Intersubband transitions in strained Si/Si1 − xGex/Si quantum wells

The energy subbands in pseudomorphic p-type Si/Si_1 − xGe_x /Si quantum wells are calculated within the multiband effective-mass approximation that describes the heavy, light and split-off hole valence bands. We examine the intersubband transitions in this system and the selection rules are obtained for a light polarization vector parallel or perpendicular to the growth direction. Comparison is made with other theories and experiment.     

优质GaAs/Si和AlGaAs/Si材料的MOCVD生长研究

用自制常压MOCVD装置,在Si衬底上生长GaAs和AlGaAs外延层,在高温去除Si衬底表面氧化膜之后,采用两步法,即低温生长过渡层,再提高温度生长外延层。得到了表面镜面光亮的优质GaAs和AlGaAs外延层。X射线双晶衍射仪测试GaAs外延层,其回摆曲线半峰宽是200孤秒,GaAs和AlGaAs外延层在77K温度下,PL谱半峰宽分别是17meV和24meV。     

Si-W/Si/SiO2/Si(100)的横截面电子显微镜研究

本文用横截面电子显微镜法分析了Si-W/Si/SiO₂/Si(100)在440—1000℃退火后的晶化过程,以及各个界面的变化情况.发现Si-W合金膜中,WSi₂并未优先在表面、界面处形成晶核.当退火温度不高于700℃时,反应在合金膜内发生,表面、界面起伏和缓.退火温度高达800—1000℃时,界面、表面出现原子扩散,造成剧烈的界面起伏;表面则出现小的热沟槽,Si/SiO₂界面也出现高分辨电子显微镜才能观察到的起伏.表面、界面的原子迁移的动力来源于晶界与表面、界面张力.由于SiO₂中Si—O键很稳定,不易发生Si和O在界面处的互扩散,所以Si/SiO₂界面起伏很小. 关键词：     

Si/Ge/Si异质横向SPiN二极管固态等离子体解析模型

采用横向表面PiN(SPiN)二极管构造的硅基可重构天线具有众多优于传统天线的独特优势, 是实现天线小型化和提升雷达与微波通信系统性能的有效技术途径. 本文提出一种Si/Ge/Si异质横向SPiN二极管, 并基于双极扩散模型与Fletcher型边界条件, 在大注入条件下建立了二极管结电压、电流密度与本征区固态等离子体浓度分布解析模型, 并数值模拟分析了本征区长度、P⁺与N⁺区掺杂浓度、外加电压对所建模型的影响. 结果表明, 固态等离子体浓度随本征区长度的增加下降, 随外加电压的增加而指数上升, 随P⁺与N⁺区掺杂浓度的提高而上升, 电流密度随外加电压的增加而指数上升. 同等条件下, 异质SPiN二极管的固态等离子体浓度相比同质二极管提高近7倍以上. 本文所建模型为硅基可重构天线的设计与应用提供有效的参考.     

Electronic Structure of Si1-xⅣx/Si Superlattices on Si （001）

We have preformed systematical ab initio studies of the structural and electronic properties of short-period Si1-xⅣx/Si （x = 0.125, 0.25, 0.5, Ⅳ=Ge, Sn） superlattices （SLs） grown along the [001] direction on bulk Si. The present calculations reveal that the Si0.875Ge0.125/Si, Si0.75Ge0.25/Si and Si0.875Sn0.125/Si are the F-point direct bandgap semiconductors. The technological importance lies in the expectation that the direct gap Si1-xⅣx/Si SLs may be used as components in integrated optoelectronic devices, in conjunction with the already well-established and highly advanced silicon technology.     

Vibrational and Light-Emitting Properties of Si/Si1−xSnx Heterostructures

Multilayer heterostructures Si/Si_1−xSn_x grown by molecular beam epitaxy on Si (001) substrates have been studied by Raman and photoluminescence spectroscopy. Raman spectra exhibit peaks corresponding to the vibrations of Si-Sn and Sn-Sn bonds; the vibrations of Sn-Sn bonds imply the presence of tin nanocrystals in heterostructures. Two photoluminescence bands at 0.75 eV (1650 nm) and 0.65 eV (1900 nm) have been observed in heterostructures at low temperatures. The former band can be attributed to optical transitions in quantum wells in the type II heterostructure Si/Si_1−xSn_x. The latter band can be associated with excitons localized in tin nanocrystals.

