Potentialities of GaN-based microcavities in strong coupling regime at room temperature

In a recent publication [N. Antoine-Vincent, F. Natali, D. Byrne, A. Vasson, P. Disseix, J. Leymarie, M. Leroux, F. Semond, J. Massies, Phys. Rev. B 68 (2003) 153313], we have highlighted for the first time the exciton–photon strong coupling in a GaN-based microcavity and obtained a Rabi splitting of 31 meV persistent at 77 K. Our aim is now to study the feasibility of GaN-based microcavities for which the strong coupling regime would be maintained at room temperature. A complex heterostructure containing GaN/AlGaN quantum wells (QWs) is investigated by photoreflectivity and reflectivity at 5 K. The QW thickness is 3 nm and the Al composition and thickness of the barriers are respectively 0.11 and 10 nm. From the modeling of the experimental spectra, the values of the oscillator strength, the energy and the broadening parameter of the QW fundamental transition are determined; the broadening is found to be relatively weak (15 meV). Simulations of microcavities containing QWs have then been performed including this set of parameters: a theoretical Rabi splitting of 34 meV is obtained at 5 K. Considering an additional broadening induced by the increase of the temperature (23 meV), the strong coupling regime could be maintained theoretically at room temperature in such a structure. This is due to the low value of the inhomogeneous broadening related to the QW transition which is lower than in bulk GaN. The influence of the QW number and the nature of the Bragg mirror on the Rabi splitting is then discussed in realistic structures.     

Properties of Si-doped GaN and AlGaN/GaN heterostructures grown by RF-MBE on high resistivity Fe-doped GaN

Silicon-doped GaN epilayers and AlGaN/GaN heterostructures were developed by nitrogen plasma-assisted molecular beam epitaxy on high resistivity iron-doped GaN (0001) templates and their properties were investigated by atomic force microscopy, x-ray diffraction and Hall effect measurements. In the case of high electron mobility transistors heterostructures, the AlN mole fraction and the thickness of the AlGaN barrier employed were in the range of from 0.17 to 0.36 and from 7.5 to 30 nm, respectively. All structures were capped with a 2 nm GaN layer.Despite the absence of Ga droplets formation on the surface, growth of both GaN and AlGaN by RF-MBE on the GaN (0001) surfaces followed a step-flow growth mode resulting in low surface roughness and very abrupt heterointerfaces, as revealed by XRD. Reciprocal space maps around the reciprocal space point reveal that the AlGaN barriers are fully coherent with the GaN layer.GaN layers, n-doped with silicon in the range from 10¹⁵ to 10¹⁹ cm⁻³ exhibited state of the art electrical properties, consistent with a low unintentional background doping level and low compensation ratio. The carrier concentration versus silicon cell temperatures followed an Arhenius behaviour in the whole investigated doping range. The degenerate 2DEG, at the AlGaN/GaN heteroiterfaces, exhibited high Hall mobilities reaching 1860 cm²/V s at 300 K and 10 220 cm²/V s at 77 K for a sheet carrier density of 9.6E12 cm⁻².The two dimensional degenerate electron gas concentration in the GaN capped AlGaN/GaN structures was also calculated by self-consistent solving the Schrödinger–Poisson equations. Comparison with the experimental measured values reveals a Fermi level pinning of the GaN (0001) surface at about 0.8 eV below the GaN conduction band.     

Vertical electron transport study in GaN/AlN/GaN heterostructures

In this work, we investigate the electronic structure and vertical electron transport through GaN/AlN/GaN single-barrier structures with different AlN thickness, grown by plasma-assisted molecular beam epitaxy. Conductive and capacitive characterization has been performed, and the experimental results are interpreted by comparison with 1D self-consistent simulations. Capacitive measurements reveal a complete depletion of the top GaN layer, and the formation of a two-dimensional electron gas at the bottom interface of the AlN barrier, even for barrier thicknesses of 0.5 nm (2 monolayers of AlN). Conductive atomic force microscopy reveals discrete leakage current locations with a density of 10⁷ cm⁻², more than one order of magnitude lower than the dislocation density in these samples. These results are promising for the fabrication of resonant tunnelling diodes using the GaN/AlN material system.     

GaN/AlN quantum dot photodetectors at 1.3–1.5 μm

We have demonstrated GaN/AlN quantum dots (QD) photodetectors, relying on intraband absorption and in-plane carrier transport in the wetting layer. The devices operate at room temperature in the wavelength range 1.3–1.5 μm. Samples with 20 periods of Si-doped GaN QD layers, separated by 3 nm-thick AlN barriers, have been grown by plasma-assisted molecular-beam epitaxy on an AlN buffer on a c-sapphire substrate. Self-organized dots are formed by the deposition of 5 monolayers of GaN under nitrogen-rich conditions. The dot height is 1.2±0.6 to 1.3±0.6 nm and the dot density is in the range 10¹¹–10¹² cm⁻². Two ohmic contacts were deposited on the sample surface and annealed in order to contact the buried QD layers. The dots exhibit TM polarized absorption linked to the s–p_z transition. The photocurrent at 300 K is slightly blue-shifted with respect to the s–p_z intraband absorption. The responsivity increases exponentially with temperature and reaches a record value of 10 mA/W at 300 K for detectors with interdigitated contacts.     

