4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

苯乙炔基封端聚酰亚胺材料研究进展

在过去二十年中，芳香族聚酰亚胺材料得到越来越广泛的应用，其中苯乙炔基封端的聚酰亚胺材料因其优异的性能成为目前耐高温聚合物材料研究的热点。本文综述了苯乙炔基封端聚酰亚胺材料的研究现状与发展趋势，着重对材料的化学结构设计与制备方法、以及化学结构与性能之间的关系进行介绍。     

以2-苯基-4,4'-二氨基二苯醚为基础的热固性聚酰亚胺树脂及其复合材料

以2-苯基-4,4'-二氨基二苯醚(p-ODA)、异构二苯醚二酐(ODPA)和苯乙炔基苯酐(PEPA)为原料,通过两步法合成了聚合度分别为1,2和3的酰亚胺树脂低聚物,并通过模压成型法制备了单向碳纤维增强的聚酰亚胺复合材料.表征了酰亚胺树脂低聚物的溶解性、熔体黏度及其固化物聚酰亚胺树脂的热性能,结果表明,聚酰亚胺树脂具有良好的溶解性,在N,N-二甲基乙酰胺(DMAc)、四氢呋喃(THF)及1,4-二氧六环等溶剂中的溶解度大于30%;所有酰亚胺树脂低聚物的最低熔体黏度均在10 Pa·s以下,具有良好的成型工艺性;聚酰亚胺树脂具有良好的热性能,玻璃化转变温度(Tg)最高可达300℃,5%热失重温度(T5%)最高可达545℃,碳纤维增强聚酰亚胺复合材料PIC-4,4'-ODPA-2具有最佳的高低温力学性能.     

热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学

近年来,半互穿聚合物网络(SIPN)概念被用来研制能结合热塑性聚合物的加工性和热固性聚合物的高温性能的大分子体系,用于复合材料耐高温树脂基体。例如:乙炔端基酰亚胺低聚物与热塑性聚酰亚胺基SIPN,线性聚酰亚胺与热固性双马来酰亚胺基SIPN以及热塑性树脂与双腈基SIPN已有报道。研究结果表明共混物起到协同作用,易于加工并具有优异的性能。乙炔端基砜(ATS)树脂具有与聚砜树脂相类似的结构,被认为在将来代替环氧用于高性能粘合剂和复合材料树脂基体的候选者之一。其另     

含氟苯乙炔苯胺封端聚酰亚胺的合成与性能研究

设计并合成了一种含氟苯乙炔苯胺封端剂4-苯乙炔基-3-三氟甲基苯胺(3FPA),使用3FPA与4,4′-(六氟异丙基)双邻苯二甲酸二酐(6FDA)和对苯二胺(p-PDA)制备了计算分子量为5000的聚酰亚胺树脂3FPA-PI-50,并对树脂溶液、树脂模塑粉和树脂模压件的制备与性能进行了研究,实验结果表明3FPA-PI-50树脂溶液具有良好的储存稳定性,成型后树脂具有优异的热性能和热氧化稳定性,后固化后树脂玻璃化转变温度为404℃,5%热失重温度大于530℃.此外树脂具有低的介电常数和吸水率.     

聚异酰亚胺树脂合成条件的优化

采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能。在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ。随处理温度的增加,PⅡ低聚物的T5%随之增加,PⅡ在110℃处理的T5%为208℃,150℃处理的T5%为323℃,180℃处理的T5%为382℃,PⅡ固化后的T5%为550℃,显示出较优异的耐热性能。     

苯乙炔封端的BTDA系列酰亚胺预聚体的研究

合成了具有苯侧基的二胺单体1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ), 并与3,3',4,4'-苯酮四羧酸二酐(BTDA)进行缩聚反应, 分别以4-苯乙炔苯酐(PEPA)和4-苯乙炔-1,8-萘二甲酸酐(PENA)作为封端剂, 合成了两个系列的苯乙炔封端的酰亚胺预聚体. DSC测试结果表明, 此类预聚体具有比PETI-5更宽的加工窗口; 利用所合成的预聚体制成了具有较高热分解温度热固性交联PI薄膜. 结果表明, PI预聚体加工性能良好, 其交联后具有优异的力学和热学性能; 同时PEPA封端的预聚体树脂具有比PENA封端的树脂更为优异的综合性能.     

