High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity,low coefficient of thermal expansion,and low dielectric loss

High‐performance insulating materials have been increasingly demanded by many cutting‐edge fields. A new kind of high‐performance composites with high thermal conductivity, low coefficient of thermal expansion (CTE), and low dielectric loss was successfully developed, consisting of hexagonal boron nitride (hBN) and 2,2′‐diallylbisphenol A (DBA)‐modified 4,4′‐bismaleimidodiphenylmethane (BDM) resin. The effects of hBN and its content on the integrated properties, including curing behavior of uncured system, the CTE, thermal conductivity, dielectric properties, and thermal resistance of cured composites, are systematically investigated and discussed. Results show that there are amino groups on the surface of hBN, which supply desirable interfacial adhesion between hBN and BDM/DBA resin and a good dispersion of hBN in the resin. With the increase of the hBN content, the thermal conductivity increases linearly, whereas the CTE value decreases linearly; in addition, dielectric loss gradually decreases and becomes more stable over the whole frequency from 10 to 10⁹ Hz. In the case of the composite with 35 wt% hBN, its thermal conductivity, CTE in glassy state, and dielectric loss are about 3.3, 0.63, and 0.5 times of the corresponding value of BDM/DBA resin, respectively. These attractive integrated properties suggest that hBN/BDM/DBA composites are high‐performance insulating materials, which show great potential in applications, especially for electronics and aerospace industries. Copyright © 2011 John Wiley & Sons, Ltd.     

The thermal and dielectric properties of high performance cyanate ester resins/microcapsules composites

Novel high performance bisphenol A dicyanate ester (BADCy) resins/poly(urea-formaldehyde) microcapsules filled with epoxy resins (MCEs) composites have been prepared. The effects of different contents of MCEs on the thermal and dielectric properties of cured BADCy were investigated using dynamic mechanical analyzer (DMA), thermalgravimetric analyzer (TGA) and broadband dielectric analyzer. The dielectric properties of BADCy/MCEs treated in hot water and hot air were also discussed. The morphologies of BADCy/MCEs composites were characterized by scanning electron microscopy (SEM). Results indicate that the appropriate content of MCEs can improve or maintain the thermal stability, the low dielectric constant and dielectric loss of cured BADCy mainly owing to higher conversion of cyanate ester (-OCN) groups. After aged in hot water and hot air, respectively, BADCy/MCEs composites with small content of MCEs can retain the low dielectric constant and dielectric loss.     

Novel preparation of glass fiber reinforced polytetrafluoroethylene composites for application as structural materials

A novel method was developed to fabricate continuous glass fiber reinforced polytetrafluoroethylene (PTFE/GF) composites which includes the use of conventional sintering and vacuum assisted resin transfer molding (VARTM), successively. The RTM resin (coded as M4506‐1) “fills” the porosity and defects of original PTFE/GF composites prepared by traditional sintering processing, improves the overall interface bonding between the matrix and fibers, and thus significantly improves the mechanical properties such as the flexural and interlaminar shear strength of fiber reinforced PTFE composites. The present work suggests a new way to produce fiber (especially continuous fiber) reinforced PTFE composites with high mechanical properties, and thus make it potentially possible to use PTFE‐based composites as structural materials. Copyright © 2008 John Wiley & Sons, Ltd.     

Barium Titanate-reinforced Acrylonitrile-Butadiene Rubber: Synergy Effect of Carbon-based Secondary Filler

Acrylonitrile rubber(NBR) composites filled with barium titanate(BT) were prepared using an internal mixer and a two-roll mill. Also, a secondary filler, namely carbon nanotubes(CNT), was added in order to find a potential synergistic blend ratio of BT and CNT. The cure characteristics, tensile and dielectric properties(dielectric constant and dielectric loss) of the composites were determined. It was found that NBR/BT composites with CNT secondary filler, at a proper BT:CNT ratio, exhibited shorter scorch time(t_(s1)) and cure time(t_(c90)) together with superior tensile properties and reinforcement efficiency, relative to the one with only the primary filler. In addition, the NBR/BT-CNT composite with 80 phr BT and 1-2 phr CNT had dielectric constant of 100-500, dielectric loss of 12-100 and electrical conductivity below 10~(-4) S/m together with high thermal stability. Thus, with a proper BT:CNT mix and filler loading, we can produce mechanically superior rubber composites that are easy to process and low-cost, for flexible dielectric materials application.     

