压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距离的增大而减弱,压电双材料中螺型位错对裂纹的屏蔽效应强于相应弹性双材料中螺型位错对裂纹的屏蔽效应;位错发射所需的临界无穷远加载或电位移随位错方位角及裂纹钝化程度的增加而增大;最可能的位错发射角度为零度即位错最可能沿裂纹前方发射.论文解答的特殊情况与已有文献一致.     

Nanoscale rotational deformation effect on dislocation emission from an elliptically blunted crack tip in nanocrystalline materials

A grain size-dependent model is theoretically established to describe the effect of a special physical micromechanism of plastic flow on the dislocation emission from an elliptical blunt crack tip in nanocrystalline solids. The micromechanism represents the fast nanoscale rotational deformation (NRD) occurring through collective events of ideal nanoscale shear near crack tips, which as a stress source is approximately equivalent to a quadrupole of wedge disclinations. By the complex variable method, the grain size-dependent criterion for the dislocation emission from an elliptical blunt crack tip is derived. The influence of the grain size and the features of NRD on the critical stress intensity factors for dislocation emission is evaluated. The results indicate that NRD releases the high stresses near the crack tip region and thereby enhances the critical stress intensity factor for dislocation emission. The NRD has great influence on the most probable angle for dislocation emission. The critical stress intensity factor will increase with the increment of the grain size, which means the emission of the dislocation becomes more difficult for larger grain size due to the effect of NRD.     

Effect of temperature on dislocation emission from crack tip for BCC metal Mo

The effect of thermally activated energy on the dislocation emission from a crack tip in BCC metal Mo is simulated in this paper. Based on the correlative reference model on which the flexible displacement boundary scheme is introduced naturally, the simulation shows that as temperature increases the critical stress intensity factor for the first dislocation emission will decrease and the total number of emitted dislocations increase for the same external load. The dislocation velocity and extensive distance among partial dislocations are not sensitive to temperature. After a dislocation emission, two different deformation states are observed, the stable and unstable deformation states. In the stable deformation state, the nucleated dislocation will emit from the crack tip and piles up at a distance far away from the crack tip, after that the new dislocation can not be nucleated unless the external loading increases. In the unstable deformation state, a number of dislocations can be emitted from the crack tip continuously under the same external load. The project is supported by the National Natural Science Foundation of China.     

温度对金属材料钼位错发射的影响

应用关联参照模型、随位错位置变化的柔性位移边界条件和三维分子动力学方法研究了体心立方（ＢＣＣ）金属晶体钼在不同温度下裂尖发射位错的力学行为，随着温度的提高，不但发射位错的临界应力强度因子下降而且在同一应 度因子条件下，发射位错的数量出增加，位错速度和不全位错之间的扩展距离对温度不敏感，在位错发射过程中，发现了稳定的和不稳定的两个变形状态，在稳定的有状态，位错发射后，塞积在远离裂纹尖端处；必须增加外     

分子动力学方法在研究材料力学行为中的应用进展

报道近年来分子动力学方法应用于研究位错、裂纹、晶界及其相互作用方面的进展．主要包括:裂纹尖端的位错发射,位错发射的不稳定堆垛能,晶体与裂纹’几何关系对位错发射的影响,温度对位错发射的影响以及由裂纹尖端发射的位错列与不对称倾侧晶界的相互作用．报道主要以我们的工作为主,重点讨论裂纹尖端位错发射的研究结果      

Atomistic/continuum simulation of interfacial fracture part I: Atomistic simulation

The phenomenon of interfacial fracture, as manifested by atomistic cleavage, debonding and dislocation emission provides a challenge for combined atomistic-continuum analysis. As a precursor for fully coupled atomistic-continuum simulation^[1] of interfacial fracture, we focus here on the atomistic behavior within a nanoscopic core surrounding the crack tip. The inter-atomic potential under Embedded Atom Method is recapitulated to form an essential framework of atomistic simulation. The calculations are performed for a side-cracked disc configuration under a remoteK field loading. It is revealed that a critical loading rate defines the brittle-to-ductile transition of homogeneous materials. We further observe that the near tip mode mixity dictates the nanoscopic profile near an interfacial crack tip. A zigzag interface structure is simulated which plays a significant role in the dislocation emission from an interfacial crack tip, as will be explored in the second part of this investigation. The project supported by the National Natural Science Foundation of China     

