TBBPAER/DDM的固化反应动力学

用等温差示扫描量热法研究了4，4’-二氨基二苯甲烷固化四溴双酚-A环氧树脂的反应动力学，测定了固化反应热，得出了不同温度下固化反应速率与反应程度、固化反应程度与反应时间的关系曲线．结果表明等温固化反应按自催化反应机理进行，用Kamal方程较好地描述了不同温度下其固化反应的自催化反应过程，并反映出不同温度下扩散作用的差别，其动力学参数k1、k2、m、n由非线性回归法拟合而出，k1、k2对应的反应表现活化能分别为52．2kJ·mol-1和46．5kJ·mol-1。     

Features of Curing of a Diane Epoxy Oligomer Modified with Epoxyphosphazene

The results of rheokinetic, dynamic mechanical, and calorimetric investigations of the process of curing of an epoxy oligomer ED-20 blend with epoxyphosphazene by a low-molecular-weight polyamide L-20 are analyzed. It is shown that the phenomenological curing kinetics of all studied systems is characterized by the presence of two stages of the process: a second-order reaction followed by a self-retarded second-order reaction upon reaching the isothermal glass transition of the system.     

一种液晶环氧树脂固化动力学FTIR研究

应用示差扫描量热分析研究了含液晶基元的环氧化合物４,４‘－二（２,３－环氧丙氧基）偶氮苯与五种芳香胺类固化剂的固化行为,选择了４,４’－二氨基二苯甲烷为固化剂。确定了具体的固化条件并合成了液晶环氧树脂。根据环氧树脂自催化固化反应模型和氨基氢等活性假设,利用傅立叶变换红外光谱法研究了４,４‘－二（２,３－环氧丙氧基）偶氮苯／４,４’－二氨基二苯甲烷五氧树脂在１００℃,１２０℃和１５５℃恒温国大化时,     

FTIR法研究环氧树脂固化反应动力学

用傅里叶红外光谱（ＦＴＩＲ）法研究了双酚Ｓ环氧树脂和甲溴双酚Ａ环氧树脂分别与二胺基二苯砜在恒温条件下的固化反应动力学,得出了各反应的表观活化能。     

松香改性酚醛环氧树脂的固化反应动力学研究

以自制的松香改性酚醛环氧树脂（RPAE）为对象,采用差示扫描量热法研究了其与4,4．二氨基二苯砜组成的体系（RPAE／DDS）的固化动力学,利用Kissinger方程计算得到体系的固化热约为109．29J／g,表观活化能为51．56kJ／mol,该体系反应级数为0．85,近似为1级反应,反应速率常数为2．69×10^4／s。采用Ozawa-Flynn-Wall方程分析,得到体系的表观活化能为70。1kJ／mol。     

Electret and Strength Properties of Polymeric Materials Based on Epoxy Oligomer and Amine Curing Agents

Russian Journal of Applied Chemistry - Electret properties of polymeric materials based on DER-331 epoxy oligomer and amine curing agents, produced in the course of synthesis of the polymer in a...     

双酚-S环氧树脂与琥珀酸酐固化反应动力学

用差示扫描量热法（ＤＳＣ）研究了双酚－Ｓ环氧树脂（ＢＰＳＥＲ）与琥珀酸酐固化反应的历程。实验结果表明,固化反应主要分两个阶段,前期由化学动力学控制,服从自催化机理。实验数据利用Ｋａｍａｌ方程处理得到两个速率常数ｋ、、ｋ２及两个反应级数ｍ、ｎ、ｋ１、ｋ２的值随反应温度的升高呈增大的趋势,总反应级数ｍ＋ｎ在２～２．５之间,当转化率达到４０％左右后,由于交联程度增加,分子量迅速增长,分子间扩散较慢,进入     

Oligomer blends: Rheology, structure, and properties

The specifics of the phase structure, rheological properties, and mechanical characteristics of cured and liquid blends of reactive oligomers are discussed, as well as filled compositions in the form of emulsions on their basis. One of the main factors that determine the properties of these blends is their phase composition and the colloid-chemical structure. In the filled emulsions, an uneven distribution of filler between the phases is possible. If the emulsion structure of the two-phase blends of reactive oligomers is fixed during their curing, the blends may exhibit quite surprising properties.     

应用激光解吸电离飞行时间质谱法研究芳香聚硫醚醚砜环状低聚物

应用激光解吸电离飞行时间质谱法对芳香环状聚硫醚醚砜低聚物结构进行了分析,比较了四种不同基质对环状物结构分析结果的影响,发现1,8,9-蒽三酚为此类芳香环状低聚物的有效基质。探讨了金属阳离子对此类芳香环状低聚物的影响,认为三氟乙酸银是此种芳香环状低聚物的有效阳离子剂。     

咪唑改性氧化石墨烯对阻燃环氧固化动力学的促进作用

讨论了添加量为1%(Per hundreds of resin)的咪唑改性的氧化石墨烯(GO-IPDI-MZ)对磷质量分数为1.5%的环氧树脂体系(1.5P-D-U-EMI)固化的影响.差示扫描量热法(DSC)研究结果表明,当GO-IPDI-MZ添加量为1%时不会改变1.5P-D-U-EMI的非等温自催化固化反应特征.添加1%GO-IPDI-MZ的磷质量分数为1.5%的环氧树脂(1.5P-D-GOM-1)的固化起始温度(Tonset)和峰顶温度(Tp)均比1.5P-D-U-EMI体系低,而总的固化热(ΔH)比1.5P-D-U-EMI体系高.说明GO-IPDI-MZ添加量为1%时,对环氧体系起到一定的促进固化和共固化作用.等温DSC分析表明,在固化反应后期,体系出现了玻璃化转变现象,在此阶段,含扩散控制因子的Kamal模型预测结果与实验结果吻合较好.GO-IPDI-MZ的加入使固化反应相对均匀地进行,对固化反应会产生促进和共固化作用.     

