CH_3CSNH_2钝化对铁磁金属与GaAs界面扩散的影响

通过实验对比 ,研究了CH3CSNH2 钝化对铁磁金属与GaAs界面处As扩散行为的影响 .发现S钝化处理改变了表面As元素的化学环境 ,减弱了As元素向铁磁金属外延层中的扩散现象 ,削弱了As与铁磁金属的反应 ,形成了较窄的反应层 ,并且改善了界面磁性 .初步探讨了S钝化影响As扩散的原因 .     

Co/S钝化GaAs(100)界面形成的SRPES研究

利用同步辐射光电发射谱研究了Co与CH\-3CSNH\-2处理的S钝化GaAs(100)的界面形成.发现 其界面反应较弱,Co覆盖层达到0.8nm时,形成稳定的界面.GaAs表面上和S原子形成桥 键的Ga原子与Co发生交换反应并扩散到覆盖层中,形成Co—S键.Co覆盖层表面无偏析As的出现,与Co/GaAs(100)界面不同,这表明GaAs表面的S钝化可有效地阻止As原子向覆盖层的扩散. 关键词：     

磁性隧道结热稳定性的x射线光电子能谱研究

通过XPS等微观分析手段证实了磁性隧道结在高温退火后，反铁磁层中的Mn元素扩散到被钉 扎铁磁层及势垒层中，破坏了势垒层/铁磁层界面，从而导致了磁性隧道结高温退火后TMR的 下降.然而在反铁磁层和被钉扎铁磁层之间插入一层纳米氧化层后，Mn的扩散得到了抑制， 使磁性隧道结的热稳定性得以提高. 关键词： 磁性隧道结 纳米氧化层 x射线光电子能谱     

合成反铁磁Ni81Fe19/Co90Fe10/Ru/Co90Fe10/Ni81Fe19的研究

采用直流磁控溅射方法制备了一系列的合成反铁磁及以其为自由层的自旋阀.研究发现,在Ni₈₁Fe₁₉与Ru层之间插入适当厚度的Co₉₀Fe₁₀层后,可有效地提高合成反铁磁两磁性层间的反铁磁耦合强度,得到具有饱和场H_s更高、饱和磁化强度M_s更低、热稳定性更好的合成反铁磁.另外,以这种合成反铁磁作自旋阀的自由层时,可有效提高自旋阀的稳定性. 关键词： 合成反铁磁 退火 自旋阀     

Ni81Fe19/Cr82Al18双层膜中的交换偏置

研究了直流磁控溅射法制备的Ni₈₁Fe₁₉/Cr₈₂Al₁₈双层膜中的交换耦合.样品的室温矫顽力与1/t^{3/2_FM(t_FM为铁磁层厚度）近似成正比例关系,从而表明在Ni₈₁Fe₁₉/Cr₈₂Al₁₈中交换耦合为铁磁/反铁磁界面的随机相互作用.另外还讨论了反铁磁层厚度对交换偏置的影响. 关键词：}     

磁性d波超导/铁磁/磁性d波超导结中的约瑟夫森效应

通过求解磁性d波超导中的能隙和磁交换能的自洽方程, 研究磁性d波超导/铁磁/磁性d波超导结中的约瑟夫森电流. 计算结果表明: 1)临界电流随中间的铁磁层厚度呈现出两种不同周期的振荡混合, 通过增强铁磁层中的磁交换能q₀和铁磁/磁性d波超导界面处的势垒强度z₀, 短周期分量可从长周期中分离出来, 反之, 通过降低q₀和z₀, 长周期分量可从短周期中分离出来; 2)在两边磁性d波超导的磁化方向取平行时, 在取一些特定的铁磁层厚度下, 磁性d波超导中的磁交换能可增强系统的临界电流. 关键词： 磁性d波超导体 铁磁体 约瑟夫森电流     

GaAs表面硫化学钝化,CH3CSNH2处理新探

应用同步辐射光电子谱（SRPES）和光致荧光（PL）方法探讨不同钝化条件对GaAs表面键合状态和电子态的影响．发现无论在酸性溶液或碱性溶液条件下，经过CH₃CSNH₂处理的GaAs表面S都与Ga和As成键，形成硫化物钝化层；钝化层形成后，PL谱的强度明显增强，表明GaAs表面复合中心的减少和缺陷态密度的降低 关键词：     

