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1.
A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004  相似文献   

2.
A novel tetraimide dicarboxylic acid was synthesized with the ring‐opening addition of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, 4,4′‐oxydianiline, and trimellitic anhydride in a 1/2/2 molar ratio in N‐methyl‐2‐pyrrolidone followed by azeotropic condensation to tetraimide dicarboxylic acid. A series of poly(amide imide imide)s (PAIIs) with inherent viscosities of 0.8–1.1 dL/g were prepared from tetraimide dicarboxylic acid with various aromatic diamines by direct polycondensation. Most of the PAIIs were readily soluble in a variety of amide polar solvents and even in less polar m‐cresol and pyridine. Solvent‐cast films had tensile strengths ranging from 99 to 106 MPa, elongations at break ranging from 8 to 13%, and initial moduli ranging from 2.0 to 2.3 GPa. The glass‐transition temperatures of these PAIIs were recorded at 244–276 °C. They had 10% weight losses at temperatures above 520 °C in air or nitrogen atmospheres. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1092–1102, 2002  相似文献   

3.
A new type of tetraimide‐dicarboxylic acid ( I ) was synthesized starting from the ring‐opening addition of m‐aminobenzoic acid, 4,4′‐oxydiphthalic anhydride, and 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane at a 2:2:1 molar ratio in N‐methyl‐2‐pyrrolidone (NMP), followed by cyclodehydration to the diacid I . A series of soluble and light‐colored poly(amide‐imide‐imide)s ( III a–j) was prepared by triphenyl phosphite‐activated polycondensation from I with various aromatic diamines ( II a–j). All films cast from N,N‐dimethylacetamide (DMAc) had cutoff wavelengths shorter than 390 nm (374–390 nm) and b* values between 25.26 and 43.61; these polymers were much lighter in color than the alternating trimellitimide series. All of the polymers were readily soluble in a variety of organic solvents such as NMP, DMAc, N,N‐dimethylformamide, dimethyl sulfoxide, and even in less polar m‐cresol and pyridine. Polymers III a–j afforded tough, transparent, and flexible films that had tensile strengths ranging from 96 to 118 MPa, elongations at break from 9 to 11%, and initial moduli from 2.0 to 2.5 GPa. The glass‐transition temperatures of the polymers were recorded at 240–268 °C. They had 10% weight loss at a temperature above 540 °C and left more than 55% residue even at 800 °C in nitrogen. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 707–718, 2002; DOI 10.1002/pola.10153  相似文献   

4.
A series of poly(amide–imide)s IIIa–m containing flexible isopropylidene and ether groups in the backbone were synthesized by the direct polycondensation of 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline (PIDA) with various bis(trimellitimide)s IIa–m in N‐methyl‐2‐pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting poly(amide–imide)s had inherent viscosities in the range of 0.80–1.36 dL/g. Except for those from the bis(trimellitimide)s of p‐phenylenediamine and benzidine, all the polymers could be cast from DMAc into transparent and tough films. They exhibited excellent solubility in polar solvents. The 10% weight loss temperatures of the polymers in air and in nitrogen were all above 495°C, and their Tg values were in the range of 201–252°C. Some properties of poly(amide–imide)s III were compared with those of the corresponding poly(amide–imide)s V prepared from the bis(trimellitimide) of diamine PIDA and various aromatic diamines. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 69–76, 1999  相似文献   

5.
A series of organosoluble aromatic polyimides (PIs) was synthesized from 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4,7‐methanohexahydroindan (3) and commercial available aromatic dianhydrides such as 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA), 4,4′‐sulfonyl diphthalic anhydride (SDPA), or 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropanic dianhydride (6FDA). PIs (IIIc–f), which were synthesized by direct polymerization in m‐cresol, had inherent viscosities of 0.83–1.05 dL/g. These polymers could easily be dissolved in N,N′‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), N,N‐dimethylformamide (DMF), pyridine, m‐cresol, and dichloromethane. Whereas copolymerization was proceeded with equivalent molar ratios of pyromellitic dianhydride (PMDA)/6FDA, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA)/6FDA, or BTDA/SDPA, or ½ for PMDA/SDPA, copolyimides (co‐PIs), derived from 3 and mixed dianhydrides, were soluble in NMP. All the soluble PIs could form transparent, flexible, and tough films, and they showed amorphous characteristics. These films had tensile strengths of 88–111 MPa, elongations at break of 5–10% and initial moduli of 2.01–2.67 GPa. The glass transition temperatures of these polymers were in the range of 252–311°C. Except for IIIe, the 10% weight loss temperatures (Td) of PIs were above 500°C, and the amount of carbonized residues of the PIs at 800°C in nitrogen atmosphere were above 50%. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1681–1691, 1999  相似文献   

