Thermomechanical behaviors and dielectric properties of polyaniline‐doped para‐toluene sulfonic acid/epoxy resin composites

Composites based on conductive organic/inorganic fillers dispersed in insulating matrix have been widely investigated because of their widespread applications such as electromagnetic shielding, electrostatic discharge, and sensors. In this context, novel composite materials based on epoxy resin matrix charged with polyaniline (PANI)‐doped para‐toluene sulfonic acid were elaborated. Fourier transform infrared spectroscopy, X‐ray diffraction and scanning electron microscopy were used to check the structure and the morphology of the samples. Viscoelastic behavior and thermal stability of the composites were explored by dynamic mechanical thermal analysis and thermogravimetric analysis. It was shown that the PANI particles exhibited a partial crystalline structure and were homogeneously dispersed in epoxy matrix. Consequently, this structure affected the thermal stability and viscoelastic properties of the composites. Furthermore, the dielectric and electrical properties were investigated up to 1 MHz. Measurements of dielectric properties revealed that with loading fillers in matrix, the dielectric parameters increased to high values at low frequency then decreased at values around 40 and 32 of real and imaginary parts, respectively, at 1 MHz with 15% of PANI content. Copyright © 2011 John Wiley & Sons, Ltd.     

Reinforcing epoxy resin through covalent integration of functionalized graphene nanosheets

A chemically converted graphene/epoxy (EP) resin nanocomposite has been developed through the use of the functionalized graphene nanosheets (FGNs). The FGNs were prepared via the reaction of amines with alkylcarboxyl groups attached to the graphite oxides in the course of a dicarboxylic acid acyl peroxide treatment. FGNs/EP composites were prepared by dissolving the FGNs in organic solvent followed by mixing with EP and curing agent. In this composite, the FGNs were able to create molecular entanglement with EP matrix by taking advantage of the reactions between amine groups of FGNs and EP groups of EP, thus the FGNs could be covalently integrated into the EP matrix and became part of the cross‐linked network structure rather than just a separated component. Great enhancement in the mechanical properties of the epoxy composite, such as the ultimate tensile strength and toughness, had been achieved with small loading (0.1 wt%) of FGNs by 17.0% and 262.2%, respectively. However, the FGNs reinforced EP composites showed a slight decrease in glass transition temperature (Tg). Copyright © 2014 John Wiley & Sons, Ltd.     

Properties of methyltetrahydrophthalic anhydride‐cured epoxy resin modified with MITU

Methylimidazole‐terminated chain‐extended urea (MITU) containing polypropylene oxide spacer was synthesized and employed to modify epoxies composed of a diglycidyl ether of bisphenol‐A (E‐51) and methyltetrahydrophthalic anhydride (MTHPA). The curing behavior, viscoelastic property, impact response, and fracture surface morphology of the curing systems were systematically investigated. Differential scanning calorimeter (DSC) analysis reveals that the curing reactivity of the epoxy system is greatly enhanced with the addition of MITU. From the dynamic mechanical analysis, besides the low‐temperature β relaxation, shoulder at higher temperature side appears for the MITU‐modified systems. Meanwhile, the addition of MITU leads to the increase of loss factor (tan δ) over the temperature range of 0–75°C. Impact tests show that the modifier can be effective in toughening the epoxy resin at relatively low loading, and the scanning electron microscope (SEM) images of the fracture surface for the modified systems display signs of ductility. Copyright © 2008 John Wiley & Sons, Ltd.     

Rheological and mechanical properties of epoxy/polyurethane blends initiated by N‐benzylpyrazinium hexafluoroantimonate salt

In this work the cure behavior and rheological and mechanical interfacial properties of the diglycidylether of bisphenol A (DGEBA)/polyurethane (PU) blend system, initiated by 1 wt % N‐benzylpyrazinium hexafluoroantimonate as a latent thermal catalyst, were investigated. To characterize the mechanical interfacial properties of the system, the critical stress intensity factor (K_IC) was calculated with a single‐edge‐notched beam (SEN) beam fracture toughness test. And an impact test was performed at room and cryogenic temperatures to determine the performance of PU at room and low‐temperatures, respectively. As a result, the E_c of the blend system was increased with increasing PU content, showing a maximum value at 30 wt % PU, which was in good agreement with the mechanical properties of the blend system. Consequently, these results could be explained by the improvement that occurred in intermolecular hydrogen bonding between the hydroxyl group in EP and the isocyanate group in PU, resulting in increased compatibility of the components within the interpenetrating polymer networks. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3841–3848, 2004     

