Synthesis of semiaromatic polyimides from aromatic diamines containing adamantyl units and alicyclic dianhydrides

We prepared new semiaromatic polyimides from alicyclic dianhydrides and aromatic diamines containing adamantyl and biadamantyl units. Polycondensations were performed in 1‐methyl‐2‐pyrrolidinone at room temperature for 7 h and then 80 °C for 23 h, giving poly(amic acid)s with inherent viscosities up to 0.58 dL/g. Poly(amic acid)s were converted to corresponding poly(imide)s by thermal treatment. Poly(imide)s showed relatively high thermal stability (5% weight loss around 450 °C) and low dielectric constants (2.69–2.79). © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 144–150, 2004     

Partially bio‐based poly(amide imide)s by polycondensation of aromatic diacylhydrazides based on lignin‐derived phenolic acids and aromatic dianhydrides: Synthesis,characterization, and computational studies

Two new bio‐based diacylhydrazide monomers, namely, 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3‐methoxybenzohydrazide) and 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3,5‐dimethoxybenzohydrazide) were synthesized starting from lignin‐derived phenolic acids, namely, vanillic acid and syringic acid. A series of poly(amide imide)s was synthesized by polycondensation of these diacylhydrazide monomers with commercially available aromatic dianhydrides. Poly(amide imide)s showed inherent viscosity in the range 0.44–0.56 dL g^?1 and exhibited good solubility in organic solvents. Poly(amide imide)s could be cast into transparent, flexible, and tough films from their N ,N‐dimethylacetamide solutions. Poly(amide imide)s showed 10% weight loss in the temperature range 340–364 °C indicating their good thermal stability. Glass transition temperature (T _g) of poly(amide imides)s were measured by DSC and DMA which were in the range 201–223 °C and 214–248 °C, respectively. The T _g values of poly(amide imide)s were dependent on the number methoxy substituents on aromatic rings of diacylhydrazide monomers. Molecular dynamics simulation studies revealed that chain rigidity is the dominant factor for observed trends in T _g. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55 , 3636–3645     

Fluorinated polyamides and poly(amide imide)s based on 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy)benzene,aromatic dicarboxylic acids,and various monotrimellitimides and bistrimellitimides: Syntheses and properties

A CF₃‐containing diamine, 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy) benzene ( I ), was prepared from hydroquinone and 2‐chloro‐5‐nitrobenzotrifluoride. Imide‐containing diacids ( V _a–h and VI _a,b ) were prepared through the condensation reaction of amino acids, aromatic diamines, and trimellitic anhydride. Then, a series of soluble fluorinated polyamides ( VII _a–h ) and poly(amide imide)s ( VIII _a–h and X _a,b ) were synthesized from I with various aromatic diacids ( II _a–h ) and imide‐containing diacids ( V _a–h and VI _a,b ) via direct polycondensation with triphenyl phosphate and pyridine. The polyamides and poly(amide imide)s had inherent viscosities of 1.00–1.70 and 0.79–1.34 dL/g, respectively. All the synthesized polymers showed excellent solubility in amide‐type solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, and N‐dimethylformamide and afforded transparent and tough films via solvent casting. Polymer films of VII _a–h , VIII _a–h , and X _a,b had tensile strengths of 91–113 MPa, elongations to break of 8–40%, and initial moduli of 2.1–2.8 GPa. The glass‐transition temperatures of the polyamides and poly(amide imide)s were 254–276 and 255–292 °C, respectively, and the imide‐containing poly(amide imide)s had better thermal stability than the polyamides. The polyamides showed higher transparency and were much lighter in color than the poly(amide imide)s, and their cutoff wave numbers were below 400 nm. In comparison with isomeric IX _{c – h} , poly(amide imide)s VIII _c–h exhibited less coloring and showed lower yellowness indices. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3116–3129, 2004     

Preparation and properties of polybenzoxazine/poly(imide‐siloxane) alloys: In situ ring‐opening polymerization of benzoxazine in the presence of soluble poly(imide‐siloxane)s