6.
Two sulfonyl group-containing bis(ether anhydride)s, 4,4′-[sulfonylbis(1,4-phenylene)dioxy]diphthalic anhydride ( IV ) and 4,4′-[sulfonylbis(2,6-dimethyl-1,4-phenylene)dioxy]diphthalic anhydride (Me- IV ), were prepared in three steps starting from the nucleophilic nitrodisplacement reaction of the bisphenolate ions of 4,4′-sulfonyldiphenol and 4,4′-sulfonylbis(2,6-dimethylphenol) with 4-nitrophthalonitrile in N,N-dimethylformamide (DMF). High-molar-mass aromatic poly(ether sulfone imide)s were synthesized via a conventional two-stage procedure from the bis(ether anhydride)s and various aromatic diamines. The inherent viscosities of the intermediate poly(ether sulfone amic acid)s were in the ranges of 0.30–0.47 dL/g for those from IV and 0.64–1.34 dL/g for those from Me- IV. After thermal imidization, the resulting two series of poly(ether sulfone imide)s had inherent viscosities of 0.25–0.49 and 0.39–1.19 dL/g, respectively. Most of the polyimides showed distinct glass transitions on their differential scanning calorimetry (DSC) curves, and their glass transition temperatures (Tg) were recorded between 223–253 and 252–288°C, respectively. The results of thermogravimetry (TG) revealed that all the poly(ether sulfone imide)s showed no significant weight loss before 400°C. The methyl-substituted polymers showed higher Tg's but lower initial decomposition temperatures and less solubility compared to the corresponding unsubstituted polymers. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1649–1656, 1998  相似文献   

7.
Polyhydrazides and poly(amide‐hydrazide)s were prepared from two ether‐sulfone‐dicarboxylic acids, 4,4′‐[sulfonylbis(1,4‐phenylene)dioxy]dibenzoic acid and 4,4′‐[sulfonylbis(2,6‐dimethyl‐1,4‐phenylene)dioxy]dibenzoic acid, or their diacyl chlorides with terephthalic dihydrazide, isophthalic dihydrazide, and p‐aminobenzhydrazide via a phosphorylation reaction or a low‐temperature solution polycondensation. All the hydrazide polymers were found to be amorphous according to X‐ray diffraction analysis. They were readily soluble in polar organic solvents such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylacetamide and could afford colorless, flexible, and tough films with good mechanical strengths via solvent casting. These hydrazide polymers exhibited glass‐transition temperatures of 149–207 °C and could be thermally cyclodehydrated into the corresponding oxadiazole polymers in the solid state at elevated temperatures. Although the oxadiazole polymers showed a significantly decreased solubility with respect to their hydrazide prepolymers, some oxadiazole polymers were still organosoluble. The thermally converted oxadiazole polymers had glass‐transition temperatures of 217–255 °C and softening temperatures of 215–268 °C and did not show significant weight loss before 400 °C in nitrogen or air. For a comparative study, related sulfonyl polymers without the ether groups were also synthesized from 4,4′‐sulfonyldibenzoic acid and the hydrazide monomers by the same synthetic routes. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2271–2286, 2001  相似文献   