基于乙炔基-苯并噁嗪单元双重交联反应的聚酰亚胺树脂的制备与性能

为开发可低温固化的聚酰亚胺树脂, 通过分子结构设计将苯并噁嗪单元引入聚酰亚胺树脂中, 合成了含苯并噁嗪单元及乙炔基封端的双官能化新型聚酰亚胺预聚体(PIBzA). 经高温处理, 苯并噁嗪单元发生开环交联, 同时, 乙炔基端基发生三聚成环反应, 从而在固化树脂中形成双重交联网络结构. 苯并噁嗪单元的引入使聚酰亚胺树脂最快固化反应温度降低约32 ℃, 有效降低了固化温度. 同时, 苯并噁嗪单元的引入未大幅度降低树脂的耐热稳定性, 其玻璃化转变温度(T_g)介于266~290 ℃之间, 5%热失重温度(T_d,5%)接近500 ℃, 依然可以满足耐高温复合材料的应用需求. 此外, PIBzA固化树脂具有低介电特性, 其介电常数k介于2.3~3.0, 介电损耗介于0.002~0.008, 可满足透波复合材料及先进微电子封装材料的应用需求.     

Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

Thermosetting resin matrix is the key component of advanced wave-transparent composites,where low dielectric constant,excellent processability,high thermal stability,as well as good bonding ability are required for resins.Herein,we prepared a series of phenylethynyl terminated polyimide(PI)resins by grafting amine-functionalized hyperbranched polysiloxane(HBPSi)to PI chains during the in situ polymerization.The effects of HBPSi on the processability of oligomers,molecular packing,thermal stability,dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in detail.The dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal stability.Meanwhile,the 10 wt％HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the interfacial shear strength(IFSS)of 37.64 MPa,compared with that of neat PI-6 matrix(27.34 MPa),and better adhesion to metal with the lap shear strength of 10.48 MPa,50％higher than that of neat resin PI-6(6.98 MPa).These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties,indicating their great potential as low-dielectric constant resin matrix in radar radome.     

Meltable phenylethynyl-capped oligoimide resins derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene and 3,4′-oxydianiline

A series of meltable oligoimide resins with controlled molecular weights by reactive phenylethynyl endcapping groups have been prepared by the thermal polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with the aromatic diamine mixtures consisting of different mole ratios of 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (1,4,4-6FAPB) and 3,4′-oxydianiline (3,4′-ODA) in the presence of 4-phenylethynylphthalic anhydride (PEPA) as molecular weight-controlling and reactive endcapping reagent. Experimental results indicated that the molecular weight-controlled oligoimide resins were mixtures containing a series of biphenylethynyl-endcapped oligoimides with different chemical structures and different molecular weights. The typical oligoimide resins could be melted at temperatures of 300 °C to yield stable molten fluid with melt viscosity of 13.4 Pa s, which was suitable for melt processing. The molten oligoimide resins could be further polymer chain extended and crosslinked by thermal curing of the reactive phenylethynyl groups to give strong and tough thermosetted polyimides. Thus, the oligoimide resin with calculated molecular weight of 2500 exhibited not only good meltability with low melt viscosity, but also high melt stability and fluidability at temperatures of <300 °C. After thermal curing, the obtained thermosetted polyimide showed high glass transition temperature (>316 °C, DMA), excellent thermal stability with initial thermal decomposition temperature of 588 °C and good mechanical properties with flexural strength of 159.1 MPa, flexural moduli of 3.3 GPa, tensile strength of 94.7 MPa and elongation at breakage of 9.0%.     

