动态扭振法观察环氧树脂/蒙脱土插层聚合物的二次固化

聚合物 /无机纳米复合材料是当今材料研究中的热点。但由于无机纳米颗粒在聚合物中不易分散 ,有时用具有纳米层间距的片晶结构的无机矿物 ,如蒙脱土作填料 ,通过聚合时的热效应来撑开片晶达到蒙脱土的纳米级分散 ,制得所谓的插层聚合物〔1〕。插层型纳米复合材料不仅物理力学性能有很大提高 ,并且也为高分子凝聚态物理工作者提供了研究聚合物分子在二维空间受限情况的理想模型。由于在蒙脱土层间和层外的聚合物所处的环境不一样 ,它们的一些行为会有所不同。本文在用动态扭振法研究环氧树脂 /蒙脱土插层聚合物的等温固化行为时 ,观察到了该…     

动态扭振法在树脂固化研究中的最新应用

用计算机全自动控制的LHX-Ⅱ型树脂固化仪对热固性树脂基蒙脱土纳米复合材料、热塑性树脂PMMA基蒙脱土纳米复合材料以及聚合物互穿网络等体系进行了固化反应的研究。借用Avrami理论来处理树脂基纳米复合材料的固化行为,求取固化反应表现动力学参数。     

环氧树脂-三乙醇胺体系固化行为的预估

应用Flory凝胶化理论和非平衡态热力学涨落理论对环氧树脂-三乙醇胺体系不同温度下的凝胶化时间t_g和t_g以后树脂体系的固化行为进行了预估。动态扭振的实验表明,理论预估与实验有良好的相符。     

介绍一本新书《热固性树脂和树脂基复合材料的固化——动态扭振法及其应用》

中国科学技术大学出版社近日在“当代科学技术基础理论与前沿问题研究丛书、中国科学技术大学校友文库”中出版了一本由何平笙、金邦坤、李春娥撰写的《热固性树脂及树脂基复合材料的固化——动态扭振法及其应用》专著^[1],值得向读者推介。     

动态扭振法研究聚甲基丙烯酸甲酯/蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究热塑性塑料聚甲基丙烯酸甲酯(PMMA)/蒙脱土(MMT)复合体系的本体插层聚合.并试用处理交联体系固化的Flory理论、非平衡态热力学涨落理论和Avrami方程研究PMMA/MMT复合体系的本体插层聚合,求取表观活化能Ea.实验发现,PMMA/MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似,表明剥离后的蒙脱土片层在复合材料中起到交联点的作用.     

动态扭振法研究聚甲基丙烯酸甲酸／蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究塑性塑料聚甲基丙烯酸甲酸（PMMA）／蒙脱土（MMT）复合体系的本体插层聚合，并试用处理交联体系固化的Folry理论，非平衡态热力学涨落理论和Avrami方程研究PMMA／MMT复合体系的本体插层聚合，求取表观活化能Ea.实验发现，PMMA／MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似，表明剥离后的蒙脱土片层在复合材料中起到交联点的作用。     

扩链脲改性环氧树脂E-51/双氰双胺(dicy)体系的固化行为

反应活性;扩链脲改性环氧树脂E-51/双氰双胺(dicy)体系的固化行为     

苯并(口恶)嗪热固化过程中体积变化的研究

采用不同的测试方法,对双酚A型苯并(口恶)嗪和两种苯并(口恶)嗪模型化合物热聚合体系固化过程中的体积变化从表观体积收缩率、密度-固化时间曲线、恒温固化收缩率以及密度-温度曲线几方面进行了研究,深入探讨了苯并(口恶)嗪在固化过程中是否发生体积膨胀,并着重讨论了不同酚核结构苯并(口恶)嗪开环聚合过程中体积变化的差异及影响因素.结果表明,不同结构的苯并(口恶)嗪均呈现出宏观体积膨胀效应,但在恒温固化过程中却均呈现体积收缩,且这种体积变化的大小与苯并(口恶)嗪的分子结构、聚合反应程度和交联密度相关.     

CS21B2(1Σ+u)态预离解产物CS的振转布居研究

用一束波长为210.27 nm的激光将CS2分子激发至预离解态1 B2(1 Σ+u),用另一束激光通过激光诱导荧光(LIF)方法检测碎片CS,在250.5～286.5 nm获得了CS碎片A1 Π←X1 Σ+振转分辨的激发谱.通过对光谱强度的分析,获得了CS碎片v″=0～8的振动布居和v″=1,4～8振动态的转动布居.结果发现,碎片CS的振动布居呈双模结构,分别对应于CS2分子1 B2(1 Σ+u)态的两个解离通道,即CS(X1 Σ+,v″=0～9)+S(3PJ)和CS(X1 Σ+, v″=0～1)+S(1 B2).由此得到两个解离通道的分支比S(3PJ): S(1 B2)为5.6±1.2.与前人193 nm处的研究结果相比, 210.27 nm激发更有利于S(3PJ)通道的生成.此外,实验还发现CS的转动布居不满足热平衡分布,为两个Boltzmann分布的合成.     

