Frontal cationic curing of epoxy resins

We studied the frontal curing of trimethylolpropane triglycidyl ether (TMPTGE) using two BF₃‐amine initiators and two fillers, kaolin and fumed silica. In the case of kaolin, the range of concentrations allowing for frontal polymerization to propagate was dependent on its heat absorption effect whereas in the case of silica it was a consequence of the rheological features of this additive. However, for both systems the velocity and front temperature show the same trends; in all cases front velocities were on the order of 1 cm/min with front temperatures about 200 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2000–2005, 2010     

New curing agents for epoxy resins: protoporphyrins

Two similar macrocycles protoporphyrin IX and zinc protoporphyrin IX (ZPP) have been used as cross‐linking agents for curing the epoxy resin of bisphenol A diglycidyl ether (BADGE, n = 0). The enthalpies and the activation energies of the esterification reaction of the 2 systems are very close to each other. However, the temperature of the minimum in the differential scanning calorimetry thermogram is 38°C lower for BADGE (n = 0)/ZPP, thus requiring a less energy expenditure for curing the system. By the contrary, the enthalpy and activation energies for the etherification reaction are lower and higher, respectively, for BADGE (n = 0)/ZPP suggesting that the zinc ion affects it, although the involved mechanism is unknown.     

Influence of curing conditions on the morphology and physical properties of epoxy resins modified with a liquid polyamine

A diglycidyl ether of bisphenol-A (DGEBA) epoxy resin has been stoichiometrically cured with cycloaliphatic amine 4,4′-diamino-3,3′-dimethylcyclohexylmethane (3DCM) and modified with an amine terminated oligomer polyoxypropylenetriamine (POPTA) at a concentration of 15 wt %. Mixtures, postcured at the same temperature, have been precured at different temperatures. Phase separation takes place before gelation at all precure temperatures used. The variation in the glass transition region of the mixtures has been analyzed by dynamic mechanical measurements. Mechanical properties and fracture toughness of the modified mixtures have been related to their microstructural spherical features. Results are compared to those for the unmodified mixtures cured with different precure temperatures. © 1997 John Wiley & Sons, Inc.     

Curing behavior and kinetics of epoxy resins cured with liquid crystalline curing agent

This article describes the synthesis of a liquid crystalline curing agent 4,4′-bis-(4-amine-butyloxy)-biphenyl (BABB), and its application as a curing agent for the epoxy resin (DGEBA) in comparison with normal curing agent, 4,4′-diaminobiphenyl (DABP). BABB was investigated with polarized optical microscopy, differential scanning calorimetry, and small-angle X-ray scatting, and the results showed that BABB displayed smectic liquid crystalline phase. The curing behaviors of DGEBA cured with BABB and DABP were studied by using differential scanning calorimetry (DSC), polarized optical microscopy (POM), and dynamic mechanical analysis (DMA). The results indicated that BABB showed a higher chemical reactivity than DABP. The kinetics was studied under isothermal conditions using an isoconversional method, and the isothermal DSC data can be fitted reasonably by an autocatalytic curing model. The nematic droplet texture was observed for the resulting polymer network of DGEBA/BABB system, while the DGEBA/DABP system showed an isotropic state. The storage modulus of DGEBA/BABB system was enhanced in comparison with DGEBA/DABP system because of the formation of LC phase, whereas the glass transition temperatures decreased because of the introduction of flexible spacer group.     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

Evaluation of furfurylamines as curing agents for epoxy resins

Epoxy resin adhesives are widely used because of their strength, versatility, and ability to bond a variety of substrates. Furfurylamines represent a potential, new class of epoxy curing agents. Furfuryl amine (FA), tetrahydrofurfuryl amine (THFA), and 5,5′-methylenebis-2-furanmethanamine (DFA) were studied as possible epoxy curing agents. The utility of FA and THFA are limited by their volatility at the temperatures needed to effect cure of diglycidyl-ether of bisphenol A (DGEBA) based epoxy resins. DFA is a very effective epoxy curing agent with the ability to cure DGEBA at rates similar to that of standard epoxy curing agents such as liethylenetriamine.     

Anhydride curing of epoxy resins via chain reaction

In contrast to common curing reactions, the anhydride curing of epoxies follows a living anionic chain growth. The resulting consequences of this mechanism, i.e. (1) DP_n = a[M_o]/[I_o], (2) first-order kinetics and (3) Poisson chain-length distribution were tested with the phenyl glycidyl ether/phthalic acid anhydride system, using l-methyl imidazole. Overall agreement was found and the observed deviations could be explained with a modified Poisson process. Conformational properties of the resins were measured by static and dynamic light scattering and by viscometry. These were compared with the quantities of a corresponding branched system prepared with a mixture of phenyl glycidyl ether and bisphenol-A diglycidyl ether. Typical deviations to smaller dimensions were observed at high molar masses as a result of increasing branching.     

