Cost-effective smart power CMOS/DMOS technology: design of main driving and protection functions

This paper intends to show that even with a CMOS technology main driving and protection functions of a power VDMOS can be made performant. Original circuits taking advantage of the availibility of the parasitic vertical bipolar transistor are presented and experimentally evaluated. A current mode approach is proposed to improve the accuracy of the current sensing function aimed at performing overcurrent, short-circuit and open-load detection.     

CMOS反相器在高功率微波下闩锁效应的温度影响

The temperature dependence of the latch-up effects in a CMOS inverter based on 0.5 μm technology caused by high power microwave （HPM） is studied. The malfunction and power supply current characteristics are revealed and adopted as the latch-up criteria. The thermal effect is shown and analyzed in detail. CMOS in- verters operating at high ambient temperature are confirmed to be more susceptible to HPM, which is verified by experimental results from previous literature. Besides the dependence of the latch-up triggering power P on the ambient temperature T follows the power-law equation P = ATβ. Meanwhile, the ever reported latch-up delay time characteristic is interpreted to be affected by the temperature distribution. In addition, it is found that the power threshold increases with the decrease in pulse width but the degree of change with a certain pulse width is constant at different ambient temperatures. Also, the energy absorbed to cause latch-up at a certain temperature is basically sustained at a constant value.     

CMOS工艺射频功率放大器的实现与验证

射频功率放大器是无线设备的关键器件,GaAs工艺被广泛使用在射频功放的设计制造上。而CMOS工艺在生产成熟度和成本上有很大优势,主要关注用CMOS工艺来做射频功放的问题,介绍世界上第一颗量产的CMOS功放及其所使用的特殊技术。利用一款成熟的手机产品,替换这颗功放及外围器件,最后与原产品进行对比测试。     

基于SOI的低功耗智能卡芯片技术

利用SIMOX材料制作智能卡是一种新的技术.本文简要介绍了智能卡的发展及应用,描述了利用SOI(SIMOX)技术制作的新型智能卡芯片,概述了其优点,并分析了现存的问题.     

一种应用于RFID的低功耗温度传感器

This paper presents the design and implement of a CMOS smart temperature sensor,which consists of a low power analog front-end and a 12-bit low-power successive approximation register(SAR) analog-to-digital converter(ADC).The analog front-end generates a proportional-to-absolute-temperature(PTAT) voltage with MOSFET circuits operating in the sub-threshold region.A reference voltage is also generated and optimized in order to minimize the temperature error and the 12-bit SAR ADC is used to digitize the PTAT voltage.Using 0.18 m CMOS technology,measurement results show that the temperature error is0.69/C0.85 °C after one-point calibration over a temperature range of40 to 100 °C.Under a conversion speed of 1K samples/s,the power consumption is only 2.02 W while the chip area is 230225 m2,and it is suitable for RFID application.     

一种新的低功耗CMOS三值电路设计

提出一种新的静态电压型CMOS三值电路设计方案.该方案具有电路结构规则,输入信号负载对称等特点,是一种具有互补输入-输出的双轨三值逻辑电路.由于电路中同时采用pMOS和nMOS两种传输管,从而保证了输出信号具有完整的逻辑摆幅和高噪声容限.尤为重要的是该设计方案是基于标准CMOS工艺而无需修改阈值电压,且结构较简单.采用0.25μm CMOS工艺参数及3V电源的计算机模拟结果同时表明所提出的电路设计具有高速及低功耗的特点.     

Design methodology for full custom CMOS microcomputers

A highly structured design methodology is necessary to be successful in the design of VLSI integrated circuits with more than 100000 transistors on a chip. Such a methodology is described: it is based on the regularity of the circuit architecture with an associated chip floor plan and on a new layout technique named metal oriented layout.This methodology has been tested with the design of a 13500 MOS microcomputer. From the instruction set and through different levels of instruction interpretation, the architecture and associated chip floor plan are generated. The detailed logic design is made directly in symbolic layout with the chip floor plan in mind.The proposed design methodology can be best appreciated by the short development time and small chip area required for the designed 13500 MOS microcomputer.     

