SOI新结构——SOI研究的新方向

SOI（silicon-on-insulator：绝缘体上单晶硅薄膜）技术已取得了突破性的进展，但一般SOI结构是以SiO2作为绝缘埋层，以硅作为顶层的半导体材料，这样导致了一些不利的影响，限制了其应用范围。为解决这些问题和满足一些特殊器件／电路的要求，探索研究新的SOI结构成为SOI研究领域新的热点。如SOIM，GPSOI，GeSiOI，SionAlN，SiCOI，GeSiOI，SSOI等。文章将结合作者的部分工作，报道SOI新结构研究的新动向及其应用。     

离子注入形成SOI结构的界面及埋层的俄歇能谱研究

本文中研究了O⁺(200keV,1.8×10¹⁸/cm²)和N⁺(190keV,1.8×10¹⁸/cm²)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O⁺的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO₂相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N⁺的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。 关键词：     

SOI新结构——SOI研究的新方向

SOI(silicon-on-insulator绝缘体上单晶硅薄膜)技术已取得了突破性的进展,但一般SOI结构是以SiO2作为绝缘埋层,以硅作为顶层的半导体材料,这样导致了一些不利的影响,限制了其应用范围.为解决这些问题和满足一些特殊器件/电路的要求,探索研究新的SOI结构成为SOI研究领域新的热点.如SOIM,GPSOI,GeSiOI,Si on AlN, SiCOI, GeSiOI,SSOI等.文章将结合作者的部分工作,报道SOI新结构研究的新动向及其应用.     

新型SOANN埋层SOI器件的自加热效应研究

本文提出了一个新型的SOI埋层结构SOANN (silicon on aluminum nitride with nothing),用AlN代替传统的SiO₂材料,并在SOI埋氧化层中引入空洞散热通道. 分析了新结构SOI器件的自加热效应.研究结果表明:用AlN做为SOI埋氧化层的材料, 降低了晶格温度,有效抑制了自加热效应.埋氧化层中的空洞,可以进一步提供散热通道, 使埋氧化层的介电常数下降,减小了电力线从漏端通过埋氧到源端的耦合, 有效抑制了漏致势垒降低DIBL(drain Induced barrier lowering)效应.因此,本文提出的新型SOANN结构可以提高SOI器件的整体性能,具有优良的可靠性.     

双面阶梯埋氧层部分SOI高压器件新结构

提出了双面阶梯埋氧层部分绝缘硅(silicon on insulator,SIO)高压器件新结构. 双面阶梯埋氧层的附加电场对表面电场的调制作用使表面电场达到近似理想的均匀分布, 耗尽层通过源极下硅窗口进一步向硅衬底扩展, 使埋氧层中纵向电场高达常规SOI结构的两倍, 且缓解了常规SOI结构的自热效应. 建立了漂移区电场的二维解析模型, 获得了器件结构参数间的优化关系. 结果表明, 在导通电阻相近的情况下, 双面阶梯埋氧层部分SOI结构击穿电压较常规SOI器件提高58％, 温度降低10—30K. 关键词： 双面阶梯 埋氧层 调制 自热效应     

螺旋波等离子体增强化学气相沉积氮化硅薄膜

利用螺旋波等离子体增强化学气相沉积(HWP-CVD)技术，以SiH4和N2为反应气体进行了氮化硅(SiN)薄膜沉积，并研究了实验参量对薄膜特性的影响.利用傅里叶变换红外光谱、紫外—可见光谱和椭偏光检测等技术对薄膜的结构、厚度和折射率等参量进行了测量.结果表明，采用HWP-CVD技术能在低衬底温度条件下以较高的沉积速率制备低H含量的SiN薄膜，所沉积的薄膜主要表现为Si—N键合结构.采用较低的反应气体压强将提高薄膜沉积速率，并使薄膜的致密性增加.适当提高N2/SiH4比例有利于薄膜中H含量的降低. 关键词： 螺旋波等离子体 化学气相沉积 氮化硅薄膜     

外加磁场对磁控溅射制备氮化硅陷光薄膜的影响

在基底与靶材之间放置磁性强弱不同的永久磁铁来研究外加磁 场对磁控溅射制备氮化硅陷光薄膜的影响. 通过X射线衍射、原子力显微镜 (AFM) 以及紫外分光光度计分别测试了外加磁场前后所制备薄膜的组织结构、表面形貌和光学性能. 结果表明, 外加磁场后, 氮化硅薄膜依然呈现非晶结构; 但是表面形貌发生明显改变, 中心磁场1.50 T下, 薄膜表面为特殊锥状尖峰结构"类金字塔"的突起, 而且这些突起颗粒垂直于基底表面; 在 可见光及近红外范围内, 中心磁场1.50 T 下的薄膜样品平均透射率最大, 平均透射率达到90% 以上, 比未加磁场的样品提高了近1 倍, 具有很好的陷光特性. 关键词： 外加磁场 磁控溅射 氮化硅薄膜 陷光效应     

