Synthesis and properties of a cyanate ester containing dicyclopentadiene(II)

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac (DCPDNO) was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant DCPDNO was reacted with cyanogen bromide into 2,6‐dimethyl phenol‐dicyclopentadiene cyanate ester (DCPDCY). The structures of the novolac and cyanate ester were confirmed with Fourier transform infrared spectroscopy, elemental analysis, mass spectrometry (MS), and nuclear magnetic resonance. For the purpose of increasing the mobility of residual DCPDCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butylphenol cyanate ester (4TPCY), was added to DCPDCY to form the cyanate ester copolymer. The synthesized DCPDCY was then cured with 4TPCY at various molar ratios. The thermal properties of the cured cyanate ester resins were studied with dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. Compared with the bisphenol A cyanate ester system, the cured DCPDCY resins exhibited lower dielectric constants (2.52–2.67 at 1 GHz), dissipation factors (0.0054–0.0087 at 1 GHz), glass‐transition temperatures (261–273 °C), thermal stability (5% degradation temperature at 406–450 °C), thermal expansion coefficients (4.8–5.78 × 10^?5/°C before the glass‐transition temperature), and moisture absorption (0.8–1.1%). © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 671–681, 2005     

Low dielectric thermoset. IV. Synthesis and properties of a dipentene‐containing cyanate ester and its copolymerization with bisphenol A dicyanate ester

A 2,6‐dimethylphenol‐dipentene dicyanate ester ( DPCY ) was synthesized from the reaction of 2,6‐dimethylphenol‐dipentene adduct and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared (FTIR), elemental analysis, mass, and nuclear magnetic resonance (NMR) spectra. DPCY was then cured by itself or cured with bisphenol A dicyanate ester ( BADCY ). Thermal properties of cured epoxy resins were studied using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermogravimetric analysis (TGA). These data are compared with those of BADCY . The cured DPCY exhibits a lower dielectric constant (2.61 at 1 MHz), dissipation factor (29.3 mU at 1 MHz), thermal stability (5% degradation temperature and char yield are 429 °C and 17.64%, respectively), glass transition temperature (246 °C by TMA and 258 °C by DMA), coefficient of thermal expansion (33.6 ppm before Tg and 134.1 ppm after Tg), and moisture absorption (0.95% at 48 h) than those of BADCY , but higher moduli (5.12 GPa at 150 °C and 4.60 GPa at 150 °C) than those of the bisphenol A system. The properties of cured cocyanate esters lie between cured BADCY and DPCY , except for moduli. Moduli of some cocyanate esters are even higher than those of cured BADCY and DPCY . A positive deviation from the Fox equation was observed for cocyanate esters. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3986–3995, 2004     

Synthesis,characterization, and properties of novel epoxy resins and cyanate esters

We synthesized a novel epoxy (dopotep) and cyanate ester (dopotcy) based on a phosphorus‐containing triphenol (dopotriol). The proposed structures were confirmed by IR, mass spectra, NMR spectra, and epoxy‐equivalent‐weight titration. The synthesized dopotep or dopotcy was copolymerized with diglycidyl ether of bisphenol A (DGEBA), 6′,6‐bis(3‐phenyl‐3,4‐dihydro‐2H‐1,3‐benzoxazineyl)methane (F‐a), or dicyanate ester of bisphenol A (BADCY). Thus, copolymers based on DGEBA/dopotep/diphenylmethane (ddm), F‐a/dopotep, BADCY/dopotcy, and DGEBA/dopotcy were developed. The thermal properties, dielectric properties, and flame retardancy of these copolymers were investigated. The curing kinetics of dopotep/ddm and dopotep/diamino diphenylsulfone were studied with differential scanning calorimetry. The microstructure of DGEBA/dopotcy was studied with IR. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3487–3502, 2006     

Effect of ortho‐methylation on a bis(4‐cyanatocumyl)benezene low‐dielectric resin

A synthesis procedure for and characterization of a tetra‐ortho‐methyl substituted three‐ringed cyanate ester monomer, 4,4′‐[1,3‐phenylenebis(1‐methylethylidene)]bis[2,6‐dimethyl]phenylcyanato, and the corresponding cured resin are described with comparative characterization of the resin analogue without the ortho‐methyl substitutents. The othro‐methylation lowered the dielectric from 2.64 to 2.59 at 1 GHz and from 2.64 to 2.48 GHz at 15 GHz, whereas the tan δ was not significantly affected. Other physical properties also affected included a 40 °C decrease in the glass‐transition temperature, an increase in the thermal‐expansion coefficients, and a reduction in thermogravimetric stability. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 60–67, 2003     

Dielectric properties of self‐catalytic interpenetrating polymer network based on modified bismaleimide and cyanate ester resins