电力通信技术在智能电网中的应用

市场经济的高度发展是促进我国社会建设、科技发展、人民安居乐业的主要因素,在今天越来越多的经济建设成果开始惠及人民,电力通信技术正是这样一种基于经济发展而存在和进步的高新技术。中国是一个人口大国,所以人们的生产生活用电量非常可观,在这种情况下如何才能实现智能电网的建设、如何才能让电力通信技术发挥积极作用成为了我们必须要考虑的问题之一。     

DB-driver: a low power CMOS bootstrapped differential cross-coupled driver

This paper for the first time reports the design of a high speed and low power differential cross-coupled bootstrapped CMOS driver circuit. The circuit design style, based on the proposed differential cross-coupled bootstrapped driver achieves high performance low core area, and fast full-swing operation, even in spite of the fact that the magnitude of the threshold voltage of the CMOS devices cannot be scaled down with the scaling of the power supply voltage. The proposed driver is implemented on 0.13?µm CMOS technology with a power supply of 1.2?V. It is 34% faster and provides 8% less core area when compared to a base-line circuit using an indirect bootstrap technique. In addition, the proposed driver reduces the power consumption by 35%. The superior performance of the proposed circuit over the other differential cross-coupled bootstrapped CMOS driver circuit, for the applications that require high performance, has been verified with post-layout simulation.     

电力通信技术在智能电网中的运用与相关研究

在社会市场经济背景下,智能网络建设已成为现代化建设事业发展的核心内容,智能电网建设的重要性不断显现.因此,本文作者站在客观的角度,多角度客观分析了电力通信与智能电网,多层次详细探讨了智能电网中电力通信技术的运用,新能源、配电、变电等方面,优化创新电力通信技术的基础上,提高新时期智能电网运营效益.     

CMOS集成电路的ESD设计技术

首先论述了CMOS集成电路ESD保护的必要性 ,接着介绍了CMOS集成电路ESD保护的各种设计技术 ,包括电流分流技术、电压箝位技术、电流均衡技术、ESD设计规则、ESD注入掩膜等。采用适当的ESD保护技术 ,0 8μmCMOS集成电路的ESD能力可以达到 30 0 0V。     

PMOS-switching dual-path charge pump in standard twin-well CMOS technology

In this article a new charge pump circuit is presented, which is feasible for implementation with the standard twin-well CMOS process. The proposed charge pump employs PMOS-switching dual charge-transfer paths and a simple two-phase clock. Since charge transfer switches are fully turned ON during each half of the clock cycle, they transfer charges completely from the present stage to the next stage without suffering threshold voltage drop. During one clock cycle, the pump transfers charges twice through two pumping paths which are operating alternately. Test chips have been fabricated in a 0.35-μm twin-well CMOS process. The output voltage of a 4-stage charge pump with each pumping capacitor of 7.36 pF measures 6.7 V under a 1.5 V power supply and 20 MHz clock frequency. It can supply a maximum load current of about 180 μA. Although the proposed circuit exhibits somewhat inferior performances against triple-well charge pumps using additional mask and process steps, it shows at least 60% higher voltage gain at V _DD = 0.9 V, approximately 10% higher peak power efficiency at V _DD = 1.5 V, much larger output current drivability and faster initial output rising than traditional twin-well charge pumps. This new pumping efficient circuit is suitable for design applications with a low-cost standard twin-well CMOS process.     

Electromagnetically compatible CMOS auto-balanced current sensor for highly integrated power control System-On-Chip

This paper describes the design and prototyping of an auto-balanced contactless current sensor in standard Complementary Metal–Oxide–Semiconductor (CMOS) technology, without any additional post-processing cost. The architecture includes two high-sensitivity Hall plates with differential amplification electronics. A high common mode rejection is insured by the integrated auto-balancing system based on the use of integrated coils. When a common current is applied in the embedded coils, the integrated system provides a feedback signal to a digital control unit which in turn adjusts the biasing current of one of the Hall plates in order to balance the amplification of the two Hall plates. Designed in a standard CMOS technology, this sensor can be integrated in power control System-On-Chip requiring extremely electro-magnetically compatible current sensor.     

High-efficiency dynamic supply CMOS audio power amplifier for low-power applications

This paper describes the analysis and design of a dynamic supply CMOS audio power amplifier for low-power applications. The dynamic supply technique is used to increase the efficiency of a class AB power amplifier. The polarization of its output stage is adaptive so that the maximum efficiency enhancement can be achieved without jeopardizing the linearity of the system. Two types of adaptive polarization are proposed and compared. A concept of power supplies switching is also proposed. Simulation results are presented showing that an efficiency of 53.6% at a total harmonic distortion (THD) of less than 0.1% can be achieved, whereas the maximal theoretical value for a class AB amplifier is approximately 33.3%.     

