非晶态镍磷—镍钨磷双层组合镀层的耐蚀性能研究

本文对比研究了镍磷镀层、镍钨磷镀层及非晶态镍磷和镍钨磷双层组合镀层的耐蚀性能，分别进行了各种镀层的浸渍腐蚀实验，镀层的Ｘ射线衍射图象、镀层的扫描电镜图象、以及在工厂实际的腐蚀环境里进行的腐蚀实验。实验结果表明镍磷及镍钨磷双层组合镀层的耐 性优于镍磷镀层、镍钨磷镀层的耐蚀性。     

化学镀镍磷合金镀层孔隙率的电化学评价

本文通过研究镍磷合金、镍磷合金镀层和碳钢在不同浓度硝酸溶液中的动电位极化曲线 ,选择了能够快速检测镍磷合金镀层孔隙率的硝酸浓度 ,并对不同厚度的镍磷合金镀层试样进行评价 .结果表明 :镍磷合金镀层在 1 0 %硝酸溶液中的动电位极化曲线能准确地反映镀层的孔隙率 ,该硝酸溶液最适合作为应用电化学方法检测镀层孔隙率的检测溶液 ,其变化规律是随着镀层孔隙率的减少 ,镀层的腐蚀电位逐渐正移 .应用常规的孔隙率检测方法只能检测较大的孔隙 .     

化学沉积Ni–Fe–P合金的冲蚀特性研究

采用扫描电镜、能谱仪、X射线衍射等方法,研究了化学沉积Ni–Fe–P合金的组成和结构,并对其冲蚀性进行了研究。结果表明,随着镀液中硫酸亚铁浓度增大,化学沉积Ni–Fe–P镀层中的铁含量增大,磷含量下降。化学沉积Ni–Fe–P镀层的腐蚀电位比化学镀Ni–P镀层的腐蚀电位高。在3.5%(质量分数)Na Cl溶液组成的悬浮液冲击下,碳化硅颗粒粒度为124μm时,镀层质量损失出现最大值,随着悬浮液流速的增大镀层质量损失增加。     

不同材料表面纳米复合化学镀层镍-磷-硅酸锌的XPS和AES分析

对Q235碳钢片和D310硅钢片表面表面镍－磷－硅酸锌纳米复合化学镀层，用SEM观察外貌，称重法测定厚度；10％NaCl、1％H2S加速腐蚀试验，10％CuSO4溶液点滴试验循环伏安（CV）、抗粘性及抗高温氧化试验等测定其性能。用X－射线电子谱（XPS）及俄歇电子能谱（AES）测定其价态及组成。结果表明其性能优镍－磷镀层和其它微米复合化学镀层，表面的镀层Q235碳钢片优于D310硅钢片表面的镀层，镀层的原子百分组成为：D235碳钢片：Ni79.00,P10.06,Zn2.01,Si1.88,O5.87,C1.18;D310硅钢片：Ni80.50,P10.67,Zn1.70,Si1.52,O4.83,C0.78.     

电沉积Ni—Mo—P合金镀层在NaCl溶液中的腐蚀特性

用失重法，阳极率曲线，Ｘ－光电子能谱（ＸＰＳ）以及俄歇电子能谱（ＡＥＳ）研究了电沉积Ｎｉ－Ｍｏ－Ｐ合金镀层在５％ＮａＣｌ溶液中的腐蚀特性，非晶态Ｎｉ－Ｍｏ－Ｐ合金镀层比晶态Ｎｉ－Ｍｏ－Ｐ合金镀层有较低的腐蚀速度阳极极化曲线表明，Ｎｉ－Ｍｏ－Ｐ合金镀层中，镍的摩尔分数国０．７１９～０．８６８时，随镀层中磷含量的增加，腐蚀电位正移，而活化区的峰电流随镀层中钼含量的增加而增加，磷含量的活化区的峰电流以及     

