LTCC定向耦合器的研制

LTCC（低温共烧陶瓷）技术是无源元件集成的主流技术之一。本文介绍了一种基于LTCC工艺的定向耦合器的设计原理和方法。该定向耦合器是一种采用侧边耦合的传输线型耦合器。在电路结构上,通过把两个弱耦合器进行对称串联的方式满足了5dB紧耦合的要求,并使方向性有了较大改善。在研制过程中,利用ADS软件对电路进行了仿真和优化,采用LTCC过孔互联结构,避免使用键合线,从而提高了可靠性。     

用于微波组件的LTCC 3 dB耦合器

低温共烧陶瓷(LTCC)技术是实现机载、星载、舰载相控阵雷达小型化、轻量化、高性能、高可靠、低成本的有效手段。文中论述了LTCC技术在微波集成器件应用中所具有的技术优势,并介绍了用于微波组件的LTCC 3dB耦合器的构成、关键制造工艺技术以及性能参数等,为LTCC技术在微波集成器件中的应用进行了有益的探索。     

一种LTCC芯片天线研制

研制了一种新型的频率范围适用于GSM800/CDMA Cellular(824～960MHz)的全向芯片天线.该天线将曲折导线嵌入在LTCC介质中,采用通孔连接各层形成立体结构.通过分析天线的结构,给出了芯片天线的等效电路,并且进行仿真对比.该天线外形小巧,设计尺寸只有20.0mm×4.0mm×1.5mm.该芯片天线具有带宽大,全向性好,电气特性稳定等优点,适合应用于各种高灵敏度、低剖面的无线通信收发模块及移动通信终端.     

基于LTCC技术超小型宽带巴伦的设计与实现

介绍了一种基于LTCC（低温共烧陶瓷）技术的超小型宽带巴伦的设计与实现。该巴伦由Marchand微带巴伦改进而来,综合采用LTCC多层立体三维集成结构,螺旋线宽边耦合带状线结构（SBCS）和带状线末端电容加载技术来实现宽带巴伦的小型化。最终设计出了一款频带0.9~2.3GHz,尺寸仅为1.8mm×1.2mm×1.0mm,插损小,幅度平坦度好,相位一致性高,各项性能均优的宽带巴伦。讨论了该款巴伦的设计思路、工作原理、三维结构,最后给出了该款巴伦的仿真和测试结果,两者一致性较好。     

LTCC材料在微波电路中的应用

本文主要介绍了Au,Ag,Cu等低温共烧陶瓷材料,这些较低电阻率金属材料作导电材料时可以极大地降低插入损耗,并且介电常数比高温共烧陶瓷（HTCC）低,因此可以提高微波信号传输速率,减小信号延迟时间。本文还介绍了低温共烧陶瓷（LTCC）目前的发展现状,MCM封装技术的状况以及低温陶瓷性能。     

C 波段LTCC 无通孔微型Lange 耦合器的研究

研究了一种C波段LTCC无通孔微型Lange耦合器,其结构紧凑,尺寸小。LTCC叠层技术是实现高性能、高可靠、微型化微波元件的主流技术之一,尤其是在提高电路集成度方面。Lange耦合器由于其特殊的结构使得其可以实现宽频带、高性能。设计、制作了一种中心频率为4GHz的宽带3dB Lange耦合器,尺寸仅为7.0mm×2.2mm×1.4mm。在2.0～6.0GHz频带内测试结果如下:插入损耗<0.3dB,反射损耗<21dB,隔离>27dB,相位平衡<90±3°,最大承受功率<40W(连续波)。测试与仿真结果较吻合,验证了研究结果的一致性。     

基于LTCC工艺的定向耦合器的设计理论与方法

本文主要介绍了定向耦合器的基本模型、分类和技术指标;分析了常见耦合器结构的特点;最后着重讨论了基于LTCC工艺的单节带状线定向耦合器的设计方法,包括设计的理论基础、LTCC工艺、设计与仿真方法、设计与优化的指导准则;最后,设计实例的测试结果表明了该方法的有效性。     

LTCC工艺技术的重点发展与应用

本文主要介绍LTCC工艺制造技术在目前和将来一段时间内的重点发展与应用情况,包括平面零收缩LTCC基板、空腔制作、精密细线条加工、带敏感结构LTCC基板,以及LTCC集成组件与模块、MCM用标准化封装外壳、LTCC用于微系统和传感器等。     

LTCC抽头式交指型滤波器的研制

本文介绍了一种基于LTCC工艺的抽头式交指型滤波器的设计技术，该滤波器采用以综合设计为主的集总参数低通原型滤波器电路设计法，用分布参数的谐振元件代替LC回路，采用低温共烧陶瓷（LTCC）工艺制作。利用抽头式交指结构形式，改善了性能，提高了可靠性。产品具有体积小、指标高、易于集成等显著特点。     

