含全氟环丁烷环可溶性聚酰亚胺的合成与表征

以乙酰氨基苯酚为原料,经过BrCF2CF2Br氟烷基化、Zn催化脱卤、热环化二聚,以及水解去保护,合成了一种含全氟环丁烷环的二胺单体1,2,3,3,4,4-六氟-1,2-双[4-(氨基)苯氧基]环丁烷.用该单体分别与酯环二酐双环[2·2·1]辛烷-2,3,5,6-四羧基2,3,5,6-二酐(BHDA)、芳香性二酐3,3′,4,4′-联苯四酸二酐(BPDA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)通过“一步法”制备了3种新型含全氟环丁烷环聚酰亚胺.通过粘度测试、溶解性实验、FT-IR、热失重分析(TGA)和差热扫描量热(DSC)分析等手段,对所合成的聚酰亚胺的结构与性能进行了表征.结果显示该类聚酰亚胺可溶于大多数常用极性有机溶剂,热分解温度高于480℃,其中两种聚合物玻璃化温度低于150℃,表明含全氟环丁烷环聚酰亚胺具有良好的溶解性和可加工性.     

原位一步法制备BTDA/4,4′-ODA/4,4′-SDA聚酰亚胺表面银化薄膜

采用原位一步自金属化的方法制备了具有反射性和导电性的表面银(Ag)化的聚酰亚胺(PI)薄膜,PI是由一种二酐(3,3′,4,4′-四羧基二苯酮酐,BTDA)和两种二胺(4,4′-二氨基二苯醚,4,4′-ODA与4,4′-二氨基二苯硫醚,4,4′-SDA)三元共聚而得,系统研究了4,4′-SDA的引入对薄膜性能及相态结构的影响.结果表明,4,4′-SDA的加入有助于银的还原和迁移,并利于薄膜导电性的提高,薄膜的反射率在两种二胺单体4,4′-ODA与4,4′-SDA的摩尔比为1比1时达到最佳.     

原位一步法制备BTDA/4,4′-ODA/4,4′-SDA 聚酰亚胺表面银化薄膜

采用原位一步自金属化的方法制备了具有反射性和导电性的表面银(Ag)化的聚酰亚胺(PI)薄膜,PI是由一种二酐(3,3′,4,4′-四羧基二苯酮酐,BTDA)和两种二胺(4,4′-二氨基二苯醚,4,4′-ODA与4,4′-二氨基二苯硫醚,4,4′-SDA)三元共聚而得,系统研究了4,4′-SDA的引入对薄膜性能及相态结构的影响.结果表明,4,4′-SDA的加入有助于银的还原和迁移,并利于薄膜导电性的提高,薄膜的反射率在两种二胺单体4,4′-ODA与4,4′-SDA的摩尔比为1比1时达到最佳.     

含二氮杂萘酮结构磺化聚酰亚胺共聚物的合成及其膜性能研究

将磺化二胺单体4,4′-二(4-氨基苯氧基)联苯-3,3′-二磺酸(BAPBDS),含二氮杂萘酮结构的二胺1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZDA)和1,4,5,8-萘四甲酸二酐(NTDA)进行缩合聚合反应,通过改变磺化二胺单体BAPBDS的含量,合成了一系列不同磺化度的聚酰亚胺(SPIs).采用FT-IR,1H-NMR表征了聚合物的结构,热重分析仪(TGA)研究了聚合物的耐热稳定性.以间甲酚为溶剂,通过溶液浇铸法成膜研究了该系列聚合物膜的性能.结果表明,与其它磺化聚酰亚胺相比,该系列磺化聚酰亚胺的溶解性以及在高温下(80℃)水解稳定性有较大提高.     

可溶性聚酰亚胺的制备及其在液晶显示器上的潜在应用

以3,5-二硝基苯甲酰氯和4-羟基联苯为原料,合成了功能性二胺单体3,5-二氨基苯甲酸联苯酯(DABBE).用此单体与3,3′-二甲基-4,4′-二氨基二苯甲烷(DMMDA)、3,3′,4,4′-二苯醚四甲酸二酐(ODPA)共缩聚,采用低温缩聚-化学亚胺化的方法,通过调节共聚物组成制备了5种聚酰亚胺(PI).利用FT-IR、NMR、UV-Vis与DSC等手段对合成二胺单体及聚酰亚胺进行了结构表征和性能测试;研究了其溶解性能、透光性能、取向性能和耐热性能.结果表明,5种聚酰亚胺均可溶于NMP、DMF等极性溶剂;对液晶分子取向时的预倾角随DABBE的比例增加而增大,可达1.8°.但当DABBE的比例增加时,PI的分子量降低,将影响其成膜性能.此外,实验所得的PI透过率大于80%,玻璃化转变温度在220℃以上.     