Optical studies on a coherent InGaN/GaN layer

Photoluminescence (PL), photoluminescence excitation (PLE) and selective excitation (SE-PL) studies were performed in an attempt to identify the origin of the emission bands in a pseudomorphic In_0.05Ga_0.95N/GaN film. Besides the InGaN near-band-edge PL emission centred at 3.25 eV an additional blue band centred at 2.74 eV was observed. The lower energy PL peak is characterized by an energy separation between absorption and emission–the Stokes’ shift–(500 meV) much larger than expected. A systematic PLE and selective excitation analysis has shown that the PL peak at 2.74 eV is related to an absorption band observed below the InGaN band gap. We propose the blue emission and its related absorption band are associated to defect levels, which can be formed inside either the InGaN or GaN band gap.     

Ni/Au Schottky gate oxidation and BCB passivation for high-breakdown-voltage AlGaN/GaN HEMT

A new AlGaN/GaN high electron mobility transistor (HEMT) employing Ni/Au Schottky gate oxidation and benzocyclobutene (BCB) passivation is fabricated in order to increase a breakdown voltage and forward drain current. The Ni/Au Schottky gate metal with a thickness of 50/300 nm is oxidized under oxygen ambient at 500 C and the highly resistive NiO is formed at the gate edge. The leakage current of AlGaN/GaN HEMTs is decreased from 4.94 μA to 3.34 nA due to the formation of NiO. The BCB, which has a low dielectric constant, successfully passivates AlGaN/GaN HEMTs by suppressing electron injection into surface states. The BCB passivation layer has a low capacitance, so BCB passivation increases the switching speed of AlGaN/GaN HEMTs compared with silicon nitride passivation, which has a high dielectric constant. The forward drain current of a BCB-passivated device is 199 mA /mm, while that of an unpassivated device is 172 mA /mm due to the increase in two-dimensional electron gas (2DEG) charge.     

Dual-blue light-emitting diode based on strain-compensated InGaN-AlGaN/GaN quantum wells

Strain-compensated InGaN quantum well (QW) active region employing tensile AlGaN barrier is analyzed. Its spectral stability and efficiency droop for dual-blue light-emitting diode (LED) are improved compared with those of the conventional InGaN/GaN QW dual-blue LED based on stacking structure of two In_0.18Ga_0.82N/GaN QWs and two In_0.12Ga_0.88N/GaN QWs on the same sapphire substrate. It is found that the optimal performance is achieved when the Al composition of strain-compensated AlGaN layer is 0.12 in blue QW and 0.21 in blue-violet QW. The improvement performance can be attributed to the strain-compensated InGaN-AlGaN/GaN QW that can provide a better carrier confinement and effectively reduce leakage current.     

DLTS study of n-type GaN grown by MOCVD on GaN substrates

Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm² of substrate A and on an area of 1×1 cm² of substrate B. Two traps labeled B1 and B2 are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.     

Effect of Si doping on GaN/AlN multiple-quantum-well structures for intersubband optoelectronics at telecommunication wavelengths

We present a study of the effect of Si doping localization on the optical and structural properties of GaN/AlN multiple-quantum-well structures for intersubband (ISB) absorption at 1.55 μm. Samples were either undoped or Si doped in different regions (barrier, quantum well (QW), middle of barrier or middle of QW). Structural characterization by atomic force microscopy and X-ray diffraction does not show significant differences in the crystalline quality. All doped samples present room-temperature p-polarized ISB absorption of about 1%–2% per pass, with a line width of 80–90 meV. In contrast, undoped samples present a weaker ISB absorption with a record line width of 40 meV. Both photoluminescence (PL) and ISB absorption display structured shapes whose main peaks correspond to monolayer fluctuations of the well thickness. The emission and absorption line widths depend on the Si doping concentration, but not on the Si location.     

AlGaN/GaN HEMTs grown on silicon (001) substrates by molecular beam epitaxy

We report the realization of an AlGaN/GaN HEMT on silicon (001) substrate with noticeably better transport and electrical characteristics than previously reported. The heterostructure has been grown by molecular beam epitaxy. The 2D electron gas formed at the AlGaN/GaN interface exhibits a sheet carrier density of 8×10¹² cm⁻² and a Hall mobility of 1800 cm²/V s at room temperature. High electron mobility transistors with a gate length of 4 μm have been processed and DC characteristics have been achieved. A maximum drain current of more than 500 mA/mm and a transconductance g_m of 120 mS/mm have been obtained. These results are promising and open the way for making efficient AlGaN/GaN HEMT devices on Si(001).     

