Poly(lactic acid)-based polymer composites with high electric and thermal conductivity and their characterization

Electrically and thermally conductive polymer composites on the basis of biodegradable poly(lactic acid) (PLA) were developed and studied in this work. Pristine single-walled carbon nanotubes (CNTs) and powder of natural graphite (G) were used as fillers in polymer composites. PLA-based composites were prepared by melt-compounding method. The volume resistivity of PLA/CNT composites can be changed by more than ten orders of magnitude compared to that for neat PLA. The thermal conductivity of PLA/G composites can be changed from 0.193 W⋅m⁻¹⋅K⁻¹ (neat PLA) up to 2.73 W⋅m⁻¹⋅K⁻¹. Loading small quantity of CNTs into PLA/G composites increases the thermal conductivity not less than by 40% of magnitude. Besides, all developed PLA-based composites are suitable for processing by injection molding, extrusion or additive manufacturing technology (3D printing).     

Enhanced directional thermal conductivity of polylactic acid/polybutylene adipate terephthalate ternary composite filled with oriented and surface treated boron nitride

A combination of solution casting and melt extrusion technique was used to fabricate Boron nitride (BN)-filled Polylactic acid (PLA)/polybutylene adipate terephthalate (PBAT) blend composites. The BN particles were surface treated with a silane coupling agent and functionalization was confirmed via spectroscopic analysis. Field emission scanning electron microscopy confirmed that the BN surface treatment improved the particle adhesion with the polymer matrices and acted as a compatibilizer for the polymers. Moreover, changes in the particle orientation in the blend composite yielded improved thermal conductivity in different directions. The inclusion of the treated BN particles enhanced the in-plane (~1.1 W m⁻¹K⁻¹) and through-plane (~0.8 W m⁻¹K⁻¹) thermal conductivity of the composites as compared to the neat PLA. In addition, the storage modulus of the composite become more than 3 GPa that is twice that of the PLA/PBAT blend with a reasonable tensile property. In general, compared with the PLA/PBAT blend, the blend composites exhibited superior thermal and mechanical properties.     

High thermal conductivity polylactic acid composite for 3D printing: Synergistic effect of graphene and alumina

With the continuous development of the electronics industry, in order to meet the requirements of electronic equipment to reduce the size and increase power consumption, the development of high thermal conductivity materials is crucial. In this study, thermally conductive polylactic acid (PLA) composites were prepared by constructing graphene and alumina (Al₂O₃) hybrid filler network, and it was further successfully used in additive manufacturing. Due to the synergistic effect of Al₂O₃ and graphene, the resulting composite achieved the thermal conductivity of 2.4 Wm^?1 K^?1 with 70 wt% Al₂O₃ and 1 wt% graphene, which are superior to data reported in the literature in the same filler condition. The Al₂O₃ and graphene hybrid filler network reduced the agglomeration of graphene and the thermal contact resistance between the fillers, thereby leading a faster cooling rate. Furthermore, the obtained thermally conductive PLA composite has good thermal stability at a normal temperature. The PLA composite powder obtained by the cryogenic pulverization can be used in the laser sintering additive manufacturing process to prepare a heat conductive material with a complicated shape.     

Effect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy composites

The composites comprising vertically aligned network of copper nanowires (CuNWs) in the presence of cellulose nanofibers were fabricated by using the freeze‐templating method and the effect of aspect ratio (A/R) of CuNWs on the thermal conductivity of epoxy composites was investigated. The thermal conductivity of epoxy composites increased to 0.79 W m^?1 K^?1 at 1.12 vol% of high A/R CuNWs loading, corresponding to the thermal conductivity enhancement of 365% as compared to the pure epoxy. The thermal conductivity of vertically aligned higher A/R CuNWs/epoxy, which is 38.5% and 51.9% higher than those of the lower A/R CuNWs and the randomly aligned CuNWs, respectively. The application of the epoxy composites in heat dissipation was demonstrated by the temperature changes of composites on a hot plate with the increase of heating time. These results indicate that the thermally conductive composites in this study could be applied for thermal dissipating materials in electronic devices.     

Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

Development of high thermally conductive and electrically insulative composites is of interest for electronic packaging industry. Advancements in smaller and more compact electronic devices required improvements in packing materials, including their weight, thermal conductivity, and electrical resistivity. In addition, with the increasing environmental awareness, the usage of green (bio‐based) alternatives was equally important. In the present study a hybrid based on fibers of highly concentrated hexagonal boron nitride (hBN) in liquid crystal polymer (LCP) matrix were fabricated. These hybrids were formed by arranging hBN platelets into LCP fiber form to reach high filler concentration and then randomly mix it in polylactide (PLA) matrix. With appropriate filler interaction within the hybrid, thermal conductivity similar to that of pure fiber could be achieved. Filler interaction may be tailored by optimizing the fibers aspect ratio. This study demonstrated the effect of random fillers in fibers shape in increasing the overall thermal conductivity of PLA polymeric hybrid using hBN and LCP fibers. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 457–464     

Silane surface modification of boron nitride for high thermal conductivity with polyphenylene sulfide via melt mixing method

Polyphenylene sulfide (PPS) is a promising engineering polymer, which is used for various industrial applications. In this study, we developed a highly thermally conductive PPS composite containing boron nitride (BN) as a thermally conductive ceramic filler. (3‐Aminopropyl) triethoxysilane was doped onto the surface of hydroxyl‐functionalized BN using a simple sol–gel process. The modified BN particles were embedded in a PPS matrix via a melt mixing process using a twin extruder to form BN‐Si composites. The maximum thermal conductivity 3.09 W/m·K was exhibited by the surface‐modified BN‐Si containing 60 wt%. This value was 116% higher than the thermal conductivities of the pristine BN and PPS matrix, respectively. The surface‐treated composites also showed an improved storage modulus because of an improvement in the interfacial adhesion and interaction between the BN filler and the PPS matrix. Copyright © 2017 John Wiley & Sons, Ltd.     

Eco‐friendly conductive polymer nanocomposites (CPC) for solar absorbers design

To reduce both the cost and the environmental impact of copper‐based thermal solar absorbers, we have investigated their possible substitution by bio‐based conductive polymer nanocomposite (CPC) elements. Our results show that carbon nanotubes (CNT) have no significant influence on polymers’ calorimetric properties such as T_m and T_g but lead to a strong increase in crystallinity of poly(lactic acid) (PLA) and to a lesser extent of poly(amide 12) poly(amide 12) (PA12) for 2 and 3 CNT wt % respectively. Percolation thresholds as low as 0.5 and 0.58 were obtained for PA12 and PLA, respectively, and visco‐elastic properties such as η*, G’ and G” were found to increase exponentially with CNT content confirming the formation of a CNT network within the matrix. All CPC are absorbing more energy in the visible and infrared than in the ultraviolet wavelength ranges. Finally, the thermal conductivity k of PLA–CNT and PA12–CNT were increased, respectively, of 85% and 24%, to reach 0.28 W.m^?1.K^?1 and 0.26 W.m^?1.K^?1, for only 5 wt% CNT. The figure of merit suggests that PA12 is the polymer which satisfies at best all criteria, particularly combining a lower viscosity at almost equivalent thermal conductivity and absorptivity. Copyright © 2013 John Wiley & Sons, Ltd.     

高分子导热复合材料结构设计及性能研究进展

近年来,电子设备的需求逐渐向集成化、微型化发展,随之带来了愈发严重的发热问题已经成为了阻碍电子设备发展的重要因素之一。作为电子设备重要组成材料之一的高分子材料对优良导热性能的要求也越来越高,导热高分子复合材料的研究已经成为当前功能复合材料的重要发展方向。本文综述了高分子导热复合材料的发展趋势,介绍了当前选用填料法来制备单一填料、混杂填料高分子导热复合材料以及双逾渗结构、隔离结构等复杂多相结构的高分子导热复合材料的研究进展。重点介绍了通过多种导热填料的组合利用来制备高性能导热高分子复合材料。最后,对填料法高导热高分子复合材料的发展方向做出了简要展望。     

Enhancement of thermal conductivity and tensile strength of liquid silicone rubber by three-dimensional alumina network