     

Si3N4/Si表面Si生长过程的扫描隧道显微镜研究

利用原位扫描隧道显微镜和低能电子衍射分析了Si的纳米颗粒在Si₃N₄/Si(111)和Si₃N₄/Si(100)表面生长过程的结构演变.在生长早期T为350—1075K范围内,Si在两种衬底表面上都形成高密度的三维纳米团簇,这些团簇的大小均在几个纳米范围内,并且在高温退火时保持相当稳定的形状而不相互融合.当生长继续时,Si的晶体小面开始显现.在晶态的Si₃N₄(0001)/S 关键词： 氮化硅 扫描隧道显微镜 纳米颗粒     

Si/SiGe量子级联激光器研究进展

Si／SiGe量子级联激光器是一种新型的带内跃迁的红外光源，突破了Si基材料间接带隙特性对光跃迁的限制。Si/SiGe量子级联激光器的开发将为实现太赫兹有源器件的硅基集成产生深远影响。文章介绍了Si/SiGe量子级联激光器的工作原理，以及这类激光器在能带设计、材料生长和波导制作方面的最新进展。     

Ⅲ–Ⅴ/Si Hybrid Laser Array with DBR on Si Waveguide

We report an eight-channel silicon evanescent laser array operating at continuous wave under room temperature conditions using the selective-area metal bonding technique.The laser array is realized by evanescentl.y coupling the optical gain of InGaAsP multi-quantum wells to the silicon waveguides of varying widths and patterned with distributed Bragg reflector gratings.The lasers have emission peak wavelengths in a range of 1537-1543 nm with a wavelength spacing of about 1.0 nm.The thermal impedances Z_T of these hybrid lasers are evidently lower than those DFB counterparts     

氧化SiGe/Si多量子阱制备Si基SiGe弛豫衬底

SiGe弛豫衬底是制备高性能Si基SiGe光电子器件的基础平台。本文通过1050℃不同时间氧化SiGe/SiMQW材料,分析氧化过程中Ge组分、弛豫度的变化趋势,制备位错密度低、表面平整、弛豫度超过60%的Si基Si0.75Ge0.25缓冲层。     

Determination of conduction band edge characteristics of strained Si/Si1-xGex

The feature of conduction band （CB） of Tensile-Strained Si（TS-Si） on a relaxed Si1-xGex substrate is systematically investigated, including the number of equivalent CB edge energy extrema, CB energy minima, the position of the extremal point, and effective mass. Based on an analysis of symmetry under strain, the number of equivalent CB edge energy extrema is presented; Using the K.P method with the help of perturbation theory, dispersion relation near minima of CB bottom energy, derived from the linear deformation potential theory, is determined, from which the parameters, namely, the position of the extremal point, and the longitudinal and transverse masses （m1^＊ and mt^＊）are obtained.     

Si/Gen/Si(001)异质结薄膜的掠入射荧光X射线吸收精细结构研究

利用掠入射荧光X射线吸收精细结构(XAFS)方法研究了在400℃的温度下分子束外延生长的Si/Ge_n/Si(001)异质结薄膜(n=1，2，4和8个原子层)中Ge原子的局域环境结构.结果表明，在1至2个Ge原子层(ML)生长厚度的异质结薄膜中，Ge原子的第一近邻配位主要是Si原子.随着Ge原子层厚度增加到4ML，Ge原子的最近邻配位壳层中的Ge-Ge配位的平均配位数增加到1.3.当Ge原子层厚度增加到8ML时，第一配位壳层中的Ge-Ge配位占的比例只有55%.这表明在400℃的生长条件下，Ge原子有很强的迁移到Si覆盖层的能力.随着Ge层厚度从1 增加到2，4和8ML，Ge原子迁移到Si覆盖层的量由0.5ML分别增加到1.5，2.0和3.0ML.认为在覆盖Si过程中Ge原子的迁移主要是通过产生Ge原子表面偏析来降低表面能和Ge层的应变能. 关键词： XAFS n/Si(001)异质膜')" href="#">Si/Ge_n/Si(001)异质膜 迁移效应     

Si离子注入对分子束外延Si1-xGex/Si量子阱发光特性的影响

对分子束外延生长带边激子发光的Si_1-xGe_x/Si量子阱结构，通过Si离子自注入和不同温度退火，观测到深能级发光带和带边激子发光的转变.Si离子注入量子阱中并在600℃的低温退火，形成链状或小板式的团簇缺陷，它导致深能级发光带的形成，在850℃的高温退火后重新观测到带边激子发光.这种团簇缺陷的热离化能约为0.1eV，比Si中空穴或填隙原子缺陷的热激活能(约0.05eV)高.这表明早期文献中报道的深能级发光带是由类似的团簇缺陷产生的. 关键词：     

Subsurface localization of charge carriers in Si/SiO2/Si x Ge1 − x nanostructures

Analysis of the capacitance-voltage (C-V) characteristics reveals an elevated concentration of charge carriers under the surface of a silicon substrate due to the formation of elastically stressed regions induced in the substrate by Si _x Ge_{1 ? x} nanoislands grown on the preliminarily oxidized Si surface. The C-V characteristics exhibit charge density peaks at a depth from 700 to 1000 nm for Si/SiO₂/Si _x Ge_{1 ? x} structures with various thicknesses of the SiO₂ layer. The results of theoretical calculations of the electron density distribution in the bulk of the silicon substrate correspond on the whole to the C-V characteristics. The state of the interfaces in the structures with different thicknesses of the oxide layer, which determines the effects of surface and interfacial recombination as well as charge carrier scattering, is studied by analyzing the kinetics of decay of a photo-emf signal and the photo-emf distribution over the surface of the structure. The results can be used in the development of various devices based on SiGe with inclusions of oxide layers.     

