Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Flame‐retardant epoxy resins: An approach from organic–inorganic hybrid nanocomposites

Phosphorus‐containing epoxy‐based epoxy–silica hybrid materials with a nanostructure were obtained from bis(3‐glycidyloxy)phenylphosphine oxide, diaminodiphenylmethane, and tetraethoxysilane in the presence of the catalyst p‐toluenesulfonic acid via an in situ sol–gel process. The silica formed on a nanometer scale in the epoxy resin was characterized with Fourier transform infrared, NMR, and scanning electron microscopy. The glass‐transition temperatures of the hybrid epoxy resins increased with the silica content. The nanometer‐scale silica showed an enhancement effect of improving the flame‐retardant properties of the epoxy resins. The phosphorus–silica synergistic effect on the limited oxygen index (LOI) enhancement was also observed with a high LOI value of 44.5. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 986–996, 2001     

Reaction of epoxy resin and hyperbranched polyacids

The condensation reaction between two different epoxy resins and a hyperbranched polyester (MAHP) [poly(allyloxy maleic acid‐co‐maleic anhydride)] was studied. We compared two kinds of diglycidyl ether bisphenol A type of epoxy resins with different molecular weights, that is, epoxy resin GY240 (M = 365 g/mol) and GT6064 (M = 1540 g/mol) in this reaction. The results showed a marked difference in their reaction pattern in terms of ability to form crosslinked polymer networks with MAHP. For the former low‐molecular‐weight epoxy resin, no crosslinking could be observed in good solvents such as THF or dioxane within the set of reaction conditions used in this study. Instead, polymers with epoxide functional degrees between 0.34 and 0.5 were formed. By contrast, the latter high‐molecular‐weight epoxy resin, GT6064, rapidly produced highly crosslinked materials with MAHP under the same reaction conditions. The spherical‐shape model of hyperbranched polymer was applied to explain this difference in reaction behavior. Hence, we have postulated that low‐molecular‐weight epoxy resins such as GY240 are unable to crosslink the comparatively much bigger spherically shaped MAHP molecules. However, using high‐molecular‐weight epoxy resins greatly enhances the probability of crosslinking in this system. Computer simulations verified the spherical shape and condensed bond density of MAHP in good solvents, and submicron particle analysis showed that the average MAHP particle size was 9 nm in THF. Furthermore, the epoxy‐functionalized polyesters were characterized by ¹H NMR and FTIR, and the molecular weights and molecular‐weight distributions were determined by size‐exclusion chromatography. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4457–4465, 2000     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Influence of the type of epoxy hardener on the structure and properties of interpenetrated vinyl ester/epoxy resins

The morphology–toughness relationship of vinyl ester/cycloaliphatic epoxy hybrid resins of interpenetrating network (IPN) structures was studied as a function of the epoxy hardening. The epoxy was crosslinked via polyaddition reactions (with aliphatic and cycloaliphatic diamines), cationic homopolymerization (via a boron trifluoride complex), and maleic anhydride. Maleic anhydride worked as a dual‐phase crosslinking agent by favoring the formation of a grafted IPN structure between the vinyl ester and epoxy. The type of epoxy hardener strongly affected the IPN morphology and toughness. The toughness was assessed by linear elastic fracture mechanics, which determined the fracture toughness and energy. The more compact the IPN structure was, the lower the fracture energy was of the interpenetrated vinyl ester/epoxy formulations. This resulted in the following toughness ranking: aliphatic diamine > cycloaliphatic diamine ≥ boron trifluoride complex > maleic anhydride. For IPN characterization, the width of the entangling bands and the surface roughness parameters were considered. Their values were deduced from atomic force microscopy scans taken on ion‐etched surfaces. More compact, less rough IPN‐structured resins possessed lower toughness parameters than less compact, rougher structured ones. The latter were less compatible according to dynamic mechanical thermal and thermogravimetric analyses. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5471–5481, 2004     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Preparation and thermomechanical properties of epoxy resins modified by octafunctional cubic silsesquioxane epoxides

