Barrier height homogeneity for 4.5 kV 4H-SiC Schottky diodes

4.5 kV SiC Schottky diodes have been fabricated using Ni as the Schottky contact. A manufacturing yield of 40% is reached for the bigger area diodes (1.6×1.6 mm²) and of 70% for the smaller ones (0.4×0.4 mm²). The measured variations of barrier height and ideality factor with temperature do not agree with the thermionic model. This has been interpreted in terms of barrier height inhomogeneities using the Werner model. We extracted an average barrier height and its standard deviation . These two parameters are almost independent of the diode size. The variation of the barrier height distribution with field has also been investigated and shows a dependence similar to that of Schottky diodes realized from other semiconductor materials.     

Thermal annealing behaviour of Al/Ni/Au multilayer on n-GaN Schottky contacts

Recently GaN-based high electron mobility transistors (HEMTs) have revealed the superior properties of a high breakdown field and high electron saturation velocity. Reduction of the gate leakage current is one of the key issues to be solved for their further improvement. This paper reports that an Al layer as thin as 3 nm was inserted between the conventional Ni/Au Schottky contact and n-GaN epilayers, and the Schottky behaviour of Al/Ni/Au contact was investigated under various annealing conditions by current--voltage (I--V) measurements. A non-linear fitting method was used to extract the contact parameters from the I--V characteristic curves. Experimental results indicate that reduction of the gate leakage current by as much as four orders of magnitude was successfully recorded by thermal annealing. And high quality Schottky contact with a barrier height of 0.875 eV and the lowest reverse-bias leakage current, respectively, can be obtained under 12 min annealing at 450°C in N₂ ambience.     

Al/Ti/4H-SiC Schottky barrier diodes with inhomogeneous barrier heights

This paper investigates the current-voltage (I-V) characteristics of Al/Ti/4H-SiC Schottky barrier diodes (SBDs) in the temperature range of 77 K-500 K,which shows that Al/Ti/4H-SiC SBDs have good rectifying behaviour.An abnormal behaviour,in which the zero bias barrier height decreases while the ideality factor increases with decreasing temperature (T),has been successfully interpreted by using thermionic emission theory with Gaussian distribution of the barrier heights due to the inhomogeneous barrier height at the Al/Ti/4H-SiC interface.The effective Richardson constant A =154 A/cm 2 · K 2 is determined by means of a modified Richardson plot ln(I 0 /T 2)-(qσ) 2 /2(kT) 2 versus q/kT,which is very close to the theoretical value 146 A/cm 2 · K 2.     

Calculation of current–voltage characteristics of a Cu (II) complex/n-Si/AuSb Schottky diode

In this study, Cu (II) complex/n-Si structure has been fabricated by forming a thin organic Cu (II) complex film on n-Si wafer. It has been seen that the structure has clearly shown the rectifying behaviour and can be evaluated as a Schottky diode. The contact parameters of the diode such as the barrier height and the ideality factor have been calculated using several methods proposed by different authors from current–voltage (I–V) characteristics of the device. The calculated barrier height and ideality factor values from different methods have shown the consistency of the approaches. The obtained ideality factor which is greater than unity refers the deviation from ideal diode characteristics. This deviation can be attributed to the native interfacial layer in the organic/inorganic interface and the high series resistance of the diode. In addition, the energy distribution of the interface state density (N_ss) in the semiconductor band gap at Cu (II) complex/n-Si interface obtained from I–V characteristics range from 2.15 × 10¹³ cm⁻² eV⁻¹ at (E_c − 0.66) eV to 5.56 × 10¹² cm⁻² eV⁻¹ at (E_c − 0.84) eV.     