8.
Two new extended self‐polymerizable AB monomers, N‐(4‐fluorobenzoyl)‐4‐amino‐4′‐hydroxydiphenylether and N‐(4‐fluorobenzoyl)‐4‐amino‐4′‐hydroxybiphenyl, were prepared. The monomers were homopolymerized and copolymerized to high‐molecular‐weight, linear poly(arylether amides) in N‐methylpyrrolidone (NMP)/toluene in the presence of potassium carbonate at elevated temperature. The polymers retained NMP up to 200 °C. Samples containing small amounts of the solvent (5–10 wt %) were soluble in polar aprotic solvents. However, after complete removal of the NMP, the polymers were only soluble in strong acids such as sulfuric acid and methanesulfonic acid (MSA). The polymers, which had intrinsic viscosities of 0.57–1.49 dL/g (30.1 ± 0.1 °C in MSA), were semicrystalline with melting temperatures above 400 °C. Two new self‐polymerizable AB2 amide monomers, N,N′‐bis(4‐fluorobenzoyl)‐3,4‐diamino‐4′‐hydroxydiphenylether and N,N′‐bis(4‐fluorobenzoyl)‐3,5‐diamino‐4′‐hydroxybenzophenone, were also prepared and polymerized to give a hyperbranched poly(arylether amide) and a hyperbranched poly(aryletherketone) amide. The arylfluoride‐terminated, amorphous polymers had intrinsic viscosities of 0.34 and 0.24 dL/g (30.0 ± 0.1 °C in m‐cresol), glass‐transition temperatures of 210–269 °C, and were soluble in a wide variety of organic solvents. Matrix‐assisted laser desorption/ionization time‐of‐flight analysis indicated that the components of the low‐molecular‐weight fractions contained cyclic structures. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2374–2389, 2003  相似文献   

9.
A series of poly(arylene ether)s were successfully prepared by aromatic, nucleophilic substitution reactions with various perfluoroalkyl‐activated bisfluoromonomers with 4,4′‐bishydroxybiphenyl and 4,4′‐bishydroxyterphenyl. 4,4′‐Bishydroxyterphenyl was synthesized through the Grignard coupling reaction of magnesium salt of 4‐bromoanisole with dibromobenzene followed by demethylation with pyridine–hydrochloride. The products obtained by the displacement of fluorine atoms exhibited good inherent viscosity, up to 0.77 dL/g, and number‐average molecular weights up to 69,300. These poly(arylene ether)s showed very good thermal stability, up to 548 °C for 5% weight loss according to thermogravimetric analysis under synthetic air, and high glass‐transition temperatures, up to 259 °C according to differential scanning calorimetry, depending on the exact repeat unit structure. These polymers were soluble in a wide range of organic solvents, such as N‐methylpyrrolidone, dimethylformamide, tetrahydrofuran, toluene, and CHCl3, and were insoluble in dimethyl sulfoxide and acetone. Thin films of these poly(arylene ether)s showed good transparency and exhibited tensile strengths up to 132 MPa, moduli up to 3.34 GPa, and elongations at break up to 84%, depending on their exact repeating unit structures. These values are comparable to those of high‐performance thermoplastic materials such as poly(ether ether ketone) (PEEK) and Ultem poly(ether imide) (PEI). These poly(arylene ether)s exhibited low dielectric constants. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 55–69, 2002  相似文献   

10.
A new bis(ether anhydride), 3,3′,5,5′‐tetramethyl‐2,2‐bis[4‐(4‐dicarboxyphenoxy)phenyl]propane dianhydride ( 3 ), was prepared in three steps: the nitro displacement of 4‐nitrophthalonitrile with 2,2‐bis(4‐hydroxy‐3,5‐dimethylphenyl)propane, the alkaline hydrolysis of the intermediate bis(ether dinitrile), and the subsequent dehydration of the resulting bis(ether diacid). A series of new highly soluble poly(ether imide)s with tetramethyl and isopropylidene groups were prepared from the bis(ether anhydride) 3 with various diamines by a conventional two‐stage synthesis including polyaddition and chemical cyclodehydration. The resulting poly(ether imide)s had inherent viscosities of 0.54–0.73 dL g?1. Gel permeation chromatography measurements revealed that the polymers had number‐average and weight‐average molecular weights of up to 54,000 and 124,000, respectively. All the polymers showed typical amorphous diffraction patterns. All of the poly(ether imide)s showed excellent solubility and were readily dissolved in various solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, N,N‐dimethylformamide, pyridine, cyclohexanone, tetrahydrofuran, and even chloroform. Most of the polymers could be dissolved with chloroform concentrations as high as 30 wt %. These polymers had glass‐transition temperatures of 244–282 °C. Thermogravimetric analysis showed that all polymers were stable, with 10% weight losses recorded above 463 °C in nitrogen. These transparent, tough, and flexible polymer films were obtained through solution casting from N,N‐dimethylacetamide solutions. These polymer films had tensile strengths of 81–102 MPa and tensile moduli of 1.8–2.0 GPa. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2556–2563, 2002  相似文献   

