Interfacial structure and electrical properties of LaAlO3 gate dielectric films on Si by metalorganic chemical vapor deposition

LaAlO₃ (LAO) gate dielectric films were deposited on Si substrates by low-pressure metalorganic chemical vapor deposition. The interfacial structure and composition distribution were investigated by high-resolution transmission electron microscopy (HRTEM), X-ray photoelectron spectroscopy (XPS), secondary-ion mass spectroscopy (SIMS), and Auger-electron spectroscopy (AES). HRTEM confirms that there exists an interfacial layer between LAO and Si in most samples. AES, SIMS, and XPS analyses indicate that the interfacial layer is compositionally graded La–Al silicate and the Al element is severely deficient close to the Si surface. Electrical properties of LAO films were evaluated. No evident difference in electrical properties between samples with and without native SiO₂ layers was observed. The electrical properties are discussed in terms of LAO growth mechanisms, in relation to the interfacial structure. PACS 73.40.Qv; 81.15.Gh; 77.55.+f; 68.35.-p     

Study of interfacial oxide layer of LaAlO3 gate dielectrics on Si for metal–insulator–semiconductor devices

Lanthanum aluminate (LAO) thin films were deposited on silicon by pulsed-laser deposition. It was found that oxygen partial pressure played an essential role in the formation of an interfacial layer. The films deposited in nitrogen at a pressure of 20 Pa had no interfacial layer. However, an interfacial layer was observed in the films deposited in 1×10^-2 Pa atmosphere. According to the thickness of the LAO film and interfacial layer and the measured capacitance, it could be deduced that the interfacial layer was not pure SiO₂. Auger electron spectroscopy, secondary ion mass spectroscopy and X-ray photoelectron spectroscopy depth analyses indicated that the interfacial layer was La–Al–silicate rather than pure silicon oxide and that the La and Al concentrations in the interfacial layer had gradients from the LAO layer to the substrate. PACS 79.61.Jv; 77.55.+f; 81.15.Gh     

Characteristics of SrBi2Ta2O9 ferroelectric films on Si using LaAlO3 thin film as an insulator

Metal–ferroelectric–insulator–semiconductor structures using LaAlO₃ (LAO) layers as an insulating barrier have been investigated. LAO films were deposited on n-Si substrates by low-pressure metalorganic chemical vapor deposition (MOCVD). SrBi₂Ta₂O₉ (SBT) films were prepared as ferroelectric layers at a low processing temperature of 650 °C by a metalorganic decomposition method. The MOCVD-derived LAO buffer layer shows an amorphous structure, relatively high dielectric constant, and good electrical properties. Au/SBT/LAO/n-Si exhibits a larger counterclockwise C–V memory window of 3.7 V and a lower leakage-current density of 2.5×10^-8 A/cm² at an applied voltage of 10 V. It has been confirmed that the hysteresis loop is caused by ferroelectricity. The Auger electron spectrometry depth profile indicates that the introduction of the LAO buffer layer prevents the interfacial diffusion between SBT and the Si substrate effectively and improves the interface quality. PACS 77.84.Dy; 81.15.Fg     

High quality,high-<Emphasis Type="Italic">k</Emphasis> gate dielectric: amorphous LaAlO<Subscript>3</Subscript> thin films grown on Si(100) without Si interfacial layer

High-k dielectric amorphous LaAlO₃ thin films have been grown on n-type Si(100) substrates by laser molecular beam epitaxy. The interfacial characteristics of the LaAlO₃ films on Si were measured by high-resolution transmission electron micrography and X-ray photoemission spectroscopy. A sharp interface without a silica inter-layer between the LaAlO₃ film and Si substrate was observed. Atomic force microscopy measurements indicated that the root-mean-square surface roughness within a 2m×2m area of the LAO films was 0.12 nm. The flatband voltage and fixed charge density of the 8 nm thickness LaAlO₃ films were about 0.355 V and 1.8×10¹²/cm², respectively. The leakage currents of the LaAlO₃/Si(100) samples with different film thicknesses of 5, 8 and 12 nm were 0.45, 0.23 and 0.05 mA/cm², respectively, at a +1 V dc bias voltage. LaAlO₃ appears to be one of the most promising high dielectric constant materials for use in future ultra large scale integrated devices. PACS 77.55+f; 77.84.Bw; 73.40.Qv     

Surface characterisation and interface studies of high-k materials by XPS and TOF-SIMS