ABSTRACT

Rapidly increasing demands for higher integration density and stability of electronic devices embrace higher requirements for thermally conductive silicone rubber, which is promisingly used in ultra-thin components. In this work, alumina whiskers (AWs) and alumina flakes (AFs) are used to modify liquid silicone rubber (LSR) by fabricating binary (AFs/LSR) or ternary (AWs/AFs/LSR) composites. The thermal conductivity and mechanical strength of the binary and ternary composites were investigated. Thermal conductivity of the binary AFs/LSR composite (25AFs/LSR) was 0.1990 W m^?1 K^?1, while the thermal conductivity of the ternary AFs/AWs/LSR composite (20AFs/5AWs/LSR) was 0.2655 W m^?1 K^?1. Furthermore, the tensile strength of the ternary AWs/AFs/LSR composites increased by 180.9% as compared with the binary system, increased to 7.81 MPa from 2.78 MPa due to the introduction of 1 wt% AWs. As a reason, a significant synergistic effect of AWs and AFs in the enhancement of both thermal and mechanical properties of the LSR was proved. Furthermore, the dielectric property measurements demonstrated that the ternary composites exhibited a lower dielectric constant and dielectric loss, indicating that the AWs/AFs/LSR composites were qualified to be applied in the field of electronic devices.     

Enhancement of the thermal and mechanical properties of a surface‐modified boron nitride–polyurethane composite

Thermoplastic polyurethane (PU) elastomer, prepared from poly(tetramethylene glycol) and methyl diphenyl diisocyanate, was blended with boron nitride (BN) to fabricate a thermally conductive interface material. BN treated by a silane coupling agent (BN―NH₂) and PU‐grafted BN were prepared to fabricate a composite that has better thermal conductivity and mechanical strength. The surface‐modified filler showed enhanced dispersibility and affinity because of the surface treatment with functional groups that affected the surface free energy, along with the structural similarity of the doped crystallized diisocyanate molecule with the matrix. The thermal conductivity increased from 0.349 to 0.467 W mk^?1 on 20 wt% PU‐grafted BN loading that is a 1.34‐fold higher value than in the case of pristine BN loading at the same weight fraction. Moreover, the number of BN particles acting as defects, thereby reducing the mechanical strength, is decreased because of strong adhesion. We can conclude that these composite materials may be promising materials for a significant performance improvement in terms of both the thermal and mechanical properties of PU‐based polymers. Copyright © 2014 John Wiley & Sons, Ltd.     

Fluorine-Containing Flow Modifier for BN/PPS Composites Enabled by Low Surface Energy

In this study, a fluorine-containing flow modifier (Si-DF) with low surface energy is successfully synthesized, which is applied to fabricate ideal electronic packaging materials (BN/PPS composites) with high thermal conductivity, excellent dielectric properties, processability, and toughness by conventional melt blending. Si-DPF is located at the interface between the BN fillers and the PPS matrix, which not only improves the dispersion of BN fillers but also strengthens the interaction. With the help of 5 wt% Si-DF, BN/PPS/Si-DF (70/25/5) still exhibits the high thermally conductive coefficient (3.985 W/m·K) and low dielectric constant (3.76 at 100 MHz) although BN fillers are loaded as high as 70 wt%. Moreover, the sample processes a lower stable torque value (2.5 N·m), and the area under the stress–strain curves is also increased. This work provides an efficient way to develop high-performance polymer-based composites with high thermally conductive coefficients and low dielectric constants for electronic packaging applications.     

Thermal characterization and electrical properties of Fe-modified cellulose long fibers and micro crystalline cellulose

Thermal properties of polylactic acid (PLA) filled with Fe-modified cellulose long fibers (CLF) and microcrystalline cellulose (MCC) were studied using thermo gravimetric analysis (TG), differential scanning calorimetry, and dynamic mechanical analysis (DMA). The Fe-modified CLFs and MCCs were compared with unmodified samples to study the effect of modification with Fe on electrical conductivity. Results from TG showed that the degradation temperature was higher for all composites when compared to the pure PLA and that the PLA composites filled with unmodified celluloses resulted in the best thermal stability. No comparable difference was found in glass transition temperature (T _g) and melting temperature (T _m) between pure PLA and Fe-modified and unmodified CLF- and MCC-based PLA biocomposites. DMA results showed that the storage modulus in glassy state was increased for the biocomposites when compared to pure PLA. The results obtained from a femtostat showed that electrical conductivity of Fe-modified CLF and MCC samples were higher than that of unmodified samples, thus indicating that the prepared biocomposites have potential uses where conductive biopolymers are needed. These modified fibers can also be tailored for fiber orientation in a matrix when subjected to a magnetic field.     

