Soluble and transparent polyimides from unsymmetrical diamine containing two trifluoromethyl groups

A new unsymmetrical diamine monomer containing two trifluoromethyl (CF₃) groups is prepared from 2‐bromo‐5‐nitro‐1,3‐bis(trifluoromethyl)benzene. The monomer is polymerized with typical dianhydrides, in this case PMDA, BPDA, BTDA, ODPA, and 6‐FDA, using a one‐pot synthetic method to obtain corresponding polyimides. All of the prepared polyimides are readily soluble in many organic solvents and can be solution‐cast into transparent, flexible, and tough films. These films have a UV–vis absorption cut‐off wavelength at 340–375 nm and light transparencies of 87–91% at a wavelength of 550 nm. Incorporation of two CF₃ groups unsymmetrically into rigid polyimides improves their solubility and transparencies without decreasing their physical properties. The polymers exhibit high thermal stability with 5% weight loss at temperatures ranging from 534 to 593 °C in nitrogen and from 519 to 568 °C in air, and high glass transition temperatures (T_g) above > 300 °C depending on their molecular structures. They also have a coefficient of thermal expansion (CTE) value of 46–69 ppm/°C. In addition, they show low refractive indices in the range of 1.535–1.602 at a wavelength of 633 nm due to the unsymmetrical incorporation effect of the two CF₃ groups. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013, 51, 4413–4422     

Novel fluorinated polyimides derived from an unsymmetrical diamine containing trifluoromethyl and methyl pendant groups

Novel fluorinated polyimides were prepared from an unsymmetrical diamine, 3‐methyl‐4‐(4‐amino‐2‐trifluoromethylphenoxy)‐4'‐aminobenzophenone ( 3 ), with four aromatic dianhydrides via a one‐step high‐temperature polycondensation procedure. All the obtained polyimides were soluble in some polar solvents such as NMP, DMAc, and DMF. Flexible and tough films were prepared by casting from polymer solution. These polyimide films exhibited high optical transparency, good mechanical and thermal properties. Moreover, they possessed low dielectric constants and low‐moisture absorption. Due to their properties, these fluorinated polyimides could be considered as photoelectric and microelectronic materials. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis and characterization of poly(epoxy‐imide) crosslinked networks

Poly(epoxy imide)s were prepared by a reaction between a hydroxyl‐group‐containing soluble copolyimide and commercial epoxy resins at 220 °C for 2 h. Poly(epoxy imide) thin films exhibited higher thermal stability and lower dielectric constants than a commercial flip‐chip package material (U300). The thermal stabilities of the poly(epoxy imide)s were 1.4–2.0 times higher than that of U300. The thermal stability increased with increasing crosslink density and with decreasing bulky CF₃ groups (which were easily decomposable). The dielectric constants of the poly(epoxy imide)s were 1.1–1.3 times lower than that of U300, and this is highly desirable for the microelectronic packaging industry. The dielectric constant dramatically decreased when bulky CF₃ groups were added and when the functionalities of epoxy resins decreased. The residual stresses, slopes in the cooling curves, and glass‐transition temperatures of the poly(epoxy imide)s were measured with a thin‐film stress analyzer. Low residual stresses and slopes in the cooling curves were achieved with a higher crosslink density. However, in the presence of bulky CF₃ groups, the copolyimide backbone structure did not affect the residual stress values. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4293–4302, 2004     

Synthesis and positive‐imaging photosensitivity of soluble polyimides having pendant carboxyl groups

Polyimides having pendant carboxyl groups were prepared by a direct one‐pot polycondensation of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 3,5‐diaminobenzoic acid (DABz) and bis[4‐(3‐aminophenoxy)phenyl]sulfone (m‐BAPS) in the presence of a γ‐valerolactone/pyridine catalyst system using N‐methyl‐2‐pyrrolidone (NMP)/toluene mixture as a solvent at 180 °C. The obtained polyimides were soluble in dipolar aprotic solvents such as dimethylformamide, dimethyl sulfoxide, and NMP as well as in tetrahydrofuran and aqueous basic solution. The solubility of the polyimides was dependent on the diamine composition. Photosensitve polyimide (PSPI) systems composed of the polyimides and diazonaphthoquinone compound as a photosensitive material gave positive‐tone behavior by UV irradiation, followed by development with aqueous tetramethylammonium hydroxide (TMAH) solution. The scanning electron microscopic photograph of the resulting image showed 10‐μm line/space resolution with about 15 μm of film thickness. The PSPIs baked at 350 °C for a short time had excellent thermal resistance comparable to the original polyimides. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 934–946, 2001     