The thermomechanical properties of octafunctional cubic silsesquioxane‐modified epoxy resins associated with dicycloaliphatic hardener (4,4′‐dimethyldiaminodicyclo hexyl methane) were studied using thermogravimetric analysis, differential scanning calorimetry, and dynamic mechanical analysis. The structures of epoxy resin containing cubic silsesquioxane epoxides were characterized by Fourier transform infrared spectroscopy and wide‐angle X‐ray scattering techniques. In this work, octa(dimethylsiloxybutylepoxide) octasilsesquioxane (OB), and octa(glycidyldimethyl‐siloxyepoxide) octasilsesquioxane (OG), were synthesized and used as additives to improve the properties of a commercial epoxy resin by exploring the effects of varying the ratio of OB or OG. The commercial Ciba epoxy resin (Araldite LY5210/HY2954) was used as a standard. It was found, by thermogravimetric analysis and dynamic mechanical analysis, that the highest thermal stability was observed at N = 0.5 (N = number of amine groups/number of epoxy rings). No glass transition temperature was observed by adding 20 mol % OB to the Ciba epoxy resin, indicating the reduction of chain motion in the presence of octafunctional cubic silsesquioxane epoxide. The storage modulus of the OB‐modified epoxy resin also increased, especially at higher temperatures, compared with the Ciba epoxy resin under identical curing conditions. Fourier transform infrared data elucidated the preservation of cubic silsesquioxane structure after curing at high temperature. In contrast, the OG/Araldite LY5210/HY2954 systems gave poorer thermomechanical properties. The low viscosity of OB at room temperature (～ 350 cPs) makes it suitable for composite processing and, when used in conjunction with the Ciba epoxy, lowers the viscosity of this system as well. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3490–3503, 2004     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Development of novel phosphorus‐containing epoxy resins from renewable resources

Novel biobased epoxy resins were prepared from two fatty acid derivatives; epoxidized 10‐undecenoyl triglyceride and epoxidized methyl 3,4,5‐tris(10‐undecenoyloxy)benzoate, with 4,4′‐diaminodiphenylmethane as a crosslinking agent. The flame retardancy of these epoxy resins was improved by the addition of 10‐[2′, 5′‐bis(9‐oxiranyl‐nonayloxy)phenyl]‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and by crosslinking with a phosphorus‐containing curing agent, bis(m‐aminophenyl)methylphosphine oxide. The thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured with differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, and the limiting oxygen index. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6717–6727, 2006     

Effect of the substituted benzene group on thermal and mechanical properties of epoxy resins initiated by cationic latent catalysts

Epoxy resins (DGEBA) were cured by cationic latent thermal catalysts, that is, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH) to investigate the effect of substituted benzene group on cure kinetics and mechanical properties of epoxy system. Differential scanning calorimetry (DSC) was undertaken for activation energy of the system. It was also characterized in terms of flexural, fracture toughness, and Izod impact strengths for the mechanical tests. As a result, the cure reaction of both epoxy systems resulted in an autocatalytic kinetic mechanism accelerated by hydroxyl groups. Also, the conversion and cure activation energy of the DGEBA/BQH system were higher than those of DGEBA/BPH system. The mechanical properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system, as well as the morphology. This was probably due to the consequence of the effect of the substituted benzene group of the BQH catalyst, resulting in increasing the crosslinking density and structural stability in the epoxy system studied. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2419–2429, 2004     

Synthesis and characterization of poly(epoxy‐imide) crosslinked networks

Poly(epoxy imide)s were prepared by a reaction between a hydroxyl‐group‐containing soluble copolyimide and commercial epoxy resins at 220 °C for 2 h. Poly(epoxy imide) thin films exhibited higher thermal stability and lower dielectric constants than a commercial flip‐chip package material (U300). The thermal stabilities of the poly(epoxy imide)s were 1.4–2.0 times higher than that of U300. The thermal stability increased with increasing crosslink density and with decreasing bulky CF₃ groups (which were easily decomposable). The dielectric constants of the poly(epoxy imide)s were 1.1–1.3 times lower than that of U300, and this is highly desirable for the microelectronic packaging industry. The dielectric constant dramatically decreased when bulky CF₃ groups were added and when the functionalities of epoxy resins decreased. The residual stresses, slopes in the cooling curves, and glass‐transition temperatures of the poly(epoxy imide)s were measured with a thin‐film stress analyzer. Low residual stresses and slopes in the cooling curves were achieved with a higher crosslink density. However, in the presence of bulky CF₃ groups, the copolyimide backbone structure did not affect the residual stress values. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4293–4302, 2004     

Nanostructured hybrid polymer networks from in situ self‐assembly of RAFT‐synthesized POSS‐based block copolymers

