Liquid–liquid structure transition in Sn–3.5Ag–3.5Bi melts

The liquid–liquid structure transition (LLST) as the function of temperature and time in Sn–3.5Ag–3.5Bi melts was investigated with the help of direct current four-probe method. The LLST which occurs during first cycle heating of two cycles heating/cooling experiments can divide into two different structure changes: irreversible LLST of 650°C isothermal and step reversible LLST at 770°C–806°C on subsequent heating process. Obvious kinetic phenomena are observed during isothermal experiments. Irreversible and reversible LLST are analysed from the viewpoint of short-range order. These results will help to understand the law and mechanism of liquid field, and provide some scientific reference for the innovation of lead-free solder manufacturing.     

Electrical resistivity of liquid Sb–Zn alloys

Using the DC four-probe method, temperature dependence of the electrical resistivity (ρ???T) of Sb_{100? x} Zn _x (x?=?25,?40,?50,?57,?61,?80 at%) alloys was investigated in the temperature range of 500–860°C. The results showed that resistivity of each liquid alloy decreased non-linearly with temperature increasing above their liquidus (T _L) until reaching critical temperature, at which the resistivity–temperature coefficients dρ/dT–T converts from negative into positive. The phenomena of liquid phase transformation might relate with the dissociation of covalent bonds, chemical orders and associations in Sb–Zn melts.     

Electrical resistivity and superconductivity of amorphous La−Ag alloys

We report on measurements of the electrical resistivity and the superconducting transition temperature of amorphous La–Ag alloys (60–74 at % La) obtained by liquid quenching. The temperature coefficient of the resistivity is always slightly negativ, its value cannot be described well by existing theories.T _c depends linearly on the La content and seems to be not very sensitive to the second alloy constituent.Dedicated to Prof. Dr. W. Buckel on the occasion of his 60th birthday     

Electrical resistivity of liquid Bi–Sb alloys

The electrical resistivities of liquid Bi–Sb alloys have been measured by DC four-probe method within Bi-rich composition through a wide temperature range. The distinct anomaly of a hump shape was observed on resistivity–temperature (ρndash;T) curves for liquid Bi–Sb alloys on heating at the relatively high temperatures. These anomalies have revealed the temperature-induced liquid–liquid phase transition in Bi–Sb melts. The DSC results for BiSb20wt% alloy further prove the existence of liquid–liquid transition. Measuring the ρ–T curves first on heating and then on cooling we have found that on cooling the ρ–T curve remained linear. It means that the postulated liquid–liquid transition may be irreversible.     

Electrical resistivity of alkali metals: Inflation–deflation effect of Fermi surface

The electrical resistivity of liquid alkali metals was calculated using the extended Ziman formula. The possible role of Fermi surface (FS) inflation–deflation (ID) was examined. The calculations reveal that replacing the sharp free electron FS by the expanded (respectively, contracted) one substantially improves the results. This was achieved directly by considering a FS correction factor of the Fermi radius and indirectly by a shift in the muffin-tin zero (MTZ) of the potential from its initial values. Consequently, a correlation between the shift of the MTZ of the potential and the FS factor parameter is revealed. The role of this correlation might contribute to a better understanding of the electron transport properties of other liquid metals and their alloys.     

Viscosities and their correlations with structures of Cu–Ag melts

The viscosities of a series of Cu–Ag melts in a temperature range from 1473 K to nearly liquid temperatures are measured by using an oscillating viscometer. At the same temperature, the value of viscosity increases first with silver content increasing, and reaches a maximum value at the eutectic component Cu40Ag60, then decreases. All the temperature dependences of the viscosities of Cu–Ag melts conform with the Arrhenius equation. The parameters of correlation length D of the studied Cu–Ag melts are calculated according to the experimental results of x-ray diffraction. The temperature dependence of correlation length D shows an exponential decay function, which is similar to the Arrhenius equation. Based on the values of viscosities and correlation length D, a direct correlation between viscosity and liquid structure is found for the investigated Cu–Ag melts through comparative analysis.     

Electrical Explosion of Wires for Manufacturing Bimetallic Antibacterial Ti–Ag and Fe–Ag Nanoparticles

Russian Physics Journal - Using a simultaneous electrical explosion of two twisted wires, bimetallic Ti–Ag and Fe–Ag nanoparticles are synthesized, where the component ratios are...     

Electrical resistivity of microinhomogeneous PdMnxFe1−x alloys

The electronic band-structure calculations of the PdFe ferromagnet and the PdMn antiferromagnet performed in this work permit one to conclude that the specific features of the electrical resistivity observed in the ternary PdMn_xFe_1−x alloy system [the deviation from the Nordheim-Kurnakov rule ρ₀(x)∼x(1−x), which is accompanied by a high maximum of residual resistivity (not typical of metals) ρ ₀ ^m ∼220 μΩ cm at x _C∼0.8 and a negative temperature resistivity coefficient in the interval 0.5≤x≤1] are due to the microinhomogeneous (multiphase) state of the alloys and a variation in the band-gap parameter d spectrum caused by antiferromagnetic ordering of a PdMn-type phase. __________ Translated from Fizika Tverdogo Tela, Vol. 44, No. 2, 2002, pp. 193–197. Original Russian Text Copyright ? 2002 by Kourov, Korotin, Volkova.     