11.
A new bis(o‐aminophenol) with a crank and twisted noncoplanar structure and ether linkages, 2,2′‐bis(4‐amino‐3‐hydroxyphenoxy)biphenyl, was synthesized by the reaction of 2‐benzyloxy‐4‐fluoronitrobenzene with biphenyl‐2,2′‐diol, followed by reduction. Biphenyl‐2,2′‐diyl‐containing aromatic poly(ether benzoxazole)s with inherent viscosities of 0.52–1.01 dL/g were obtained by a conventional two‐step procedure involving the polycondensation of the bis(o‐aminophenol) monomer with various aromatic dicarboxylic acid chlorides, yielding precursor poly(ether o‐hydroxyamide)s, and subsequent thermal cyclodehydration. These new aromatic poly(ether benzoxazole)s were soluble in methanesulfonic acid, and some of them dissolved in m‐cresol. The aromatic poly(ether benzoxazole)s had glass‐transition temperatures of 190–251 °C and were stable up to 380 °C in nitrogen, with 10% weight losses being recorded above 520 °C. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2656–2662, 2002  相似文献   

12.
A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003  相似文献   

13.
3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (4,4′‐carbonyldiphathalic anhydride) was reacted with L ‐leucine in a mixture of acetic acid and pyridine (3 : 2), and the resulting imide‐acid [N,N′‐(4,4′‐carbonyldiphthaloyl)‐bis‐L ‐leucine diacid] was obtained in quantitative yield. The compound was converted to the N,N′‐(4,4′‐carbonyldiphthaloyl)‐bis‐L ‐leucine diacid chloride by reaction with thionyl chloride. A new facile and rapid polycondensation reaction of this diacid chloride with several aromatic diamines such as 4,4′‐diaminodiphenyl methane, 2,4‐diaminotoluene, 4,4′‐sulfonyldianiline, p‐phenylenedi‐amine, 4,4′‐diaminodiphenylether, and m‐phenylenediamine was developed by using a domestic microwave oven in the presence of a small amount of a polar organic medium such as O‐cresol. The polymerization reactions proceeded rapidly compared with the conventional solution polycondensation and were completed within 6 min, producing a series of optically active poly(amide‐imide)s with a high yield and an inherent viscosity of 0.37–0.57 dL/g. All of the above polymers were fully characterized by IR, elemental analyses, and specific rotation. Some structural characterization and physical properties of these optically active poly(amide‐imide)s are reported. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 177–186, 2001  相似文献   

14.
New diene and dithiol monomers, based on aromatic imides such as benzophenone‐3,3′,4,4′‐tetracarboxylic diimide were synthesized and used in thiol‐ene polymerizations which yield poly(imide‐co‐thioether)s. These linear polymers exhibit limited solubility in various organic solvents. The molecular weights of the polymers were found to decrease with increasing imide content. The glass transition temperature (Tg) of these polymers is dependent on imide content, with Tg values ranging from ?55 °C (with no imide) up to 13 °C (with 70% imide). These thermal property improvements are due to the H‐bonding and rigidity of the aromatic imide moieties. Thermal degradation, as studied by thermogravimetric analysis, was not significantly different to the nonimide containing thiol‐ene polymers made using trimethyloylpropane diallyl ether and 3,5‐dioxa‐1,8‐dithiooctane. It is expected that such monomers may lead to increased glass transition temperatures in other thiol‐ene polymer systems as these normally exhibit low glass transition temperatures. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4637–4642  相似文献   