几种元素的界面插层对Ta/NiFe/Ta的各向异性磁电阻效应的影响

文章中,通过磁控溅射制备了界面处插入4d,5d元素薄层(包括Ru,Pd,Ag和Au)的Ta/NiFe/Ta多层膜,并对它们的磁输运和磁性以及微结构进行了测试和表征.结果显示,Pd和Pt一样界面效应显著,能有效地提高NiFe薄膜退火前后的AMR比值,并抑制磁性死层.表面能比较小、熔点相对低的插层材料Ag,Au在退火过程中容易通过晶界扩散,强烈破坏其AMR性能.对于熔点高、表面能比较大的插层材料如Ru,磁性死层同样得到了抑制,NiFe薄膜的温度稳定性也可以得到提高.结果表明界面插层从界面电子自旋-轨道散射、界面死层和界面原子扩散等方面深刻影响NiFe薄膜的AMR. 关键词： 各向异性磁电阻 界面效应 原子扩散     

GaAs(100)表面硫钝化的新方法:CH3CSNH2/NH4OH处理

建立了一种硫钝化GaAs(100)表面的新方法,即CH₃CSNH₂/NH₄OH溶液处理,应用同步辐射光电子能谱(SRPES)和X射线光电子能谱(XPS)表征了该钝化液处理的n-GaAs(100)表面的成键,特性和电子态.结果表明,经过处理的n-GaAs(100)表面,S既与As成键也与Ga成键,形成S与GaAs的新界面,并且Ga和As的氧化物被移走,这标志着CH₃CSNH₂/NH_{4关键词：}     

B对Mo等元素在奥氏体钢/Cr2O3界面占位倾向影响的理论研究

超级奥氏体不锈钢中因含有更高铬、钼含量,具有极高的耐点蚀、晶间腐蚀性能,这与Mo等合金元素对钝化膜结构的影响密切相关,尤其含硼超奥钢钝化层表面Cr、Mo含量明显增加,但其原子层次的微观作用机制尚不清楚.本文采用第一性原理方法,研究了置换原子(Mo、Mn、Ni、Si),及间隙原子B在fcc-Fe/Cr₂O₃界面占位倾向,并分析了可稳定存在于界面B对这些元素偏析倾向的影响.结果表明:Mo、Mn、Ni、Si、B均可与fcc-Fe/Cr₂O₃界面结构体系形成稳定结构;Mo、Ni倾向分布于界面基体侧,Mo有向氧化层扩散的趋势,B处于fcc-Fe/Cr₂O₃界面基体侧更稳定,Mn、Si易分布于氧化层中;存在于界面B对四种元素在fcc-Fe/Cr₂O₃界面体系中的占位影响不同,有利于Mn、Mo偏析于界面基体侧,但抑制Mo向界面基体侧的偏析程度,使得Si、Ni更均匀的分布于基体. Mo等合金元素分布于界面时的态密度来看,界面处M...     

Stability of La2O3 and GeO2 passivated Ge surfaces during ALD of ZrO2 high-k dielectric

La₂O₃ grown by atomic layer deposition (ALD) and thermally grown GeO₂ are used to establish effective electrical surface passivations on n-type (1 0 0)-Ge substrates for high-k ZrO₂ dielectrics, grown by ALD at 250 °C substrate temperature. The electrical characterization of MOS capacitors indicates an impact of the Ge-surface passivation on the interfacial trap density and the frequency dependent capacitance in the inversion regime. Lower interface trap densities can be obtained for GeO₂ based passivation even though a chemical decomposition of the oxidation states occur during the ALD of ZrO₂. As a consequence the formation of a ZrGeO_x compound inside the ZrO₂ matrix and a decline of the interfacial GeO₂ are observed. The La₂O₃ passivation provides a stable amorphous lanthanum germanate phase at the Ge interface but also traces of Zr germanate are indicated by X-ray-Photoelectron-Spectroscopy and Transmission-Electron-Microscopy.     

Investigation of interface characteristics of Al2O3/Si under various O2 plasma exposure times during the deposition of Al2O3 by PA-ALD

Plasma-assisted atomic layer deposition (PA-ALD) is more suitable than thermal atomic layer deposition (ALD) for mass production because of its faster growth rate. However, controlling surface damage caused by plasma during the PA-ALD process is a key issue. In this study, the passivation characteristics of Al₂O₃ layers deposited by PA-ALD were investigated with various O₂ plasma exposure times. The growth per cycle (GPC) during Al₂O₃ deposition was saturated at approximately 1.4?Å/cycle after an O₂ plasma exposure time of 1.5?s, and a refractive index of Al₂O₃ in the range of 1.65–1.67 was obtained. As the O₂ plasma exposure time increased in the Al₂O₃ deposition process, the passivation properties tended to deteriorate, and as the radio frequency (RF) power increased, the passivation uniformity and the thermal stability of the Al₂O₃ layer deteriorated. To study the Al₂O₃/Si interface characteristics, the capacitance-voltage (C-V) and the conductance-voltage (G-V) were measured using a mercury probe, and the fixed charge density (Q_f) and the interface trap density (D_it) were then extracted. The Q_f of the Al₂O₃ layer deposited on a Si wafer by PA-ALD was almost unaffected, but the D_it increased with O₂ plasma exposure time. In conclusion, as the O₂ plasma exposure time increased during Al₂O₃ layer deposition by PA-ALD, the Al₂O₃/Si interface characteristics deteriorated because of plasma surface damage.     