低温共烧陶瓷(LTCC)工艺的研究

低温共烧陶瓷（LTCC）技术是近年发展起来的令人瞩目的整合组件技术,已经成为无源集成的主流技术,成为无源元件领域的发展方向和新的元件产业的经济增长点。叙述了低温共烧陶瓷技术（LTCC）的制备工艺以及未来应用前景。     

A compact LTCC branch-line coupler UsingModified-T equivalent-circuit modelfor transmission line

In this letter, a compact branch-line coupler is proposed by making good use of the three-dimensional layout capability of the low-temperature co-fired ceramic (LTCC) substrate. This branch-line coupler is accomplished by using lumped-inductors and lumped-capacitors to realize the modified-T equivalent-circuit model for the transmission line so that the circuit size may drastically be reduced. Specifically, a very compact LTCC branch-line coupler with a size of 0.079/spl lambda//spl times/0.0717/spl lambda/ is implemented and carefully examined, where /spl lambda/ is the wavelength of the multilayer structure at the operating frequency f/sub 0/.     

A compact branch-line coupler using discontinuous microstrip lines

We introduce a branch-line coupler using discontinuous microstrip lines whose size is significantly reduced relative to the standard design. We manipulate the reactive characteristics of discontinuities in its microstrip lines to achieve a physical size reduction of almost 60% with comparable performance.     

Broadband microstrip branch-line coupler Broadband microstrip branch-line coupler

The design and measured performances of a broadband branch-line coupler are presented. The broadband coupler was designed by using a four-section branch line topology with a structure of the defected ground. Such a structure can make the impedance of the microstrip line much larger than that without defected structure, even using a normal PCB process. More than 231 Omega was easily achieved by such a defected structure. The measured performance of the broadband coupler agrees well with the results from simulation     

A novel compact-size branch-line coupler

A novel compact-size branch-line coupler without any implementation of lumped-elements, bonding wires, and via holes is proposed. In this study, the size of the proposed coupler occupied only 45% of the conventional branch-line coupler at 2.4GHz. The performances of the circuit can be competed with the conventional coupler. The element sizes of this coupler can be realized easily by using simply standard printed-circuit-board etching processes. It is very useful for applications in the wireless communication systems.     

微带分支线定向耦合器的小型化

基于尺寸原因定向耦合器在微波电路中的应用受到限制,采用接终端开路短截线的方法使四分之一波长的微带线变成T型结构,并进一步对短截线等效成为十字型微带线的方法,设计出小型化的定向耦合器。通过使用ADS软件进行仿真,设计的定向耦合器各项性能指标符合要求,面积为常规微带分支线定向耦合器的36%。     

基于DMRC结构的小型分支线耦合器设计

首先基于复合左右手传输线和微带缺陷结构提出了一种新型双螺旋微带缺陷谐振单元,并研究了其幅度特性和相位特性。然后,研究了其结构参数对传输特性的影响。最后,运用该新型双螺旋微带缺陷结构设计了一个小型化分支线耦合器,仿真及实测结果表明：该分支线耦合器不仅实现了62.8%的小型化,而且避免了后向辐射的问题。     

Independently-tuned concurrent dual-band branch-line coupler using varactor

This paper presents a concurrent dual-band branch-line coupler with an independently tunable center frequency.In the proposed architecture,the quarter-wavelength lines,which work at two separated bands concurrently and can be tuned in one of them,are key components.Based on the analysis of ABCD-matrix,a novel hybrid structure and a pair of varactors topology are utilized to achieve concurrent dual-band operation and independent tunability,respectively.Using this configuration,it is convenient to tune the center frequency of the upper band,while the responses of the lower band remain unaltered.To verify the proposed idea,a demonstration is implemented and the simulated results are presented.     

具有宽频带的小型化双频分支线耦合器设计

针对当前通信系统需要耦合器支持多频段、小型化和高性能等要求,提出了一种双频(DB)分支线耦合器(BLC).通过在传统耦合器中间加非对称交叉耦合分支线同时实现了分支线耦合器的双频带和宽频带.非对称交叉耦合分支线的引入增加了设计的自由度.利用等效替换的方法实现耦合器的小型化.使用SBO(Surrogate-Based Op...     

Dual-band rat-race coupler design using tri-section branch-line

The design of a novel rat-race coupler that can operate at two widely separated frequency bands is presented. The proposed circuit also features compact size, planar structure without a via hole, and low insertion loss. For validation, both simulated and measured performance of a microstrip rat-race coupler operating at 2.45/5.8 GHz are shown     

Miniature X-band branch-line coupler using photoimageablethick-film materials

The design and measurement of a 10 GHz miniaturised branch-line coupler using thick-film photoimageable materials is presented. This attempts to reduce passive component size by demonstrating thin-film microstrip (TFMS)-based structures with a thick film processing technology. This technique offers a cheaper and faster way to implement compact multilayer circuits compared to thin-film technology. The fabricated hybrid of intrinsic area 1.19×1.07 mm demonstrates excellent performance and the measurements are in good agreement with the simulations