High-k dielectric LaAlO₃ (LAO) films on Si(100) were studied by TOF-SIMS and XPS to look for diffusion processes during deposition and additional thermal treatment and for the formation and composition of possible interfacial layers. The measurements reveal the existence of SiO₂ at the LAO/Si interface. Thermal treatment strengthens this effect indicating a segregation of Si. However, thin LAO layers show no interfacial SiO₂ but the formation of a La-Al-Si-O compound. In addition, Pt diffusion from the top coating into the LAO layers occurs. Within the LAO layer C is the most abundant contamination (10²¹ at/cm³). Its relatively high concentration could influence electric characteristics. XPS shows that CO₃²⁻ is intrinsic to the LAO layer and is due to the adsorption of CO₂ of the residual gas in the deposition chamber.     

Dielectric properties of SrZrO3 thin films prepared by pulsed laser deposition

SrZrO₃ (SZO) thin films have been prepared on Pt-coated silicon substrates and directly on Si substrates by pulsed laser deposition (PLD) using a ZrSrO target at a substrate temperature of 400 °C in 20 Pa oxygen ambient. X-ray –2 scans showed that the as-deposited films remain amorphous at a substrate temperature of 400 °C. The dielectric constant of SZO has been determined to be in the range 24–27 for the Pt/SZO/Pt structure. Capacitance–voltage (C–V) characteristics of a metal-oxide-semiconductor (MOS) structure for SZO films deposited in 20 Pa oxygen ambient and 20 Pa nitrogen ambient (SZON) indicated that incorporation of nitrogen during the substrate heating and film deposition can suppress the formation of an interfacial SiO₂ layer, and the SZON films have a lower equivalent oxide thickness (EOT) than that of the SZO films. However, the leakage current of the SZON films is larger than that of the SZO films. The EOT is about 1.2 nm for a 5-nm SZON film deposited at 400 °C. The leakage-current characteristics of as-deposited SZON films and SZON films post-annealed in oxygen ambient by rapid thermal annealing (RTA) have been studied comparatively. The films post-annealed with RTA have a lower leakage current than the as-deposited SZON films. Optical transmittance measurements showed that the band gap of the films is about 5.7 eV. It is proposed that SrZrO₃ films prepared at 400 °C are potential materials for alternative high-k gate-dielectric applications. PACS 77.84.Bw; 77.84.-s; 77.55.+f     

Highly (100) oriented Pb(Zr<Subscript>0.52</Subscript>Ti<Subscript>0.48</Subscript>)O<Subscript>3</Subscript>/LaNiO<Subscript>3</Subscript> films grown on amorphous substrates by pulsed laser deposition

Pb(Zr_0.52Ti_0.48)O₃ (PZT)/LaNiO₃ (LNO) thin films with highly (100) out of plane orientation were produced on SiO₂/Si(100) and alkaline earth aluminosilicate glass substrates by pulsed laser deposition (PLD). Orientations of both PZT and LNO films were evaluated using X-ray diffraction. The pure (100)-oriented PZT/LNO films were obtained under optimized deposition conditions. Time of flight-secondary ion mass spectrometry analysis showed that LNO could effectively block interdiffusion between the PZT films and the substrates. Fairly smooth surfaces of the PZT films with roughness of about 4 nm were observed using an atomic force microscope. Cross sectional examination revealed that the films grew in columnar grains. The PZT films grown on both SiO₂/Si and glass substrates demonstrated very good ferroelectric characteristic at room temperature with remnant polarization of up to 26 μC/cm². PACS 79.20.DS; 77.84.DY; 78.70.Ck     

An investigation into ultra-thin pseudobinary oxide (TiO<Subscript>2</Subscript>)<Subscript>x</Subscript>(Al<Subscript>2</Subscript>O<Subscript>3</Subscript>)<Subscript>1-x</Subscript> films as high-<Emphasis Type="Italic">k</Emphasis> gate dielectrics