Synthesis and characterization of new soluble aromatic polyimides from diaminotetraphenylimidazolinone and aromatic tetracarboxylic dianhydrides

A series of new soluble aromatic polyimides with inherent viscosities of 0.65–1.12 dL/g were synthesized from 1,3-bis(4-aminophenyl)-4,5-diphenylimidazolin-2-one and various aromatic tetracarboxylic dianhydrides by the conventional two-step procedure that included ring-opening polyaddition and subsequent thermal cyclodehydration. These polyimides could also be prepared by the one-pot procedure in homogeneous m-cresol solution. Most of the tetraphenyl-pendant polyimides were soluble in organic solvents such as N,N-dimethylacetamide, 1,3-dimethyl-2-imidazolidone, and m-cresol. Some polyimides gave transparent, flexible, and tough films with good tensile properties. The glass transition temperatures and 10% weight loss temperatures under nitrogen of the polyimides were in the range of 287–326 and 520–580°C, respectively. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1767–1772, 1998     

Synthesis and characterization of novel polyimides with bulky pendant groups

New dianhydrides containing t‐butyl and phenyl pendant groups have been synthesized and used as monomers, together with commercial diamines, to prepare novel polyimides. The influence of the chemical structure of the monomers on their reactivity has been studied by quantum semiempirical methods. The polyimides have been characterized by FTIR and by NMR in the case of soluble polymers. The presence of pendant groups and the method used to imidize polyimide precursors greatly affected polymer properties such as solubility, glass transition temperature, thermal stability, and mechanical properties. As a rule, the novel polyimides showed better solubility in organic solvents than the parent polyimides. Glass transition temperatures in the range 250–270°C and decomposition temperatures over 520°C were observed for the set of current polymers. Tensile strengths up to 135 MPa and mechanical moduli up to 3.0 GPa were measured on films of the current polyimides. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 805–814, 1999     

Chain orientation and anisotropies in optical and dielectric properties in thin films of stiff polyimides

Thin films of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the precursor poly(amic acid) on substrates, have been investigated by optical waveguide, ultraviolet-visible (UV-VIS), infrared (IR), and dielectric spectroscopies. The polyimide films exhibit an extraordinarily large anisotropy in the refractive indices with the in-plane index n_∥ = 1.806 and the out-of-plane index n_⊥ = 1.589 at 1064 nm wavelength. No discernible effect of the film thickness on this optical anisotropy is found between films of ca. 2.1 and ca. 7.8 μm thickness. This large birefringence is attributed to the preferential orientation of the biphenyltetracarboximide moieties with their planes parallel to the film surface, coupled with the strong preference of BPDA-PDA chains to align along the film plane. The frequency dispersion of the in-plane refractive index n_∥ is consistent with the results calculated by the Lorentz–Lorenz equation from the UV-visible spectrum exhibiting several absorption bands in the 170–500 nm region. The contribution from the IR absorption in the range 7000–400 cm,^?1 computed by the Spitzer-Kleinmann dispersion relations from the measured spectra, adds ca. 0.046 to the in-plane refractive index n_∥. Tilt-angle–dependent polarized IR results indicate nearly the same increase for the out-of-plane index n_⊥. Application of the Maxwell relation then leads to the out-of-plane dielectric constant ε^⊥ ? 2.7 at 1.2 × 10¹³ Hz, as compared with the measured value of ca. 3.0 at 10⁶ Hz. Assuming this small difference to remain the same for the in-plane dielectric constants ε_∥, we obtain a very large anisotropy in the dielectric properties of these polyimide films with the estimated in-plane dielectric constant ε_∥ ? 3.4 at 1.2 × 10¹³ Hz, and ε_∥ ? 3.7 at 10⁶ Hz. © 1992 John Wiley & Sons, Inc.     

Synthesis and characterization of unsymmetrical benzonitrile‐containing polyimides: Viscosity‐lowering effect and dielectric properties