Electrical characteristics of the hydrogen pre-annealed Au/n-GaAs Schottky barrier diodes as a function of temperature

We investigated the passivation effects of hydrogen gas on the Au/n-GaAs Schottky barrier diodes in a wide temperature range. Reference diodes were prepared by evaporating barrier metal on semiconductor wafers un-annealed in N₂ gas atmosphere. The other diodes were made by evaporating barrier metal on n-GaAs semiconductor substrates annealed in H₂ atmosphere. Then, electrical measurements of all diodes were carried out by using closed-cycle Helium cryostat by steps of 20 K in the temperature range of 80-300 K in dark. The basic diode parameters such as ideality factor and barrier height were consequently extracted from electrical measurements. It was seen that ideality factors increased and barrier heights decreased with the decreasing temperature. The case was attributed to barrier inhomogeneity at the metal/semiconductor interface. Barrier heights of the diodes made from samples annealed in H₂ gas atmosphere were smaller than those of reference diodes at low temperatures. Here, it was ascribed to the fact that hydrogen atoms passivated dangling bonds on semiconductor surface in accordance with former studies.     

The study on Schottky contact between Au and clean CdZnTe

Au Schottky contact was deposited on the clean CZT (1 1 0) and (1 1 1) A surface by molecular beam epitaxy (MBE). The real Schottky barrier heights were measured to be 0.738 eV and 0.566 eV by Synchrotron radiation photoemission spectroscopy (SRPES) respectively. The constituents of (1 1 0) and (1 1 1) A surfaces were measured by XPS. The Te concentration on (1 1 1) A surface is higher than that of (1 1 0) surface. And the difference of chemical reactivity and charge transfer were identified by Au 4f_7/2, Cd 4d, Te 4d_5/2 core level shifts using SRPES. Using metal-induced gap states model, the results of experiment were explained.     

6H-SiC肖特基源漏MOSFET的模拟仿真研究

给出了一种新型SiC MOSFET——6H-SiC肖特基源漏MOSFET.这种器件结构制备工艺简单，避 免了长期困扰常规SiC MOSFET的离子注入工艺难度大、退火温度高、晶格损伤大，注入激活 率低等问题.分析了该器件的电流输运机理，并通过MEDICI模拟，给出了SiC肖特基源漏MOSF ET伏安特性以及其和金属功函数、栅氧化层厚度和栅长关系. 关键词： 碳化硅 肖特基接触 MOSFET 势垒高度     

Hydrogen peroxide treatment on ZnO substrates to investigate the characteristics of Pt and Pt oxide Schottky contacts

We utilize hydrogen peroxide (H₂O₂) treatment on (0 0 0 1) ZnO substrates to investigate the characteristics of Pt and Pt oxide Schottky contacts (SCs). X-ray rocking curves show the mosaicity structure becomes larger after H₂O₂ treatment. Photoluminescence (PL) spectra show the yellow-orange emission peaking at ∼576-580 nm with respect to deep level of oxygen interstitials introduced by H₂O₂ treatment. The threshold formation of ZnO₂ resistive layer on H₂O₂-treated ZnO for 45 min is observed from grazing-incidence X-ray diffraction. The better electrical characteristic is performed by Pt oxide SC with the larger barrier height (1.09 eV) and the lower leakage current (9.52 × 10⁻¹¹ A/cm² at −2 V) than Pt SC on the H₂O₂-treated ZnO for 60 min. X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometer (SIMS) examinations indicate the promoted interface oxide bonding and Zn outdiffusion for Pt oxide contact, different from Pt contact. Based on current-voltage, capacitance-voltage, X-ray diffraction, PL spectra, XPS, and SIMS results, the possible mechanism for effective rectifying characteristic and enhanced Schottky behavior is given.     

Effect of nanopatches on electrical behavior of Ni/n-type Si Schottky diode

Topological surface measurement of thin metal film using a conducting probe atomic force microscope (C-AFM) shows that thin metal film deposited on Ni/n-Si Schottky diode (SD) consists of patches. These patches are sets of parallel connected and electrically cooperating nano-contacts of size between 50 and 100nm. Every individual patch acts as an individual diode with different I-V curve, barrier height (BH) and ideality factor (n). Between these diodes or patches, there are spot field distributions; the patches with different local work functions are in direct electric contact with surrounding patches. As a result, a potential difference between surfaces of patches, the so-called electrostatic spot field E_f, is formed. It is shown that in real metal-semiconductor (MS) contacts, patches with quite different configurations, various geometrical sizes and local work functions are randomly distributed on the surface of metal; hence direction and intensity of spot field are non-uniformly distributed along the surface of metal. There is a linear dependence between barrier height and ideality factor, which is the consequence of reduction of distance of the maximum of BH from the interface. This dependency is the sign of reduction of contribution of a peripheral current.     