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Bisphenol‐A‐based difunctional epoxy resin was modified with poly(ether ether ketone) with pendent tert‐butyl groups (PEEKT). PEEKT was synthesized by the nucleophilic substitution reaction of 4,4′‐difluoro benzophenone with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone. Blends with various amounts of PEEKT were prepared by melt‐mixing. All the blends were homogeneous in the uncured state. The glass transition temperature of the binary epoxy/PEEKT blends was predicted using several equations. Reaction‐induced phase separation was found to occur upon curing with a diamine 4,4′‐diaminodiphenyl sulfone. The phase morphology of the blends was studied using scanning electron microscopy. From the micrographs, it was found that PEEKT‐rich phase was dispersed in a continuous epoxy matrix. The domain size increased with the amount of PEEKT in the blends. The increase in domain size was due to the coalescence of the domains after phase separation. Dynamic mechanical analysis of the blends gave two peaks corresponding to epoxy‐rich phase and thermoplastic‐rich phase. The tensile strength and modulus of the blends remained close to that of the unmodified resin, while the flexural properties decreased with the addition of PEEKT to epoxy resin. The fracture toughness of the epoxy resin increased with the addition of PEEKT. Investigation of the fracture surfaces revealed evidences for local plastic deformation of the matrix, crack pinning, crack path deflection, and ductile tearing of PEEKT‐rich phase. Thermogravimetric analysis revealed that the initial decomposition temperature of the blends were close to that of the unmodified resin. Finally, the properties of the blends were compared with other modified PEEK/epoxy blends. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2481–2496, 2007     

The nearly constant loss,Johari‐Goldstein β‐relaxation,and α‐relaxation of 1,4‐polybutadiene

From high‐resolution dielectric spectroscopy measurements on 1,4‐polybutadiene (1,4‐PB), we show that in addition to the structural α‐relaxation and higher frequency secondary relaxations in the spectra, a nearly constant loss (NCL) is observed at shorter times/lower temperatures. The properties of this NCL are compared to those of another chemically similar polymer, 1,4‐polyisoprene. The secondary relaxations in 1,4‐PB include the well‐known Johari‐Goldstein (JG) β‐relaxation and two other higher‐frequency peaks. One of these, referred to as the γ‐relaxation, falls between the JG‐relaxation and the NCL. Seen previously by others, this γ‐relaxation in 1,4‐PB is not the JG‐process and bears no relation to the glass transition. At very low temperatures (<15 K), we confirm the existence of a very fast secondary relaxation, having a weak dielectric strength and an almost temperature‐invariant relaxation time. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 342–348, 2007     

Enhancement of mechanical properties of natural rubber with maleic anhydride grafted liquid polybutadiene functionalized graphene oxide

An effective procedure has been developed to synthesize the functionalized graphene oxide grafted by maleic anhydride grafted liquid polybutadiene(MLPB-GO). Fourier transform spectroscopy and X-ray photoelectron spectroscopy indicate the successful functionalization of GO. The NR/MLPB-GO composites were then prepared by the co-coagulation process. The results show that the mechanical properties of NR/MLPB-GO composites are obviously superior to those of NR/GO composites and neat NR. Compared with neat NR, the tensile strength, modulus at 300% strain and tear strength of NR composite containing 2.12 phr MLPB-GO are significantly increased by 40.5%, 109.1% and 85.0%, respectively. Dynamic mechanical analysis results show that 84% increase in storage modulus and 2.9 K enhancement in the glass transition temperature of the composite have been achieved with the incorporation of 2.12 phr MLPB-GO into NR. The good dispersion of GO and the strong interface interaction in the composites are responsible for the unprecedented reinforcing efficiency of MLPB-GO towards NR.     

The mechanical properties and tribological behavior of epoxy resin composites modified by different shape nanofillers

Mechanical properties and tribological behavior of epoxy resin (EP) and EP nanocomposites containing different shape nanofillers, such as spherical silica (SiO₂), layered organo‐modified montmorillonite (oMMT) and oMMT‐SiO₂ composites, were investigated. The SiO₂‐oMMT composites were prepared by in situ deposition method and coupling agent modification, and transmission electron microscopy (TEM) analysis shows that spherical SiO₂ is self‐assembled on the surface of oMMT, which forms a novel layered‐spherical nanostructure. The mechanical properties test results show that oMMT obviously improves the strength of EP and SiO₂ enhances its toughness, but oMMT‐SiO₂ exhibits a synergistic effect on toughening and reinforcing EP simultaneously. A pin‐on‐disc rig was used to test friction and wear loss of pure EP and EP nanocomposites. The tribological test results prove that these nanofillers with different shapes play different roles for improving the wear resistance of EP nanocomposites. Morphologies of the worn surfaces were studied further by scanning electron microscopy (SEM) observations, and it was clarified that the EP and EP nanocomposites undergo similar wear mechanisms. Copyright © 2006 John Wiley & Sons, Ltd.     