Benzoxazine monomer (Ba) was blended with soluble poly(imide‐siloxane)s in various weight ratios. The soluble poly(imide‐siloxane)s with and without pendent phenolic groups were prepared from the reaction of 2,2′‐bis(3,4‐dicarboxylphenyl)hexafluoropropane dianhydride with α,ω‐bis(aminopropyl)dimethylsiloxane oligomer (PDMS; molecular weight = 5000) and 3,3′‐dihydroxybenzidine (with OH group) or 4,4′‐diaminodiphenyl ether (without OH group). The onset and maximum of the exotherm due to the ring‐opening polymerization for the pristine Ba appeared on differential scanning calorimetry curves around 200 and 240 °C, respectively. In the presence of poly(imide‐siloxane)s, the exothermic temperatures were lowered: the onset to 130–140 °C and the maximum to 210–220 °C. The exotherm due to the benzoxazine polymerization disappeared after curing at 240 °C for 1 h. Viscoelastic measurements of the cured blends containing poly(imide‐siloxane) with OH functionality showed two glass‐transition temperatures (T_g's), at a low temperature around ?55 °C and at a high temperature around 250–300 °C, displaying phase separation between PDMS and the combined phase consisting of polyimide and polybenzoxazine (PBa) components due to the formation of AB‐crosslinked polymer. For the blends containing poly(imide‐siloxane) without OH functionalities, however, in addition to the T_g due to PDMS, two T_g's were observed in high‐temperature ranges, 230–260 and 300–350 °C, indicating further phase separation between the polyimide and PBa components due to the formation of semi‐interpenetrating networks. In both cases, T_g increased with increasing poly(imide‐siloxane) content. Tensile measurements showed that the toughness of PBa was enhanced by the addition of poly(imide‐siloxane). Thermogravimetric analysis showed that the thermal stability of PBa also was enhanced by the addition of poly(imide‐siloxane). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2633–2641, 2001     

Analysis of dimensionally stable copolyimide with a low‐level residual stress

Copolyimide thin film, which has low‐level stress and stress relaxation induced by water sorption, was characterized for potential applications as an encapsulant, a stress‐relief buffer, and in interlayer dielectrics. The polyimides examined were poly(p‐phenylene pyromellitimide) (PMDA‐PDA) and poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) as well as their random copolyimides with various compositions. These copolyimide films exhibited good combinations of physical and mechanical properties with low thermal expansion coefficients, residual stress, and moisture‐induced stress–relaxation behavior by appropriately selecting the ratios of the dianhydride component. For these polyimides, the residual stress increased in the range of −8.1–7.5 MPa, whereas stress relaxation induced by water uptake decreased in the range of 10.3–4.7 MPa with increasing BPDA contents, respectively. The major factor in determining the magnitude of the stress behavior induced by both the thermal mismatch and water uptake in films should be the morphological factors such as chain rigidity, chain orientation, crystallinity, and microvoids. Their morphological structures were examined by wide angle X‐ray diffraction and a prism coupler, and the thermal properties were measured using a dynamic mechanical thermal analyzer as well as thermomechanical analysis. Overall, the candidate for the low level stress buffer application from the PMDA/BPDA‐PDA copolyimide was the 30/70 (= PMDA/BPDA in molar ratio) copolyimide. This copolyimide showed no residual stress after curing at 400 °C and relatively insensitive stress relaxation to ambient humidity. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 796–810, 2001     

Highly soluble and optically transparent poly (ether imide)s based on 2,6‐ or 2,7‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride and aromatic bis(ether amine)s bearing trifluoromethyl groups