Biphenylene End-Capped Polyaromatics

Biphenylene end-capped polyquinoline pre-polymers (DP = 3,11 and 22) were melt processed in the presence of a nickel catalyst at 325–340°C under 500 psi to give high quality transparent films. Very short cure times (～ 5 min) were realized, and the resulting films were insoluble, had increased Tg's, and showed improved mechanical properties both above and below the Tg as compared with the uncured resins. The main curing reaction is a chain extension by the conversion of the biphenylene ends to tetrabenzocyclooctatetraene, while a smaller amount of crosslinking takes place. Biphenylene end-capped polyimide, poly(keto-ether-sulfone) and polyphenylquinoxaline pre-polymers also were synthesized. The polyimide pre-polymer (DP=3) was melt processed at 325°C and 500 psi (Ni catalyst) for 15 min to give films that showed good mechanical properties. Friedel Crafts polymerization to yield the biphenylene end-capped poly(keto-ether-sulfone) could not be adequately controlled to give reproducible oligomers. Polyphenylquinoxaline pre-polymers were similarly melt processed to give insoluble films with good mechanical properties. Graphite reinforced composites were prepared from biphenylene end-capped polyquinoline and polyimide pre-polymers. The composites showed excellent initial properties and low weight loss after oxidative aging at 316°C. However, the mechanical properties were severely diminished after aging for 50–100 h at 316°C in air.     

含三氟甲基聚酰亚胺的合成与性能研究

通过在4,4′-二氨基二苯醚(4,4-′ODA)单体中引入三氟甲基合成了一种新型二胺单体2-三氟甲基-4,4′-二氨基二苯醚(3FODA),该单体具有良好的溶解性和高的反应活性,使用3FODA替代4,4′-二氨基二苯甲烷(MDA)制备了PMR热固性聚酰亚胺树脂.树脂溶液高浓度低粘度,具有室温下良好的储存稳定性;树脂具有很好的加工性能,成型后的模压件显示了优异的热性能和耐热氧化稳定性,玻璃化转变温度在336~379℃之间;此外树脂具有较好的电性能和较低的吸水率.     

Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

A series of phenylethynyl terminated oligoimides based on 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA), m-phenylene diamine (m-PDA) or/and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) with calculated molecular weight of 5000 g mol⁻¹ were synthesized. The effect of molecular structure on solubility and melt viscosity of oligoimides as well as the thermal properties of cured polyimide resins was investigated. Experimental results indicated that the oligoimides have good solubility in strong polar solvents to afford homogeneous solutions with the solid content as high as 50 wt%. The oligoimides exhibited better solubility and lower minimum melt viscosity at relatively lower temperature with the incorporation of flexible 6FAPB. These oligoimides could be thermally cured at 320-380 °C to give thermosetted resins. The cured resins have good thermal stability with the glass transition temperatures of 278-329 °C and the onset decomposition temperatures higher than 500 °C. Adhesive properties of polyimides adhered to stainless steel at various conditions were evaluated by lap shear strength test. It was found that the LSS at room temperature increased with the molar ratio of 6FAPB increasing. The polyimides with combination of rigid and flexible structures exhibited good adhesive properties. With the increasing of curing temperature, the lap shear strength of polyimides at elevated temperature maintained at a high level due to the formation of strong bond.     

Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride

Phenylethynyl containing imide oligomers have been under investigation as part of an effort to develop resins for non-autoclave composite fabrication processes such as resin transfer molding (RTM). These high performance/high temperature composites are potentially useful on advanced aerospace vehicles such as reusable launch vehicles (RLVs). New phenylethynyl terminated imide oligomers (PETI) based upon 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) were prepared and characterized primarily by rheological behavior and cured glass transition temperature (Tg). In comparison to resins from the symmetrical isomer (3,3′,4,4′-biphenyltetracarboxylic dianhydride, s-BPDA), a-BPDA afforded corresponding resins with lower melt viscosities and upon curing, higher Tgs. Several resins exhibited an attractive combination of properties such as low and stable melt viscosities required for RTM composite fabrication, high cured Tgs, and moderate toughness. One resin (P10) was used to fabricate flat, void free laminates by RTM. The laminates exhibited high mechanical properties at temperatures to 288°C. The chemistry and physical properties of these new PETIs and the laminate properties of one composition are discussed.