Synthesis of composite of ZnO spheres with polyaniline and their microwave absorption properties

Three-dimensional (3D) ZnO microspheres with the composite of polyaniline (PANI) have been successfully synthesized by one-pot solvothermal and in-suit polymerization method. The obtained microspheres were uniform having the diameter of 4 μm–7 μm. These microspheres, inside cushion of PANI polymer, exhibit excellent microwave absorption properties. Composite of ZnO microspheres with PANI increased the complex permeability and enhanced the dielectric loss. Thus, the microwave absorption properties of the composite have been intensified. Despite the fact that the composite of ZnO with PANI herein dissipate the microwaves by dielectric loss, their performance is admirable compared to most of PANI-based composites reported. The morphological, structural and spectral properties have been investigated using scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD) and the Fourier transform infrared (FT-IR). It is found that the maximum reflection loss value of [email protected] reaches ?41 dB at 14 GHz with a thickness of 3.5 mm that is superior to the previously reported composite of PANI with other materials.     

Preparation, microstructure, and properties of novel low-κ brominated epoxy/mesoporous silica composites

Brominated epoxy resin (BER) composites containing various amounts of SBA-15 and SBA-16 types mesoporous silicas were prepared through the thermal curing with 3-methyl-tetrahydrophthalic anhydride, and their morphologies, dielectric constants (κ), thermal properties and mechanical properties were studied. The investigation suggested that the dielectric constant could be reduced from 4.09 of the pure thermosetting BER to 3.74 and 3.7 by incorporating 3 wt.% SBA-15 and SBA-16, respectively. The reduction of the dielectric constant is attributed to the incorporation of the air voids (κ = 1) stored within the mesoporous silica materials, the air volume existing in the gaps on the interfaces between the mesoporous silica and the BER matrix, and the free volume created by introducing large-sized domains. The BER/mesoporous silica composites also present stable dielectric constants across the wide frequency range. An improvement of thermal stability of the BER is achieved by incorporation of the mesoporous silica materials. The enhanced interfacial interaction between the surface-modified mesoporous silica and the BER matrix has also led to an improvement of the toughness.     

Improved dielectric and mechanical properties of polystyrene-hybrid silica sphere composite induced through bifunctionalization at the interface

Hybrid silica spheres (HS) of size 270-350 nm with vinyl and aminopropyl surface groups were incorporated in polystyrene (PS), and its effect on dielectric properties, coefficient of thermal expansion (CTE), and strength of PS-HS composite was studied. Incorporation of HS in PS followed a decrease in the dielectric constant from 3.2 for PS to 2.6 for composite with 7.5 vol % HS. The decrease in the dielectric constant was attributed to (i) increased interfacial porosity, (ii) formation of anhydrous HS having low dielectric constant, during hot processing of the composites, and (iii) dispersion and preservation of the anhydrous HS in the hydrophobic matrix. The dielectric constant of the composites with HS content up to 7.5 vol % does not vary much with temperature in the range from -20 to 65 °C. These composites also exhibited reduced CTE and improved flexural strength/stiffness due to good interfacial bonding through HS vinyl groups and dispersion of the filler in the matrix. The dielectric loss increased with HS content, and the loss measured for 7.5 vol % PS-HS composite was 6 × 10(-3), as compared to 10(-4) for PS. At HS loading above 7.5 vol %, the tendency of HS to agglomerate and form percolated structure lead to an increase in the dielectric constant and decrease in the mechanical properties of the composites.     

Enhanced dielectric performance of TPU composites filled with Graphene@poly(dopamine)-Ag core-shell nanoplatelets as fillers

A new type of graphene@poly(dopamine)-Ag (Gns@PDA-Ag) core-shell nanoplatelets was designed to improve the dielectric properties of thermoplastic polyurethane (TPU) composites. The microstructure, dielectric performances and the effects of Ag nanoparticles’ content on the dielectric properties of composites were investigated. Results showed that the addition of Gns@PDA-Ag nanoplatelets could effectively improve the dielectric constant of the composite. When tested at low frequency (below 100 Hz), the highest dielectric constant of the TPU/Gns@PDA-0.78Ag (3 wt%) composite was 118.82, which was 14 times higher than that of pure TPU (8.39). This increase in dielectric constant should be attributed to the strong polarization effect of conductive graphene nanoflakes (Gns) and Ag nanoparticles to TPU molecules. The PDA shell could prevent direct contact between Gns and Ag nanoparticles, limit the formation of conductive pathways, which kept the dielectric loss of the composites at a low level and maintained the breakdown strength in a stable state. Compared with pure TPU (0.29), the minimum dielectric loss of composites was only 0.36. Moreover, after Gns@PDA-Ag nanoplatelets with higher Ag content were doped into TPU, the composite showed a higher dielectric constant, and due to the existence of the Coulomb blocking effect, the dielectric loss did not increase significantly. The scalability and simplicity of the described method will provide a promising route to polymer composites for highspeed integrated circuits and energy storage applications.     