Two series of novel fluorinated poly(ether imide)s (coded IIIA and IIIB ) were prepared from 2,6‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride and 2,7‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride, respectively, with various trifluoromethyl‐substituted aromatic bis(ether amine)s by a standard two‐step process with thermal or chemical imidization of the poly(amic acid) precursors. These fluorinated poly(ether imide)s showed good solubility in many organic solvents and could be solution‐cast into transparent, flexible, and tough films. These films were nearly colorless, with an ultraviolet–visible absorption edge of 364–386 nm. They also showed good thermal stability with glass‐transition temperatures of 221–298 °C, 10% weight loss temperatures in excess of 489 °C, and char yields at 800 °C in nitrogen greater than 50%. The 2,7‐substituted IIIB series also showed better solubility and higher transparency than the isomeric 2,6‐substituted IIIA series. In comparison with nonfluorinated poly (ether imide)s, the fluorinated IIIA and IIIB series showed better solubility, higher transparency, and lower dielectric constants and water absorption. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5909–5922, 2006     

Synthesis and characterization of fluorinated poly(amide imide)s derived from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and aromatic diamines

A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10^?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003     

Structure and property relationships in model diglycidyl ether of bisphenol‐a and diglycidyl ether of tetramethyl bisphenol‐a epoxy systems. I. Mechanical property characterizations

Model epoxy networks, with variations in crosslink density and in epoxy monomer rigidity, were prepared to study how the network structure affects modulus, T_g, and toughness/toughenability of epoxy resins. Diglycidyl ether of bisphenol‐A and diglycidyl ether of tetramethyl‐bisphenol‐A, along with the corresponding chain extenders, were chosen to study how monomer backbone rigidity and crosslink density affect physical and mechanical properties of epoxies. The present study indicates that, as expected, the backbone rigidity of the epoxy network, not the crosslink density alone, will strongly influence modulus and T_g of epoxy resins. Upon rubber toughening, it is found that the rigidity of the epoxy backbone and/or the nature of the crosslinking agent utilized are most critical to the toughenability of the epoxy. That is, the well‐known correlation between toughenability and the average molecular weight between crosslinks (M_c) does not necessarily hold true when the nature of epoxy backbone molecular mobility is altered. The potential significance of the present findings for a better design of toughened thermosets for structural applications is discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2137–2149, 1999     

Epoxy resins from rosin acids: synthesis and characterization

A series of multifunctional cycloaliphatic glycidyl ester and ether epoxy resins were synthesized by reaction of condensed rosin acid‐formaldehyde resins with epichlorohydrin. The chemical structure of the produced resins was determined by IR and ¹H‐NMR analysis. The molecular weight of the produced resins was determined by gel permeation chromatography (GPC). A series of poly‐ (amide‐imide) hardeners were prepared from condensation of Diels–Alder adducts of rosin acid‐maleic anhydride and acrylic acid with triethylene tetramine and pentaethylene hexamine. These amines were also condensed with Diels–Alder adducts of rosin ketones. The curing exotherms of the produced epoxy resins with poly(amide‐imide) hardeners were investigated. The data of mechanical properties, solvent and chemical resistance indicate the superior adhesion of the cured epoxy resins. Copyright © 2004 John Wiley & Sons, Ltd.     

Synthesis and properties of sulfur‐contained poly(silylene arylacetylene)s

Poly(silylene arylacetylene) (PSA) is a kind of poly(arylacetylene) silicon‐containing resins with excellent heat resistance and good mechanical performances. In this article, the sulfur atom is introduced into the main chain of the PSA molecule to obtain a sulfur‐containing poly(silylene arylacetylene), named S‐PSA. By Williamson and Sonogashira reactions, bis(4‐ethynylphenyl)sulfide and bis(4‐ethynylphenyl)sulfone were synthesized. Thereafter, through Grignard reagent way, the poly(silylene ethynylene phenylene sulfide phenylene ethynylene) (PSESE) and poly(silylene ethynylene phenylene sulfone phenylene ethynylene) (PSESO₂E) were synthesized from bis(4‐ethynylphenyl)sulfide, bis(4‐ethynylphenyl)sulfone, and methylphenyl dichlorosilane. Poly(silylene ethynylene phenylene sulfoxide phenylene ethynylene) (PSESOE) was synthesized by the oxidation of PSESE. The structures and properties of these resins were characterized and the mechanical properties of the T300 reinforced composites were tested. The results show that the novel S‐PSA resins have excellent heat resistance and good mechanical properties, and could be used as resin matrices for high‐performance composites in high‐tech fields. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2019, 57, 2324–2332     

