Al-50wt% Sn合金的离子溅射研究

用捕获膜技术和卢瑟福背散射(RBS)分析,测定Al-Sn多相合金在30keV Ar⁺离子轰击时Al和Sn的溅射原子角分布。溅射后的样品用扫描电子显微镜(SEM)进行观察,并用电子微探针分析仪(EPMA)对轰击样品(靶点)和未轰击样品作成分分析。结果表明,Al的溅射原子角分布近于cosine形状,而Sn却是over-cosine型角分布。本文给出一个按不同表面形貌特征划分的各元素富集区i进行叠加的产额表达式,Y(θ)=∑Y_i(θ),解释了实验结果。 关键词：     

Analysis of temperature and enhanced diffusion effects in sputtering of CrSi2

Previously reported experimental results on sputtering and enhanced diffusion processes in CrSi₂ during 100 keVXe⁺ bombardment at different temperatures have been quantitatively analyzed.The framework for the analysis is a simple theoretical model in which the Si atoms are considered mobile in a matrix of Cr atoms whose density is assumed constant and diffusivity is considered zero everywhere. Erosion velocity of the matrix (due to the sputtering of Cr atoms), sputtering and enhanced diffusion processes of Si atoms are taken into account in the mathematical model.In our analysis we show that the time evolution of the total number of sputtered atoms in binary solids cannot yield an unambigous conclusion as to the existence of preferential sputtering.Further, it is found that in the case of CrSi₂ the preferential sputtering of Si atoms depends on the suicide temperature.     

Interaction of low-energy Cu2 dimers with copper clusters on the graphite surface

The sputtering of clusters consisting of 13, 27, and 75 copper atoms from the (0001) graphite surface under bombardment by Cu₂ dimers with energies of 100, 200, and 400 eV has been simulated using the molecular dynamics method. A comparative analysis of the distributions of backscattered particles and their energies over polar angles and the energy distributions of sputtered atoms has been performed. The factors responsible for the large sputtering yield from surface clusters under their bombardment with dimers as compared to copper and xenon monomers have been discussed. It has been demonstrated that, in the case of bombardment with dimers, the substantial role in the sputtering of surface clusters is played by the overlap of collision cascades initiated by each atom of the incident dimer. The differences in the sputtering under cluster and atom bombardments are especially pronounced in the case of large surface clusters.     

用自洽的蒙特卡罗—流体结合模型模拟溅射过程

 采用自洽的蒙特卡罗－流体结合模型对溅射过程进行模拟,以了解等离子体粒子行为与溅射参数的关系。溅射过程包括气体放电和溅射原子传输。对于气体放电,蒙特卡罗部分模拟快电子和快气体原子,而流体部分则描述离子和慢电子。对于溅射原子传输,蒙特卡罗部分模拟溅射原子的碰撞过程,而流体部分则描述溅射原子的扩散和漂移。模拟的结果包括：等离子体粒子的密度和能量分布;不同电离机制对气体原子和溅射原子电离的贡献;不同等离子体粒子对阴极溅射碰撞的贡献;溅射原子的密度分布;溅射场和溅射粒子相对于入射离子能量和角度的分布;溅射原子经碰撞后在整个等离子体区的分布。     

Sputtering of Cu and Zn atoms from elemental and alloy targets

The energy distributions of Cu and Zn atoms sputtered from elements and Cu_xZn_1-x alloys (x=0.80, 0.24) with a 6 keV Ar⁺ beam have been measured. It was found that the collision-cascade theory properly described the flux of sputtered atoms. From the spectra the binding energies of Cu and Zn atoms in the elemental and alloy surfaces were determined. The collision-cascade theory and the experimentally adjusted values of the binding energies allowed for calculation of the total and partial sputtering yields, and the equilibrium surface composition of the ion bombarded alloys. This work was carried out as a part of Research Project M.R. I/5.     

Anisotropic angular distribution of sputtered atoms

The sputtering yield angular distributions have been calculated on the basis of the ion energy dependence of total sputtering yields for Ni and Mo targets bombarded by low-energy Hg⁺ ions. The calculated curves show excellent agreement with the corresponding Wehner's experimental results of sputtering yield angular distributions. This fact clearly demonstrates the intrinsic relation between the ion energy dependence of total sputtering yields and the sputtering yield angular distribution. This intrinsic relation had been ignored in Yamamura's papers [Yamamura, Y. (1982). Theory of sputtering and comparison to experimental data, Nucl. Instr. and Meth., 194, 515–522; Yamamura, Y. (1981). Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms, Rad. Eff., 55, 49–55.] due to some obvious mistakes.     