A series of well‐defined hybrid block copolymers PMACyPOSS‐b‐PMMA and PMAiBuPOSS‐b‐PMMA exhibiting high POSS weight contents have been synthesized by RAFT polymerization and further studied as modifiers for epoxy thermosets based on diglycidyl ether of bisphenol A. The hybrid block copolymers self‐assembled within the epoxy precursors into micelles possessing an inorganic core and a PMMA corona. Thanks to the presence of the PMMA blocks that remain miscible until the end of the reaction, curing of the resulting blends afforded nanostructured hybrid organic/inorganic networks with well‐dispersed inorganic‐rich nanodomains with diameters on the order of 20 nm. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Preparation and characterization of multifunctional maleimide macromonomers and their cured resins

Multifunctional compounds with pendent and terminal maleimide groups were prepared through the reaction of 4‐maleimidobenzoic acid and 5‐maleimidoisophthalic acid with diglycidyl ether of bisphenol A. The ratios of the pendent maleimide groups to the terminal maleimide groups in the obtained compounds were varied to tailor the chain length and properties of the maleimide compounds. The maleimide group ratios, determined from differential scanning calorimetry, showed good coincidence with the values calculated from the charged monomer amounts. The good solubility and low softening points of the maleimide compounds indicated their good processability. High glass‐transition temperatures (220 °C) were observed for the cured resins because of the relatively high crosslinking density. The curing reaction, thermal stability, and degradation behavior of the resins were also studied with differential scanning calorimetry and thermogravimetric analysis. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3178–3188, 2004     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

Structure and property relationships in model diglycidyl ether of bisphenol‐a and diglycidyl ether of tetramethyl bisphenol‐a epoxy systems. I. Mechanical property characterizations

Model epoxy networks, with variations in crosslink density and in epoxy monomer rigidity, were prepared to study how the network structure affects modulus, T_g, and toughness/toughenability of epoxy resins. Diglycidyl ether of bisphenol‐A and diglycidyl ether of tetramethyl‐bisphenol‐A, along with the corresponding chain extenders, were chosen to study how monomer backbone rigidity and crosslink density affect physical and mechanical properties of epoxies. The present study indicates that, as expected, the backbone rigidity of the epoxy network, not the crosslink density alone, will strongly influence modulus and T_g of epoxy resins. Upon rubber toughening, it is found that the rigidity of the epoxy backbone and/or the nature of the crosslinking agent utilized are most critical to the toughenability of the epoxy. That is, the well‐known correlation between toughenability and the average molecular weight between crosslinks (M_c) does not necessarily hold true when the nature of epoxy backbone molecular mobility is altered. The potential significance of the present findings for a better design of toughened thermosets for structural applications is discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2137–2149, 1999     

Radical induced cationic frontal polymerization as a versatile tool for epoxy curing and composite production

Radical induced cationic frontal polymerization (RICFP) is an extremely powerful and elegant alternative curing technique that allows cationic bulk curing of epoxy resins with very little energy consumption, as well as curing in compartments that are not readily accessible. We recently introduced a bisphenol‐A diglycidylether (BADGE) based system that allows the bubble‐free photocuring of this widely used epoxy resin. In this article, we describe the high storage stability and possibilities to influence the curing speed via the initiator concentrations of different formulations. These properties allow the adjustment of the frontal polymerization to ones need. We also show that the (thermo)mechanical and electrical properties of frontal cured epoxy polymers compares favorably with those of state of the art material. Finally, different strategies to overcome the challenges on producing epoxy resin based mica composites via RICFP are presented. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3751–3759     

Novel approach to preparing epoxy/polyhedral oligometric silsesquioxane hybrid materials possessing high mass fractions of polyhedral oligometric silsesquioxane and good homogeneity

Epoxy/polyhedral oligometric silsesquioxane (POSS) hybrid materials, containing 50 wt % POSS and exhibiting good homogeneity, were obtained in a two‐step preparation. Monoamine‐functionalized POSS was first reacted with diglycidyl ether of bisphenol A to form an epoxy POSS precursor, which was then cured. Curing agents such as 4,4′‐diaminodiphenylmethane, dicyandiamide (DICY), and diethylphosphite (DEP) were used for the synthesis of the epoxy–POSS hybrid materials. The use of small‐molecule curing agents, such as DICY and DEP, efficiently avoided macrophase separations and enhanced the thermal properties of the hybrid materials. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1869–1876, 2006