Synthesis and characterization of soluble polyimides containing trifluoromethyl groups in their backbone

A series of polyimides were synthesized from 2,2‐Bis(3,4‐dicarboxyphenyl)hexafluoropropane, 2,2‐bis(3‐amino‐4‐hydroxyphenyl)‐hexafluoropropane, and 4,4′‐oxydianiline by chemical imidization. The effects of the diamine ratios on the properties of the films were evaluated through the study of their thermal, electrical, and morphological properties. All the polymers exhibited better solubility in most of the organic solvents and hence were easily processable. Polyimides with more 2,2‐bis(3‐amino‐4‐hydroxyphenyl)‐hexafluoropropane exhibited better solubility and a low refractive index, which is highly desired for microelectronic applications. The dielectric constant and birefringence were strongly dependent on the fluorine content. With an increase in the fluorine substitution, both the dielectric constant and birefringence decreased. All the polymers exhibited high thermal stability (>400 °C). The absence of crystalline melting in differential scanning calorimetry and broad wide‐angle X‐ray diffraction patterns revealed the amorphous nature of the polymers, which was due to the presence of bulky CF₃ groups and hinged ether linkages of the diamine component. The residual stress values decreased with an increase in the 4,4′‐oxydianiline content, and the results were in agreement with the dielectric constant. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4303–4312, 2004     

Molecular structure and thickness dependence of chain orientation in aromatic polyimide films

Degrees of orientation of main chains and imide rings were quantitatively estimated for spin‐coated films of six kinds of aromatic polyimides (PIs) using polarized attenuated total reflection (ATR)/Fourier transform infrared (FT‐IR) spectroscopy. The degrees of chain orientation parallel to the film planes are significantly larger for the PIs having rigid structures than those having flexible structures, and the introduction of side groups decrease the degrees of chain orientation. In contrast, the rotational orientations of imide rings are almost isotropic for all PI films. Moreover, the film thickness dependences of the degrees of orientation were investigated for two kinds of rigid‐rod PIs having bulky trifluoromethyl ( CF₃) side groups in their diamine moieties. The degrees of chain orientation slightly decrease as the film thickness increases, whereas the rotational orientation of imide rings is independent of the film thickness. The degrees of chain orientation on the substrate sides significantly differ from the atmospheric sides of PI films. This difference was generated during thermal imidization because of tensile stress originated from the mismatch in thermal expansion coefficients between the substrates and the PI films. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 2109–2120, 2005     

Preparation and properties of new poly(amide‐imide)s based on 1,4‐bis(4‐trimellitimidophenoxy)naphthalene and aromatic diamines

A diimide dicarboxylic acid, 1,4‐bis(4‐trimellitimidophenoxy)naphthalene (1,4‐BTMPN), was prepared by condensation of 1,4‐bis(4‐aminophenoxy)naphthalene and trimellitic anhydride at a 1 : 2 molar ratio. A series of novel poly(amide‐imide)s (IIa–k) with inherent viscosities of 0.72 to 1.59 dL/g were prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid 1,4‐BTMPN with various aromatic diamines (Ia–k) in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. The poly(amide‐imide)s showed good solubility in NMP, N,N‐dimethylacetamide, and N,N‐dimethylformamide. The thermal properties of the obtained poly(amide‐imide)s were examined with differential scanning calorimetry and thermogravimetry analysis. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures in the range of 215 to 263°C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses at temperatures in the range of 538 to 569°C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s also is presented. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1–8, 2000     

Mechanistic study of ring‐opening copolymerization of ɛ‐caprolactam with epoxide: Development of novel thermosetting epoxy resin system