Filler size effects on the conductivity of polymer nanocomposites: Semiconductive phthalocyanine nanoparticles in epoxy matrices

Three Cobalt(III) phthalocyanine (Phthalcon) powders with different particle sizes and chemical compositions, but almost equal XRD spectra and powder conductivity were synthesized and used as conductive fillers in crosslinked epoxy matrices. Two of these Phthalcons are new compounds. The relation between the conductivity of the composites and the type and amount of filler used was determined. The influence of particle size and chemical composition on this relation appeared to be minimal. These composites had a percolation threshold of 0.9 vol % and a maximum volume conductivity of 10^?7 S/cm. Detailed analysis showed that the particle networks have very similar fractal structures and that they are likely to be formed by diffusion limited cluster‐cluster aggregation during processing. Evidence is presented that these particle networks are formed at an early stage of crosslinking and that the charge transfer between particles in the networks is neither limited by the Phthalcon particle size, nor by the presence of polymer matrix between the particles. The maximum volume conductivity of these composites is likely to be limited by the amount of filler used, the crystal structure defects on the particle surface, and the fractality and the imperfection of the particle networks. The impact of these findings on the conductivity of other polymer nanocomposites is discussed. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 1079–1093, 2008     

Cellulose nanofibril-reinforced biodegradable polymer composites obtained via a Pickering emulsion approach

Preparation of cellulose nanofibril (CNF)-reinforced, biodegradable polymer composites is challenging in that it’s hard to achieve good dispersion of the hydrophilic cellulose fibers in a hydrophobic polymer matrix. In this work, we developed a surfactant-free and efficient process to prepare CNF-reinforced poly (lactic acid) (PLA) composites from an aqueous dichloromethane Pickering emulsion self-emulsified by CNFs. CNF/PLA composites of homogeneous dispersion were obtained upon evaporation of CH₂Cl₂, filtration, drying and hot-pressing. Differential scanning calorimetry measurement revealed an enhanced crystallization capacity of the CNF/PLA composites. Thermogravimetric analysis indicated an increase of onset degradation temperature. The composites displayed an enhanced storage modulus compared with neat PLA throughout the testing temperature range, and especially in the high-temperature region (>70 °C). Enhancements of the flexural modulus and strength were also achieved.     

A new method of growing crystalline networks in polymer matrices by simultaneous CT complex formation and in situ crystallization

A new method of preparing conductive polymer composites by growing crystalline networks of conductive additives in polymer matrices (reticulate doping) is described. The method consists of treating the polymer containing molecularly dispersed donor additive with acceptor/solvent vapors. In the swollen polymer layer simultaneously CT complex formation and crystallization takes place which for proper conditions leads to the formation of a network of the CT complex crystallites, making the film surface-conducting. The preparation and properties of surface conductive films using several electron donors and an iodine acceptor are described. The films obtained show surface resistivities of 10⁴–10⁶ ohm and are generally stable under ambient conditions.     

Development and thermal behaviour of ternary PLA matrix composites

Biodegradable PLA composites were prepared using microcrystalline cellulose (MCC) and silver (Ag) nanoparticles. The main objective of the present study is to develop new biopolymer composites with good mechanical properties, thermal stability, maintaining the optical transparency and also providing antimicrobial properties through silver nanoparticle introduction. Composites were prepared with 1%wt of Ag nanoparticles and 5%wt of MCC using a twin-screw microextruder; film parameters were optimized in order to obtain a thickness range between 20 and 60 μm.PLA composites maintained optical transparency properties of the matrix, while MCC was able to reduce polymer permeability. Thermal analysis revealed that MCC increased PLA crystallinity and the mechanical properties of the composites demonstrated that tensile modulus was improved by microcrystalline cellulose.     