Modified Fowler–Nordheim tunnelling for modelling charge injection into Si3N4 in an Al/Si3N4/Si structure

Charge injection behaviours in silicon nitride of an Al/Si₃N₄/n-Si metal?Cinsulator?Csemiconductor (MIS) device are systematically studied before and after applying different high constant DC bias conditions with the aim of controlling charge accumulation in the dielectric when a high actuation voltage is applied. We found that both polarity and magnitude of charge accumulation in silicon nitride depend on the biasing direction. Charge injection from the semiconductor to the silicon nitride always dominates over charge injection from the Al electrode to the silicon nitride. Negative charge accumulation happens in silicon nitride when the Al electrode is positively biased, and positive charge accumulation occurs in silicon nitride when the Al electrode is negatively biased. The positive charge accumulation is much bigger than the negative charge accumulation under the same magnitude of stress voltage. Furthermore, the experimental results also show that the charge injection level exponentially increases with the applied voltage across the silicon nitride. These observed experimental results can be well explained by a modified Fowler?CNordheim tunnelling charge injection model, which takes into account the roles of both electrons and holes in the process of charge injection.     

磁控溅射制备的W,WSi2,Si单层膜和W/Si,WSi2/Si多层膜应力

采用直流磁控溅射技术制备了厚度约100 nm的W,WSi2,Si单层膜和周期约为20 nm,Si膜层厚度与周期的比值为0.5的W/Si,WSi2/Si周期多层膜.利用台阶仪对镀膜前后基底表面的面形进行了测试,计算并比较了不同膜系的应力值.结果表明:W单层膜表现出较大的压应力,而W/Si周期膜则表现为张应力.WSi2单层...     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜. 利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征. 在此基础上，研究了Cu/SiO₂/Si(111)体系的扩散和界面反应. 实验结果表明：当退火温度高于450℃时出现明显的扩散现象，并且随着温度的升高，体系扩散现象会更加显著. 当退火温度低于450℃时没有铜硅化合物生成，当温度达到500℃时才有铜硅化合物生成. 关键词： 薄膜 扩散 界面反应 硅化物     

稳定In/Si表面的LEED研究

利用LEED图形拟合的方法对大量不同取向In/Si表面的稳定性和小面化进行了研究，新发现了In覆盖度在1/2单层原子以下的三个稳定表面：Si(214)-In，Si(317)-In和Si(436)-In，以及In覆盖度在1单层原子左右的两个稳定表面Si(101)-In和Si(313)-In.此外还确定了In覆盖度在1单层原子左右的6个稳定In/Si表面的家族领地以及In覆盖度在1/2单层原子以下的4个稳定In/Si表面的家族领地.特别值得注意的是 Si(103)-In的家族领地相当大，甚至比最稳定的Si(1 关键词： 硅表面 铟 稳定表面 家族领地     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜.利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征.在此基础上,研究了Cu/SiO2/Si(111)体系的扩散和界面反应.实验结果表明:当退火温度高于450 ℃时出现明显的扩散现象,并且随着温度的升高,体系扩散现象会更加显著.当退火温度低于450 ℃时没有铜硅化合物生成,当温度达到500 ℃时才有铜硅化合物生成.     

Si/Gen/Si(001)异质结薄膜的掠入射荧光X射线吸收精细结构研究

利用掠入射荧光X射线吸收精细结构(XAFS)方法研究了在400℃的温度下分子束外延生长的Si/Gen/Si(001)异质结薄膜(n=1,2,4和8个原子层)中Ge原子的局域环境结构.结果表明,在1至2个Ge原子层(ML)生长厚度的异质结薄膜中,Ge原子的第一近邻配位主要是Si原子.随着Ge原子层厚度增加到4 ML,Ge原子的最近邻配位壳层中的Ge-Ge配位的平均配位数增加到1.3.当Ge原子层厚度增加到8 ML时,第一配位壳层中的Ge-Ge配位占的比例只有55%.这表明在400℃的生长条件下,Ge原子有很强的迁移到Si覆盖层的能力.随着Ge层厚度从1增加到2,4和8 ML,Ge原子迁移到Si覆盖层的量由0.5 ML分别增加到1.5,2.0和3.0 ML.认为在覆盖Si过程中Ge原子的迁移主要是通过产生Ge原子表面偏析来降低表面能和Ge层的应变能.