Synthesis of a caged bicyclic phosphates derived anhydride and its performance as a flame‐retardant curing agent for epoxy resins

A novel curing and flame‐retardant agent (PEPA‐TMAC) was successfully synthesized. The chemical structure was characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). Use of PEPA‐TMAC as part of the curing agent in combination with another anhydride for a commercial epoxy resin (EP) was studied. Results of differential scanning calorimetry (DSC) indicated that PEPA‐TMAC was an effective curing agent for EP. The dynamic mechanical analysis (DMA) results showed that the glass transition temperature (T_g) and cross‐linking density (V_e) of EP composites exhibited an increase trend with the addition of PEPA‐TMAC. The limiting oxygen index (LOI) value of EP composites reached 26.9%, and the cone calorimeter results indicated that peak heat release rate (PHRR), total heat release (THR), smoke produce rate (SPR), and total smoke produce (TSP) remarkably decreased with increasing PEPA‐TMAC content. TGA data showed that the addition of PEPA‐TMAC greatly increased the amount of residual char during combustion. The morphology of the residual char was studied by SEM and showed that the addition of PEPA‐TMAC greatly increased the stability of EP composites. The thermogravimetric analysis (TGA), energy‐dispersive X‐ray spectroscopy (EDS), and FTIR results revealed the flame‐retardant mechanism that PEPA‐TMAC can promote the formation of charred layers with the phospho‐carbonaceous complexes in the condensed phase during burning of EP composites.     

Network build-up and structure in curing of epoxy resins

The available branching theories and their application to curing of epoxy resins are reviewed. Special attention is paid to theoretical treatment and experimental results of curing with polyamines, polyetherification, and to curing with poly(carboxylic acid)s and cyclic anhydrides.     

Thermoanalytical study of an epoxy resin crosslinked with an aliphatic polyamine

Samples of the cured resins were prepared in the form of cast sheets. The concentration of the amine curing agent (triethylenetetramine) in the epoxy resin (bisphenol-A diglycidylether) was varied between 25 and 100% of the stoichiometric quantity. The cured resins were examined by differential scanning calorimetry, penetration under load as a function of temperature, and dynamic mechanical analysis. It is found that all of these methods provide a useful means of monitoring crosslinking through changes in the glass transition temperature. The dependence of some characteristic secondary relaxation temperatures, and the change in heat capacity at the glass transition, on the concentration of the amine were also investigated.     

Lanthanide–imidazole complexes as latent curing agents for epoxy resins

Imidazoles have for some time been recognized as curing agents for epoxy resins. Once the resin and the imidazole compound are mixed there is a relatively short time in which the mixture can be used, since the polymerization (curing) reaction occurs to some extent even at room temperature causing the reaction mixture to thicken. In order to circumvent this problem we have found that imidazoles can be complexed with organo-lanthanide compounds thereby tying up the imidazole and retarding its rate of reaction in the cure of epoxy materials at ambient temperatures. When it is desired to enhance the rate of cure the temperature of the mixture is simply raised. This paper concerns studies of the epoxy cure reaction with the M(THD)₃–IM series. M represents the lanthanide metals Eu, Ho, Pr, Dy, Yb, and Gd, and THD is 2,2,6,6-tetramethyl-3,5-heptanedione. Cure reactions were followed by differential scanning calorimetry and in some cases by infrared spectroscopy. We have demonstrated that these organo-lanthanide–imidazole complexes are effective thermally latent curing agents for epoxy resins. At a temperature of 150°C cure is quite rapid. In the course of these studies it has also been determined that there is an inverse correlation between the lanthanide ionic radius in the complex and the temperature at which the cure reaction occurs. Thus the Yb compound, where the imidazole is most strongly bound, cures at the highest temperature and Pr, where imidazole is bound most weakly, at the lowest. Consistent with these facts is the observation that the Yb compound also gives the longest latency period when mixed with epoxy resin.     

Mechanism of imidazole catalysis in the curing of epoxy resins

The mechanism of imidazole catalysis in the curing of epoxy resins was studied using the PGE/1-methylimidazole, 2-methylimidazole, and 1,2-dimethylimidazole model systems and another model system based on trichloromethylethylene oxide. It was demonstrated that imidazolium systems, generated in the curing reaction, show an inherent instability leading to cleavage of an N? C bond or the 2-C? H bond (2-unsubstituted imidazoles). Fourier-transform infrared spectroscopy was used to follow specific changes in the IR spectrum of the curing mixture during polymerization. The identification of carbonyl absorptions occurring during the polymerization led to the conclusion that ketone formation is a general occurrence in the cure of epoxides with nitrogen compounds. We have also shown that imidazoles are regenerated during the curing process by at least two routes. One pathway for the regeneration of the catalyst involves N-dealkylation of the imidazole via a substitution process. Another route, β-elimination, afforded carbonyl compounds, which account for the previously unexplained appearence of infrared bands in the 1650–1770 cm^?1 region during the curing process. These investigations demonstrated the true catalytic function of the imidazole. Possible mechanisms for the regeneration of the catalyst are also suggested.     