非晶态Ni-Ce-P合金的共沉积与耐蚀性能

采用恒电位沉积、循环状安等方法研究了在水溶液中电沉积稀土合金的可能性 ,首次在含有CeCl3的弱酸性NaH2 PO2 镀液中获得了不同铈含量的Ni Ce P合金镀层 ,XPS、AES、XRD和SEM等实验技术表征了镀层的组成和结构 ,极化电阻和腐蚀电位的测试数据表明此镀层与Ni P无定形合金相比 ,具有更强的耐腐蚀能力 ,同时 ,讨论了沉积条件与镀层耐蚀性能的关系 ,结论是 :镀层中铈含量越高 ,其耐腐蚀性能越好 ,此外还对Ni Ce P的共沉积机理进行了初步探讨 ,指出在所研究的电沉积条件下 ,Ni Ce P合金共沉积可以用“诱导共沉积理论”合理解释     

钇对Zn-Fe合金镀层耐蚀性的影响

电镀液中加入钇盐,在A3钢表面电镀Zn-Fe合金薄膜,研究了钇对Zn-Fe合金镀层耐蚀性能的影响.用线性扫描伏安法和交流阻抗法,研究Zn-Fe合金镀层在30℃0.20 mol·L-1H2SO4溶液中的腐蚀行为.用XRD和SEM研究zn-Fe合金镀层在腐蚀前后的微观结构和形貌的变化.结果表明:加入钇盐,能改变Zn-Fe合金镀层的晶面择优取向和织构系数,使结晶粒度变小,且低晶面指数的晶面耐蚀性较好;当加入钇盐量为0.60 g·L-1时,镀层变得均匀、致密,电结晶生长形态变为层状;镀层的致钝电流密度(ipp)和维钝电流密度(ip)降低显著,极化电阻Rp增大,获得的Zn-Fe合金镀层的耐蚀性能最好.     

硝酸铈及热处理对化学镀Ni-W-P合金的性能影响

为提高化学镀Ni-W-P镀层的耐蚀性和耐磨性,拓宽其应用,采用电化学方法和热处理等手段,研究了镀液中添加剂硝酸铈(Ce(NO3)3)的质量分数和热处理对化学镀Ni-W-P镀层的沉积速度、孔隙率、失重腐蚀速度、腐蚀电位、腐蚀电流、交流阻抗、显微硬度、摩擦系数等性能的影响。结果表明:添加1.0 wt%Ce(NO3)3时,所得镀层的沉积速度最大(36.5 g/m2·h),孔隙率最低(0.8个/cm2),耐腐蚀性能最好。镀层的组织均匀、致密、无缺陷和非晶态结构是其耐蚀性能高的重要原因。100~600℃热处理后,镀层硬度和耐磨性有所提高,而400℃热处理之后,合金显微硬度高达1100 HV,是镀态的1.8倍。     

Ni-Cu-P合金镀层在燃气冷凝换热器上的应用

研究硫酸铜镀液中浓度对Ni-Cu-P合金镀层的成分、组织结构及耐腐蚀性能的影响.EPMA、XRD和极化曲线镀层测试表明,以浓度为0.5g.L-1的硫酸铜作镀液镀层的耐蚀性能最优.在天然气冷凝液中考察了Ni-Cu-P、Ni-P合金镀层和铜基体的电化学耐腐蚀性能,Ni-Cu-P合金镀层的自腐蚀电位低,自腐蚀电流密度小,交流阻抗值最大.因此该镀层可作为铜质燃气冷凝换热器的耐蚀阻挡层和牺牲阳极保护镀层,防止铜管腐蚀穿孔,有效地延长铜质冷凝换热器的使用寿命.     

无电镀镍复合镀层耐蚀性质研究

研究无电镀镍镀层加入钻石微粒或PTFE微粒的均匀分散相 ,所得之复合镀层在 3.5%NaCl水溶液中的电化学分析 ,浸渍试验与临雾试验 ,皆显示复合镀层之耐蚀性低于不含微粒之无电镀镍镀层 .由SEM ,AES ,XRD ,EPMA分析镀层微观组成 ,复合镀层之磷含量分布呈差异性变化 ,磷量较多区域为微阴极 ,磷量较少区域为微阳极 ,复合镀层存在众多微电池组合 ,容易引起电化学伽凡尼腐蚀 ,造成复合镀层耐蚀性降低 ,当镀层微粒含量增加时 ,微粒的惰性保护效果超过微电池效应 ,复合镀层的耐蚀性质才能提高     