Interface engineering with an MOCVD grown ZnO interface passivation layer for ZrO2-GaAs metal-oxide-semiconductor devices

This work deals with the fabrication of a GaAs metal-oxide-semiconductor device with an unpinned interface environment. An ultrathin (∼2 nm) interface passivation layer (IPL) of ZnO on GaAs was grown by metal organic chemical vapor deposition to control the interface trap densities and to prevent the Fermi level pinning before high-k deposition. X-ray photoelectron spectroscopy and high resolution transmission electron microscopy results show that an ultra thin layer of ZnO IPL can effectively suppress the oxides formation and minimize the Fermi level pinning at the interface between the GaAs and ZrO₂. By incorporating ZnO IPL, GaAs MOS devices with improved capacitance-voltage and reduced gate leakage current were achieved. The charge trapping behavior of the ZrO₂/ZnO gate stack under constant voltage stressing exhibits an improved interface quality and high dielectric reliability.     

Effect of atomic passivation at Ni-MoS2 interfaces on contact behaviors

Recently, spintronics devices using MoS₂ and ferromagnetic electrode have been in the spotlight. However, strong Fermi level pinning (FLP) is known to occur between MoS₂ and ferromagnetic electrode, resulting in a large Schottky barrier height (SBH), which makes it difficult to inject electron from ferromagnetic electrode to semiconductor. To resolve this problem, we study the reduction of FLP occurring between two materials by investigating the effect of atomic passivation at Ni-MoS₂ interfaces on contact behaviors. Such atomic passivation can reduce the FLP and magnetic moments induced at S atoms of MoS₂. Especially, the largest decrease in the FLP occurs in the case of H atom passivation. Besides, the N, O, and F atom passivation confirms the possibility of ohmic contact, indicated from small SBHs (~0.2 eV). As a result, the SBH and thus the efficiency of the device can be controlled by atomic passivation at metal-semiconductor interfaces.     

P2S5/NH4OH处理GaAs(100)表面的电子能谱研究

采用俄歇电子能谱(AES)和X射线光电子能谱(XPS)研究了P₂S₅/NH₄OH钝化液处理的GaAs(100)表面的微观特性。AES测量表明,在钝化膜和GaAs衬底之间的界面处无O组分,只有P和S组分。XPS测量分析指出,经过P₂S₅/NH₄OH溶液处理后,GaAs表面处Ga₂O₃和As₂O_{3关键词：}     

多晶Si0.9654Mn0.0346:B薄膜的磁性研究

利用磁控溅射和快速热处理的方法制备了Mn,B共掺的多晶硅薄膜(Si_0.9654Mn_0.0346:B).磁性和结构研究发现薄膜有两个铁磁相.低温铁磁相来源于杂相Mn₄Si₇,高温铁磁相(居里温度T_C～250K)是由Mn原子掺杂进入Si晶格导致.晶化后的薄膜利用射频等离子体增强化学气相沉积系统(PECVD)进行短暂(4min)的氢化处理后发现,薄膜的微结构没有发生变化而饱和磁化强度却随着 关键词： 磁性半导体 硅 氢化     

DC current effect on the magnetic phase and transport properties of polycrystalline La0.7Ca0.3MnO3

The influence of DC current on the resistivity and phase transition of polycrystalline La_0.7Ca_0.3MnO₃ has been investigated. The specific heat measurement found that charge carriers and ferromagnetic spin-wave contributions were changed after applied DC current. Applying high electric fields leads to the formation of ferromagnetic regions. The resistivity drops abruptly once the percolating current path is established. As current through the sample disappears, the larger ferromagnetic (FM) clusters, however, remain and are frozen in giving a measurable contribution to the specific heat of the system. The larger clusters should give rise to the value of spin-wave stiffness constant (D), as it is expected to increase the strength of the ferromagnetic coupling. The metallic ferromagnetic regions would make the charge carrier delocalization and attribute to specific heat linear term γ.     

Evidence for instability in charge ordering Nd0.5Sr0.5MnO3

The transport properties and magnetic phase transitions of charge ordering manganites Nd_0.5Sr_0.5MnO₃ have been investigated. From resistivity measurements, a continuous increase of resistivity upon the thermal cycling occurs at , and shows an instable behavior in the system. The experimental results of magnetization and electron-spin-resonance spectra indicate that the ferromagnetic phase and antiferromagnetic phase coexist in a broad temperature region. We think that the origin of the instability stems from an inhomogeneous strain yielded in the ferromagnetic interface, due to the competition among different phases.