铁酸镍/碳复合中空多壳层结构的制备及吸波性能

采用次序模板法合成了单、双壳层的中空铁酸镍(NiFe₂O₄)材料,通过改变前驱体溶液组成及煅烧条件等因素实现了对产物形貌的调控.在中空NiFe₂O₄颗粒表面原位包覆聚多巴胺,再经过碳化处理,制备了具有中空多壳层结构(HoMS)的NiFe₂O₄/C复合吸波材料;考察了其电磁参数,计算了其吸波性能,分析了不同复合结构对性能的影响.结果表明,中空多壳层结构能够显著降低材料的密度,而碳薄层不仅能够改善其阻抗匹配性,而且提升了材料的反射损耗性能.其中,双壳层NiFe₂O₄/C复合物的吸波性能最佳,当样品厚度为3.5 mm时,材料在8.44 GHz处反射损失最小,为-32.35 dB;当样品厚度为2.0 mm时,材料在14.01～17.69 GHz范围内反射损耗小于-10 d B,有效吸收频宽为3.68 GHz.这些优异性能主要源于独特的中空多壳层结构增加了电磁波多次反射/散射的概率,提供了更多的界面极化,实现了电磁波的快速...     

Achieving full effective microwave absorption in X band by double-layered design of glass fiber epoxy composites containing MWCNTs and Fe3O4 NPs

The glass fiber epoxy composites containing MWCNTs and Fe₃O₄ NPs were manufactured by composites liquid molding process. The microwave absorbing properties of single-layered and double-layered glass fiber/MWCNTs/epoxy and glass fiber/Fe₃O₄ NPs/epoxy composites were evaluated. The reflection loss(RL) were calculated by the measured complex permittivity and permeability using waveguide method by vector network analyzer. Based on the mechanism analysis and deficiency of single-layer absorber, the double-layered composites were fabricated by using matching layer and absorbing layer to enhance the microwave absorption performance, which can be modulated by tailoring the electromagnetic parameters and thicknesses of each layer. The optimized microwave absorbing properties of double-layered composites with minimum RL of −45.7 dB and full X-band effective absorption can be achieved when the total thickness of the matching layer and absorbing layer is 1.8 mm, which can be attributed to synergistic effect of improved impedance matching characteristic and superior microwave attenuation characteristic of the absorbing layer. The combined utilization of dielectric loss and magnetic loss absorbent and their double-layered structure design shows great design flexibility and diversity and can be a promising candidate for designing high performance microwave absorbing materials.     

Structural and tribological properties of polytetrafluoroethylene composites in atomic oxygen environment

Effects of atomic oxygen (AO) irradiation on the structural and tribological behaviors of glass fiber (GF) and MoS₂ filled polytetrafluoroethylene (PTFE) composites were investigated in a ground‐based simulation facility, in which the average energy of AO was about 5 eV and the flux was 5.0 × 10¹⁵ cm^–2 s^–1. The structural changes were characterized by XPS and attenuated total‐reflection Fourier transform infrared spectroscopy, and the tribological changes were evaluated by friction and wear tests and SEM analysis of the worn surfaces. It was found that AO irradiation induced the degradation of PTFE molecular chains, and the primary erosion mechanism is collisionally induced rather than chemically induced. The addition of MoS₂ filler significantly increased the AO resistance of PTFE composites. Friction and wear tests indicated that GF and MoS₂ improved the tribological properties of materials before and after AO irradiation. Short GF and MoS₂ exhibited a good synergistic effect for improving the AO resistant and tribological properties of PTFE material. Copyright © 2012 John Wiley & Sons, Ltd.     

Ku-band EMI shielding effectiveness and dielectric properties of Polyaniline-Y2O3 composites

Electromagnetic interference (EMI) shielding has become a phenomenon of great concern and there is growing demand towards the synthesis of materials with better EMI shielding effectiveness (EMI SE). This work highlights the preparation of Polyaniline-Yttrium Oxide (PANI-Y₂O₃) composites for EMI shielding applications in the frequency range from 12.4 to 18 GHz (Ku-band). The structure and morphology of the composites were investigated by Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). EMI SE, microwave absorption and reflection, dielectric properties of the composites are discussed in detail. All the computations were based on microwave scattering parameters measured by transmission line waveguide technique. The observed results show absorption dominant EMI shielding in these composites with EMI SE of ?19 to ?20 dB, which mainly depends on the dielectric loss of the composites. Through the results of our observations, we propose these composites to be potential materials for microwave absorption and EMI shielding applications.     