Photoluminescence ofn-GaAs at transparent Schottky contacts

Near-bandgap photoluminescence at 300 K of a Se-dopedn-GaAs crystal withn=4.8·10¹⁶ cm⁻³ was measured at a transparent CrAu−GaAs Schottky contact. The dependence of the luminescence intensity on the applied reverse voltage was recorded. Both the doping concentration and absorption coefficients above bandgap are determined.     

A1/Ti/4H-SiC Schottky barrier diodes with inhomogeneous barrier heights

This paper investigates the current-voltage （I-V） characteristics of Al/Ti/4H-SiC Schottky barrier diodes （SBDs） in the temperature range of 77 K-500 K, which shows that Al/Ti/4H SiC SBDs have good rectifying behaviour. An abnormal behaviour, in which the zero bias barrier height decreases while the ideality factor increases with decreasing temperature （T）, has been successfully interpreted by using thermionic emission theory with Gaussian distribution of the barrier heights due to the inhomogeneous barrier height at the A1/Ti/4H-SiC interface. The effective Richardson constant A＊ = 154 A/cm2 . K2 is determined by means of a modified Richardson plot In（I0/T2） - （qσ）2/2（κT）2 versus q/kT, which is very close to the theoretical value 146 A/cm2 · K2.     

Double threshold behaviour of I－V characteristics of CoSi2/Si Schottky contacts

The forward current－voltage (I－V) characteristics of polycrystalline CoSi₂/n-Si(100) Schottky contacts have been measured in a wide temperature range. At low temperatures (≤200K), a plateau-like section is observed in the I－V characteristics around 10^-4A·cm^-2. The current in the small bias region significantly exceeds that expected by the model based on thermionic emission (TE) and a Gaussian distribution of Schottky barrier height (SBH). Such a double threshold behaviour can be explained by the barrier height inhomogeneity, i.e. at low temperatures the current through some patches with low SBH dominates at small bias region. With increasing bias voltage, the Ohmic effect becomes important and the current through the whole junction area exceeds the patch current, thus resulting in a plateau-like section in the I－V curves at moderate bias. For the polycrystalline CoSi₂/Si contacts studied in this paper, the apparent ideality factor of the patch current is much larger than that calculated from the TE model taking the pinch-off effect into account. This suggests that the current flowing through these patches is of the tunnelling type, rather than the thermionic emission type. The experimental I－V characteristics can be fitted reasonably well in the whole temperature region using the model based on tunnelling and pinch-off.     

二硫化钨/石墨烯异质结的界面相互作用及其肖特基调控的理论研究

采用第一性原理方法研究了二硫化钨/石墨烯异质结的界面结合作用以及电子性质,结果表明在二硫化钨/石墨烯异质结中,其界面相互作用是微弱的范德瓦耳斯力.能带计算结果显示异质结中二硫化钨和石墨烯各自的电子性质得到了保留,同时,由于石墨烯的结合作用,二硫化钨呈现出n型半导体.通过改变界面的层间距可以调控二硫化钼/石墨烯异质结的肖特基势垒类型,层间距增大,肖特基将从p型转变为n型接触.三维电荷密度差分图表明,负电荷聚集在二硫化钨附近,正电荷聚集在石墨烯附近,从而在界面处形成内建电场.肖特基势垒变化与界面电荷流动密切相关,平面平均电荷密度差分图显示,随着层间距逐渐增大,界面电荷转移越来越弱,且空间电荷聚集区位置向石墨烯层方向靠近,导致费米能级向上平移,证实了肖特基势垒随着层间距的增加由p型接触向n型转变.本文的研究结果将为二维范德瓦耳斯场效应管的设计与制作提供指导.     

