Anisotropic plastic stress field at a mixed-mode crack tip under plane and anti-plane strain

On condition that any perfectly plastic stress component at a crack tip is nothingbut the function ofθ.by making use of equilibrium equations,anisotropic plastic stress-strain-rate relations,compatibility equations and Hill anisotropic plastic yieldcondition,in the present paper,we derive the generally analytical expressions of theanisotropic plastic stress field at a mixed-mode crack tip under plane and anti-planestrain.Applying these generally analytical expressions to the mixed-mode cracks,wecan obtain the analytical expressions of anisotropic plastic stress fields at the tips ofmixed-modeⅠ-Ⅲ,Ⅱ-ⅢandⅠ-Ⅱ-Ⅲcracks.     

On perfectly stress field at a mixed-mode crack tip under plane and anti-plane strain

In [1], under the condition that all the perfectly plastic stress components at a crack tip are functions of ϕ only, making use of equilibrium equations, stress-strain rate relations, compatibility equations and yield condition. Lin derived the general analytical expressions of the perfectly plastic stress field at a mixed-mode crack tip under plane and anti-plane strain. But in [1] there were several restrictions on the proportionality factor γ in the stress-strain rate relations, such as supposing that γ is independent of ϕ and supposing that γ=c or cr⁻¹. In this paper, we abolish these restrictions. The cases in [1], γ=cr^d (n=0 or-1) are the special cases of this paper.     

Plane-strain state of an elastoplastic body with a crack under mixed-mode loading

A mixed-mode (I + II) crack model with a plastic strip on its continuation under plane strain is proposed. The stress components within the strip are determined from the yield conditions, stress limitation, and relationship between the normal stress components defined via the principal stress state. The crack parameters are analyzed for the Mises yield condition. In the quasibrittle case, the governing system of equations includes stress intensity factors K _I, K _II, and T-stresses     

Thermal stress intensity factors for a crack in an anisotropic half plane

On the basis of the two-dimensional theory of anisotropic thermoelasticity, a solution is given for the thermal stress intensity factors due to the obstruction of a uniform heat flux by an insulated line crack in a generally anisotropic half plane. The crack is replaced by continuous distributions of sources of temperature discontinuity and dislocations. First, the particular thermoelastic dislocation solutions for the half plane are obtained; then the corresponding isothermal solutions are superposed to satisfy the traction-free conditions on the crack surfaces. The dislocation solutions are applied to calculate the thermal stress intensity factors, which are validated by the exact solutions. The effects of the uniform heat flux, the ply angle and the crack length are investigated.     

Inverse parameter identification of cohesive zone model for simulating mixed-mode crack propagation

Inverse analysis is widely applied to the identification of material properties or model parameters. In order to improve the computational efficiency of the inverse method based on the genetic algorithm, an interpolation scheme upon the response surface constructed by the finite element simulation has been adopted in this paper. Meanwhile, a gradual homogenization treatment scheme has also been presented to improve the convergence of the inverse method based on the Kalman filter algorithm. Both methods are proven effective in dealing with the single-objective inverse problem. However, literature studies show that the adoption of multiple types of experimental information is useful to improve the accuracy of inverse analysis. In this case, it turns into a multiple-objective inverse problem. Our practice proved that the above-mentioned two methods might not yield a proper result if the sensitivity issue of different types of information is not considered. Therefore, another multi-objective inverse method, in combination of the above two optimization algorithms and a weight-estimating scheme that can consider such sensitivity, has been further presented. Finally, by using a mixed-mode crack propagation simulation and two types of experimental information (loading-displacement response curve and crack path profile), the parameters of the cohesive zone model were inversely identified and its simulation results are in good agreement with the experiment.     

Pseudo plane stress plastic field for mode I crack growth

The pseudo plane stress field for a mode I crack growth is analyzed for both perfectly plastic and power law hardening plastic materials. When finite strain is taken into account, it is found that for perfectly plastic materials, the plastic domain is a narrow strip ahead of the crack tip. For power law hardening plastic material, the plastic domain contains a strip and a region ahead of the strip. The fracture criterion is discussed. The energy dissipated in the plastic strip is found to be proportional to the square of the thickness. Singular solutions to the field are ruled out by analysis.     

THE EXACT SOLUTIONS OF ELASTIC－PLASTIC CRACK LINE FIELD FOR MODE ⅡPLANE STRESS CRACK

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Thermostressed state of a piezoelectric bodywith a plane crack under symmetric thermal load

The paper addresses a thermoelectroelastic problem for a piezoelectric body with an arbitrarily shaped plane crack in a plane perpendicular to the polarization axis under a symmetric thermal load. A relationship between the intensity factors for stress (SIF) and electric displacement (EDIF) in an infinite piezoceramic body with a crack under a thermal load and the SIF for a purely elastic body with a crack of the same shape under a mechanical load is established. This makes it possible to find the SIF and EDIF for an electroelastic material from the elastic solution without the need to solve specific problems of thermoelasticity. The SIF and EDIF for a piezoceramic body with an elliptic crack and linear distribution of temperature over the crack surface are found as an example __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 3, pp. 96–108, March 2008.     

Determination of the dynamic stress intensity factorsK I d andK II d,for a mixed-mode propagating crack

In this paper, the dynamic propagation problem of a mixed-mode crack was studied by means of the experimental method of caustics. The initial curve and caustic equations were derived under the mixed-mode dynamic condition. A multi-point measurement method for determining the dynamic stress intensity factors,K _I ^d , andK _II ^d , and the position of the crack tip was developed. Several other methods were adopted to check this method, and showed that it has a good precision. Finally, the dynamic propagating process of a mixed-mode crack in the three-point bending beam specimen was investigated with our method.     