C+离子注入Si单晶形成SiC埋层中Si2p的特征能量损失谱

利用metal vapor vacuum arc离子源产生的C⁺离子，注入单晶Si衬底，得到了SiC埋层.利用X射线光电子能谱，研究了SiC埋层中Si2p的特征能量损失谱.结果表明：Si2p的特征能量损失谱依赖于SiC埋层中C原子的浓度分布，并且与SiC埋层的有序度对应. 关键词：     

离子束合成钇硅化物的结构及红外谱特征

将稀土金属钇离子注入到n型单晶Si(111)中制备出钇硅化物埋层.利用x射线衍射、卢瑟福背散射和傅里叶红外吸收谱测量分析了样品的结构、原子的埋层分布和振动模式.结果表明，Y离子在注入过程中已与基底中的Si原子形成了YSi2结构相.真空下的红外光辐照处理促使YSi2择优取向生长，埋层中Si与Y的平均原子浓度比由24下降为20，与六方YSi2的化学计量比一致.还给出了钇硅化物的特征红外吸收谱.     

低压等离子体增强化学汽相沉积法制备立方氮化碳薄膜

用低压等离子体增强化学汽相沉积法和氮化硅中间过渡层的方法，在硅片和玻璃上，制备了立方氮化碳薄膜.用光电子能谱测试了其成分和结合能，薄膜含氮量为42.96%.C1s和N1s的结合能分别为285.01和398.60eV.透射电子显微镜研究表明，制备的氮化碳属于体心立方结构，根据衍射花样，计算的晶格常量a为0.536nm，这与理论预言的结果a为0.53973nm很接近.随着沉积的时间增长，还观测到了氮化碳薄膜的菊池花样.在玻璃上沉积的氮化碳薄膜在可见光和近红外区域是透明的，在400nm处有光吸收. 关键词：     

Dual material insulator SOI-LDMOSFET: A novel device for self-heating effect improvement

The silicon-on-insulator (SOI) power devices show good electrical performance but they suffer from inherent self-heating effect (SHE), which limits their operation at high current levels. The SHE effect is because of low thermal conductivity of the buried oxide layer. In this paper we propose a novel silicon on insulator lateral double diffused MOSFET (SOI-LDMOSFET) where the buried insulator layer under the active region consists of two materials in order to decrease the SHE. The proposed structure is called dual material buried insulator SOI-LDMOSFET (DM-SOI). Using two-dimensional and two-carrier device simulation, we demonstrate that the heat dissipation and the SHE can be improved in a conventional SOI-LDMOSFET by replacement of the buried oxide with dual material buried insulator (silicon nitride and silicon oxide) beneath the active region. The heat generated in the active silicon layer can be flowed through the buried silicon nitride layer to the silicon substrate easily due to high thermal conductivity of silicon nitride. Furthermore, the channel temperature is reduced, negative drain current slope is mitigated and electron and hole mobility is increased during high-temperature operation. The simulated results show that silicon nitride is a suitable alternative to silicon dioxide as a buried insulator in SOI structures, and has better performance in high temperature.     

A new structure and its analytical model for the vertical interface electric field of a partial-SOI high voltage device

A new partial-SOI (PSOI) high voltage device structure called a CI PSOI (charge island PSOI) is proposed for the first time in this paper. The device is characterized by a charge island layer on the interface of the top silicon layer and the dielectric buried layer in which a series of equidistant high concentration n⁺-regions is inserted. Inversion holes resulting from the vertical electric field are located in the spacing between two neighbouring n⁺-regions on the interface by the force with ionized donors in the undepleted n⁺-regions, and therefore effectively enhance the electric field of the dielectric buried layer (E_I) and increase the breakdown voltage (BV), thereby alleviating the self-heating effect (SHE) by the silicon window under the source. An analytical model of the vertical interface electric field for the CI PSOI is presented and the analytical results are in good agreement with the 2D simulation results. The BV and E_I of the CI PSOI LDMOS increase to 631~V and 584~V/μ m from 246~V and 85.8~V/μ m for the conventional PSOI with a lower SHE, respectively. The effects of the structure parameters on the device characteristics are analysed for the proposed device in detail.     

A new physics-based self-heating effect model for 4H-SiC MESFETs

A new self-heating effect model for 4H-SiC MESFETs is proposed based on a combination of an analytical and a computer aided design (CAD) oriented drain current model. The circuit oriented expressions of 4H-SiC low-field electron mobility and in-complete ionization rate, which are related to temperature, are presented in this model, which are used to estimate the self-heating effect of 4H-SiC MESFETs. The verification of the present model is made, and the good agreement between simulated results and measured data of DC I-V curves with the self-heating effect is obtained.     