15.
Four bis(ether anhydride)s, 4,4′‐(1,4‐phenylenedioxy)diphthalic anhydride (IV), 4,4′‐(2,5‐tolylenedioxy)‐diphthalic anhydride (Me‐IV), 4,4′‐(2‐chloro‐1,4‐phenylenedioxy)diphthalic anhydride (Cl‐IV), and 4,4′‐(2,5‐biphenylenedioxy)diphthalic anhydride (Ph‐IV), were prepared in three steps starting from the nucleophilic nitrodisplacement reaction of 4‐nitrophthalonitrile with the potassium phenoxides of hydroquinone and various substituted hydroquinones such as methylhydroquinone, chlorohydroquinone, and phenylhydroquinone in N,N‐dimethylformamide, followed by alkaline hydrolysis and dehydration. Four series of poly(ether imide)s were prepared from bis(ether anhydride)s with various aromatic diamines by a classical two‐step procedure. The inherent viscosities of the intermediate poly(amic acid)s were in the range of 0.40–2.63 dL/g. Except for those derived from p‐phenylenediamine and benzidine, almost all the poly(amic acid)s could be solution‐cast and thermally converted into transparent, flexible, and tough polyimide films. Introduction of the chloro or phenyl substituent leads to a decreased crystallinity and an increased solubility of the polymers. The glass transition temperatures (Tg) of these polyimides were recorded in the range of 204–263°C. In general, the methyl‐ and chloro‐substituted polyimides exhibited relatively higher Tgs, whereas the phenyl‐substituted ones exhibited slightly lower Tgs compared to the corresponding nonsubstituted ones. Thermogravimetric analysis (TG) showed that 10% weight loss temperatures of all the polymers were above 500°C either in nitrogen or in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 665–675, 1999  相似文献   

16.
Benzoxazine monomer (Ba) was blended with soluble poly(imide‐siloxane)s in various weight ratios. The soluble poly(imide‐siloxane)s with and without pendent phenolic groups were prepared from the reaction of 2,2′‐bis(3,4‐dicarboxylphenyl)hexafluoropropane dianhydride with α,ω‐bis(aminopropyl)dimethylsiloxane oligomer (PDMS; molecular weight = 5000) and 3,3′‐dihydroxybenzidine (with OH group) or 4,4′‐diaminodiphenyl ether (without OH group). The onset and maximum of the exotherm due to the ring‐opening polymerization for the pristine Ba appeared on differential scanning calorimetry curves around 200 and 240 °C, respectively. In the presence of poly(imide‐siloxane)s, the exothermic temperatures were lowered: the onset to 130–140 °C and the maximum to 210–220 °C. The exotherm due to the benzoxazine polymerization disappeared after curing at 240 °C for 1 h. Viscoelastic measurements of the cured blends containing poly(imide‐siloxane) with OH functionality showed two glass‐transition temperatures (Tg's), at a low temperature around ?55 °C and at a high temperature around 250–300 °C, displaying phase separation between PDMS and the combined phase consisting of polyimide and polybenzoxazine (PBa) components due to the formation of AB‐crosslinked polymer. For the blends containing poly(imide‐siloxane) without OH functionalities, however, in addition to the Tg due to PDMS, two Tg's were observed in high‐temperature ranges, 230–260 and 300–350 °C, indicating further phase separation between the polyimide and PBa components due to the formation of semi‐interpenetrating networks. In both cases, Tg increased with increasing poly(imide‐siloxane) content. Tensile measurements showed that the toughness of PBa was enhanced by the addition of poly(imide‐siloxane). Thermogravimetric analysis showed that the thermal stability of PBa also was enhanced by the addition of poly(imide‐siloxane). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2633–2641, 2001  相似文献   

17.
A spirobichroman structure-containing diether anhydride (SBCDA), 6,6′-bis(3,4-dicarboxyphenoxy)-4,4,4′,4′,7,7′-hexamethyl-2,2′-spirobichroman dianhydride, was prepared by the nucleophilic nitrodisplacement of 4-nitrophthalonitrile with the phenolate ion of 6,6′-dihydroxy-4,4,4′,4′,7,7′-hexamethyl-2,2′-spirobichroman, followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetraacid. A series of high molecular weight poly(ether imide)s with inherent viscosities between 0.45 and 1.28 dL/g were synthesized from SBCDA and various aromatic diamines via a conventional two-stage procedure that included ring-opening polyaddition in N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclization to poly(ether imide)s. The intermediate poly(amic acid)s had inherent viscosities of 0.70–1.50 dL/g. Except for the poly(ether imide) obtained from p-phenylenediamine, the other poly(ether imide)s were soluble in various organic solvents and could be solution-cast into transparent, flexible, and tough films. These poly(ether imide)s had glass transition temperatures in the range 175–262°C and showed no significant decomposition below 420°C, with 10% weight loss being recorded above 446°C in nitrogen or air. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 2801–2809, 1997  相似文献   

