Mode III stress intensity factors in an interfacial crack in dissimilar bonded materials

The antiplane shear deformation problem of two edge-bonded dissimilar isotropic wedges is considered. In the case when the sum of the two apex angles is equal to 2π, the problem reduces to that of two edge-bonded dissimilar materials with an interfacial crack subjected to concentrated antiplane shear tractions on the crack faces. An explicit expression is extracted for the stress intensity factor at the crack tip. In the special cases of different combinations of the apex angles, the obtained expression for the stress intensity factor may be simplified and relations of a simpler form are given for the stress intensity factor. It is shown that the stress intensity factor is dependent on the material properties as well as the geometry and loading. However, in special cases of equal apex angles as well as the case of similar materials the dependency of the stress intensity factor on the material properties disappears.     

Wedge corner stress behaviour of bonded dissimilar materials

A contour integral, based on Betti’s reciprocal theorem, is used in conjunction with the finite element method to evaluate the magnitude of the wedge corner stress intensities associated with the higher order terms of the singular stress field near the interface corner of a bi-material joint. It is shown that using a different auxiliary field can eliminate the dependence of the wedge corner stress intensity on the integration path observed by [W.C. Carpenter, Int. J. Fracture 73 (1995) 93–108]. Finite element analysis of a typical joint geometry is used to demonstrate the path-independence of the magnitude of the stress intensities evaluated using the proposed method, and to show the effects of higher order terms on the stress state near the interface corner.     

Interfacial transient thermal fracture of adhesively bonded dissimilar materials

The effect of a transient thermal load on an interface crack in adhesively bonded dissimilar materials was experimentally studied by using photothermoelasticity. It is determined that the effect of the thermal load is to cause mostly shearing deformations at the crack tip. For two configurations, a horizontal crack (normal to the heat flow direction) and a vertical crack (parallel to the heat flow direction), it is shown that increasing the adhesive thickness results in steady-state and maximum transient strain-energy release rates and stress-intensity factors of smaller magnitudes. It is also found that the ratio of mode I to mode II stressintensity factors for the vertical crack is larger than the one for the horizontal crack.     

Stress intensity factor for an edge crack in two bonded dissimilar materials under convective cooling

The transient thermal stress crack problem for two bonded dissimilar materials subjected to a convective cooling on the surface containing an edge crack perpendicular to the interface is considered. The problem is solved using the principle of superposition and the uncoupled quasi-static thermoelasticity. The crack problem is formulated by applying the transient thermal stresses obtained from the uncracked medium with opposite sign on the crack surfaces to be the only external loads. Fourier integral transform is used to solve the perturbation problem resulting in a singular integral equation of Cauchy type in which the derivative of the crack surface displacement is the unknown function. The numerical results of the stress intensity factors are calculated for both the edge crack and the crack terminating at the interface using two different composite materials and illustrated as a function of time, crack length, coefficient of heat transfer, and the thickness ratio.     

A crack emanating from the tip of bonded dissimilar materials

1.IntroductionBondedstructurescanbewidelyfoundindifferentareas,suchasweldedpressurevessels,reinforcedconcretemembers,groutingsoftfoundationandsolidrocketpropellants.etc.Thestudy'ofthesingularityofbondedstructuresisespeciallyimp6rtantnotonlyforsafedesignbutalsoforconstruction.DeinpseyandSinclairl61studiedthegeneraleaseofN-materialcompositewedges,andprovedthat'ingeneralthereexistsstresssingularitynearthetipofthewedges,andtheorderofthesingularitydependsontheelasticconstantsandthelocalgeometry.Fo…     

Singular stress field near the edge of interface of bonded dissimilar materials with an interlayer

For bonded dissimilar materials, the free-edge stress singularity usually prevails near the intersection of the free-surface and the interface. When two materials are bonded by using an adhesive, an interlayer develops between the two bonded materials. When a ceramic and a metal are bonded, the residual stress develops because of difference in the coefficient of thermal expansion. An interlayer may be inserted between the two materials to defuse the residual stress. Stress field near the intersection of the interface and free-surface in the presence of the interlayer is then very important for evaluating the strength of bonded dissimilar materials.In this study, stress distributions on the interface of bonded dissimilar materials with an interlayer were calculated by using the boundary element method to investigate the effect of the interlayer on the stress distribution. The relation between the free-edge singular stress fields of bonded dissimilar materials with and without an interlayer was investigated numerically. It was found that the influence of the interlayer on the stress distributions was confined within a small area of the order of interlayer thickness around the intersection of the interface and the free-surface when the interlayer was very thin. The stress distribution near the intersection of the interface and the free-surface was controlled by the free-edge stress singularity of the bonded dissimilar materials without the interlayer. In this case, the interlayer can be called free-edge singularity-controlled interlayer. If a stress distribution on the interface is known for one thickness of an interlayer h, stress distributions on the interface for other values of h can be estimated.     