BaF2晶体的取向和入射束的剂量对溅射的影响

２７ｋｅＶ Ａｒ^＋离子束沿法向分别入射在ＢａＦ₂单晶（１１１），（１００）和（１１０）的晶面上，用捕获器方法和Ｒｕｔｈｅｒｆｏｒｄ背散射分析法测定了Ｂａ原子的溅射角分布和溅射产额。结果发现不同取向的晶体表面，它们的溅射产额有明显差异。当用剂量为５×１０¹⁷ｉｏｎ／ｃｍ²的Ａｒ^＋离子分别轰击这三种晶面时，其溅射产额的顺序Ｙ_１００＞ｙ_１１１＞ｙ_１１０．对已被上述剂量辐照过的晶面再作相同剂量轰击时，测得的溅射产额明显增大。这些结果被认为是由于在离子辐照过程中表面晶格受损逐步增大所致。 关键词：     

Effect of temperature on the sputtering of surface metallic clusters

Sputtering of a cluster of 75 copper atoms from a copper-substrate surface by 200-eV argon ions is simulated using a molecular-dynamics method for target equilibrium temperatures of 0, 300, and 500 K. The sputtering coefficients of the substrate and the cluster and the angular and energy distributions of the sputtered atoms are studied. The mechanisms behind the influence of the thermal atomic vibrations on the sputtering yield of surface metallic clusters are discussed.     

离子轰击引起的表面形貌对Ag的溅射产额的影响

用捕获膜技术和卢瑟福背散射(RBS)谱仪测定Ag靶在27keV Ar⁺离子轰击下的溅射原子角分布,从而确定不同剂量下Ag的溅射产额,并对其靶点表面形貌进行扫描电子显微镜(SEM)观察。结果发现,所有的角分布都呈over-cosine形状,但其溅射产额却随着表面形貌不同而不同。根据溅射产额Y与轰击离子入射角φ变化关系,讨论不同轰击剂量下溅射产额的差别,肯定了表面形貌是影响溅射产额的一个重要因素,并由此提出“表观产额”的新概念。 关键词：     

Densities and velocity distributions of atomic hydrogen and carbon,measured by laser-induced fluorescence with frequency tripling into the vacuum UV

By focussing a commercial dye laser pumped with a XeCl excimer laser into phase matched Xe-A or Kr-A gas mixtures, radiation at the third-harmonic frequency has been generated in the wavelength regions: 1142–1165, 1178–1186, 1203–1224, and 1268–1290 Å. VUV powers up to about 200 W have been detected by a calibrated Au-photodiode. The vacuum uv radiation has been used for the fluorescence excitation of H and C atoms produced by thermal dissociation or by a gas discharge. Absolute densities have been derived by a comparison of fluorescence intensities with intensities from Rayleigh scattering in argon. As a further application, velocity distributions of C atoms sputtered from a graphite target by 1.5 keV argon ions have been measured. These data are in good agreement with a Thompson distribution corresponding to a surface energy of 8.2 eV.     

Sputtering studies with the Monte Carlo Program TRIM.SP

The Monte Carlo Program TRIM.SP (sputtering version of TRIM) was used to determine sputtering yields and energy and angular distributions of sputtered particles in physical (collisional) sputtering processes. The output is set up to distinguish between the contributions of primary and secondary knock-on atoms as caused by in- and outgoing incident ions, in order to get a better understanding of the sputtering mechanisms and to check on previous theoretical models. The influence of the interatomic potential and the inelastic energy loss model as well as the surface binding energy on the sputtering yield is investigated. Further results are sputtering yields versus incident energy and angle as well as total angular distributions of sputtered particles and energy distributions in specific solid angles for non-normal incidence. The calculated data are compared with experimental results as far as possible. From this comparison it turns out that the TRIM.SP is able to reproduce experimental results even in very special details of angular and energy distributions.     

A simple calculation of the angular distribution of sputtered atoms

Angular distributions of atoms sputtered with fast ions from smooth amorphous targets are estimated by a straightforward treatment of the collision cascade. When the geometrical situation at oblique ion impact is considered, the angle of maximum emission and the sputtering yield in dependence on the angle of ion incidence are described.     