Surface tension estimation of high temperature melts of the binary alloys Ag–Au

Abstract

Surface tension calculation of the binary alloys Ag–Au at the temperature of 1381 K, where Ag and Au have similar electronic structures and their atomic radii are comparable, are carried out in this study using several equations over entire composition range of Au. Apparently, the deviations from ideality of the bulk solutions, such as activities of Ag and Au are small and the maximum excess Gibbs free energy of mixing of the liquid phase is for instance ?4500 J/mol at X_Au = 0.5. Besides, the results obtained in Ag–Au alloys that at a constant temperature the surface tension increases with increasing composition while the surface tension decreases as the temperature increases for entire composition range of Au. Although data about surface tension of the Ag–Au alloy are limited, it was possible to make a comparison for the calculated results for the surface tension in this study with the available experimental data. Taken together, the average standard error analysis that especially the improved Guggenheim model in the other models gives the best agreement along with the experimental results at temperature 1383 K although almost all models are mutually in agreement with the other one.     

Electrical resistivity of fluid methane multiply shock compressed to 147 GPa

Shock wave experiments were carried out to measure the electrical resistivity of fluid methane. The pressure range of 89–147?GPa and the temperature range from 1800 to 2600?K were achieved with a two-stage light-gas gun. We obtained a minimum electrical resistivity value of 4.5?×?10^?2?Ω?cm at pressure and temperature of 147?GPa and 2600?K, which is two orders of magnitude higher than that of hydrogen under similar conditions. The data are interpreted in terms of a continuous transition from insulator to semiconductor state. One possibility reason is chemical decomposition of methane in the shock compression process. Along density and temperature increase with Hugoniot pressure, dissociation of fluid methane increases continuously to form a H₂-rich fluid.     

Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn–Pb–Bi–Ag alloy paste

Soldered joints of Bi-2223/Ag-sheathed high temperature superconducting multifilamentary tapes were fabricated using 63 wt.%Sn–34 wt.%Pb–1 wt.%Bi–2 wt.%Ag paste. The soldered joints were observed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Moreover, the electrical properties of joints were evaluated by current–voltage curves, and the tensile strengths of the joints were also tested. The results show that the soldered joint consists of Ag sheath – Ag₃Sn compound layer – PbSn₂ and Ag₃Sn solder layer – Ag₃Sn compound layer – Ag sheath. The joints are obeyed with Ohms Law and the magnitude of the joint resistance, which deceases with the increase of the overlap length, can reach the order of 10^?8 Ω. The tensile strength of the joints with a brittle fracture mode is a little lower than that of the original tapes.     

Experimental evidence of the transformation from microheterogeneous to microhomogeneous states in Ga–Sn melts

The electrical resistivities of liquid Ga–Sn system have been carefully measured as a function of temperature for different compositions employing direct-current four-probe method. It was well known that the electrical resistivity varies linearly with temperature for typical liquid metals. However, an abnormal change on the resistivity-temperature curve in the intermediate temperature region Ts–Te$T_s\text{–}{T}_e$ (385–422 °C for Ga₂₀Sn₈₀ melt and 395–449 °C for liquid Ga₁₀Sn₉₀ melt, here Ts$T_s$ and Te$T_e$ are denoted as the start-temperature and the end-temperature of the abnormal change) is observed in the initial Ga₂₀Sn₈₀ and Ga₁₀Sn₉₀ melts during first heating, but this abnormal behavior disappears during subsequent cooling as well as reheating process. This result indicates that in the initial Ga₂₀Sn₈₀ and Ga₁₀Sn₉₀ melts there may exist the microheterogeneities, during heating in the temperature range from Ts$T_s$ to Te$T_e$ the irreversible structure transition possibly takes place from microheterogeneous melt to microhomogeneous melt. It suggests that the necessary overheating above liquidus up to Te$T_e$ is a guarantee of the molten alloy getting the microhomogeneous sate or the true solution and conserving it during cooling down to liquidus at any cooling rates.     

Effects of Ag on Electrical Properties of Ag/Ni/p-GaN Ohmic Contact

Properties of the Ag/Ni/p-GaN structure at different temperatures are studied by Auger electron spectroscopy, scanning electron microscopy and high resolution x-ray diffraction. The effect of Ag in ohmic contact on the crystalline quality is investigated and the optimized value of annealing temperature is reported. The lowest specific contact resistance of 2.5 × 10^-4 Ωcm^2 is obtained at annealing temperature of 550^o C.     