Studying of barrier height and ideality factor relation in the nano sized Au-n type Si Schottky diodes

The results of formation of the operating potential barrier height (Φ_в) of inhomogeneous Schottky diodes (SD) in view of an additional electric field in the near contact region of the semiconductor and features of its dependence on the external applied voltage are presented. A correlation, between SD heterogeneity and dependence between potential barrier height (Φ_в) and ideality factor (n), is presented. Using conducting probe atomic force microscope (CP-AFM) techniques, it is shown that Au/n-Si diodes consist of sets of parallel-connected and cooperating nano diodes with the contact surfaces sizes in the order of 100-200 nm. The effective Φ_в and ideality factors of the SD have been obtained from the current-voltage (I-V) characteristics, which were measured using a CP-AFM along a contact surface. It was experimentally shown that the forward and reverse part of I-V characteristics and their effective Φ_в and ideality factors of the identically fabricated nano-SD differ from diode to diode. The Φ_в for the nano-SD has ranged from 0.565 to 0.723 eV and ideality factor from 1.11 to 1.98. No correlation can be found between the Φ_в and ideality factor. The Φ_в distribution obtained from the I-V characteristics has been fitted by a Gaussian function but the ideality factor distribution could not be fitted by a Gaussian function.     

镍的锗化物与锗肖特基接触的工艺与特性

本文利用在n型Ge衬底上溅射金属Ni，然后在不同温度下氮气中退火的方法制备了Ni的锗化物肖特基二极管。X射线衍射（XRD）分析表明在Ge衬底上形成了一层Ni的锗化物。研究了退火温度对Ni的锗化物肖特基二极管电学特性的影响。实验结果表明具有典型I-V整流特性的肖特基二极管被获得，在300oC中退火的肖特基二极管的开关比最高。通过C-V方法提取了肖特基二极管的肖特基势垒高度。     

Ti/Al p-GaN Schottky barrier height determined by C–V measurements

Data are presented on the rigorous method of capacitance–voltage (C–V) measurements to the barrier height of Ti/Al p-GaN Schottky junction. For a sample with Hall concentration of 5.5 × 10¹⁶/cm³ the upper limit of the modulation frequency leading the full response of the activated carriers is defined as 1.5 kHz from the capacitance versus modulation frequency (C–f) plot. The activation energy of the Mg acceptors determined from the temperature-dependent C–f plot is 0.12 eV. The barrier height estimated with this activation energy and the intercept voltage of the 1/C²–V plot drawn with the 1.5 kHz C–V data is 1.43 eV at 300 K and 1.41 eV at 500 K. This is the most reliable barrier height ever reported. A reliable room temperature C–V doping profile is demonstrated using the 1.5 KHz modulation, which is sensitive enough to resolve the presence of a 15 nm thin highly doped (8 × 10¹⁸/cm³) layer formed near the surface.     

High-temperature current conduction through three kinds of Schottky diodes

Fundamentals of the Schottky contacts and the high-temperature current conduction through three kinds of Schottky diodes are studied. N-Si Schottky diodes, GaN Schottky diodes and AlGaN/GaN Schottky diodes are investigated by I--V--T measurements ranging from 300 to 523~K. For these Schottky diodes, a rise in temperature is accompanied with an increase in barrier height and a reduction in ideality factor. Mechanisms are suggested, including thermionic emission, field emission, trap-assisted tunnelling and so on. The most remarkable finding in the present paper is that these three kinds of Schottky diodes are revealed to have different behaviours of high-temperature reverse currents. For the n-Si Schottky diode, a rise in temperature is accompanied by an increase in reverse current. The reverse current of the GaN Schottky diode decreases first and then increases with rising temperature. The AlGaN/GaN Schottky diode has a trend opposite to that of the GaN Schottky diode, and the dominant mechanisms are the effects of the piezoelectric polarization field and variation of two-dimensional electron gas charge density.     

Modification of Al/Si interface and Schottky barrier height with chemical treatment

The influence of different chemical treatments on the electrical behaviour of n- and p-type Al/Si Schottky junctions was studied. A Schottky barrier height of 0.91 eV was achieved on p-type Si probably due to the unpinning of the Fermi-level at the Al/Si interface. This is one of the highest barrier height values reported so far for a solid-state Schottky junction prepared to p-Si. A doping level reduction was observed in the vicinity of the Si surface for wafers with native oxide and for those boiled in acetone or annealed in forming gas. It was observed unexpectedly that the reactive plasma etch used for the formation of mesa structures decreases the apparent Schottky barrier height. The relation between the sum of n- and p-type Schottky barrier heights and forbidden gap is discussed.