Contour integrals for mixed-mode crack analysis: effect of nonsingular terms

An integral formulation for computing the nonsingular stresses (NSS) in a cracked body under mixed-mode static and dynamic loads is presented. The reciprocity theorems are applied to find the integral formula. The auxiliary fields are selected to eliminate the singular terms in the asymptotic expansion of the stresses near the crack tip. For elastodynamic crack problems, the integral representation of the NSS is presented in both the time and Laplace transform domain. Required variables along the integration path and region enclosed by the integration contour are obtained from the boundary element analysis. Influence of the NSS on predicting the crack growth direction is investigated for cracks under mixed-mode load conditions.     

Stress state of a piezoelectric ceramic body with a plane crack under antisymmetric loads

The static equilibrium of an electroelastic transversely isotropic space with a plane crack under antisymmetric mechanical loads is studied. The crack is located in the plane of isotropy. Relationships are established between the stress intensity factors (SIFs) for an infinite piezoceramic body and the SIFs for a purely elastic body with a crack of the same form under the same loads. This makes it possible to find the SIFs for an electroelastic body without the need to solve specific electroelasitc problems. As an example, the SIFs are determined for a piezoelastic body with penny-shaped and elliptic cracks under shear __________ Translated from Prikladnaya Mekhanika, Vol. 42, No. 2, pp. 32–42, February 2006.     

Integral equation for stress concentration at the edge of a plane crack of arbitrary contour

Equations are derived for stress concentration near a crack of closed contour lying in a plane. A system of one-dimensional integral equations for the concentration factor is obtained. The right sides of the equations contain the initial approximation—a solution of the problem of a circular crack whose sides are acted upon by nonaxisymmetric loading. Mining Institute, Siberian Division, Russian Academy of Sciences, Novosibirsk 630091. Translated from Prikladnaya Mekhanika i Tekhnicheskaya Fizika, Vol. 40, No. 5, pp. 143–148, September–October, 1999.     

Stress state of a piezoceramic body with a plane crack opened by a rigid inclusion

The paper establishes a relationship between the solutions for cracks located in the isotropy plane of a transversely isotropic piezoceramic medium and opened (without friction) by rigid inclusions and the solutions for cracks in a purely elastic medium. This makes it possible to calculate the stress intensity factor (SIF) for cracks in an electroelastic medium from the SIF for an elastic isotropic material, without the need to solve the electroelastic problem. The use of the approach is exemplified by a penny-shaped crack opened by either a disk-shaped rigid inclusion of constant thickness or a rigid oblate spheroidal inclusion in an electroelastic medium __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 7, pp. 47–60, July 2008.     

Quasicontinuum simulation of single crystal nano-plate with a mixed-mode crack

The quasicontinuum (QC) method is employed to simulate a nickel single crystal nano-plate with a mixed-mode crack. Atomic stresses near the crack tip are fitted according to the elastoplastic fracture mechanics equations. It is found that the atomic stress fields neighboring the crack tip are also singular and controlled by the atomic stress intensity factors. And then the critical energy release rates for brittle and ductile fracture are computed and compared in order to predict crack propagation or dislocation emission. Four possible slip directions at the crack tip are pointed out. Finally, the slip direction around the crack tip is determined by the shear stress and it is well consistent with the atomic pictures from the QC simulation.     

Stress state of a transversely isotropic magnetoelectroelastic body with a plane crack under antisymmetric loads

The static equilibrium of a transversely isotropic magnetoelectroelastic body with a plane crack of arbitrary shape in the isotropy plane under antisymmetric mechanical loading is studied. The relationships between the stress intensity factors (SIFs) for an infinite magnetoelectroelastic body and the SIFs for a purely elastic body with the same crack and under the same antisymmetric loading are established. This enables the SIFs for a magnetoelectroelastic body to be found directly from the analogous problem of elasticity. As an example of using this result, the SIFs for penny-shaped, elliptic, and parabolic cracks in a magnetoelectroelastic body under antisymmetric mechanical loading are found Translated from Prikladnaya Mekhanika, Vol. 44, No. 10, pp. 37–51, October 2008.     

Transformation toughening of a ceramic in stable crack growth under plane stress conditions

A finite element study of stable crack growth in ceramics that can undergo a stress-induced martensitic phase transformation is performed under plane stress and small scale transforming conditions. The finite element method is based on the continuum model developed by Budiansky et al. (Int. J. Solids Structures 19, 1983). To guarantee the subcritical transformation behavior without loss of ellipticity of the governing equations, the possibility of strain localization is first re-examined. It is found that the plane stress conditions greatly favor transformation instability in that supercritical transformation occurs when the bulk modulus ¯B during transformation is below –G/3, instead of –4G/3 for three-dimensional or plane strain cases, whereG is the shear modulus. Next, transient crack extension under continuously increasing tensile load is simulated by a node release technique. Transformation zones and crack growth resistance curves are obtained.     

Pseudo plane stress mode II crack growth in plastic materials

The near tip field of mode II crack that grows in thin bodies with power hardening or perfectly plastic behavior is analyzed. It is shown that for power hardening behavior, the pseudo plane stress field possesses the logarithm singularity, i.e. σ (ln r)²/(n−1), (ln r)^{2n/(n − 1)}, where r is the distance from the crack tip, n the hardening exponent is σⁿ. When n → ∞ the solution reduced to that for the perfectly plastic case.