Core–shell functionalized MWCNT/poly(m‐aminophenol) nanocomposite with large dielectric permittivity and low dielectric loss

Core–shell carboxyl‐functionalized multiwall carbon nanotube (c‐MWCNT)/poly(m‐aminophenol) (PmAP) nanocomposite were prepared through in‐situ polymerization of m‐aminophenol (m‐AP) in the presence of MWCNTs, and explicated as a dielectric material for electronic applications. The formation of thin PmAP layer on individual c‐MWCNT with excellent molecular level interactions at interfaces was confirmed by morphological and spectroscopic analyses. Here we conducted a comparative study of the dielectric performances of PmAP based nanocomposite films with pristine MWCNTs and c‐MWCNTs as fillers. Compared to PmAP/MWCNT nanocomposites, the PmAP/c‐MWCNT nanocomposites exhibited higher dielectric permittivity and lower dielectric loss. The well dispersed c‐MWCNTs in PmAP/c‐MWCNT nanocomposite produce huge interfacial area together with numerous active polarized centers (crystallographic defects), which in turn intensified the Maxwell‐Wagner‐Sillars (MWS) effect based on excellent molecular level interactions and thus, produce large dielectric permittivity (8810 at 1 kHz). The percolation threshold of PmAP/c‐MWCNT nanocomposites is found lower than that of the PmAP/MWCNT nanocomposites, which could be attributed to homogeneous distribution of c‐MWCNTs and strong c‐MWCNT//PmAP interfacial interactions in the nanocomposites. Copyright © 2016 John Wiley & Sons, Ltd.     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Curing kinetics,thermal, mechanical,and dielectric properties based on o‐cresol formaldehyde epoxy resin with polyhedral oligomeric (N‐aminoethyl‐γ‐amino propyl)silsesquioxane

The curing reaction and kinetics of o‐cresol formaldehyde epoxy resin (o‐CFER) with polyhedral oligomeric silsesquioxane of N‐aminoethyl‐γ‐amino propyl group (AEAP‐POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o‐CFER/AEAP‐POSS nanocomposites were investigated with thermogravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the ?esták‐Berggren (S‐B) autocatalytic model. The glass transition temperature (T_g) increases with the increase in AEAP‐POSS content, and reaches the maximum, 107°C, when the molar ratio (N_s) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP‐POSS exhibited a higher thermostability. The AEAP‐POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84 MPa and 143.25 kJ m^?2, respectively, when N_s is 0.5. The dielectric constant (ε), dielectric loss factor (tan δ), volume resistivity (ρ_v), and surface resistivity (ρ_s) are 4.98, 3.11 × 10^?4, 3.17 × 10¹² Ω cm³, and 1.41 × 10¹² Ω cm², respectively, similarly at N_s 0.5. Copyright © 2009 John Wiley & Sons, Ltd.     

Synthesis and degradation of end‐group‐functionalized polylactide

Three kinds of OH‐terminated polylactides were synthesized by the ring‐opening polymerization of lactide, with an alcohol such as dodecanol, glycerol, or pentaerythritol, in the presence of stannous octoate. Moreover, Cl‐, NH₂‐, and COOH‐terminated polylactides were synthesized from OH‐terminated polylactides. The end groups of the polylactides were identified by ¹H NMR and ¹³C NMR. According to thermal analysis, the cold crystallization temperatures of Cl‐, NH₂‐, and COOH‐terminated polylactides were higher than those of OH‐terminated polylactides. The thermal stability of OH‐terminated polylactides was poor, whereas NH₂‐ and Cl‐terminated polylactides were more resistant to thermal degradation. In a hydrolysis degradation test, the mass and molecular weight loss of COOH‐terminated polylactides were high, whereas those of Cl‐ and NH₂‐terminated polylactides were much lower. These end‐group effects were increased with an increasing number of chain arms. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 973–985, 2001     

Fluorinated hydroxytelechelic polybutadiene as additive in cationic photopolymerization of an epoxy resin