Electrical characteristics of SiGe-on-insulator nMOSFET and SiGe-silicon-on-aluminum nitride nMOSFET

This paper investigates the electrical characteristics and temperature distribution of strained Si/SiGe n-type metal oxide semiconductor field effect transistor(nMOSFET) fabricated on silicon-on-aluminum nitride(SOAN) substrate.This novel structure is named SGSOAN nMOSFET.A comparative study of self-heating effect of nMOSFET fabricated on SGOI and SGSOAN is presented.Numerical results show that this novel SGSOAN structure can greatly eliminate excessive self-heating in devices,which gives a more promising application for silicon on insulator to work at high temperatures.     

Characteristics of AlGaN/GaN high electron mobility transistors on metallic substrate

We have successfully prepared GaN based high electron mobility transistors(HEMTs)on metallic substrates transferred from silicon substrates by electroplating technique.GaN HEMTs on Cu substrates are demonstrated to basically have the same good electric characteristics as the chips on Si substrates.Furthermore,the better heat dissipation of HEMTs on Cu substrates compared to HEMTs on Si substrates is clearly observed by thermoreflectance imaging,showing the promising potential for very high-power and high-temperature operation.This work shows the outstanding ability of HEMT chips on Cu substrates for solving the self-heating effect with the advantages of process simplicity,high yield,and low production requirement.     

Development of novel flexible black silicon

We report a new type of black silicon: flexible black silicon. A silicon-on-insulator (SOI) wafer is irradiated by automatically scanning a femtosecond laser and then split by etching out the SOI silica middle layer. Large-area, uniform micro spikes on the surface of a very thin flexible silicon layer are obtained. The black silicon shows good flexibility and optical properties. The absorption spectrum of the flexible black silicon is as high as 97% in the visible and insensitive to the change of the incident angle of the light, which makes it a potential good candidate as an absorber for the solar-thermo generator.     

Novel high-voltage power lateral MOSFET with adaptive buried electrodes

A new high-voltage and low-specific on-resistance (R on,sp ) adaptive buried electrode (ABE) silicon-on-insulator (SOI) power lateral MOSFET and its analytical model of the electric fields are proposed. The MOSFET features are that the electrodes are in the buried oxide (BOX) layer, the negative drain voltage V d is divided into many partial voltages and the output to the electrodes is in the buried oxide layer and the potentials on the electrodes change linearly from the drain to the source. Because the interface silicon layer potentials are lower than the neighboring electrode potentials, the electronic potential wells are formed above the electrode regions, and the hole potential wells are formed in the spacing of two neighbouring electrode regions. The interface hole concentration is much higher than the electron concentration through designing the buried layer electrode potentials. Based on the interface charge enhanced dielectric layer field theory, the electric field strength in the buried layer is enhanced. The vertical electric field E I and the breakdown voltage (BV) of ABE SOI are 545 V/μm and -587 V in the 50 μm long drift region and the 1 μm thick dielectric layer, and a low R on,sp is obtained. Furthermore, the structure also alleviates the self-heating effect (SHE). The analytical model matches the simulation results.     

Silicon doping effects on optical properties of InAs ultrathin layer embedded in GaAs/AlGaAs:δSi high electron mobility transistors structures

Micro-Raman scattering measurements were used to study the silicon delta-doped layer density variation effect on InAs ultrathin layer embedded in silicon-delta-doped GaAs/AlGaAs high electron mobility transistors (HEMTs) structures properties. These structures were grown by molecular beam epitaxy on GaAs substrates with different silicon (Si) delta-doped layer densities. Two coupled plasmon–longitudinal optical (LO) phonon modes (L− and L+) were observed in the micro-Raman spectra of the Si-delta-doped samples, and both their wave numbers and intensities were dependent on the silicon delta-doped layer density. There is evidence to suggest that the increase of the Si doping level results in the increase of exciton–phonon scattering which is mainly due to the incorporation of Si and the increase of the two-dimensional electron gas (2DEG) in the InAs/GaAs interface. From fitting the temperature-dependence of full width at half maximum (FWHM) of quantum well’s photoluminescence peak (P₁) by the exciton–photon coupling model, it was found that the interaction between exciton and phonon in Si-delta-doped quantum wells was higher than that in the undoped sample. This result was confirmed as resulting from the increase of plasmon–phonon scattering which is attributed to the increase of free carriers donated from implanted Si dopant. The self-consistent Poisson–Schrödinger model calculation results are in good agreement with the experimental results, where the 2DEG densities increase linearly with increasing the Si-delta-doped layer density.