Formation of Structural-Phase States in Ag–Cu Bimetallic Nanoparticles Produced By Electrical Explosion of Wires

Russian Physics Journal - Regular features of formation of structural-phase states in Ag–Cu bimetallic nanoparticles produced under the conditions of a simultaneous electrical explosion of...     

Electrical characterization of metal–molecule–silicon junctions

Direct assembly of molecules onto silicon surfaces is of particular interest for potential employment in hybrid organic-semiconductor devices. In this study, aryl diazonium salts are used to assemble covalently bound molecular groups onto a hydride-passivated, oxide-free n-type Si(111) surface. The reaction of 4-(trimethylsilylethynyl)benzenediazonium tetrafluoroborate generates a molecular layer of 4-(trimethylsilylethynyl)phenylene (TMS-EP) on the Si surface. The monolayer modifies the electrical properties of the interface and exhibits nonlinear current–voltage characteristics, as compared with the ohmic behavior observed from metal- n⁺⁺-Si(111) junctions. Results of current–voltage measurements at variable temperatures (from 300 to 10 K) on samples made with the TMS-EP molecules do not show significant thermally-activated transport, indicating tunneling is the dominant transport mechanism for this device structure. The measured data is compared to a tunneling model.     

Effects of composition and cooling rate on the microstructure of?Sn–3.7Ag–0.9Zn–Bi solders

The effects of Bi addition, of less than 3 wt.%, and applied cooling rate on the solidified microstructure of the eutectic Sn–3.7Ag–0.9Zn (weight percent, hereafter) solder were investigated. As observed by microstructural analysis, the increase of Bi content favors the separation of the β-Sn and AgZn intermetallic compounds (IMCs) in the eutectic Sn–Ag–Zn solder. And there are some Bi precipitates formed along with the primary β-Sn dendrites as the concentration of Bi exceeds 2%. As the applied cooling rate increases, the microstructure of the Sn–3.7Ag–0.9Zn–Bi solder is refined, and the segregation of Bi is restrained. By increasing the amount of Bi, the microhardness of the solder increases.     

Synthesis and characterization of highly conductive Sn–Ag bimetallic nanoparticles for printed electronics

To synthesize low-cost, highly conductive metal nanoparticles for inkjet printing materials, we synthesized Sn–Ag bimetallic nanoparticles using a polyol process with poly(vinyl pyrrolidone). Because a surface oxidation layer forms on Sn nanoparticles, various compositions of Sn–xAg [x = 0, 20, 40, 60, 80, 100 (wt%)] nanoparticles were synthesized and characterized for the purpose of removing the β-Sn phase. The results of XPS, TEM, and XRD analyses confirm that the formation of a bimetallic phase, such as Ag₄Sn or Ag₃Sn, hinders the β-Sn phase and, consequently, leads to the removal of the surface oxidation layer. To measure the sheet resistance of various compositions of Sn–Ag nanoparticles, we made the ink that contains Sn–Ag by dispersing 10 wt% of Sn–Ag nanoparticles in methanol. The sheet resistance is decreased by the conductive Sn–Ag phases, such as the fcc, Ag₄Sn, and Ag₃Sn phases, but sharply increased by the low-conductive Sn nanoparticles and the surface oxidation layer on the Sn nanoparticles. The sheet resistance results confirm that 80Ag20Sn and 60Ag40Sn bimetallic nanoparticles are suitable candidates for inkjet printing materials.     

Electrical resistivity of dilute (Cr1−xAlx)95Mo5 alloys

The temperature dependence of the electrical resistivity of (Cr_1−xAl_x)₉₅Mo₅ alloys with x = 0.11, 0.44, 0.77, 1.49, 2.07, 3.11, 4.84, 7.31 and 10.63%, was measured. The non-magnetic behaviour of the antiferromagnetic alloys (x = 0.11, 0.44, 0.77, 1.49, 7.31 and 10.63%) was determined by using the temperature dependence of the alloys with x = 2.07, 3.11 and 4.84% that remain paramagnetic at all temperatures, as a model. This allowed an analysis of the data in terms of existing theories.     

Electrical Resistivity of Liquid Fe–Mn Alloys

Russian Physics Journal - The paper deals with the specific electrical resistivity of liquid Fe–Mn alloys with the manganese content of 3.9, 6.0, 8.2, 10.3 and 13.2 at.%. A rotary-field...     

Effect of Ag Doping on Optical and Electrical Properties of ZnO Thin Films

ZnO thin films were prepared on p-type Si (100) substrates by the sol-gel process. The influence of Ag doping at a content of 0.002% on the photoluminescence and current-voltage (I - V) characteristics of ZnO thin films has been investigated. It is found that Ag doping leads to a pronounced increase in the intensity of near band edge emission at 3.23eV and a remarkable red shift of the visible broadband at room temperature. The I - V characteristics of ZnO/p-Si heterojunctions are also changed. These results could be explained by Ag substituting for Zn in Ag doped ZnO thin films.