Fluorinated hydroxytelechelic polybutadiene (PBF), which is synthesized from the radical addition of a fluorinated mercaptan onto a hydroxytelechelic polybutadiene was used as an efficient surface and mechanical modifier in original formulations to enable the UV cationic polymerization of a telechelic diepoxy cycloaliphatic oligomer, leading to crosslinked polymers. Various amounts of PBF were used (ranging between 0 and 15 wt %). The kinetics of photocrosslinking revealed that the diepoxyde conversion reached 70% only in the absence of PBF, whereas it was about 90% in the presence of 10 wt % of PBF. When the PBF content increased, the dynamic mechanical measurements showed that: (i) the glass transition temperature values decreased and (ii) the resilience increased. The hydrophobicity of these polymers was investigated from the water contact angle (WCA) values showing a surface modification of the epoxy‐based system. Indeed, great modifications were noted on the extreme surface (i.e., air side) of the polymers (with WCA values as high as 120°) in contrast to those observed on the substrate side. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 2835–2842, 2009     

Preparation and cryogenic mechanical properties of epoxy resins modified by poly(ethersulfone)

A thermoplastic, poly(ethersulfone) (PES) was used to modify a bisphenol‐F based epoxy resin cured with an aromatic diamine. The initial mixtures before curing, prepared by melt mixing, were homogeneous. Scanning electron microscopy (SEM) micrographs of solvent‐etched fracture surfaces of the cured blends indicated that phase separation occurred after curing. The cryogenic mechanical behaviors of the epoxy resins were studied in terms of tensile properties and Charpy impact strength at cryogenic temperature (77 K) and compared to their corresponding behaviors at room temperature (RT). The addition of PES generally improved the tensile strength, elongation at break, and impact strength at both RT and 77 K except the RT tensile strength at 25 phr PES content. It was interesting to observe that and the maximum values of the tensile strength, elongation at break, and impact strength occurred at 20 phr PES content where a co‐continuous phase formed. Young's modulus decreased slightly with the increase of the PES content. Moreover, the tensile strength and Young's modulus at 77 K were higher than those at RT at the same composition, whereas the elongation at break and impact strength showed the opposite results. Finally, the differential scanning calorimetry analysis showed that the glass transition temperature (T_g) was enhanced by the addition of PES. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 612–624, 2008     

Novel epoxy nanocomposite of low Dk introduced fluorine‐containing POSS structure

A nanoporous additives, polyhedral oilgomeric silisesquioxane containing eight functional hexafluorine groups, octakis(dimethylsiloxyhexafluoropropyl ether)silsesquioxane (OF) has been synthesized and blended with the UV‐cured epoxy resin. The OF containing (10%) epoxy has significantly lower dielectric constant (2.65) than the plain epoxy (3.71). The incorporation of fluorine containing additives is well‐known to reduce dielectric constant due to lower its polarizability. In addition, the presence of the bulky POSS structure is able to create additional free space or pores and further reduces the dielectric constant of the epoxy matrix. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 502–510, 2007     

Curing characteristics of carboxyl functionalized glucose resin and epoxy resin

The curing characteristics of carboxylic functionalized glucose resin (glucose maleic acid ester vinyl resin: GMAEV) and epoxy resin have been studied using DSC and FTIR methods. Exothermic reactions attributed to esterification and etherification reactions of the hydroxyl and carboxyl functionalities of GMAEV with the epoxy groups were identified. Exothermic reactions showed very different patterns according to the degree of carboxyl group substituent of GMAEV. The results showed that esterification reaction occurs in the early stage of cure and then etherification followed after completion of the esterification. A cured matrix containing epoxy resin and 50 wt.% of GMAEV was prepared and characterized. The cured matrix showed thermal stability up to 300 °C. The average glass transition temperature and storage modulus of the matrix were as high as 95 °C and 2700 MPa, respectively. The cured matrix of epoxy resin and GMAEV with higher degree of carboxyl group was found to have a lower density due to the formation of bulky groups in the crosslinks.     

Novel bio‐based IPNs obtained by simultaneous thermal polymerization of flexible methacrylate network based on a vegetable oil and a rigid epoxy

A series of novel vegetable oil‐based interpenetrating polymer networks (IPNs) have been successfully prepared: on one hand, methacrylated camelina oil (MCO) and a polyethyleneglycol dimethacrylate (PEG, MW 750 g/mol) and on the other hand, diglycidylether of bisphenol A (DER), in various blend ratios (75/25, 50/50, and 25/75 wt). Hence the appealing innovative direction of the current work was to build oil‐based poly(methacrylate) network using PEG macromonomer which is able to modulate adequately the crosslinking degree of the oil‐based network. These innovative combinations of cross‐linkable resins in terms of flexible methacrylate network based on camelina oil (CO) and PEG and a rigid epoxy (DER) were simultaneously polymerized using two independent non‐interfering curing reactions: free‐radical process for MCO and anionic polymerization of epoxy resin in the presence of a tertiary amine. The effect of the IPNs composition compositional characteristics on the reactivity of methacrylate or epoxy groups was studied using differential scanning calorimetry. The influence of the MCO‐PEG bio‐based polymer on the system properties was evaluated after curing by dynamic mechanical and thermogravimetric analyses. In addition mechanical and morphological studies were also carried out. The results suggested that blending of MCO and DER gave synergistic effects on the overall properties of the developed oil‐based IPNs and a dependence on the methacrylate/epoxy ratio was clearly noticed. Copyright © 2014 John Wiley & Sons, Ltd.     