耐热芴型环氧树脂的非等温固化动力学

合成了9,9’-二[4-(2,3环氧丙氧基)苯基]芴,并以4,4’-二氨基二苯砜胺为固化剂,用非等温DSC法研究了其固化动力学,用Flynn-Wall-Ozawa法和Friedman法确定了固化动力学参数,用动力学模拟推测了固化机理函数,并用TGA法对等温固化树脂的耐热性进行了表征。结果表明:双酚芴环氧固化反应的表观活化能约63.86 kJ/mol,扩散因子为3.80×104s-1,反应级数为1.57;固化反应为枝状成核的自催化反应;等温固化后的环氧树脂于400℃开始分解,700℃时残碳率为41.73%。     

含联苯结构环氧树脂体系固化反应动力学研究

用示差扫描量热仪(DSC)对含联苯结构环氧树脂(TMBP)/4,4′-二氨基二苯砜(DDS)固化体系的固化反应过程进行了分析,并用Kissinger和Ozawa方法分别求得体系固化反应的表观活化能ΔE为69.7和74.2kJ/mol,根据Crane理论计算得到该体系的固化反应级数n=0.89及在不同升温速率下的频率因子A,确定了使用DDS作为固化剂的固化反应条件.     

Curing Kinetics Modeling of Epoxy Modified by Fully Vulcanized Elastomer Nanoparticles Using Rheometry Method

In this study, the curing kinetics of epoxy nanocomposites containing ultra-fine full-vulcanized acrylonitrile butadiene rubber nanoparticles (UFNBRP) at different concentrations of 0, 0.5, 1 and 1.5 wt.% was investigated. In addition, the effect of curing temperatures was studied based on the rheological method under isothermal conditions. The epoxy resin/UFNBRP nanocomposites were characterized via Fourier transform infrared spectroscopy (FTIR). FTIR analysis exhibited the successful preparation of epoxy resin/UFNBRP, due to the existence of the UFNBRP characteristic peaks in the final product spectrum. The morphological structure of the epoxy resin/UFNBRP nanocomposites was investigated by both field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) studies. The FESEM and TEM studies showed UFNBRP had a spherical structure and was well dispersed in epoxy resin. The chemorheological analysis showed that due to the interactions between UFNBRP and epoxy resin, by increasing UFNBRP concentration at a constant temperature (65, 70 and 75 °C), the curing rate decreases at the gel point. Furthermore, both the curing kinetics modeling and chemorheological analysis demonstrated that the incorporation of 0.5% UFNBRP in epoxy resin matrix reduces the activation energy. The curing kinetic of epoxy resin/UFNBRP nanocomposite was best fitted with the Sestak–Berggren autocatalytic model.     

Curing Kinetics and Thermal Property Characterization of Bisphenol-F Epoxy Resin and MeTHPA System

The curing kinetics of bisphenol-F epoxy resin (BPFER) and curing agent 3-methyl-1,2,3,6-tetrahydrophthalic anhydride (MeTHPA), with N,N-dimethyl-benzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure for the system, which could be well described by the model proposed by Kamal, which includes two rate constants, k ₁ and k ₂, and two reaction orders, m andn. The curing reaction at the later stages was practically diffusion-controlled. To consider the diffusion effect more precisely, diffusion factor, d(a), was introduced into Kamal's equation. The glass transition temperatures (T _gs) of the BPFER/MeTHPA samples were determined by means of torsional braid analysis (TBA). The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis (TG). This revised version was published online in August 2006 with corrections to the Cover Date.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

Oligomer epoxy binders with controllable molecular characteristics: Curing rheokinetics

A method for calculation of molecular characteristics and compositions of the mixtures of industrial epoxy diane oligomers (EDOs) with the given parameters of molecular weights and molecular weight distribution is proposed. Using the rheokinetic investigation techniques, the time ranges of the initial stages of EDO curing were defined and the dependence of time parameters of curing on the molecular characteristics and fractional compositions of the mixtures of these oligomers were determined. The investigations performed allow calculation, prediction, and optimization of compositions of epoxy binders and technological parameters of different stages of the production of polymer-composite materials and adhesive bonds with a complex of given properties.     

气相二氧化硅填充极性低聚物的界面与流变

气相二氧化硅(FS)/低聚物纳米复合材料应用广泛于涂料、胶黏剂、锂离子电池、液体防弹衣等诸多领域.然而,极性低聚物与FS表面相互作用复杂,FS/低聚物复合材料(ONCs)的流变响应多种多样.如何实现ONCs流变行为调控,是长期困扰工业界的难题.本文详细总结了FS在ONCs领域的应用,将FS粒子间相互作用与ONCs流变性质相关联,综述ONCs界面层结构的表征、调控手段及界面层与流变行为的关系.结合本课题组对FS/极性低聚物体系界面及流变行为的研究成果,提出未来ONCs领域的2个重要方向,即研究界面结构与粒子-极性低聚物相互作用间的关系,并通过界面设计实现对纳米粒子/极性低聚物复合材料的流变行为的精确调控.