A new unsymmetrical diamine, 2‐(3‐aminophenoxy)‐6‐(4‐aminophenoxy)benzonitrile (3,4‐APBN), is synthesized via two consecutive S_NAr reactions and the temperature‐dependent reactivity of the fluorides in 2,6‐difluorobenzonitrile, whose first S_NAr reaction occurs at 70 °C and second, at 100 °C, allowing timing control of reaction sequence and circumventing the transetherification side reaction. Thus, a series of polyimides (PIs) is prepared from the polymerization of 3,4‐APBN with five common dianhydrides (6FDA, DSDA, OPDA, BTDA, and PMDA). For comparison, a second series is also prepared from two symmetrical diamines ([2,6‐bis(3‐aminophenoxy)benzonitrile (3,3‐APBN) and 2,6‐bis(4‐aminophenoxy)benzonitrile (4,4‐APBN)] and 6FDA or PMDA. The processability of the poly(amic acids) (PAAs), for the first series is greatly improved since their solution viscosities are much lower than PAAs based on symmetrical diamines. Besides having high glass‐transition temperatures (249–332 °C), and thermal stability [5% weight loss in the range of 505–542 °C (air) and 512–546 °C (nitrogen)], these PIs form tough, transparent and flexible films that have a tensile‐strength range of 82.1–121.3 MPa, elongations‐at‐break of 5.33–9.81%, and tensile moduli of 2.11–2.97 GPa. Their film dielectric constants are 3.08–3.62 at 10 kHz, moderately higher than that (2.92) of analogous PI (CP2) without nitrile groups. Overall, we found that the reduction of structural symmetry in repeat units can improve the polymer processibility as well as increasing their dielectric constants. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4998–5011     

Synthesis and properties of thermoplastic polyimides with ether and ketone moieties

A series of polyimides containing ether and ketone moieties were synthesized from 1,3‐bis(4‐fluorobenzoyl) benzene and several commercially available dianhydrides via a conventional two‐step polymerization. The inherent viscosities of Polyamide acids ranged from 0.46 to 0.73 dL/g. Thermal properties, mechanical properties, and thermalplasticity of the obtained polimide films were investigated by focusing on the chemical structures of their repeat units. These films were amorphous, flexible, and transparent. All films displayed low T_gs (184–225 °C) but also excellent thermal stability, the 5% weight loss temperature was up to 542 °C under nitrogen. The films showed outstanding mechanical properties with the modulus up to 3.0 GPa and the elongation at break in the range of 8–160%. The uniaxial stretching of PI‐a at high temperature was studied owing to its excellent flexibility. The PI‐a had an elongation at break up to 1600% at 245 °C and the uniaxially stretched film exhibited a much higher modulus (3.9 GPa) and strength (240 MPa) than undrawn film. The results indicated that PI‐a can potentially be used to prepare materials such as fiber, ultra‐thin film or ultra‐high modulus film. All the obtained films also demonstrated excellent thermoplasticity (drop of E′ at T_g > 10³) which made the polyimides more suitable for melt processing. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2878–2884, 2010     

Synthesis and characterization of novel polyimides with 1-octadecyl side chains for liquid crystal alignment layers

A series of poly(amic acid)s have been synthesized from cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA), a functional diamine, 1-(3,5-diaminophenyl)-3-(1-octadecyl)-succinicimide and 4,4-diaminodiphenylmethane (DDM) to give liquid crystal alignment layers with high pretilt angle after a rubbing process for vertically aligned liquid crystal display devices. Inherent viscosities of the poly(amic acid)s measured were in the range 0.2–1.56 dl/g, which decreased with an increase of content of 1-(3,5-diaminophenyl)-3-(1-octadecyl)-succinicimide. The cured polyimide films had good transparency, which was above 95% at 400 nm. Surface energies of all the polyimide films prepared from 1-(3,5-diaminophenyl)-3-(1-octadecyl)-succinicimide were below 40.7 dyn/cm before the rubbing process, which resulted in very high pretilt angles above 89°. By a rubbing process, the surface energy of the polyimide prepared from diamine mixture with 10 mol% of 1-(3,5-diaminophenyl)-3-(1-octadecyl)-succinicimide and 90% of DDM increased from 40.7 to 42.7 dyn/cm. Copyright © 2007 John Wiley & Sons, Ltd.     

Novel low-dielectric constant and soluble polyimides from diamines containing fluorene and pyridine unit

Polyimides (PI's) with low-dielectric constant and excellent organic solubility have broad application prospects in the electronic field. Herein, this study designed a series of novel, low dielectric, organic soluble PI films by creatively introducing fluorene and pyridine ring into diamine monomers. Because of the noncoplanar structure of fluorenyl and the polarization of pyridine ring, PI films achieved a low-dielectric constant (2.22–3.09 at 10 MHz) and excellent organic solubility. Even in some organic solvents with low-boiling points, these PI films still exhibited outstanding solubility. In addition, all the films possessed high-tensile strength (≈120 MPa) and excellent optical transparency (>70%, 450 nm). It was worth noting that the glass transition temperature of films was all above 280°C and 5% weight loss temperature (T_5%) was at 486–553°C. In general, the novel high-performance low-dielectric PI films are expected to be used in the field of microelectronics.     