不同比例的s-BPDA/i-BPDA型聚酰亚胺共聚结构与性能关系

由不同比例的二酐单体3,3′,4,4′-联苯四酸二酐(s-BPDA)/2,2′,3,3′-联苯四酸二酐(i-BPDA)与二胺单体4,4′-二氨基二苯醚(4,4′-ODA)制得了一系列共聚可溶聚酰亚胺. 采用DSC 、TGA和拉伸等测试方法对所得共聚聚酰亚胺进行了表征, 实验结果表明, 所得聚酰亚胺具有优异的力学性能和热稳定性, 并且随着i-BPDA含量的增加, 聚酰亚胺的溶解性提高, 玻璃化转变温度(Tg)升高, 中间体聚酰胺酸的固有黏度降低.     

一种主链含光敏基团聚酰亚胺的合成与表征

通过4,4′-二羟乙基查尔酮与1,2,4-苯三酸酐酰氯反应,得到了一种新型的主链含查尔酮的二酐单体,通过二酐和2,2-双(3(-氨基-4(-羟基苯基)六氟丙烷缩聚并高温亚胺化,得到了一种新型的主链含查尔酮,侧链含羟基的光敏聚酰亚胺,并通过1H-NMR、FTIR、GPC及热分析表征了得到的聚酰亚胺的结构和热性能.这种聚酰亚胺在极性溶剂中具有较好的溶解性,并具有较高的热稳定性,在紫外光照射下,能进行[2+2]的环加成反应.     

一种可溶性聚酰亚胺的合成及其渗透汽化脱有机硫化物性能测试

由3,3′,4,4′-二苯醚四甲酸二酐(ODPA)和3,3′-二甲基4,4′二氨基二苯甲烷(DMMDA)二胺为单体,利用低温溶液缩聚化学亚胺化法合成了ODPA DMMDA聚酰亚胺.利用FT IR、NMR与DSC等手段对聚酰亚胺的结构进行了表征;研究了其溶解性能、耐热性能和力学性能.结果表明,此聚酰亚胺可溶于DMF、DMAc等极性溶剂;玻璃化转变温度为264℃,其10%的热分解温度为521℃;断裂强度为137MPa;断裂伸长率为18%.采用相转化法将其制成非对称膜,采用扫描电子显微镜(SEM)观察内部结构,在渗透汽化脱硫实验中,对噻吩有良好的选择透过性能.350K时,硫富集率为3.68,渗透通量为0.92kg m2h.     

含芳基均三嗪环耐高温低聚酰亚胺的合成与性能

通过调控聚合单体的摩尔配比,合成了一系列新型的不同分子链长度的邻苯二甲腈封端含二氮杂萘酮联苯结构低聚酰亚胺,通过FTIR、1H-NMR、WAXD和元素分析对其结构进行表征.以4,4′-二氨基二苯砜为催化剂,低聚物经常压下固化交联后,得到含芳基均三嗪环结构的热固性聚酰亚胺.低聚物表现了良好的溶解性能,可溶于N-甲基-2-...     

基于三蝶烯结构D3h对称性聚酰亚胺的合成及性能研究

以四氯邻氨基苯甲酸和蒽经Diels-Alder反应得到1,2,3,4-四氯三蝶烯,再经硝化、还原得到2,6-二氨基-13,14,15,16-四氯三蝶烯二胺单体.该二胺与双酚A二酐(BPADA)、六氟二酐(6FDA)和3,3’,4,4’-二苯甲酮四羧酸二酐(BTDA)经两步法缩聚得到系列聚酰亚胺.对2,6-二氨基-13,14,15,16-四氯三蝶烯二胺单体进行了1H-NMR,13C-NMR,FTIR表征,对所合成聚酰亚胺进行了1H-NMR、FTIR结构表征及溶解性、热性能、特性粘度、BET等测试.结果表明,含四氯三蝶烯结构的聚酰亚胺具有优异的溶解性,能溶于DMAc、DMF、NMP、THF、吡啶、间甲酚等有机溶剂,其中基于双酚A二酐和六氟二酐的聚酰亚胺在室温下能溶于氯仿中.聚合物具有良好的热性能,在0~300℃之间没有发现其玻璃化转变温度以及10%的热失重温度均高于500℃.聚合物可形成颜色较浅的透明薄膜,其中基于双酚A二酐的聚酰亚胺薄膜为无色透明.基于六氟二酐的聚酰亚胺BET比表面积为370 m2/g,是一种新型多孔聚合物.     