Bismaleimide (BMI) resins with good thermal stability, fire resistance, low water absorption, and good retention of mechanical properties at elevated temperatures, especially in hot/wet environments, have attracted more attention in the electronic and aerospace industries. However, their relatively high dielectric constant limits their application in the aforementioned fields. In this work, a new promising approach is presented that consists of the formation of a self‐catalytic thermoset/thermoset interpenetrating polymer network. Interpenetrating polymer networks (IPNs) based on modified BMI resin (BMI/DBA) and cyanate ester (b10) were synthesized via prepolymerization followed by thermal curing. The self‐catalytic curing mechanism of BMI/DBA‐CE IPN resin systems was examined by differential scanning calorimetry. The dielectric properties of the cured BMI/DBA‐CE IPN resin systems were evaluated by a dielectric analyzer and shown in dielectric properties‐temperature‐log frequency three‐dimensional plots. The effect of temperature and frequency on the dielectric constant of the cured BMI/DBA‐CE IPN resin systems is discussed. The composition effect on the dielectric constant of the cured IPN resin systems was analyzed on the basis of Maxwell's equation and rule of mixture. The obtained BMI/DBA‐CE IPN resin systems have the combined advantages of low dielectric constant and loss, high‐temperature resistance, and good processability, which have many applications in the microelectronic and aerospace industries. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1123–1134, 2003     

The thermal and dielectric properties of high performance cyanate ester resins/microcapsules composites

Novel high performance bisphenol A dicyanate ester (BADCy) resins/poly(urea-formaldehyde) microcapsules filled with epoxy resins (MCEs) composites have been prepared. The effects of different contents of MCEs on the thermal and dielectric properties of cured BADCy were investigated using dynamic mechanical analyzer (DMA), thermalgravimetric analyzer (TGA) and broadband dielectric analyzer. The dielectric properties of BADCy/MCEs treated in hot water and hot air were also discussed. The morphologies of BADCy/MCEs composites were characterized by scanning electron microscopy (SEM). Results indicate that the appropriate content of MCEs can improve or maintain the thermal stability, the low dielectric constant and dielectric loss of cured BADCy mainly owing to higher conversion of cyanate ester (-OCN) groups. After aged in hot water and hot air, respectively, BADCy/MCEs composites with small content of MCEs can retain the low dielectric constant and dielectric loss.     

Synthesis and properties of low‐dielectric‐constant polyimides with introduced reactive fluorine polyhedral oligomeric silsesquioxanes

A high‐performance, low‐dielectric‐constant polyimide (PI) nanocomposite from poly(amic acid) (PAA) cured with a reactive fluorine polyhedral oligomeric silsesquioxane (POSS) isomer was successfully synthesized. The features of this reactive fluorine POSS isomer [octakis(dimethylsiloxyhexafluoropropylglycidyl ether)silsesquioxane (OFG)] provided two important approaches (containing fluorine or being porous in the polymer matrix) of reducing the dielectric constant of PI. This reactive POSS isomer had an average of four epoxy groups and four fluorine groups on the POSS cage, and the epoxy groups could be cured with PAA to form a network framework of a PI/POSS nanocomposite. The PI/OFG nanocomposite had a high crosslinking density, high porosity (24.3%), high hydrophobicity, and low polarizability. These properties enhanced the thermal (glass‐transition temperature ～ 362 °C) and dielectric (dielectric constant ～2.30) properties of PI more than other POSS derivatives introduced into the PI backbone. A large number of small POSS particles (<10 nm) were embedded inside the PI matrix when the OFG content was low, whereas interconnected POSS aggregation domains were observed when the OFG content was high. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5391–5402, 2006     

Investigations on the cure chemistry and polymer properties of benzoxazine-cyanate ester blends

Thermosetting polymer blends composed of bisphenol A based benzoxazine (BA-a) and cyanate ester (BACY) were prepared via co-curing of benzoxazine with cyanate ester. DSC results manifested a multiple curing pattern with associated heat of reaction implying a co-reaction between oxazine moiety and cyanate group. The catalysis during the co-curing of blend was ascribed to the cycloaddition reaction between the two groups followed by the ring-opening of benzoxazine and cyclotrimerisation of cyanate ester. The spectral and analytical data supported the possibilities of further polymerization through the insertion of the phenolic OH of polybenzoxazine to cyanate group to form the intermediate iminocarbonate, which further induce curing of cyanate ester to form polycyanurate. A co-reacted network composed of triazine ring as a part of polybenzoxazine matrix is postulated. The co-reaction temperature diminished with increase in cyanate ester content in the blend. A single T_g was observed in DMTA of the cured matrix that implied a linked homogeneous matrix containing both triazine and polybenzoxazine. This was substantiated by the TGA, DTA and SEM behavior of the cured polymer. The modulus of the cured blend was higher than those of the component resins of the blend. The co-reaction with cyanate ester enhanced the high temperature stability of polybenzoxazine.     