纳米颗粒对Ni基复合镀渗层耐冲蚀性能的影响

采用复合镀渗工艺在316L不锈钢表面分别制备了两种纳米颗粒(非晶nano-SiO2颗粒和nano-SiC颗粒)增强的Ni基复合镀渗合金层. 利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)观察了两种复合镀渗合金层的微观组织特征. 通过外加电位(+0.2 V)条件下的电流密度、冲蚀条件下的极化曲线和冲蚀后的交流阻抗谱表征了这两种复合镀渗层在单相流(3.5%(w, 质量分数)NaCl溶液)与料浆流(3.5%NaCl+10%(w)石英砂)中的电化学腐蚀特征, 并采用SEM观察两种复合镀渗层冲蚀后的截面形貌, 探讨这两种纳米颗粒增强的Ni基复合镀渗层在料浆流中的冲蚀机理. 电化学测试结果表明: 静态条件下, 电刷镀含纳米SiO2颗粒的复合镀渗层的耐蚀性能低于单一合金层, 而动态冲蚀条件下, 结果与之相反; 电刷镀含SiC颗粒的复合镀渗层的耐蚀性能在静态和动态冲蚀条件下均低于单一合金层. 对两种复合镀渗层的冲蚀截面形貌观察表明: 弥散分布的纳米SiO2颗粒能明显改善Ni基合金层的耐冲蚀性能; 而添加纳米SiC颗粒在渗金属过程中已完全分解, 导致三元硅化物(Cr6.5Ni2.5Si)和碳化物(Cr23C6)的析出, 而析出相在冲蚀过程易于脱落, 加速了Ni基合金层的质量流失.     

穆斯堡尔谱研究电镀镍铁合金层

用穆斯堡尔谱研究了电镀镍铁合金层的形成过程,镀液中Al~(3 ),Mn~(2 ),Cr~(3 ),Zn~(2 )及Cu~(2 )等离子的存在对镀层组成、织构等的影响以及不同铬处理后镍铁镀层的织构和耐蚀性;分析了铬、锰等元素在其中所起的作用;并初步探讨了形成层状结构的原因.     

Synergism of Saccharum officinarum and Ananas comosus extract additives on the quality of electroplated zinc on mild steel

Synergism of Saccharum officinarum (sugarcane) and Ananas comosus (pineapple) extract additives on the quality of electroplated zinc on mild steel in acid chloride solution was investigated experimentally at ambient temperature (~28 °C). The experiments were performed at different plating times (15 and 18 min), additive concentrations (2, 2.5, 3 ml/50 ml of acid chloride solution), pH 5, temperature (27–30 °C), current (0.08 A), and voltage (13 V DC) conditions. Zinc electroplating on mild steel was performed using a DC-supply. The surface of the plated steel was examined with scanning electron microscopy, and energy dispersive spectroscopy for surface elemental composition analysis. Different surface characteristics were obtained depending upon the concentration of the additive and the plating time. The corrosion resistance of the plated surface was determined by a gravimetric method. Microstructural morphology of the plated surface indicated a good quality electroplating that was better than either the sugarcane or pineapple extracts alone. The electroplating process was sensitive to changes in additive concentration and plating time. Any variation in the plating parameter produced an entirely new and different surface crystal morphology.     

双光子微纳加工技术结合化学镀工艺制备三维金属微弹簧结构

利用飞秒激光双光子微纳加工技术与化学镀工艺制备了三维金属微弹簧结构.采用扫描电子显微镜(SEM)及选区电子能谱(EDS)对镀层进行了表征,当化学镀时间为15 min时,所得到的镀层厚度约为130 nm.对不同电镀时间下获得的镀层电阻率进行了测定,实验结果表明,当电镀时间为35 min时得到的镀层电阻率约为80×10^-9 Ω·m,仅为银块体材料电阻率16×10^-9 Ω·m的5倍.利用这种方法,我们制备了总长度为28.75 μm、周期为2.93 μm的悬空金属弹簧结构,其中弹簧圈数为9圈,直径为6 μm,弹簧线分辨率为1.17 μm.文中所述的将双光子微纳加工技术与化学镀技术相结合的方法可以实现任意三维微金属结构与器件的制备,在微光学器件、微机电系统(MEMS)及微传感器等领域有着广泛的应用前景.     