As potential gate dielectric materials, pseudobinary oxide (TiO₂)_x(Al₂O₃)_1-x (0.1≤x≤0.6) films (TAO) were deposited on Si (100) substrates by pulsed-laser deposition method and studied systematically via various measurements. By a special deposition process, including two separate steps, the TAO films were deposited in the form of two layers. The first layer was deposited at room temperature and the second layer was completed at the substrate temperature of 400 °C. Detailed data show that the properties of the TAO films are closely related to the ratio between TiO₂ and Al₂O₃. The existence of the first layer deposited at room temperature can effectively restrain the formation of the interfacial layer. And according to the results of X-ray photoelectron spectroscopy and high-resolution transmission electron microscopy performed on the films, no other information belonging to the silicon oxide could be observed. For the (TiO₂)_0.4(Al₂O₃)_0.6 film, the best result has been achieved among all samples and its dielectric constant is evaluated to be about 38. It is valuable for the amorphous TAO film as one of the promising dielectric materials for high-k gate dielectric applications. PACS 77.55.+f; 73.40.Qv; 81.15.Fg     

Pulsed laser deposition of aluminate YAlO3 and LaAlO3 thin films for alternative gate dielectric applications

Amorphous aluminate YAlO₃ (YAO) thin films on n-type silicon wafers as gate dielectric layers of metal–oxide–semiconductor devices are prepared by pulsed laser deposition. As a comparison, amorphous aluminate LaAlO₃ (LAO) thin films are also prepared. The structural and electrical characterization shows that the as-prepared YAO films remain amorphous until 900 °C and the dielectric constant is ∼14. The measured leakage current of less than 10^-3 A/cm² at a bias of V_G=1.0 V for ∼40-nm-thick YAO and LAO films obeys the Fowler–Nordheim tunneling mechanism. It is revealed that the electrical property can be significantly affected by the oxygen pressure during deposition and post rapid thermal annealing, which may change the fixed negative charge density at the gate interface. PACS 77.55.+f; 81.15.Fg; 81.40.Ef     

Domain matching epitaxy of cubic Mg<Subscript>x</Subscript>Zn<Subscript>1-x</Subscript>O films on LaAlO<Subscript>3</Subscript> by pulsed laser deposition

Wide band gap Mg_xZn_1-xO alloy films were grown on LaAlO₃(100) (LAO) substrates by pulsed laser deposition. Structural characterization by X-ray and electron diffraction reveals a single cubic phase of c-Mg_xZn_1-xO (c-MZO) with composition x>0.6 and heteroepitaxial relationships of (100)_c-MZO (100)_LAO (out-of-plane) and (011)_c-MZO (010)_LAO (in-plane). The strain relaxation is analyzed in detail under the framework of domain matching epitaxy. The sequence of 5/4, 4/3 domains observed departs from the ideal 1:4 ratio, indicating a complex strain relaxation mechanism. PACS 71.55.GS; 74.25.GZ; 81.15.Fg     

Electric and magnetic properties of CoFe<Subscript>2</Subscript>O<Subscript>4</Subscript>/Pb(Zr<Subscript>0.52</Subscript>Ti<Subscript>0.48</Subscript>)O<Subscript>3</Subscript> bilayer thin films prepared by pulsed-laser deposition

CoFe₂O₄ (CFO) thin film with highly (111)-preferential orientation was first deposited on the silicon substrate by a pulsed-laser deposition, and then Pb(Zr_0.52Ti_0.48)O₃ (PZT) layers were deposited with different oxygen pressures to form the bilayer CFO/PZT nanocomposite thin films. X-ray diffraction showed that the PZT preferential orientation was strongly dependant on the oxygen pressure. The smooth film surface was obtained after depositing the CFO and PZT layers. The bilayer thin films exhibit good ferromagnetic and ferroelectric properties, and a low leakage current density of 0.004 μA/cm² at 50 kV/cm. The leakage current density curves show loops for the electric polarized field when the electric field reverses. PACS 77.84.Lf; 75.80+q; 81.05.Zx; 81.15.Fg     

Influence of epitaxial growth on phase competition in Pr0.5Sr0.5MnO3 films

A series of Pr_0.5Sr_0.5MnO₃ (PSMO) films with various thickness were epitaxially grown on substrates of (0 0 1)-oriented (LaAlO₃)_0.3(SrAl_0.5Ta_0.5O₃)_0.7 (LSAT), LaAlO₃ (LAO) and SrTiO₃ (STO), and (0 1 1)-oriented STO using pulse laser deposition. Influence of epitaxial growth on phase competition was investigated. A ferromagnetic metal to antiferromagnetic insulator (FMM-AFI) transition upon cooling is present in both largely compressed situations deposited on LAO (0 0 1) and tensile cases deposited on STO (0 0 1) but absent in little strained films grown on LSAT (0 0 1), indicating that the antiferromagnetic insulating state is favored by strains. On the other hand, the 400 nm films deposited on (0 1 1)-oriented STO as well as LAO substrates show FMM-AFI transition. These results reveal that both the orientation of epitaxial growth and substrate-induced strain affect the FMM-AFI transition.     