Shielding effect and emission condition of a screw dislocation near a blunt crack in elliptical inhomogeneity

The shielding effect and emission condition of a screw dislocation near a blunt crack in elastic elliptical inhomogeneity is dealt with. Utilizing the Muskhelishvili complex variable method, the explicit series form solutions of the complex potentials in the matrix and the inclusion regions are derived. The stress intensity factor and critical stress intensity factor for dislocation emission are also calculated. The influences of the orientation of the dislocation and morphology of the blunt crack as well as the material elastic dissimilarity upon the shielding effect and emission criterion are discussed in detail. As a result, numerical analysis and discussion show that the positive screw dislocation can reduce the stress intensity factor of the crack tip (shielding effect) only when it is located in the certain region. The shielding effect increases with the increase of the shear modulus of the matrix and the curvature radius of the blunt crack tip, but decreases with the increase of dislocation azimuth angle. The critical loads at infinity for dislocation emission increases with the increment of the emission angle and the curvature radius of the blunt crack tip, and the most probable angle for screw dislocation emission is zero. The present solutions contain previous results as the special cases.     

Simulation of edge dislocation emission from a crack under in-plane shear

Considered is the tandem emission of dislocations and dislocation dipoles from a crack under in-plane shear in one slip system as well as multiple slip systems. Effective stress intensity factors are determined by considering zones of local distortion similar to that in macro-plasticity. The dislocation free zone (DFZ) is also obtained which is analogous to the core region in fracture mechanics. Studied are effects of dislocation emission or development of plastic zone in front of the crack tip on the potential crack propagation based on the strain energy density factor criterion.     

Dynamic self-similar debonding of interface at very high velocity: Anti-plane case

This paper analyzes the anti-plane problem of dynamic self-similar debonding of interface at very high velocity. The debonding is modeled as an interface crack propagating self-similarly from zero-length. The extending speed is assumed to be transonic or supersonic. We first consider the dynamic debonding under moving concentrated loads. The moving dislocation model of self-similar propagation of an interface crack is used to formulate the problem to a singular integral equation which is solved analytically. The singularity of stresses near the crack tip is discussed and the dynamic stress intensity factors are presented. Finally the solution of dynamic debonding underx ²-type loads is obtained by using the superposition method.     

Analysis of dynamic growth of a tensile crack in an elastic-plastic material

The influence of inertia on the stress and deformation fields near the tip of a crack growing in an elastic-plastic material is studied. The material is characterized by the von Mises yield criterion and J₂ flow theory of plasticity. The crack grows steadily under plane strain conditions in the tensile opening mode. Features of the stress and deformation state at points near the moving crack tip are described for elastic-perfectly plastic response and for several crack propagation speeds. It is found that inertia has a significant effect on the elastic-plastic response of material particles near the crack tip, and that elastic unloading may occur behind the crack tip for higher speeds. The relationship between the applied crack driving force, represented by a remote stress intensity factor, and the crack tip speed is examined on the basis of a critical crack tip opening angle growth criterion. The calculated result is compared with dynamic fracture toughness versus crack speed data for a 4340 steel.     

Dynamic behaviors of mode III interfacial crack under a constant loading rate

In an earlier study on intersonic crack propagation, Gao et al. (J. Mech. Phys. Solids 49: 2113–2132, 2001) described molecular dynamics simulations and continuum analysis of the dynamic behaviors of a mode II dominated crack moving along a weak plane under a constant loading rate. The crack was observed to initiate its motion at a critical time after the onset of loading, at which it is rapidly accelerated to the Rayleigh wave speed and propagates at this speed for a finite time interval until an intersonic daughter crack is nucleated at a peak stress at a finite distance ahead of the original crack tip. The present article aims to analyze this behavior for a mode III crack moving along a bi-material interface subject to a constant loading rate. We begin with a crack in an initially stress-free bi-material subject to a steadily increasing stress. The crack initiates its motion at a critical time governed by the Griffith criterion. After crack initiation, two scenarios of crack propagation are investigated: the first one is that the crack moves at a constant subsonic velocity; the second one is that the crack moves at the lower shear wave speed of the two materials. In the first scenario, the shear stress ahead of the crack tip is singular with exponent ?1/2, as expected; in the second scenario, the stress singularity vanishes but a peak stress is found to emerge at a distance ahead of the moving crack tip. In the latter case, a daughter crack supersonic with respect to the softer medium can be expected to emerge ahead of the initial crack once the peak stress reaches the cohesive strength of the interface.     