微米级铜-银双金属粉镀层结构及其抗氧化性

微米级铜粉具有许多优良的物理特性与催化活性 ,被广泛用于导电涂料、电极材料、催化剂等领域 但铜粉微细化后 ,由于粒子的比表面很大 ,其化学活性很高［１］,在空气中极易被氧化成氧化亚铜［２］,失去原有的物理化学特性 在铜粉表面镀银形成铜 银双金属粉 ,既能提高铜粉的抗氧化能力 ,又可保持铜粉优良特性［３ ,４］ 我们在铜粉表面镀银的研究中发现 ,当铜粉表面银含量达到一定值后 ,铜 银双金属粉就具备了常温抗氧化能力 ,并不需要铜粉表面完全包覆银 ;而温度升高时 ,表面银含量不同的双金属粉抗氧化温度不同 说明镀银铜粉氧化性与…     

Al－Mn合金镀层的组成结构及其耐蚀性

研究了在低温熔盐中（低于２００℃）电沉积Ａｌ－Ｍｎ合金镀层成分的控制,镀层化学组成与结构之间的关系以及镀层的耐蚀性能．提出影响镀层锰含量的主要因素是熔盐中锰离子的浓度．镀层含锰量在２５～４０（ｗｔ）％之间可形成非晶态结构．实验表明,Ａｌ－Ｍｎ合金镀层在０．５ｍｏｌ／ＬＨ＿２ＳＯ＿４熔液及ＮａＣｌ溶液中具有优良的耐蚀性,非晶态结构的Ａｌ－Ｍｎ合金镀层的耐蚀性更为优异．     

Pulse plating effect on microstructure and corrosion properties of Zn–Ni alloy coatings

The influence of pulse plating parameters on the surface morphology, grain size, lattice imperfection and corrosion properties of Zn–Ni alloy has been studied. The coatings were electrodeposited in an alkaline cyanide-free solution. AFM was applied for surface morphology examination, XRD measurements were carried out for phase composition and texture analysis, electron probe microanalysis was used for alloy chemical composition studies, while electrochemical techniques were applied for corrosion performance evaluation. The pulse plated Zn–Ni coatings appeared to consist of the γ-Zn₂₁Ni₅ phase and the composition of the alloy depended on the plating parameters. The grain size, lattice imperfection and homogeneity of grain distribution were established to be the main factors determining corrosion behaviour of the coating. Presented at the 4th Baltic Conference on Electrochemistry, Greifswald, March 13–16, 2005     

抗菌耐蚀性功能复合镀层(Ag)-Ni/Cr的开发研究

通过正交试验法,在优化电镀工艺条件基础上,开发并研制了一种新型金属表面功能材料(Ag)-Ni/Cr复合镀层,并分别利用菌落计数法和交流阻抗法比较镀层抗菌和耐腐蚀性能.研究表明,该镀层具有抗菌性和耐蚀性兼顾的特点,极具广阔的应用前景.     

Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating

A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more than 100 runs before complete failure.     

Methanol oxidative fuel cell: electrochemical synthesis and characterization of low-priced WO<Subscript>3</Subscript>-Pt anode material

Electroplating of WO₃-Pt has been carried out using a suitable plating bath solution and optimum working conditions. X-ray and SEM studies of the deposit reveal a smooth and uniform distribution of micro-particles on the surface. New phases of the plated material appear on heat treatment. The electrocatalytic activity of the WO₃-Pt co-deposit is considerably higher than for platinum alone. WO₃ in the WO₃-Pt co-deposit reduces the retardation effect of methanol oxidation by the reaction intermediate observed in the case of Pt alone. WO₃-Pt co-deposits exhibit low overpotential for methanol oxidation in both acidic and alkaline media at low temperature and have good corrosion resistance in electrolytic media. The electrochemical parameters for methanol oxidation of these co-deposits depend on trace amounts of the platinum, heat treatment and the microstructure of the coating.