Adjustable Plane Curvature of Covalent Organic Framework Enabling Outstanding Dielectric,Electret, and High-Temperature Processing Properties

With the rapid development of integrated circuits towards miniaturization and complexity, there is an urgent need for materials with low dielectric constant/loss and high processing temperatures to effectively prevent signal delay and crosstalk. With high porosity, thermal stability, and easy structural modulation, covalent organic frameworks have great potential in the field of low dielectric materials. However, the optimization of dielectric properties by modulating the conjugated/plane curvature structure of covalent organic frameworks (COFs) has rarely been reported. Accordingly, we herein innovatively prepare COF films with adjustable planar curvature, hence possessing ultralow dielectric constant (1.9 at 1 kHz), ultralow dielectric loss at 1 kHz (0.0029 at room temperature, 0.0052 at 200 °C), high thermal decomposition temperature (5 % weight loss temperature, 473 °C) and good hydrophobicity (water contact angle, 105.3°). Also, to the best of our knowledge, we are the first to report that the resulting COF film enables high surface potential (≈320 V) for one week, attributing to its intrinsic high porosity, thus presenting great potential in electret applications. Accordingly, this innovative work provides a readily available and scalable idea to prepare materials with comprehensively excellent dielectric and electret properties as well as high processing temperatures simultaneously for advanced electronic device applications.     

锰掺杂Ba0.6Sr0.4TiO3-MgTiO3复相陶瓷的制备和介电性能

以分析纯的Ba(NO3)2、Sr(NO3)2、草酸和钛酸丁酯为原料, 采用草酸盐共沉淀法制备了钛酸锶钡（Ba0.6Sr0.4TiO3, BST）纳米粉体. XRD和SEM分析结果表明, 该方法制备出立方相的Ba0.6Sr0.4TiO3粉体, 平均粒径小于100 nm, 具有较高的烧结活性. 用传统固相法制备了锰掺杂钛酸锶钡-钛酸镁(Ba0.6Sr0.4TiO3-MgTiO3, BST-MT)复相陶瓷, 系统研究了掺杂0.1%-2.0%(x, 摩尔分数, 下同)锰对钛酸锶钡-钛酸镁复相陶瓷微观形貌和介电性能的影响机理. 结果表明, 当锰的掺杂量小于1.5%时, Mn作为受主掺杂取代占据钙钛矿ABO3的B位, 因此导致居里点略微向高温偏移和相变扩散的发生, 锰的掺杂导致晶格畸变, 促进了晶粒生长, 使晶界相比例下降, 因此介电损耗随着锰掺杂量的增大而减小; 当锰的掺杂量为1.5%时, 介电损耗达到最小值, 继续增大掺杂量, 介电常数下降, 介电损耗上升.     

聚(金属酞菁)酰亚胺/碳纳米管复合材料的制备及介电性能

以四氨基铜(锌)酞菁为四胺单体, 与4,4'-二苯醚二胺(4,4'-ODA)和二苯醚四酸酐(ODPA)进行共聚, 合成了聚(金属酞菁)酰亚胺. 由于金属酞菁的引入, 聚(铜酞菁)酰亚胺和聚(锌酞菁)酰亚胺的介电常数均高于传统聚酰亚胺(PI). 以聚(铜酞菁)酰亚胺为基体, 采用溶液共混的方法, 制备了一系列碳纳米管/聚(铜酞菁)酰亚胺复合材料, 碳纳米管较为均匀地分散在聚合物基体中. 复合材料具有良好的介电性能, 掺杂碳纳米管质量分数为20%的复合材料的介电常数达到200, 介电损耗为2.25.     

基于多层结构设计的高储能密度氧化石墨烯/聚酰亚胺复合材料

采用逐层涂布、 分层控制固化程度的方法, 利用聚酰胺酸(PAA, 聚酰亚胺前体)溶液和含有氧化石墨烯（GO）的PAA溶液制备了一系列由高绝缘性PI层与GO@PI介电层交替组合而成的界面清晰且紧密衔接的多层复合薄膜. 通过调控介电层中GO含量及分层结构, 使多层复合薄膜兼具高介电常数和高击穿强度特征. 结果表明, 三层复合薄膜PI/1.0GO@PI/PI的击穿强度为261.5 kV/mm, 储能密度达到1.27 J/cm³, 与相同介电层厚度的单层薄膜相比, 击穿强度和储能密度分别提高了97%和144%, 同时, 其介电损耗也保持在较低水平(tanδ=0.0079). 绝缘层和高介电常数层的协同作用提升了氧化石墨烯/聚酰亚胺复合薄膜的储能密度. 这种简单的多层结构设计有利于氧化石墨烯/聚合物复合材料在介质储能领域的应用.     