异构化对二苯醚二酐/二苯醚二胺聚酰亚胺结晶行为的影响

合成了一系列基于4,4-′ODPA,3,4-′ODPA以及3,3-′ODPA 3种异构二苯醚二酐单体的异构聚酰亚胺,以苯酐(PA)作为封端剂来控制分子量.用DSC和WAXD为主要手段研究了这几种异构聚酰亚胺的结晶行为.研究发现聚酰亚胺4,4-′ODPA/ODA(二苯醚二胺)在分子量较低的情况下能够在热处理,退火或剪切作用下结晶.并且升高热处理温度和延长热处理时间有利于结晶的完善,在玻璃化温度以上施加剪切能够加速聚酰亚胺的结晶.而对于其他的两种异构体3,4-′ODPA/ODA以及3,3-′ODPA/ODA无论是经过热处理还是施加外力剪切都未能使其结晶.     

双酚F型聚酰亚胺薄膜的制备与性能

以4-氯代酞酰亚胺和双酚F为原料,在N,N′-二甲基乙酰胺溶剂中,经水解、酸化、脱水,合成了一种新型的双酚F型二酐(BPFDA)单体,并用1H NMR和IR测试方法确认了其结构。 采用传统的一步法,用N,N′-二甲基乙酰胺作溶剂,BPFDA分别与4,4′-二氨基二苯醚（ODA）和4,4′-二氨基二苯甲烷（MDA）聚合,得到聚酰胺酸,并进一步热亚胺化得到聚酰亚胺薄膜,并对其进行了表征。 结果表明,BPFDA/ODA薄膜和BPFDA/MDA薄膜的玻璃化转变温度分别为200和204 ℃; 热失重分析表明,质量损失5%的温度分别为506.50和459.10 ℃;其拉伸强度分别为110和100 MPa。     

4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

Synthesis and properties of novel polyimides derived from 2,2′,3,3′‐benzophenonetetracarboxylic dianhydride

A new synthetic route to 2,2′,3,3′‐BTDA (where BTDA is benzophenonetetracarboxylic dianhydride), an isomer of 2,3′,3′,4′‐BTDA and 3,3′,4,4′‐BTDA, is described. Single‐crystal X‐ray diffraction analysis of 2,2′,3,3′‐BTDA has shown that this dianhydride has a bent and noncoplanar structure. The polymerizations of 2,2′,3,3′‐BTDA with 4,4′‐oxydianiline (ODA) and 4,4′‐bis(4‐aminophenoxy)benzene (TPEQ) have been investigated with a conventional two‐step process. A trend of cyclic oligomers forming in the reaction of 2,2′,3,3′‐BTDA and ODA has been found and characterized with IR, NMR, matrix‐assisted laser desorption/ionization time‐of‐flight mass spectrometry, and elemental analyses. Films based on 2,2′,3,3′‐BTDA/TPEQ can only be obtained from corresponding polyimide (PI) solutions prepared by chemical imidization because those from their polyamic acids by thermal imidization are brittle. PIs from 2,2′,3,3′‐BTDA have lower inherent viscosities and worse thermal and mechanical properties than the corresponding 2,3′,3′,4′‐BTDA‐ and 3,3′,4,4′‐BTDA‐based PIs. PIs from 2,2′,3,3′‐BTDA and 2,3′,3′,4′‐BTDA are amorphous, whereas those from 3,3′,4,4′‐BTDA have some crystallinity, according to wide‐angle X‐ray diffraction. Furthermore, PIs from 2,2′,3,3′‐BTDA have better solubility, higher glass‐transition temperatures, and higher melt viscosity than those from 2,3′,3′,4′‐BTDA and 3,3′,4,4′‐BTDA. Model compounds have been prepared to explain the order of the glass‐transition temperatures found in the isomeric PI series. The isomer effects on the PI properties are discussed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2130–2144, 2004     