含裂纹三点弯曲梁起始扩展的动态分析

本文利用高速摄影捕捉含裂纹三点弯曲梁在冲击下裂纹扩展过程，借助动态焦散线对裂纹尖端初始曲线范围内的应力第二不变量分布进行了试验研究，并通过Ｄｅｔ．－准则对动载下裂纹起始扩展的条件和方向进行了分析。结果表明：裂纹扩展的实际方向与理论预测相一致；Ｄｅｔ．－准则与焦散线相结合在动态断裂力学研究中具有广泛的使用价值     

Crack tip blunting and cleavage under dynamic conditions

In structural materials with both brittle and ductile phases, cracks often initiate within the brittle phase and propagate dynamically towards the ductile phase. The macroscale, quasistatic toughness of the material thus depends on the outcome of this microscale, dynamic process. Indeed, dynamics has been hypothesized to suppress dislocation emission, which may explain the occurrence of brittle transgranular fracture in mild steels at low temperatures (Lin et al., 1987). Here, crack tip blunting and cleavage under dynamic conditions are explored using continuum mechanics and molecular dynamics simulations. The focus is on two questions: (1) whether dynamics can affect the energy barriers for dislocation emission and cleavage, and (2) what happens in the dynamic “overloaded” situation, in which both processes are energetically possible. In either case, dynamics may shift the balance between brittle cleavage and ductile blunting, thereby affecting the intrinsic ductility of the material. To explore these effects in simulation, a novel interatomic potential is used for which the intrinsic ductility is tunable, and a novel simulation technique is employed, termed as a “dynamic cleavage test”, in which cracks can be run dynamically at a prescribed energy release rate into a material. Both theory and simulation reveal, however, that the intrinsic ductility of a material is unaffected by dynamics. The energy barrier to dislocation emission appears to be identical in quasi-static and dynamic conditions, and, in the overloaded situation, ductile crack tip behavior ultimately prevails since a single emission event can blunt and arrest the crack, preventing further cleavage. Thus, dynamics cannot embrittle a ductile material, and the origin of brittle failure in certain alloys (e.g., mild steels) appears unrelated to dynamic effects at the crack tip.     

Brittle fracture dynamics with arbitrary paths. II. Dynamic crack branching under general antiplane loading

The dynamic propagation of a bifurcated crack under antiplane loading is considered. The dependence of the stress intensity factor just after branching is given as a function of the stress intensity factor just before branching, the branching angle and the instantaneous velocity of the crack tip. The jump in the dynamic energy release rate due to the branching process is also computed. Similar to the single crack case, a growth criterion for a branched crack is applied. It is based on the equality between the energy flux into each propagating tip and the surface energy which is added as a result of this propagation. It is shown that the minimum speed of the initial single crack which allows branching is equal to 0.39c, where c is the shear wave speed. At the branching threshold, the corresponding bifurcated cracks start their propagation at a vanishing speed with a branching angle of approximately 40°.     

Moving eccentric crack in a piezoelectric strip bonded to elastic materials

Summary  The steady-state of a propagation eccentric crack in a piezoelectric ceramic strip bonded between two elastic materials under combined anti-plane mechanical shear and in-plane electrical loadings is considered in this paper. The analysis based on the integral transform approach is conducted on the permeable crack condition. Field intensity factors and energy release rate are obtained in terms of a Fredholm integral equation of the second kind. It is shown for this geometry that the crack propagation speed has influence on the dynamic energy release rate. The initial crack branching angle for a PZT-5H piezoceramic structure is predicted by the maximum energy release rate criterion. Received 23 January 2001; accepted for publication 18 October 2001     

液体金属吸附促进位错发射的分子动力学研究

用第一原理算出Ｒｏｓｅ方程中的参量后,利用陈氏反演原理可以求出Ａｌ－Ｇａ和Ｃｕ－Ｇａ的对势;从而可研究Ａｌ和Ｃｉ裂纹表面吸附液体金属Ｇａ之后对裂尖发射位错的影响。结果表明,Ａｌ吸附Ｇａ后可使发射们错的临界应力强度因子从ＫＩｅ＝０．５ＭＰａｍ＾１／２,降为ＫＩｅ（Ｌ）＝０．４ＭＰａｍ＾１／２;对Ｃｕ则从ＫＩｅ＝０．５５ＭＰａｍ＾１／２降为ＫＩｅ（Ｌ）＝０．４５ＭＰａｍ＾１／２,即Ｇａ吸附后能促进位错     