Problems on collinear cracks between bonded dissimilar materials under concentrated loads

Following Ref. [6], this paper deals with the problem on collinear cracks between bonded dissimilar materials under a concentrated force and moment at an arbitrary point. Several typical solutions of complex stress functions in closed form are formulated and the stress intensity factors are given. These solutions include a series of results of previous researchers, and redress some errors in the researches of problems containing semi-infinite cracks^[3],[4].     

The analysis of thermal residual stresses near the apex in bonded dissimilar materials

By employing the complex variable method and constructing the particular solution sequences in the form of complex functions, all the cases of the thermal residual stress field near the apex in dissimilar materials bonded with two arbitrary angles are researched theoretically, and the corresponding classical solutions are obtained. Moreover, the primary paradox, the secondary paradox and even the triple paradox are discovered in the classical solutions and also resolved here, thereby it is confirmed that thermal residual stresses near the apex in bonded dissimilar materials probably possess the singularities of lnr (when the primary paradox occurs) , ln²r (when the secondary paradox occurs) and even ln³r (when the triple paradox occurs) . In addition, the systematic method to solve multiple paradox problems is put forward. © 1999 Elsevier Science Ltd. All rights reserved.     

Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials

Summary  The problem of an interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials is considered under the conditions of anti-plane shear and in-plane electric loading. The crack surfaces are assumed to be impermeable to the electric field. An integral transform technique is employed to reduce the problem under consideration to dual integral equations. By solving the resulting dual integral equations, the intensity factors of the stress and the electric displacement and the energy release rate as well as the crack sliding displacement and the electric voltage across the crack surfaces are obtained in explicit form for the case of concentrated forces and free charges at the crack surfaces and at the boundary. The derived results can be taken as fundamental solutions which can be superposed to model more realistic problems. Received 10 November 2000; accepted for publication 28 March 2001     

Antiplane crack at the interface of two bonded dissimilar graded piezoelectric materials

The problem of an antiplane crack situated in the interface of two bonded dissimilar graded piezoelectric half-spaces is considered under the permeable crack assumption. The mechanical and electrical properties of the half-spaces are considered for a class of functional forms for which the equilibrium equation has analytic solutions. By using an integral transform technique, the problem is reduced to dual integral equations which are transformed into a Fredholm integral equation by introducing an auxiliary function. The stress intensity factors are obtained in explicit form in terms of auxiliary functions. By solving the Fredholm integral equation numerically, the numerical results for stress intensity factors are obtained which have been displayed graphically to show the influence of the graded piezoelectric materials.     

Problems of collinear cracks between bonded dissimilar materials under antiplane concentrated forces

In this paper problems of cullinear cracks between bonded dissimilar materials underantiplane concentrated forces are dealt with.General solutions of the problems areformulated by applying extended Schwarz principle integrated with the analysis of thesingularity of complex stress functions.Closed-form solutions of several typical problemsare obtained and the stress intensity factors are given.These solutions include a series oforiginal results and some results of previous researches.It is found that under symmetricalloads the solutions for the dissimilar materials are the same as those for the homogeneousmaterials.     

Problem on circular-arc cracks between bonded dissimilar materials under concentrated force and moment

The method is very efficient by applying extended Schwarz principle integrated with the analysis of the singularity of complex stress functions to solve some plane-elastic problems under concentrated loads, in Ref.[1], this method is used to deal with the elastic problems of homogeneous plane. In this paper, it is extended to the case of dissimilar materials with co-circular cracks under concentrated force and moment. For several typical cases the solutions of complex stress function in closed form are built up and the stress intensity factors are given. From these solutions, we provide a series of particular results, in which two of them coincide with those in Refs. [1] and [6].     

Solution of problem of two dissimilar materials bonded at one interface subjected to temperature

A solution of problem of two dissimilar materials bonded at one interface subjected to temperature is derived. To obtain a closed-form solution, a rational mapping function and a complex variable method are used. The coefficients of the homogeneous part of the stress function are expressed by Dunders’ parameters, but loading term of temperature is not expressed by them. As a demonstration, semi-strips bonded at one part at the ends are considered. The each strip is subjected to uniform temperature. Examples of stress distributions are shown. The relations of stress and temperature on the interface are described. Debondings on both sides of the interface are considered. Stress intensity of debonding (SID) is defined, and the values are investigated for various debonding lengths. And the debonding extension or the crack initiation into the material is investigated. The effects of material constants (Dundurs’ parameter) on SID are also investigated. By changing mapping function, other geometries can be analyzed.     

Numerical analysis of an electrode embedded between dissimilar electrostrictive materials

The asymptotic problem of an electrode that is embedded between dissimilar electrostrictive materials and subjected to electric loading is numerically analyzed by using the finite element method. Electrostatic analysis for the asymptotic problem is conducted under the small-scale saturation condition on the basis of the mathematical equivalence between anti-plane shearing and electrostatics. The distribution of the electric displacement fields is obtained. It is shown that the shapes of the saturation zones are affected by the ratios of the permittivities and the saturated electric displacements between the dissimilar electrostrictive materials. Stress fields that are generated for matching incompatible strains, which are induced by non-uniform electric displacement fields, are numerically calculated for various combinations of the material properties. Also, stress intensity factors for arbitrary small cracks that are initiated from the edge of an electrode are evaluated. Behaviors of cracking that may take place at the edge of an electrode are discussed.     