NCOCH2(CF2)6CH2OCN cyanate ester resin. A detailed study

The NCOCH₂(CF₂)₆CH₂OCN fluoromethylene cyanate ester monomer and resin are synthesized and characterized. The monomer is prepared by a large‐scale bench‐top synthesis, characterized by differential scanning calorimetry, infrared, ¹H‐, ¹³C‐, ¹⁵N‐, and ¹⁹F‐NMR spectroscopies and analyzed for catalytically active impurities. Conversion of the monomer to prepolymer and cured resin is characterized by IR and NMR spectroscopies and kinetically analyzed. Resin properties characterization includes thermal, tensile, dynamic mechanical, dielectric, refractive index, thermodielectric and thermogravimetric stabilities, and water absorption. Relevant property comparisons with the commercial AroCy F cyanate ester resin (6F bisphenol A dycyanate) and a Jeffamine‐bisphenol diglycidyl ether epoxy are made. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 135–150, 1999     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Deposition of π-Conjugated Polycyanate Ester Thin Films and Their Dielectric Properties

Two kinds of novel π-conjugated polycyanate esters, namely the plasma-polymerized 4-methoxyphenol cyanate ester (PPMPCE) and the plasma-polymerized 4-phenylphenol cyanate ester (PPPPCE), were successfully prepared by plasma polymerization for the first time. The structure and compositions of both plasma polycyanate esters were investigated by Fourier Transform Infrared (FT-IR), X-ray Photoelectron Spectroscopy (XPS) and UV–Visible Absorption Spectra (UV–Vis). The results show that extensively conjugated C=N double bonds were formed in the plasma-deposited cyanate ester thin films, the plasma polymerization of both monomers proceeded mainly via the opening of π-bonds of the O–C≡N functional groups which are further on being formed into a large π-conjugated system, this unique process is noticeably different from the conventional thermal polymerization reaction of cyanate ester monomers. Further dielectric measurement shows that PPPPCE thin film gives a lower dielectric constant comparing to that of the PPMPCE film, and the dielectric constant of both plasma deposited thin films decreased with an increase in measurement frequency.     

Flame retardant polycyanurate thermosets from the cyanate esters of triphenylphosphine oxide

Three cyanate esters containing phosphorus are synthesized in good overall yields starting from bromoanisoles. Di‐ and tricyanates with meta configuration are most stable while para is less so. The para dicyanate ester isomer is particularly affected by water from the atmosphere. The meta dicyanate ester 2 has good thermal properties with glass transition at 268 °C and char yield of 65% in air at 600 °C. All three phosphorus‐containing cyanate esters are low flammability in an open flame. They make highly combustible cyanate esters resins less flammable simply by blending. Mixing 10 wt% dicyanate ester 2 into bisphenol A or E dicyanate esters makes them rate V‐0. Published 2018.^† J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1100–1110     

Studies on thermal and morphological properties of 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane-epoxy-bismaleimide matrices

A new cyanate ester monomer, 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane has been synthesized and characterized. Epoxy modified with 4, 8 and 12% (by weight) of cyanate ester were made using epoxy resin and 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane and cured by using diaminodiphenylmethane. The cyanate ester modified epoxy matrix systems were further modified with 4, 8 and 12% (by weight) of bismaleimide (N,N′-bismaleimido-4,4′-diphenylmethane). The formation of oxazolidinone and isocyanurate during cure reaction of epoxy and cyanate ester blend was confirmed by IR spectral studies. Bismaleimide-cyanate ester-epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. Thermal studies indicate that the introduction of cyanate ester into epoxy resin improves the thermal degradation studies at the expense of glass transition temperature. Whereas the incorporation of bismaleimide into epoxy resin enhances the thermal properties according to its percentage content. However, the introduction of both cyanate ester and bismaleimide influences the thermal properties according to their percentage content. DSC thermogram of cyanate ester modified epoxy and bismaleimide modified epoxy show unimodel reaction exotherms. The thermal degradation temperature and heat distortion temperature of the cured bismaleimide modified epoxy and cyanate ester-epoxy systems increased with increasing bismaleimide content. The morphology of the bismaleimide modified epoxy and cyanate ester-epoxy systems were also studied by scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

环氧树脂与氰酸酯共固化产物性能的研究

环氧树脂是一类综合性能优良并获广泛应用的热固性树脂基体 .但是通常的环氧树脂基体中含有大量反应生成的羟基等极性基团 ,吸湿率高 ,使其复合材料在湿热环境下力学性能和介电性能显著下降 .应用氰酸酯改性固化的环氧树脂等热固性树脂 ,将赋予以其为基体的复合材料以优异的耐热性能、力学性能和介电性能[1 ,2 ] .这类复合材料的研究开发对特种电子电气绝缘材料和先进复合材料的发展具有重要意义 .作者曾应用ＦＴ ＩＲ、ＤＳＣ等分析技术对氰酸酯与环氧树脂 (氰酸酯在欠量、适量和过量条件下 )的共固化反应机理和固化物结构特征等进行过深入…     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