Effects of LaNiO<Subscript>3</Subscript> on the structures and properties of SrBi<Subscript>2</Subscript>Ta<Subscript>2</Subscript>O<Subscript>9</Subscript> thin films

SrBi₂Ta₂O₉(SBT)/LaNiO₃(LNO)/Si and SBT/Pt/TiO₂/SiO₂/Si multilayers were fabricated by pulsed laser deposition. With Pt top electrodes, the measured remanent polarization (2P_r) of Pt/SBT/LNO/Si and Pt/SBT/Pt/TiO₂/SiO₂/Si capacitors was 6.5 C/cm² and 5.2 C/cm², respectively. Using LNO as both bottom electrodes and buffer layers, enhanced non-c-axis crystalline SBT films were induced, which resulted in a 2P_r greater than that of the Pt/SBT/Pt/TiO₂/SiO₂/Si capacitor. The hysteresis loop of the Pt/SBT/LNO/Si capacitor showed a great external-field-dependent horizontal shift. Using an electron-injection model, this dependence was addressed. The fatigue-free property of the Pt/SBT/LNO/Si capacitor was experimentally established, in that the non-volatile polarization decreased by less than 5% of the initial value after 1.44×10⁹ switching cycles . PACS 77.84.Dy; 68.65.+g     

Ferroelectric characteristics of silicate-bound Bi4Ti3O12 thin films

40-nm-thick Bi₄Ti₃O₁₂ films have been deposited by spin coating with a hybrid precursor solution of bismuth-2-ethylhexanoate, titanium tetraisopropoxide and tetraethysilicate. The 500 °C-annealed thin film consists of Bi₄Ti₃O₁₂ grains bound by ultra-thin amorphous silicate layers. The film shows a high degree of crystallinity with random orientation and exhibits a structure-dependent propeller-like P–V hysteresis loop. The ultra-thin layer of amorphous silicate is found to have multiple functions of binder, compositional buffer and insulator, which results in an improvement of the electrical properties of the Bi₄Ti₃O₁₂-Bi₂O₃×SiO₂ thin films. PACS 77.84.-s; 68.37.-d; 81.15.-z     

Microscopic bonding and macroscopic strain relaxations at Si-SiO<Subscript>2</Subscript> interfaces

Optical second harmonic generation studies of the temperature dependence of the phase angle differences from contributions of terrace and edge bonding at silicon–silicon dioxide interfaces prepared on vicinal Si(111) wafers have revealed an interface relaxation process at an annealing temperature between 850 and 900 °C. Complementary studies by synchrotron soft X-ray photoelectron spectroscopy have established that this relaxation is associated with changes in the concentration and composition of local suboxide bonding environments in an ultrathin, interfacial transition region that is approximately one molecular layer thick. This relaxation occurs at a significantly lower temperature than an approximately 990±10 °C relaxation of macroscopic compressive strain in the bulk of the SiO₂ film. This paper establishes an analogy between i) the Si–SiO₂ interface in which there is a transition from a rigid substrate, Si, to an ideal continuous random covalent network, SiO₂, in which the average number of bonding constraints/atom matches the network dimensionality, and ii) a concentration dependent transition between under- and over-constrained local bonding in non-crystalline glass alloys such as Ge_xSe_1-x. The interfacial suboxide transition region is demonstrated to have properties in common with a regime of alloy compositions in which self-organization reduces bond constraint induced strain, thereby stabilizing these compositions against aging as for example in time-dependent changes in the glass transition temperature. These comparisons provide important new insights into defect formation at Si–SiO₂ interfaces, as well as interfaces between Si and alternative high-k dielectrics being considered for advanced Si devices including Al₂O₃ and transition metal silicate alloys, e.g., (ZrO₂)_x(SiO₂)_1-x. This new perspective is also extended to interfaces between GaN and SiO₂, where the interfacial transition region is a suboxide of Ga, GaO_x, with x<1.5. PACS 85.30.Tv; 42.65.-k; 79.40.+z; 73.20.-r; 77.55.+f     

Temperature and frequency dependence of the ferroelectric characteristics of BaTiO<Subscript>3</Subscript> thin films for nonvolatile memory applications