多孔羰基铁/CoFe2O4/聚苯胺复合材料的制备及吸波机理

通过金属点蚀技术制备了表面多孔形貌的羰基铁粉（PCIP）,并采用共沉淀及原位聚合方法,将CoFe₂O₄与聚苯胺（PANI）负载于多孔羰基铁表面,得到具有电磁吸收性能的PCIP/CoFe₂O₄/PANI复合材料.通过扫描电子显微镜（SEM）、X射线衍射仪（XRD）、傅里叶变换红外光谱仪（FTIR）、热重分析仪（TGA）及矢量网络分析仪（VNA）等对复合材料的形貌、成分和吸波性能进行了研究.结果表明,CoFe₂O₄/PANI团聚于PCIP表面,显著提升了复合材料电损耗能力,促进了低频电磁波的1/4波长干涉相消.当苯胺添加量为0.5 mL,复合材料在频率为5.7 GHz时,反射损耗达到-22.9 dB,低频吸波性能得到大幅提升.利用1/4波长干涉相消理论及电磁波界面反射模型对复合材料低频吸波性能提升的内在原因进行了分析.     

Morphology studies and ac electrical property of low density polyethylene/octavinyl polyhedral oligomeric silsesquioxane composite dielectrics

This paper presents the results of morphological and ac electrical investigations on low density polyethylene (LDPE) composites with octavinyl polyhedral oligomeric silsesquioxane (POSS). It has been shown that at low loadings, the frequency dependence of dielectric constant and dielectric loss for the LDPE/POSS composites showed unusual behaviors when compared with conventional (micro-sized particulates) composites. The ac breakdown strength was measured and statistical analysis was applied to the results to determine the effects of POSS loadings on the dielectric strength of LDPE. The morphological characterization showed that the presence of POSS additives apparently altered the supermolecular structure of LDPE and resulted in more homogeneous morphology when compared with the neat LDPE. The structure-property relationship was discussed and it was concluded that the final dielectric properties of the composites were determined not only by the incorporation of POSS additives but also by the supermolecular structure of LDPE. Rheological analyses of LDPE/POSS composite were also performed and the results showed that the octavinyl-POSS had good compatibility with LDPE.     

锰掺杂Ba0.6Sr0．4TiO3-MgTiO3复相陶瓷的制备和介电性能

以分析纯的Ba(NO3)2、Sr(NO3)2、草酸和钛酸丁酯为原料,采用草酸盐共沉淀法制备了钛酸锶钡(Ba0.6Sr0.4tiO3,BST)纳米粉体.XRD和SEM分析结果表明,该方法制备出立方相的Ba0.6Sr0.4TiO3粉体,平均粒径小于100 nm,具有较高的烧结活性.用传统固相法制备了锰掺杂钛酸锶钡.钛酸镁(Ba0.6Sr0.4TiO3-MgTiO3,BST-MT)复相陶瓷,系统研究了掺杂0.1%-2.0%(x,摩尔分数,下同)锰对钛酸锶钡-钛酸镁复相陶瓷微观形貌和介电性能的影响机理.结果表明,当锰的掺杂量小于1.5%时,Mn作为受主掺杂取代占据钙钛矿ABO3的B位,因此导致居里点略微向高温偏移和相变扩散的发生,锰的掺杂导致晶格畸变,促进了晶粒生长,使晶界相比例下降,因此介电损耗随着锰掺杂量的增大而减小;当锰的掺杂量为1.5%时,介电损耗达到最小值,继续增大掺杂量,介电常数下降,介电损耗上升.     

Polyamide-11/lead zirconate titanates—a novel composite material with high dielectric properties

Polymeric composites gain increasing interest in materials research and practice applications due to combining excellent electric property of piezoelectric ceramic and flexibility of polymer matrix. A novel decoupling capacitor with high dielectric constant has been developed by mixing polyamide-11 (PA11) with ferroelectric ceramic lead zirconate titanates (PZT). The composite demonstrates high dielectric constant, with better frequency stability and low dielectric losses. The dependence of the dielectric constant on frequency and polymer fraction was investigated. The excellent dielectric constant of 100 and the dielectric loss of 0.1 can be obtained at a PA11 volume fraction of 0.4. The enhanced dielectric behavior originates from good connection between ferroelectric ceramic and PA11 Dielectric losses of the PZT/PA11 composites change slightly with the test frequency. Our findings suggest that the created polymeric composites with relatively high dielectric constant represent a novel type of material that is flexible and easy to process. Moreover, is suited to applications in advanced decoupling capacitors and flexible electronics.