We investigated the mechanism of the ring‐opening copolymerization of ?‐caprolactam (?‐CL) with glycidyl phenyl ether (GPE) to afford poly(?‐CL‐co‐GPE) as a model reaction of the thermal curing of certain epoxy resins with ?‐CL. The reaction of ?‐CL and GPE proceeded efficiently in the presence of 1,8‐diazabicyclo[5.4.0]undec‐7‐ene (DBU) at 170^°C for 2 h. The monomer reactivities r₁ of ?‐CL and r₂ of GPE calculated according to the Fineman‐Ross method and the Kelen‐Tüdös method were 0.58 and 5.52, respectively. These values indicate that poly(?‐CL‐co‐GPE) has a pseudo‐block gradient copolymer. Based on these results, we examined the thermal curing reactions of certain epoxy resins with ?‐CL. The corresponding novel cured products were obtained quantitatively, and each of them showed a high glass transition temperature and high thermal stability, presumably due at least in part to a pseudo‐block gradient primary structure resembling that of poly(?‐CL‐co‐GPE). © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2220–2228     

Novel method for preparation of poly(benzoxazinone‐imide)

A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (T_g ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no T_g was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000     

New poly(amide–imide)s syntheses. XXIII. Synthesis and properties of poly(amide–imide)s derived from 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline and various bis(trimellitimide)s

A series of poly(amide–imide)s III_a–m containing flexible isopropylidene and ether groups in the backbone were synthesized by the direct polycondensation of 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline (PIDA) with various bis(trimellitimide)s II_a–m in N‐methyl‐2‐pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting poly(amide–imide)s had inherent viscosities in the range of 0.80–1.36 dL/g. Except for those from the bis(trimellitimide)s of p‐phenylenediamine and benzidine, all the polymers could be cast from DMAc into transparent and tough films. They exhibited excellent solubility in polar solvents. The 10% weight loss temperatures of the polymers in air and in nitrogen were all above 495°C, and their T_g values were in the range of 201–252°C. Some properties of poly(amide–imide)s III were compared with those of the corresponding poly(amide–imide)s V prepared from the bis(trimellitimide) of diamine PIDA and various aromatic diamines. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 69–76, 1999     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Synthesis of novel boron‐containing epoxy–novolac resins and properties of cured products

Epoxy–novolac resins were synthesized by modifying a commercial novolac resin with epichlorohydrin. These epoxy–novolac resins were characterized and further modified with different contents of bis(benzo‐1,3,2‐dioxa‐borolanyl)oxide or bis(4,4,5,5‐tetramethyl‐1,3,2‐dioxa‐borolanyl)oxide. The boron‐containing epoxy–novolac resins were autocatalytically crosslinked or crosslinked with BF₃MEA and their thermal stability and flame retardancy were determined by thermogravimetric analysis and limiting oxygen index (LOI) values. These LOI values for the bis(benzo‐1,3,2‐dioxa‐borolanyl)oxide derivatives were higher than the boron‐free novolac resins, which shows the benefit of the presence of boron. To test the role of boron in the enhancement of flammability, scanning electronic microscopy and energy‐dispersive X‐ray spectroscopy images were made. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6332–6344, 2006     

Novel method for the preparation of poly(urethane–imide)s and their properties

A polymer blend consisting of polyimide (PI) and polyurethane (PU) was prepared by means of a novel approach. PU prepolymer was prepared by the reaction of polyester polyol and 2,4-tolylenediisocyanate (2,4-TDI) and then end-capped with phenol. Poly(amide acid) was prepared from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). A series of oligo(amide acid)s were also prepared by controlling the molar ratio of PMDA and ODA. The PU prepolymer and poly(amide acid) or oligo(amide acid) solution were blended at room temperature in various weight ratios. The cast films were obtained from the blend solution and treated at various temperatures. With the increase of polyurethane component, the films changed from plastic to brittle and then to elastic. The poly(urethane–imide) elastomers showed excellent mechanical properties and moderate thermal stability. The elongation of films with elasticity was more than 300%. The elongation set after the breaking of films was small. From the dynamic mechanical analysis, all the samples showed a glass transition temperature (T_g) at ca. −15°C, corresponding to T_g of the urethane component, suggesting that phase separation occurred between the two polymer components, irrespective of polyimide content. TGA and DSC studies indicated that the thermal degradation of poly(urethane–imide) was in the temperature range 250–270°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3745–3753, 1997     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002