不饱和聚酯/有机蒙脱土复合材料的固化动力学

用动态扭振法研究不饱和聚酯／有机蒙脱土复合材料的固化动力学行为。结果表明该实验体系能够很好地应用Flory理论和Avami方程进行拟合。用非平衡态热力学涨落理论对纳米复合材料的固化作了理论顸估,顸估结果与实验固化曲线有很好的相符性。有机蒙脱土的加入降低了不饱和聚酯的固化反应速率,对固化反应表现活化能和复合材料的形成过程没有很大的影响。根据实验结果分析不饱和聚酯在有机蒙脱土存在下的固化分为定型和熟化两个阶段,在一定的固化温度和填充含量下。从动态扭振曲线上可以明显地观察到这种“二次固化”现象。     

Monte Carlo Study of Binary Copolymerizations. 2. The Determination of Reactivity Ratios,Applications

This paper discusses an improved and efficient version of the MEMØRY-7 computer program described in a previous paper. The program, called MEMØRY-7/1, implements a Monte Carlo algorithm to compute reactivity ratios in binary irreversible copolymerizations. For the copolymerization of acrylic acid and methyl acrylate, the computed r₁, r₂ values (r₁ = 1.374, r₂ = 1.038) compare quite well with experimentally determined ones (r₁ = 1.4, r₂ = 1.0; Eldridge and Treloar).     

FTIR法研究环氧树脂固化反应动力学

用傅里叶红外光谱（ＦＴＩＲ）法研究了双酚Ｓ环氧树脂和甲溴双酚Ａ环氧树脂分别与二胺基二苯砜在恒温条件下的固化反应动力学,得出了各反应的表观活化能。     

动态扭振法及其在环氧树脂固化过程研究中的应用

本文改进了动态扭振的橡胶硫化仪.通过测定不同温度下环氧树脂E51-咪唑体系的等温固化曲线上的凝胶化时间推算该体系的固化反应表观活化能为12.9千卡/摩尔.测定了E51-三乙醇胺体系在100℃下的等温固化曲线,推得反应是一级反应,在凝胶点时的反应程度为48.2％,与理论值50％相当接近.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

环氧树脂/PAMAM体系的固化动力学研究

用动态扭振法研究以聚酰胺-胺(PAMAM)为固化剂的环氧树脂／PAMAM体系的固化动力学行为。结果表明,该实验体系能够很好地用Flory理论和Avami方程进行拟合。     

Curing Kinetics Modeling of Epoxy Modified by Fully Vulcanized Elastomer Nanoparticles Using Rheometry Method

In this study, the curing kinetics of epoxy nanocomposites containing ultra-fine full-vulcanized acrylonitrile butadiene rubber nanoparticles (UFNBRP) at different concentrations of 0, 0.5, 1 and 1.5 wt.% was investigated. In addition, the effect of curing temperatures was studied based on the rheological method under isothermal conditions. The epoxy resin/UFNBRP nanocomposites were characterized via Fourier transform infrared spectroscopy (FTIR). FTIR analysis exhibited the successful preparation of epoxy resin/UFNBRP, due to the existence of the UFNBRP characteristic peaks in the final product spectrum. The morphological structure of the epoxy resin/UFNBRP nanocomposites was investigated by both field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) studies. The FESEM and TEM studies showed UFNBRP had a spherical structure and was well dispersed in epoxy resin. The chemorheological analysis showed that due to the interactions between UFNBRP and epoxy resin, by increasing UFNBRP concentration at a constant temperature (65, 70 and 75 °C), the curing rate decreases at the gel point. Furthermore, both the curing kinetics modeling and chemorheological analysis demonstrated that the incorporation of 0.5% UFNBRP in epoxy resin matrix reduces the activation energy. The curing kinetic of epoxy resin/UFNBRP nanocomposite was best fitted with the Sestak–Berggren autocatalytic model.     

橡胶活性官能团对增韧环氧树脂动态力学性能的影响

用动态扭摆法测试聚丙烯酸丁酯橡胶增韧环氧树脂的动态力学行为,研究在环氧树脂低固化度和高固化度时,橡胶活性官能团种类(环氧基官能团与羧基官能团)和数量(官能度)对其影响。研究体系中橡胶玻璃化转变温度(Tg)的移动大小,与橡胶和基体树脂健合程度之间的关系。