A low power, low noise figure quadrature demodulator for a 60 GHz receiver in 65-nm CMOS technology

This paper presents the design of a low power (LP) and a low noise figure (NF) quadrature demodulator with an on-chip frequency divider for quadrature local oscillator (LO) signal generation. The transconductance stage of the mixer is implemented by an AC-coupled self-bias current reuse topology. On-chip series inductors are employed at the gate terminals of the differential input transconductance stage to improve the voltage gain by enhancing the effective transconductance. The chip is implemented in 65-nm LP CMOS technology. The demodulator is designed for an input radio frequency (RF) band ranging from 10.25 to 13.75 GHz. A fixed LO frequency of 12 GHz down-converts the RF band to an intermediate frequency (IF) band ranging from DC to 1.75 GHz. From 10 MHz to 1.75 GHz the demodulator achieves a voltage conversion gain (VCG) ranging from 14.2 to 13.2 dB, and a minimum single-sideband NF (SSB-NF) of 9 dB. The measured third-order input intercept point (IIP₃) is -3.3 dBm for a two-tone test frequency spacing of 1 MHz. The mixer alone draws a current of only 2.5 mA, whereas the complete demodulator draws a current of 7.18 mA from a 1.2 V supply. The measurement results for a frequency divider, which was fabricated individually, prior to being integrated with the quadrature demodulator, in 65-nm LP CMOS technology, are also presented in this paper.     

基于90nmCMOS工艺的低功耗宽带压控振荡器设计

A low power VCO with a wide tuning range and low phase noise has been designed and realized in a standard 90 nm CMOS technology. A newly proposed current-reuse cross-connected pair is utilized as a negative conductance generator to compensate the energy loss of the resonator. The supply current is reduced by half compared to that of the conventional LC-VCO. An improved inversion-mode MOSFET(IMOS) varactor is introduced to extend the capacitance tuning range from 32.8% to 66%. A detailed analysis of the proposed varactor is provided. The VCO achieves a tuning range of 27–32.5 GHz, exhibiting a frequency tuning range(FTR) of 18.4%and a phase noise of –101.38 d Bc/Hz at 1 MHz offset from a 30 GHz carrier, and shows an excellent FOM of –185d Bc/Hz. With the voltage supply of 1.5 V, the core circuit of VCO draws only 2.1 m A DC current.     

An evaluation of deep-submicron CMOS design optimized for operation at 77 K

Using a careful and insightful analysis of the possible benefits of 77 K CMOS in submicron technology from a decade ago [1], the development of 77 K CMOS in present-day deep submicron technology is evaluated. It is found that the basic principles from the earlier study—that the real benefit of 77 K CMOS operation is the ability to provide “pure” scaling of the threshold voltage and thus to allow aggressive super-scaling of MOS transistor dimensions—not only holds in present-day CMOS processes, but is even more important in that regard. A detailed analysis of CMOS technology, digital circuit behavior, and analog circuit behavior is provided. It is noted that not only does properly-designed 77 K CMOS technology provide opportunities; it also addresses some of the most fundamental difficulties facing CMOS technology and CMOS circuit design.     

A few CMOS transconductors optimized for low power and wide band operation

Maximizing the bandwidth of operation relative to dc power dissipation in complementary metal oxide semiconductor (CMOS) transconductors has been addressed in this article. It is proposed that the ac transconductance-to-dc power dissipation ratio is an appropriate objective function in this case. The general nature of the objective function is examined first. CMOS transconductors with two and four MOS working transistors are analyzed next. For structures of each kind, the ac transconductance-to-dc power dissipation ratio is maximized, and the optimal set of voltage variables is evaluated. For four-MOS structures with differential input signals, it is revealed that the choice of signal phase influences the objective function. The results of theoretical analyses are exhaustively tabulated. Numerical simulations are used to bring out the significance of the analytical expressions. This facilitates a comparison among several transconductors regarding the best possible ac transconductance-to-dc power dissipation ratio. These results are combined with HSPICE simulation results to suggest a few transconductor structures that are optimum with reference to the operation over wide bandwidths with lower power dissipation, high linearity and low harmonic distortion.The research was supported by grant no. N485 awarded to Dr. R. Raut by the Natural Science and Engineering Research Council (NSERC) of Canada.     

基于GSAA算法的组合电路最大功耗估计方法

最大功耗估计问题是一个NP难题。提出的方法利用遗传模拟退火算法(GSAA)在整个解空间快速搜索问题的最优解，实现组合电路最大功耗的快速、精确估计。仿真结果表明，提出的方法比基于遗传算法(GA)的估计方法在估算精度和收敛速度上都有提高，适合于大规模组合电路最大功耗的估计。