Study on properties of flame‐retardant cyanate esters modified with DOPO and triazine compounds

Ternary flame‐retardant modified cyanate ester blends (CEPG and CEPA) are formed by combining triazine compounds (TGIC or TAIC) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide with cyanate ester resin. The curing behaviors, thermal and mechanical properties, and the flame‐retardant properties are investigated. The results show that the CEPG and CEPA blends result in lower curing temperatures and glass transition temperatures than those of neat CE. Both of CEPG and CEPA blends significantly improve the flame‐retardant properties of CE resins, and UL‐94V‐0 rate is achieved for CEPG‐1.0 and CEPA‐0.5. The dielectric constant and loss of CEPA blends are lower than those of CEPG blend with the same phosphors content, and both of them are lower than those of neat CE. Therefore, the ternary flame‐retardant modified cyanate ester blends provide 2 ways for composites of producing printed circuit board with high flame‐retardant property and low dielectric constant and loss.     

Thermal and physical properties of flame-retardant epoxy resins containing 2-(6-oxido-6H-dibenz〈c,e〉〈1,2〉oxaphosphorin-6-yl)-1,4-naphthalenediol and cured with dicyanate ester

2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol (DOPONQ) was prepared by the addition reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) with 1,4-naphthoquinone. The phosphorus-containing diol (DOPONQ) was used as a reactive flame retardant by an advancement reaction with the diglycidyl ether of bisphenol-A epoxy (DGEBA) resin at various stoichiometric ratios. DOPONQ-containing advanced epoxy was separately cured with various dicyanate esters to form flame-retardant epoxy/cyanate ester systems. The effect of the phosphorus content and dicyanate ester structure on the curing characteristic, glass transition temperature, dimensional stability, thermal stability, flame retardancy, and dielectric property was studied and compared with that of the control advanced bisphenol-A epoxy system. The DOPONQ-containing epoxy/cyanate ester systems exhibited higher glass transition temperatures as well as better thermal dimensional and thermal degradation stabilities. The flame retardancy of the phosphorus-containing epoxy/dicyanate ester system increased with the phosphorus content, and a UL-94 V-0 rating could be achieved with a phosphorus content as low as 2.1%.     

Glass transition and relaxation behavior of epoxy nanocomposites

With advances in nanoscience and nanotechnology, there is increasing interest in polymer nanocomposites, both in scientific research and for engineering applications. Because of the small size of nanoparticles, the polymer–filler interface property becomes a dominant factor in determining the macroscopic material properties of the nanocomposites. The glass‐transition behaviors of several epoxy nanocomposites have been investigated with modulated differential scanning calorimetry. The effect of the filler size, filler loading, and dispersion conditions of the nanofillers on the glass‐transition temperature (T_g) have been studied. In comparison with their counterparts with micrometer‐sized fillers, the nanocomposites show a T_g depression. For the determination of the reason for the T_g depression, the thermomechanical and dielectric relaxation processes of the silica nanocomposites have been investigated with dynamic mechanical analysis and dielectric analysis. The T_g depression is related to the enhanced polymer dynamics due to the extra free volume at the resin–filler interface. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3849–3858, 2004     

Dielectric study of the phase diagram of the poly(γ‐benzyl‐L‐glutamate)/dimethylformamide system

The phase diagram for solutions of poly(γ‐benzyl‐L ‐glutamate) in dimethylformamide has been investigated over the entire composition and temperature ranges with dielectric spectroscopy. The dielectric response in this system is dominated by ionic mobility, and phase transitions have been detected as changes in the ionic conductivity. The phase boundaries, determined by dielectric spectroscopy, are consistent with earlier published results obtained by a combination of optical microscopy observations and nuclear magnetic resonance and differential scanning calorimetry studies. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3943–3952, 2004     

Novel epoxy nanocomposite of low Dk introduced fluorine‐containing POSS structure

A nanoporous additives, polyhedral oilgomeric silisesquioxane containing eight functional hexafluorine groups, octakis(dimethylsiloxyhexafluoropropyl ether)silsesquioxane (OF) has been synthesized and blended with the UV‐cured epoxy resin. The OF containing (10%) epoxy has significantly lower dielectric constant (2.65) than the plain epoxy (3.71). The incorporation of fluorine containing additives is well‐known to reduce dielectric constant due to lower its polarizability. In addition, the presence of the bulky POSS structure is able to create additional free space or pores and further reduces the dielectric constant of the epoxy matrix. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 502–510, 2007