Synthesis and characterization of soluble polyimides functionalized with carbazole moieties

Here, we report the synthesis and characterization of new soluble polyimides that are functionalized using carbazole moieties in their side chain. As a monomer for synthesizing the polyimides, 4″‐carbazole‐9‐yl‐[1,1′;2′,1″] terphenyl‐4‐4′‐diamine and 2‐(3‐carbazol‐9‐yl‐propyl)‐biphenyl‐4,4′‐diamine were synthesized and then characterized using ¹H NMR, ¹³C NMR, FTIR, UV–visible and photoluminescence spectroscopy, differential scanning calorimetry (DSC), and elemental analysis. The polyimides synthesized via chemical imidization processes were characterized with X‐ray photoelectron spectroscopy, gel permeation chromatography, wide angle X‐ray diffraction, thermogravimetric analysis, DSC, tensile strength measurement, and dielectric property measurement. Results showed that the synthesized polyimides were soluble in a variety of organic solvents, optically transparent in a visible range, thermally stable, mechanically strong, and considerably low dielectric. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 8117–8130, 2008     

Synthesis and properties of soluble trifluoromethyl‐substituted polyimides containing laterally attached p‐Terphenyls

A new fluorinated diamine monomer, 2′,5′‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐p‐terphenyl, was synthesized from the chloro‐displacement of 2‐chloro‐5‐nitrobenzotrifluoride with the potassium phenolate of 2,5‐diphenylhydroquinone, followed by hydrazine palladium‐catalyzed reduction. A series of trifluoromethyl‐substituted polyimides containing flexible ether linkages and laterally attached side rods were synthesized from the diamine with various aromatic dianhydrides via a conventional two‐step process. The inherent viscosities of the poly(amic acid) precursors were 0.84–1.26 dL/g. All the polyimides afforded flexible and tough films. The use of 4,4′‐oxydiphthalic anhydride and 2,2′‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride produced essentially colorless polyimide films. Most of the polyimides revealed an excellent solubility in many organic solvents. The glass‐transition temperatures of these polyimides were recorded between 254 and 299 °C by differential scanning calorimetry, and the softening temperatures of the polymer films stayed in the range of 253–300 °C according to thermomechanical analysis. The polyimides did not show significant decomposition before 500 °C in air or under nitrogen. These polyimides also showed low dielectric constants (2.83–3.34 at 1 MHz) and low moisture absorption (0.4–2.2%). For a comparative study, a series of analogous polyimides based on the nonfluorinated diamine 2′,5′‐bis(4‐aminophenoxy)‐p‐terphenyl were also prepared and characterized. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1255–1271, 2004     

Synthesis and properties of novel regioirregular polyimides from easily synthesized asymmetrical dichlorophthalimide monomers

New asymmetrical aromatic dichlorophthalimide monomers containing pendant groups (trifluoromethyl or methyl) were conveniently prepared from inexpensive and commercially available compounds. With these monomers, a new class of soluble polyimides with a regioirregular structure within the polymer backbone was obtained by the Ni(0)‐catalyzed polymerization method. The structures of the polymers were confirmed by various spectroscopic techniques. The polyimides displayed better solubility and higher thermal stability than the corresponding regular polyimides. In addition, fluorinated polyimides in this study had low dielectric constants ranging from 2.52 to 2.78, low moisture absorptions of less than 0.59%, and low thermal expansion coefficients between 10.6 and 19.7 ppm/°C. The oxygen permeability coefficients and permeability selectivity of oxygen to nitrogen of the films were in the ranges of 2.99–4.20 barrer and 5.55–7.50, respectively. We have demonstrated that the synthetic pathway for polyimides provides a successful approach to increasing the solubility and processability of polyimides without sacrificing their thermal stability. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 3550–3561, 2007     

Synthesis and characterization of soluble polyimides from 2,2-bis(4-aminophenyl)cycloalkane derivatives

New aromatic diamines [(1) and (2)] containing polycycloalkane structures between two benzene rings were synthesized by HCl-catalyzed condensation reaction of aniline hydrochloride and corresponding polycycloalkanone derivatives. The structures of diamines were identified by ¹H-NMR, ¹³C-NMR, FTIR spectroscopy, and elemental analysis. The polyimides were synthesized from the obtained diamines with various aromatic dianhydrides by one-step polymerization in m-cresol. The inherent viscosities of the resulting polyimides were in the range of 0.34–1.02 dL/g. The polyimides showed good thermal stabilities and solubility. All the polymers were readily soluble in N-methyl-2-pyrrolidone, m-cresol, tetrachloroethane, etc. Some of them were soluble even in chloroform at room temperature. The glass transition temperatures were observed in the range of 323–363°C, and all of the polymers were stable up to 400°C under nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3449–3454, 1999     