18.
A new dialdehyde monomer, 4,4′‐(hexafluoroisopropylidine) bis(p‐phenoxy) benzaldehyde, was prepared; it led to a number of novel poly‐Schiff bases in reactions with different diamines, such as 4,4′‐diaminidiphenyl ether, 4,4′‐(isopropylidine) bis(p‐phenoxy) dianiline, 4,4′‐(hexafluoroisopropylidine) bis(p‐phenoxy) dianiline, and benzidine. The polymers were characterized with viscosity measurements, nitrogen analyses, and IR and 1H NMR spectroscopy. These poly‐Schiff bases showed good thermal stability up to 491 °C for 10% weight loss in thermogravimetric analysis under air and high glass‐transition temperatures up to 215 °C in differential scanning calorimetry. These polymers were soluble in a wide range of organic solvents, such as CHCl3, dimethylformamide (DMF), dimethyl sulfoxide, and 1‐methyl‐2‐pyrrolidon (NMP), and were insoluble in toluene and acetone. Thin films of these polymers cast from DMF exhibited tensile strengths up to 38 MPa. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 383–388, 2001  相似文献   

19.
A series of poly(amide‐imide)s were prepared using a new monomer, 1,3‐bis(trimellitimido)‐2,4,6‐trimethyl benzene (BTB), with four different diamines: 1,4‐phenylene diamine (PDA), 2,4‐diamino mesitylene (DAM), 2,2′‐dimethyl‐4,4′‐diamino biphenyl (DMDB), and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFDB). They were prepared by the condensation method in N‐methyl‐2‐pyrrolidinone (NMP) solvent using triphenyl phosphate and pyridine as condensing agents. The synthesized poly(amide‐imide)s were characterized by Fourier transform infrared and 1H NMR techniques. Films were prepared and characterized using DSC, thermogravimetric analysis (TGA), a prism coupler, and a film dielectric property analyzer. DSC measurement showed that the glass‐transition temperatures of the polymers were in the range of 259–327 °C. TGA analysis showed 5% weight loss, in the range of 472–514 °C. The refractive index varied from 1.6004 to 1.6586 in the following increasing order: BTB‐TFBM < BTB‐DAM < BTB‐DMDB < BTB‐PDA. For the poly(amide‐imide) films, the birefringence varied in the range of 0.0319–0.0580, in the following increasing order: BTB‐DAM < BTB‐TFBM < BTB‐DMDB < BTB‐PDA. The capacitance method showed that the dielectric constant of poly(amide‐imide) varied with the diamine structure; no difference was found by the optical method. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 137–143, 2004  相似文献   

20.
A novel bis(ether anhydride) monomer, 3,6‐bis(3,4‐dicarboxyphenoxy)benzonorbornane dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile with 3,6‐dihydroxybenzonorbornane in the presence of potassium carbonate, followed by the alkaline hydrolysis of the intermediate bis(ether dinitrile) and the cyclodehydration of the resulting bis(ether diacid). A series of poly(ether imide)s bearing pendant norbornane groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were 0.81–1.81 dL/g. The poly(ether imide) with m‐phenylenediamine as a diamine showed good organosolubility. Most of the cast poly(ether imide) films have had high tensile strengths and moduli. The glass‐transition temperatures of these poly(ether imide)s, except for those from rigid p‐phenylenediamine and benzidine, were recorded between 211 and 246 °C by differential scanning calorimetry. The softening temperatures of all the poly(ether imide) films stayed within 210–330 °C according to thermomechanical analysis. No polymers showed significant decomposition before 500 °C in a nitrogen or air atmosphere. A comparative study of the properties with the corresponding poly(ether imide)s without pendant substituents was also made. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1712–1725, 2002  相似文献   

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