含亚甲基和双二氮杂萘酮结构的聚芳酮的合成与性能

聚芳醚酮是一类重要的具有优异综合性能的工程塑料 ,它具有高的热稳定性、尺寸稳定性、耐溶剂性、好的加工性能和电性能 ,因而它经常作为复合材料的基质、粘合剂等被广泛的应用于航空、航天和电子等领域 .近几十年来 ,人们付出了很大的努力去开发聚芳醚酮新品种[1,2 ] .本研究组以 4 (4′ 羟基苯氧基 ) 2 ,3 二氮杂萘 1 (2Ｈ) 酮为缩聚单体制备了一系列的性能优良的聚芳醚酮[3～ 6] ,在主链中引入高密度的氮杂萘酮结构是获得高热稳定性和良好溶解性的重要途径 .由单体中含有更多的氮杂萘酮结构获得可溶解且耐温等级更高的聚芳酮是人们期…     

New organosoluble polyimides with low dielectric constants derived from bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl] diphenylmethylene

A new kink diamine with trifluoromethyl group on either side, bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]diphenylmethane (BTFAPDM) , was reacted with various aromatic dianhydrides to prepare polyimides via poly (amic acid) precursors followed by thermal or chemical imidization. Polyimides were prepared using 3,3′, 4,4′-biphenyltetracarboxylic dianhydride(1), 4,4′-oxydiphthalic anhydride(2), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (3), 4,4′-sulfonyldiphthalic anhydride(4), and 4,4′-hexafluoroisopropylidene-diphathalic anhydride(5). The fluoro-polyimides exhibited low dielectric constants between 2.46 and 2.98, light color, and excellent high solubility. They exhibited glass transition temperatures between 227 and 253°C, and possessed a coefficient of thermal expansion (CTE) of 60-88 ppm/°C. Polymers PI-2, PI-3, PI-4, PI-5 showed excellent solubility in the organic solvents: N-methyl-2-pyrrolidinone (NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridkie and tetrahydrofuran (THF). Inherent viscosity of the polyimides were found to range between 0.58 and 0.72 dLg-1. Thermogravimetric analysis of the polyimides revealed a high thermal stability decomposition temperature in excess of 500°C in nitrogen. Temperature at 10 % weight loss was found to be in the range 506-563°C and 498-557°C in nitrogen and air, respectively. The polyimide films had a tensile strength in the range 75-87 MPa; tensile modulus, 1.5-2.2 GPa; and elongation at break, 6-7%.     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.     

Polyimides from isomeric oxydiphthalic anhydrides

2,2′,3,3′‐Oxydiphthalic dianhydride (2,2′,3,3′‐ODPA) and 2,3,3′,4′‐ODPA were synthesized from 3‐chlorophthalic anhydride with 2,3‐xylenol and 3,4‐xylenol, respectively. Their structures were determined via single‐crystal X‐ray diffraction. A series of polyimides derived from isomeric ODPAs with several diamines were prepared in dimethylacetamide (DMAc) with the conventional two‐step method. Matrix‐assisted laser desorption/ionization time‐of‐flight spectra showed that the polymerization of 2,2′,3,3′‐ODPA with 4,4′‐oxydianiline (ODA) has a greater trend to form cyclic oligomers than that of 2,3,3′,4′‐ODPA. Both 2,2′,3,3′‐ODPA and 2,3,3′,4′‐ODPA based polyimides have good solubility in polar aprotic solvents such as DMAc, dimethylformamide, and N‐methylpyrrolidone. The 5% weight‐loss temperatures of all polyimides were obtained near 500 °C in air. Their glass‐transition temperatures measured by dynamic mechanical thermal analysis or differential scanning calorimetry decreased according to the order of polyimides on the basis of 2,2′,3,3′‐ODPA, 2,3,3′,4′‐ODPA, and 3,3′,4,4′‐ODPA. The wide‐angle X‐ray diffraction of all polyimide films from isomeric ODPAs and ODA showed some certain extent of crystallization after stretching. Rheological properties revealed that polyimide (2,3,3′,4′‐ODPA/ODA) has a comparatively lower melt viscosity than its isomers, which indicated its better melt processability. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3249–3260, 2003     

Synthesis of a new aromatic dianhydride monomer and related polyimide

A novel aromatic dianhydride monomer,3,3′-oxybis[(3,4-dicarboxyphenoxy)phenol]dianhydride,was successfully synthe- sized in three steps using 3,3′-oxybis(phenol)as starting material,which was reacted with 4,4′-oxydianiline(ODA)via a conventional thermal or chemical imidization method to produce a new polyimide.The resulting polyimide exhibited excellent solubility,and film-forming capability.     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002