New flame retardant epoxy resins based on cyclophosphazene-derived curing agents

To obtain high-efficiency flame retardancy of epoxy resins, a cyclophosphazene derivative tri-(o-henylenediamino)cyclotriphosphazene (3ACP) was successfully synthesized and used as a curing agent for the thermosetting of an epoxy resin system. The flame retardant properties, thermal stability, and pyrolysis mechanism of the resultant thermosets were investigated in detail. The experiments indicated that the synthesized thermoset achieved a UL-94 V-0 rate under a vertical burning test as well as a limiting oxygen index (LOI) of 29.2%, which was able to reach V-0 even when a small amount of 3ACP was incorporated. Scanning electronic microscopic observation demonstrated that the char residue of the thermosets was extremely expanded after the vertical flame test. Thermal analysis showed that the samples had a lower initial decomposition temperature when 3ACP was introduced into the epoxy resin systems. This indicates that the carbonization ability of the thermosets was significantly improved at elevated temperatures. In addition, the incorporation of 3ACP can effectively suppress the release of combustible gases during the pyrolysis process, and the decomposition of E-44/DDS-3ACP curing systems also promotes the formation of polyphosphoramides charred layer in the condensed phase. The investigation on the chemical structures of both the gaseous and condensed phase pyrolysis process confirmed the flame-retardant mechanism of the 3ACP-cured epoxy resins. Therefore, the nonflammable halogen-free epoxy resin developed in this study has potential applications in electric and electronic fields for environment protection and human health.     

Enhanced properties of phthalonitrile resins under lower curing temperature via complex curing agent

High curing temperature has been restricting the application and development of phthalonitrile resin. A complex curing agent containing melamine (ME) and ZnCl₂ was developed to promote the curing reaction of resorcinol‐based phthalonitrile resin (DPPH). The thermal stability of ME can be significantly enhanced via adding ZnCl₂, which was due to the interaction between ZnCl₂ and amino group in ME. Moreover, the activities of pristine ZnCl₂ and ME were improved via mixing, especially, the curing temperature for DPPH can be effectively reduced. Even at a curing temperature of 300°C, the 5% weight loss temperature of the resulting resin cured with complex curing agent still exceeded 500°C, which was much higher than those with pristine curing agents. In addition, the good long‐term oxidation stability and relatively low water absorption can also be obtained in the resins cured with novel curing agent. This work affords a facile route for designing high‐performance curing agent to improve the curing process of phthalonitrile resin.     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

One component photo‐curing agent for epoxy resins based on multifunctional photobase generators containing oxime–urethane groups

In order to develop a one‐component photo‐curing system for epoxy resin, the photo‐crosslinking reactions of the diglycidyl ether of bisphenol A (DGEBA) in the presence of a multifunctional photobase generator (PBG) containing oxime–urethane groups were studied. The cross‐linking of DGEBA films and adhesion properties of DGEBA formulations containing the PBG and benzophenone increased with irradiation dose, post‐exposure baking (PEB) time, PEB temperature, and the number of oxime–urethane groups in the PBG. A synergistic effect was observed between the PBG and a base amplifier on the film cross‐linking of DGEBA. A trifunctional PBG containing oxime–urethane groups was found to be the most efficient PBG in terms of the photo‐crosslinking and adhesion properties of the DGEBA‐based formulations. Moreover, the devised formulations, including the PBG and benzophenone, were stable for at least 1 month at room temperature. The photocuring system developed in this study appears to offer a one‐pack epoxy resin curing system with practical useful properties. Copyright © 2009 John Wiley & Sons, Ltd.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

The kinetics of model reactions of curing epoxy resins with amines

The isothermal course of the reaction of phenylglycidyl ether and N,N-methylglycidylaniline with dibutyl amine at various temperatures was investigated DSC. The data were treated on the basis of a reaction scheme with two processes in parallel, one of them auto-catalyzed. A good fit with the experiment was reached only when the order of both processes with respect to amine had been reduced to half its original value. An assumption that the kinetics of the amine-epoxy resin rection are considerably affected by the formation of various complexes through hydrogen bonds may be an explanation. A simple mathematical model has been suggested to estimate this influence. Because of the relatively high heats of interaction for the formation of complexes, the dependence of the measured heat on the degree of conversion is not linear. The magnitude of the error caused by neglecting this fact in investigation of the kinetics by DSC has been estimated.     

In-situ monitoring of the curing of epoxy resins by Raman spectroscopy

Polymerization reactions are based on complex processes that are somewhat difficult to predict via mathematical models, especially without experimental data. A method to investigate the cure of epoxies via in-situ Raman spectroscopy has been developed.Differential Scanning Calorimetry (DSC) is the industry-standard method for determining the cure of a polymer, but it is a labor-intensive method that is also fairly slow. Raman spectroscopy was used to monitor the cure chemistry of DGEBA (Diglycidyl Ether of Bisphenol A) and to observe in-situ the evolution of the reticulation.