Conductive mechanism of polymer/graphite conducting composites with low percolation threshold

Preparation of the conducting composites of polystyrene/expanded graphite via in situ polymerization and investigation of the conductive mechanism were carried out. They are characterized by high conductivity and a low percolation threshold. The electrical conductivity reached 10^?2 S/cm with 3.0 vol % expanded graphite content, whereas the percolation threshold was 1.0 vol %. Optical micrographs revealed the heterogeneous distribution of the graphite particles and the formation of a conductive network in the polymer matrix. A model of primary particle was proposed to interpret the conductive phenomena. The primary particle is the basic conductive unit in the composites that comprises three of the following parts: the graphite particle, the compact‐adsorbed layer, and the wrapping shell. Our model was also used to explain the experimental data in our previous studies on nylon‐6/expanded graphite composites. A low percolation threshold of conducting composites can be also explained according to the model of the primary particle. Furthermore, the theoretical line of conductivity versus primary particle content calculated from the revised Flory's theory fits the experimental data well. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 954–963, 2002     

Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Hexagonal boron nitride (BN) platelets, also known as white graphite, are often used to improve the thermal conductivities of polymeric matrices. Due to the poor interfacial compatibility between BN platelets and polymeric matrices, in this study, polyrhodanine (PRd) was used to modify BN platelets and prepared functionalized BN-PRd platelets, thereby enhancing the interfacial interaction between the thermal conductive filler and polymeric matrix. Then, BN-PRd platelets were dispersed into the nitrile butadiene rubber (NBR) matrix to yield high thermally conductive composites. The presence of N? C═S groups in PRd allowed the combination of PRd and NBR chains containing stable covalent bonds via vulcanization reaction. The thermal conductivity of the as-prepared 30 vol% BN-PRd/NBR composite reached 0.40 W/mK, representing an increment of 135% over pure NBR (0.17 W/mK). In addition, the largest tensile strength of NBR composite containing 30 vol% BN-PRd platelets was 880% times of pure NBR. The 30 vol% BN-PRd/NBR composite also displayed a relatively high dielectric constant (9.35 at 100 Hz) and a low dielectric loss tangent value (0.07 at 100 Hz), indicating their usefulness as dielectric flexible materials of microelectronics. In sum, the simplicity and good efficiency of formation of covalent bonds between boron nitride and rubber chains look very promising for large-scale industrial production of high thermally conductive composites.     

Low percolation conductive graphite flakes-filled poly(urethane-imide) composites with high thermal stability via imidization self-foaming structure

In the study, the conductive graphite flakes filled poly(urethane-imide) composites (PUI/GFs) with high performance were constructed by the thermal imidization self-foaming reaction. It was found that the foaming action could promote the redistribution of GFs during curing process and the formation of stable linear conductive pathways. The percolation threshold of PUI/GFs composites was lowered from 1.26 wt% (2000 mesh GFs) or 0.86 wt% (1000 mesh GFs) to 0.79 wt% (500 mesh GFs), which were relatively low percolation thresholds for polymer/GFs composites so far. When the content of 500 mesh GFs was 4.0 wt%, the electrical conductivity of the composite was as high as 3.96 × 10^?1 S/m. Also, a poly(urethane-imide) (PUI) matrix with excellent thermal stability (T_d10%: 334.97 °C) and mechanical properties (elongation at break: 324.52%, tensile strength: 15.88 MPa) was obtained by introducing the rigid aromatic heterocycle into the polyurethane (PU) hard segments. Moreover, the zero temperature coefficient of resistivity for the composites was observed at the temperature range from 30 °C to 200 °C. Consequently, PUI/GFs composites may provide the novel strategy for considerable conductive materials with high thermal stability in electrical conductivity.     

导热增强聚乙二醇相变复合材料的制备及其性能

本文以聚乙二醇(PEG)为相变材料,通过添加不同的无机填料,采用熔融共混浇筑方式制备了导热增强型相变复合材料。 通过扫描电子显微镜(SEM)、热常数分析仪、差示扫描量热仪(DSC)、红外热成像和热重分析仪研究了所制备复合材料的微观结构、导热性能与相变过程。 研究结果表明,相比于碳酸钙和氧化铝,在相同添加含量下,氮化硼(BN)可有效提高PEG的导热系数,当BN质量分数为40%时,导热系数可达到3.40 W/(m·K);当填料添加量相同时,片状BN和不规则纳米碳酸钙(CaCO₃)比球形氧化铝(Al₂O₃)对PEG具有更加优良的定型效果,在相变过程中,能够更加有效阻隔PEG的流动,保持复合材料的形状稳定性。