Investigation of partial sputtering of lithium from a binary Al/Li alloy with laser induced fluorescence

Sputtering investigations of an Al/Li alloy containing 9.1 at-% of lithium have been performed for 6 keV helium ion bombardment. Absolute particle densities and velocity distributions of the sputtered neutral lithium atoms were measured with laserinduced fluorescence. The amount of sputtered lithium was found to be constant for target temperatures ranging from room temperature up to 500° C. The mean transport velocity and the sputtering yield of the Li component have been calculated from the measurements. Thermal evaporation of neutral Li atoms could be measured independently of the presence of the helium beam for target temperatures above 300° C. The experimental results indicate that the surface is covered by lithium with at least several atomic layers even under highcurrent ion irradiation.Preliminary results have been presented at the SYMPOSIUM ON SPUTTERING, Spitz/Austria (1986)     

Bombardment induced surface chemistry on Si under keV C60 impact

Molecular dynamics simulations of the sputtering of Si by C₆₀ keV bombardment are performed in order to understand the importance of chemical reactions between C atoms from the projectile and Si atoms in the target crystal. The simulations predict the formation of strong covalent bonds between the C and Si atoms, which result in nearly all of the C atoms remaining embedded in the surface after bombardment. At low incident kinetic energies, little sputtering of Si atoms is observed and there is a net deposition of solid material. As the incident kinetic energy is increased, the sputtering yield of Si atoms increases. At 15 keV, the yield of sputtered Si atoms is more than twice the number of C atoms deposited, and there is a net erosion of the solid material.     

Angular distributions of Au and Cu atoms sputtered from Au-Cu alloys by keV Ar+ ion bombardment

Angular distributions of Au and Cu atoms sputtered from Au-Cu alloys under 3 keV AR⁺ ion bombardment were measured to understand the preferential sputtering. The surface composition of sputter-deposited Au-Cu films on substrates mounted at different ejection angles was analyzed by Auger electron spectroscopy and electron probe microanalysis. Although the result indicated that the proportion of sputtered Cu atoms to the Au atoms in the Au-Cu alloy depends on the ejection angle, marked enhancement of the lighter component in the direction normal to the surface has not been observed in spite of the larger mass ratio of the constituent atoms of the Au-Cu alloy.     

溅射原子角分布与靶点表面形貌的关联研究

27keV的Ar⁺离子垂直轰击处于不同温度的Cd靶,用捕获膜技术和Rutherford背散射谱仪(RBS)测定溅射原子角分布,并对所有样品的靶点形貌进行扫描电子显微镜(SEM)观察。结果发现,所有的角分布都呈over-cosine形状,但是在极角为0°处实验值与cosine值的偏离△,是不同的,在靶温度为150℃时的偏离△_T小于在室温时的偏离△_R,亦即△_T<△_R,提出一个简单的模型对这种溅射角分布 关键词：     

Sputtered atom transport processes

It is noted that the transport of sputtered atoms can be described in terms of three pressure regimes: low pressure, where no collisions occur during the trajectory of the atom; intermediate pressure, where the atom undergoes perhaps several collisions but does not completely thermalize; and high pressure, where the sputtered atom effectively stops and begins a density-gradient-driven conventional gas-phase diffusion process. The intermediate region is the most complicated to model, given the dependence of the energy on the collision cross-section, the various distributions in energy and angle of the sputtered atoms, and the extended nature of most sputtering sources. Experimental studies reported here have measured the transport probability by observing the distribution of atoms around a chamber following sputtering. The transport is found to be quite dependent on the mass of both the sputtered atom and the background gas, as well as the particle density and geometry of the vacuum system. A strong effect of sputtered-atom-induced gas rarefaction has also been observed. This results in power-dependent transport of sputtered atoms, and as a result may also lead to power-dependent compositional variation in alloy depositions. The general result is that high discharge powers tend to correlate with lower power operation at a significantly lower operating pressure than had been assumed     

Probability of ionization of sputtered particles as a function of their energy: Part I: Negative Si ions

In this study we have investigated how the probability of ionization of sputtered Si atoms to form negative ions depends on the energy of the atoms. We have determined the ionization probability from experimental SIMS energy distributions using a special experimental technique, which included de-convolution of the energy distribution with an instrumental transmission function, found by separate measurements.We found that the ionization probability increases as a power law ∼E^0.677 for particles sputtered with energies of 0-10 eV, then becomes a constant value (within the limits of experimental error) for particles sputtered with energies of 30-100 eV. The energy distributions of Si⁻ ions, measured under argon and cesium ion sputtering, confirmed this radical difference between the yields from low and high-energy ions.To explain these results we have considered ionization mechanisms that are different for the low energy atoms (<10 eV) and for the atoms emitted with higher energy (>30 eV).     

Delay times in the sputtering of atoms from alkali-halide crystals during low-energy electron bombardment

Delay times in the sputtering of atoms from RbI, RbBr and NaCl by 540 eV electrons were investigated. This was done by simultaneously using the correlation technique and a slotted disc velocity selector. We observed delays in thermally ejected alkali and halogen atoms. These times were found to be independent of target temperature and are ascribed to lifetimes of excitons. Non-thermal halogen atoms are always sputtered without any delay.