Crack initiation direction from interface of bonded dissimilar media

Debonded region of an interface between two dissimilar materials are modeled as a line crack that tends to enhance the initiation of failure by fracture. Depending on the load that interacts with dissimilar materials, no a priori knowledge of how failure would initiate from an existing interface crack is assumed. By application of the strain energy density criterion, potential crack initiation sites are obtained for different biaxial loading states and materials with dissimilar properties.Numerical results are obtained for an epoxy/aluminum medium. In each case, a finite line segment of debonding is assumed. Uniform stresses are applied normal and parallel to the interface so that a biaxial load factor k determines the relative magnitude of biaxiality. Positive and negative k correspond, respectively, to applied tension and compression parallel to the interface. For a fixed ratio of the elastic moduli, crack initiation angles measured from the interface would increase with positive k and decrease with an increase of negative k. These findings are presented for different values of k. The direction of maximum yield initiation could also be determined from the stationary values of the strain density function. These locations are identified with elements that undergo excessive distortion while the possible fracture sites are assumed to coincide with regions where dilatational effects would dominate.     

Semi-infinite moving crack between two bonded dissimilar isotropic strips

Meccanica - The problem of a moving semi-infinite crack between two bonded dissimilar isotropic strips has been considered. The mixed boundary value problem has been reduced to a standard...     

Anti-plane shear of kinked interface crack in bonded dissimilar anisotropic solid

Complex potentials are derived to describe the anti-plane singular shear stress fields around a kinked crack, the main portion of which is embedded along the interface of two dissimilar anisotropic elastic media. This is accomplished by formulating the problem as singular integral equations with generalized Cauchy kernels. The shear stress singularity at the kink differs from the familiar inverse square root of the local distance; it is found to influence the magnitude of the Mode III crack tip stress intensity factor, K₃. Numerical results of K₃ are obtained and displayed in graphical forms for different degree of material anisotropy and crack dimensions.     

Anti-plane shear of an arbitrary oriented crack in a functionally graded strip bonded with two dissimilar half-planes

An internal crack located within a functionally graded material (FGM) strip bonded with two dissimilar half-planes and under an anti-plane load is considered. The crack is oriented in an arbitrary direction. The material properties of strip are assumed to vary exponentially in the thickness direction and two half-planes are assumed to be isotropic. Governing differential equations are derived and to reduce the difficulty of the problem dealing with solution of a system of singular integral equations Fourier integral transform is employed. Semi closed form solution for the stress distribution in the medium is obtained and mode III stress intensity factor (SIF), at the crack tip is calculated and its validity was verified. Finally, the effects of nonhomogeneous material parameter and crack orientation on the stress intensity factor are studied.     

Out-of-plane interface cracks in dissimilar piezoelectric materials

Summary This paper investigates the problem of an anti-plane interfacial crack between two dissimilar piezoelectric material layers. A single crack is first considered. The effect of interaction of two collinear cracks in the medium on the field intensity factors is investigated. The solutions of several particular cases, including an infinite piezoelectric bi-material and a piezoelectric material bonded to an elastic medium, are given. The bi-material constants governing the behavior of the crack tip fields are identified. By considering the crack as a notch of finite thickness, it is shown that the thickness of the notch has a pronounced influence on the crack tip field. The results for the assumption of a permeable crack represent the limit case where the notch thickness is reduced to zero.BLW would like to thank the National Science Foundation of China (#10102004) and the City University of Hong Kong (DAG #7100219) for the support of this work. YGS also thanks the Multidiscipline Scientific Research Foundation Project (HIT. MD 2001. 39) of the Harbin Institute of Technology and the SRF for ROCS, SEM.accepted for publication 3 April 2003     

Driving forces and kinking of an oblique crack in bonded nonhomogeneous materials

Summary  Plane elasticity solutions are presented for the problem of an oblique crack in two bonded media. The material model under consideration consists of a homogeneous half-plane with an arbitrarily oriented crack and a nonhomogeneous half-plane. The Fourier integral transform method is employed in conjunction with the coordinate transformations of field variables in the basic elasticity equations. Formulation of the crack problem results in having to solve a system of singular integral equations for arbitrary crack surface tractions. A crack perpendicular to or along the bonded interface between the homogeneous and nonhomogeneous constituents arises as a limiting case. In the numerical results, the values of mixed-mode stress intensity factors are provided for various combinations of relevant geometric and material parameters of the bonded media. Subsequently, the infinitesimal kinks from the tips of a main crack are presumed, with the corresponding local driving forces being evaluated in terms of the stress intensities of the main crack. The criterion of maximum energy release rate is applied with the aim of making some conjectures concerning the likelihood of kinking and the probable kink direction based on the approximation of local homogeneity and brittleness of the crack-tip behavior. Received 25 September 2001; accepted for publication 13 February 2002