A Peierls criterion for the onset of deformation twinning at a crack tip

A criterion for the onset of deformation twinning (DT) is derived within the Peierls framework for dislocation emission from a crack tip due to Rice (J. Mech. Phys. Solids 40(2) (1992) 239). The critical stress intensity factor (SIF) is obtained for nucleation of a two-layer microtwin, which is taken to be a precursor to DT. The nucleation of the microtwin is controlled by the unstable twinning energyγ_ut, a new material parameter identified in the analysis. γ_ut plays the same role for DT as γ_us, the unstable stacking energy introduced by Rice, plays for dislocation emission. The competition between dislocation emission and DT at the crack tip is quantified by the twinning tendencyT defined as the ratio of the critical SIFs for dislocation nucleation and microtwin formation. DT is predicted when T>1 and dislocation emission when T<1. For the case where the external loading is proportional to a single load parameter, T is proportional to . The predictions of the criterion are compared with atomistic simulations for aluminum of Hai and Tadmor (Acta Mater. 51 (2003) 117) for a number of different crack configurations and loading modes. The criterion is found to be qualitatively exact for all cases, predicting the correct deformation mode and activated slip system. Quantitatively, the accuracy of the predicted nucleation loads varies from 5% to 56%. The sources of error are known and may be reduced by appropriate extensions to the model.     

穿透夹杂界面的半无限楔形裂纹尖端螺型位错的发射研究

研究了穿透圆形夹杂界面的半无限楔形裂纹与裂纹尖端螺型位错的干涉问题.应用复变函数解析延拓技术与奇性主部分析方法,得到了位错位于半圆形夹杂内部时,半无限基体和半圆形夹杂内复势函数的解析解.然后利用保角映射技术得到了穿透圆形夹杂界面的半无限楔形裂纹尖端螺型位错产生的应力场以及作用在位错上的位错力的解析表达式.主要讨论了螺型位错对裂纹的屏蔽效应以及从楔形裂纹尖端发射位错的临界载荷条件.研究结果表明正的螺型位错可以削弱楔形裂纹尖端的应力强度因子,屏蔽裂纹的扩展,屏蔽效应随位错方位角的增大而减小.位错发射所需的无穷远临界应力随发射角的增加而增大,最可能的位错发射角度为零度,直线裂纹尖端位错的发射比楔形裂纹尖端位错的发射更容易,硬基体抑制位错的发射.     

Transient studies of screw and edge dislocation generation at crack edges

Exact transient analyses of the generation of screw and edge dislocations at the edges of stationary cracks subjected to the diffraction of, respectively, plane SH- and SV-waves, and their subsequent arrest are performed. The solutions are examined in light of a dislocation emission criterion which is based, simultaneously, on standard dislocation force concepts and quasi-static emission studies.This examination allows expressions for the times of emission and arrest, the distances traveled by the dislocations, and the dynamic stress intensity factors to be derived in terms of parameters such as dislocation speed and yield stress. These expressions exhibit distinctive dynamic effects and reveal several features of the generation process:In particular, the times and distances are, while on a micromechanical scale, not necessarily insignificant, and imply that purely brittle fracture may not easily occur. Then, edge dislocation emission would appear to occur at a preferred speed, while screw dislocation emission apparently prefers to take place quasi-statically.Examination of a general incident waveform class shows that a continuous wave could cause dislocation generation to occur before a step-stress wave can. Moreover, the emission process depends upon a weighted time history of the incident wave stress, not its instantaneous value. This, in turn, implies that dislocation emission does not necessarily shield the crack edge by lowering the dynamic stress intensity factor. Finally, unless the dislocations are allowed to decelerate to zero speed upon arrest, a repetitious process of start-stop motion can in principle take place.     

动态焦散线实验方法及其在断裂力学中的初步应用

本文给出了静、动态的焦散线方程,和确定裂纹尖端位置、动应力强度因子K_1~d的计算公式,并证明了在裂纹扩张速度较低时,可用静态公式计算,还研究了带预裂纹的三点弯曲梁和圆环在冲击载荷下的断裂问题,得到了系列动态焦散线照片、裂尖位置和动应力强度因子随时间的变化曲线。