Ferroelectric thin films of BaTiO₃ were successfully deposited on SiO₂/Si substrate under the optimal rf magnetron sputtering conditions, and their electrical and ferroelectric characteristics were discussed. The memory window, capacitance, threshold voltage and leakage current density of MFIS structure under different frequencies and temperatures were also reported. The variations of ferroelectric capacitance and threshold voltage would be attributed to the as-deposited BaTiO₃ films of MFIS structure as the temperature and frequency increased. Besides, the memory window, threshold voltage and leakage current density would be degraded from 4 V, 5 V and 8×10^-10 A/cm² to 2.5 V, 10 V and 5×10^-4 A/cm², respectively, as the temperature increased from 25 to 90 °C. PACS 77.84.-s; 81.15.Cd; 73.40.Qv; 51.50.+v; 67.80.Gb     

Silicon surface passivation by aluminium oxide studied with electron energy loss spectroscopy

The origin behind crystalline silicon surface passivation by Al₂O₃ films is studied in detail by means of spatially‐resolved electron energy loss spectroscopy. The bonding configurations of Al and O are studied in as‐deposited and annealed Al₂O₃ films grown on c‐Si substrates by plasma‐assisted and thermal atomic layer deposition. The results confirm the presence of an interfacial SiO₂‐like film and demonstrate changes in the ratio between tetrahedrally and octahedrally coordinated Al in the films after annealing. These observations reveal the underlying origin of c‐Si surface passivation by Al₂O₃. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effects of thickness on the infrared optical properties of Ba<Subscript>0.9</Subscript>Sr<Subscript>0.1</Subscript>TiO<Subscript>3</Subscript> ferroelectric thin films

Using infrared spectroscopic ellipsometry (IRSE), the optical properties of the Ba_0.9Sr_0.1TiO₃ (BST) ferroelectric thin films with different film thicknesses on Pt/Ti/SiO₂/Si substrates prepared by a modified sol-gel method have been investigated in the 2.5–12.6 m wavelength range. By fitting the measured ellipsometric parameter ( and ) data with a three-phase model (Air/BST/Pt) and the classical dispersion relation for the BST thin films, the optical constants and thicknesses of the thin films have been obtained. The average thickness of the single layer decreases with increasing film thickness. The refractive index of the BST films decreases with increasing thickness in the wavelength range 2.5–11 m, and increases with increasing thickness in the wavelength range 11–12.6 m. However, the extinction coefficient of the BST films monotonously decreases with increasing thickness. It is closely associated with the crystallinity of the thin films, the crystalline size effect and the influence of the interface layer. The absorption coefficient of the BST films with different thicknesses decreases with increasing thickness. PACS 77.55.+f; 78.20.Ci; 78.30.Am; 81.70.Fy; 81.40.Tv     

Growth of Fe<Subscript>3</Subscript>O<Subscript>4</Subscript> films on the Si(111) surface covered by a thin SiO<Subscript>2</Subscript> layer

Magnetite polycrystalline films are grown by variously oxidizing a Fe film on the Si(111) surface covered by a thin (1.5 nm) SiO₂ layer. It is found that defects in the SiO₂ layer influence silicidation under heating of the Fe film. The high-temperature oxidation of the Fe film results in the formation of both Fe₃O₄ and iron monosilicide. However, the high-temperature deposition of Fe in an oxygen atmosphere leads to the growth of a compositionally uniform Fe₃O₄ film on the SiO₂ surface. It is found that such a synthesis method causes [311] texture to arise in the magnetite film, with the texture axis normal to the surface. The influence of the synthesis method on the magnetic properties of grown Fe₃O₄ films is studied. A high coercive force of Fe₃O₃ films grown by Fe film oxidation is related to their specific morphology and compositional nonuniformity.     

多孔TiO2/Al/SiO2纳米复合结构的紫外光吸收特性研究

在SiO₂玻璃衬底上用脉冲激光沉积(PLD)技术，分别沉积Ti和Ti/Al膜，经电化学阳极氧化成功制备了多孔TiO₂/SiO₂和TiO₂/Al/SiO₂纳米复合结构. 其中TiO₂薄膜上的微孔阵列高度有序，分布均匀. 实验研究了Al过渡层对多孔TiO₂薄膜光吸收特性的影响. 结果表明：无Al过渡层的多孔TiO₂薄膜其紫外吸收峰在27