Improved mechanical properties of epoxy composites reinforced with surface‐treated UHMWPE fibers

The surface treatment of ultra‐high molecular weight polyethylene fiber using potassium permanganate and the mechanical properties of its epoxy composites were studied. After treatment, many changes were happened in the fiber surface: more O‐containing groups (―OH, ―C═O, and ―C―O groups), drastically decreased contact angles with water and ethylene glycol, slightly increased melting point and crystallinity, and formed cracks. Different contents (0.1–0.5 wt%) ultra‐high molecular weight polyethylene fibers/epoxy composites were prepared. The results indicated that the surface treatment decreased the tensile strength of epoxy composites, but increased the bending strength. When the fiber content was 0.3 wt%, the above properties reached the maximum. At the same fiber content, the interlaminar shear strength of the composites was increased by 26.6% up to the as‐received fiber composites. Dynamic mechanical analysis of the composites suggested the storage modulus and tanδ were decreased due to the surface treatment. Fractured surface analysis confirmed that the potassium permanganate treatment was effective in improving the interface interaction.     

Morphology,electro-optical and dielectric properties of polymer network liquid crystals in visible wavelengths

The correlations among electrical, optical properties and polymer morphologies of polymer network liquid crystals (PNLCs) constructed with various curing parameters are investigated. The experimental results indicate that high UV curing intensity, low curing temperature and high monomer-dopant concentration reduce the sizes of liquid crystal (LC) domains, thereby decreasing field-off response time and light scattering and increasing phase retardation of the PNLC cells. Photoinitiator concentration affects the LC domain size as well. For instance, increase in photoinitiator concentration results in the acceleration of polymerisation and thus decreases LC domain size. This effect increases driving voltages of the PNLC cells. Notably, excessive amounts of photoinitiator increases the LC domain size of the PNLC cell. Furthermore, dielectric measurement reveals that decrease in the LC domain size generally increases the dielectric relaxation frequency of the PNLC cells. When the LC domain size is small enough, the dielectric relaxation frequency of the PNLC cell is further dominated by the monomer concentration owing to the increased densities of polymer networks that facilitate the alignment of LC molecules.     

Morphology,toughness mechanism,and thermal properties of hyperbranched epoxy modified diglycidyl ether of bisphenol A (DGEBA) interpenetrating polymer networks

New hyperbranched poly(trimellitic anhydride‐triethylene glycol) ester epoxy (HTTE) is synthesized and used to toughen diglycidyl ether of bisphenol A (DGEBA) 4,4′‐diaminodiphenylmethane (DDM) resin system. The effects of content and generation number of HTTE on the performance of the cured systems are studied in detail. The impact strength is improved 2–7 times for HTTE/DGEBA blends compared with that of the unmodified system. Scanning electron microscopy (SEM) of fracture surface shows cavitations at center and fibrous yielding phenomenon at edge which indicated that the particle cavitations, shear yield deformation, and in situ toughness mechanism are the main toughening mechanisms. The dynamic mechanical thermal analyzer (DMA) analyses suggest that phase separation occurred as interpenetrating polymer networks (IPNs) for the HTTE/DGEBA amine systems. The IPN maintains transparency and shows higher modulus than the neat epoxy. The glass transition temperature (T_g) decreases to some extent compared with the neat epoxy. The T_g increases with increase in the generation number from first to third of HTTE and the concentrations of hard segment. The HTTE leads to a small decrease in thermal stability with the increasing content from TGA analysis. The thermal stability increases with increase in the generation number from first to third. Moreover, HTTE promotes char formation in the HTTE/DGEBA blends. The increase in thermal properties from first to third generation number is attributed to the increase in the molar mass and intramolecular hydrogen bridges, the increasing interaction of the HTTE/DGEBA IPNs, and the increasing crosslinking density due to the availability of a greater number of end hydroxyl and end epoxide functions. Copyright © 2008 John Wiley & Sons, Ltd.