidth as well as a very narrow transmission window. We used the determined optimum parameters at a wavelength of 1550 nm to fabricate the structure using e-beam lithography and inductively coupled plasma (ICP) etching. Experimental results show that the structure indeed has a very narrow transmission window and a low loss of just 4 dB. Hence, this structure can be regarded as a high precision filter for optical communication and photonic integrated chip technologies.     

Deposition and Etching of Thin Films by Means of Beam Plasma Discharge with Tube-Like Electron Beam

The efficiency of energy dissipation caused by the mechanism of turbulent plasma heating from a tube-like electron beam in a electronegative gas is measured calorimetrically. Amorphous Si-layers are deposited from a SiH₄/Ar discharge both on conducting and nonconducting substrates and are analyzed by means of Auger-spectrometry. The velocity and specific energy of etching of SiO₂-layers in a CF₄-plasma are determined. Measured etching velocities of tungsten surfaces biased differently against the space potential provide information on the mechanism of plasma etching in a SF₆-plasma. Simultaneously performed Langmuir-probe measurements permit predictions to be made on the properties of the etching plasma.