Novel polyimides with p-nitrophenyl pendant groups. Synthesis and characterization

Polyimides derived from a new dianhydride with p-nitrophenyl pendant groups have been synthesized and their properties compared with those of a reference series, without side groups. The polymers were obtained by combination of the novel monomer with aromatic diamines, in a two-step procedure that involved the synthesis of poly(amic acid) or poly(amic silyl ester) intermediates and the cyclization of them to polyimides by thermal treatment. The introduction of the polar nitro groups caused significant increase of the T_gs. On the contrary, the thermal stability was reduced because of the breakdown of C_Ar—NO₂ linkages around 400^oC. A slight decrease in mechanical properties was observed, due to the bulkiness of the side groups, that also produced an important decrease in the strength of the β relaxation, as determined by dynamic mechanical analysis. The solubility of the current polyimides in organic solvents was as poor as that of the parent unsubstituted polymers. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3377–3384, 1999     

Synthesis and characterization of spirobifluorene‐based polyimides

The synthesis and properties of organosoluble aromatic polyimides, containing spiro‐skeletal units in the polymer backbone on the basis of the spiro‐diamine monomer, 2,2′‐diamino‐9,9′‐spirobifluorene, are described. In the case of the spiro segment, the two fluorene rings are orthogonally arranged and connected through a tetrahedral bonding carbon atom, the spiro center. As a consequence, the polymer chain is periodically zigzagged with a 90° angle at each spiro center. This structural feature minimizes interchain interactions and restricts the close packing of the polymer chains, resulting in amorphous polyimides that have good solubility in organic solvents. Compared with their fluorene‐based cardo analogues, the spirobifluorene‐based polyimides have an improved solubility. Furthermore, the main‐chain rigidity of the polyimide appears to be preserved because of the presence of the spiro structure, which restricts the free segmental mobility. As a result, these polyimides exhibit a high glass‐transition temperature (T_g's) and good thermal stability. The T_g's of these polyimides were in the range of 287–374 °C, and the decomposition temperatures in nitrogen for a 10% weight loss occurred at temperatures above 570 °C. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3615–3621, 2002     

Synthesis and characterization of some novel aromatic polyimides

Three new diamines 1,2-di(p-aminophenyloxy)ethylene, 2-(4-aminophenoxy)methyl-5-aminobenzimidazole and 4,4-(aminopheyloxy) phenyl-4-aminobenzamide were synthesized and polymerized with 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BP), 4,4′-(hexafluoroisopropyledene)diphthalic anhydride (HF) and 3,4,9,10-perylene tetracarboxylic acid dianhydride (PD) either by one step solution polymerization reaction or by two step procedure. The later includes ring opening poly-addition to give poly(amic acid), followed by cyclodehydration to polyimides with the inherent viscosities 0.62-0.97 dl/g. Majority of polymers are found to be soluble in most of the organic solvents such as DMSO, DMF, DMAc, m-cresol even at room temperature and few becomes soluble on heating. The degradation temperature of the resultant polymers falls in the ranges from 240 °C to 550 °C in nitrogen (with only 10% weight loss). Specific heat capacity at 300 °C ranges from 1.1899 to 5.2541 J g⁻¹ k⁻¹. The maximum degradation temperature ranges from 250 to 620 °C. T_g values of the polyimides ranged from 168 to 254 °C.     

Synthesis,characterization, and thermal properties of piezoelectric polyimides

Three amorphous piezoelectric polyimides have been synthesized and characterized to analyze their utility for high‐temperature applications. The studied polyimides have been prepared from 4,4′‐oxydiphthalic anhydride and the diamines 2,4‐di(3‐aminophenoxy)benzonitrile (poly2‐4), 2,6‐bis(3‐aminophenoxy)benzonitrile (poly2‐6), and 1,3‐bis‐2‐cyano‐3‐(3‐aminophenoxy)phenoxybenzene (poly2CN). These polyimides differ in the position of the dipolar groups ? CN in the aromatic ring (poly2‐4 and poly2‐6) and in the number of these groups in the repetitive unit (poly2‐6 and poly2CN). The imidization degree has been studied by Fourier transform infrared (FTIR) and thermogravimetry‐mass spectrometry (TG‐MS) and thermal properties by differential scanning calorimetry (DSC) and thermogravimetry (TG). The piezoelectric behavior has been analyzed from remnant polarization measurements. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 722–730, 2009