A dual-blue light-emitting diode based on strain-compensated InGaN-AlGaN/GaN quantum wells

A strain-compensated InGaN quantum well(QW) active region employing a tensile AlGaN barrier is analyzed.Its spectral stability and efficiency droop for a dual-blue light-emitting diode(LED) are improved compared with those of the conventional InGaN/GaN QW dual-blue LEDs based on a stacking structure of two In0.18Ga0.82N/GaN QWs and two In0.12Ga0.88N/GaN QWs on the same sapphire substrate.It is found that the optimal performance is achieved when the Al composition of the strain-compensated AlGaN layer is 0.12 in blue QW and 0.21 in blue-violet QW.The improvement performance can be attributed to the strain-compensated InGaN-AlGaN/GaN QW,which can provide a better carrier confinement and effectively reduce leakage current.     

Active region design of a terahertz GaN/ Al0.15Ga0.85N quantum cascade laser

We propose the idea of developing THz quantum cascade lasers (QCLs) with GaN-based quantum well (QW) structures with significant advantages over the currently demonstrated THz lasers in the GaAs-based material system. While the ultrafast longitudinal optical (LO) phonon scattering in AlGaN/GaN QWs can be used for the rapid depopulation of the lower laser state, the large LO-phonon energy (∼90 meV) can effectively reduce the thermal population of the lasing states at higher temperatures. Our analysis of one particular structure has shown that a relatively low threshold current density of 832 A/cm² can provide a threshold optical gain of 50/cm at room temperature. We have also found that the characteristic temperature in this structure is as high as 136 K.     

Experimental and theoretical study of the quantum-confined Stark effect in a single InGaN/GaN quantum dot under applied vertical electric field

We present a study of the effect of externally applied vertical electric field on the optical properties of single InGaN/GaN quantum dots via microphotoluminescence spectroscopy. This is achieved by incorporating the quantum dot layer in the intrinsic region of a p–i–n diode structure. We observe a large blue energy shift of 60 meV, which is explained by the partial compensation of the internal piezoelectric field. The energy shift dependence on the applied field allows the determination of the vertical component of the permanent dipole and the polarizability. We also present theoretical modelling of our results based on atomistic semi-empirical tight-binding simulations. A good quantitative agreement between the experiment and the theory is found.     

Blue cathodoluminescence from thulium implanted AlxGa1−xN and InxAl1−xN

Room temperature cathodoluminescence (RTCL) was obtained from Tm implanted Al_xGa_1−xN with different AlN contents (in the range 0≤x≤0.2) and from implanted In_xAl_1−xN with different InN contents (x=0.13 and 0.19) close to the lattice match with GaN. The Tm³⁺ emission spectrum depends critically on the host material. The blue emission from Al_xGa_1−xN:Tm peaks in intensity for an AlN content of x0.11. The emission is enhanced by up to a factor of 50 times with an increase of annealing temperature from 1000 to 1300 C. The blue emission from In_0.13Al_0.87N:Tm, annealed at 1200 C, is more than ten times stronger than that from Al_xGa_1−xN:Tm, x≤0.2. However, the intensity decreases significantly as the InN fraction increases from 0.13 to 0.19.     

Arsenic-related recombination in MOVPE-grown ZnO/GaAs films

In this paper, ZnO films grown by metalorganic vapour phase epitaxy on various substrates (GaAs, silicon, sapphire) and using different VI /II ratios, are investigated by photoluminescence (PL) spectroscopy. The PL spectra of layers grown on GaAs show significant recombination at 3.320 eV, 3.305 eV and 3.270 eV. These energies are remarkably similar to what have been reported for hybrid beam deposited ZnO:As [Y.R. Ryu, T.S. Lee, H.W. White, Appl. Phys. Lett. 83 (2003) 87] and arsenic-implanted ZnO crystals [T.S. Jeong, M.S. Han, C.J. Youn, Y.S. Park, J. Appl. Phys. 96 (2004) 175], and the lines are ascribed to the incorporation of arsenic, which diffuses from the substrate into the films. Two acceptor levels are deduced at 120 meV and at 140–150 meV.     

Correlation between structural and electrical properties of InN thin films prepared by molecular beam epitaxy

The strain-relaxation phenomena and the formation of a dislocation network in 2H-InN epilayers during molecular beam epitaxy are reported. The proposed growth model emphasizes the dominant role of the coalescence process in the formation of a dislocation network in 2H-InN. Edge type threading dislocations and dislocations of mixed character have been found to be the dominating defects in wurtzite InN layers. It is demonstrated that these dislocations are active suppliers of electrons and an exponential decay of their density with the thickness implies a corresponding decay in the carrier density. Room temperature mobility in excess of 1500 cm² V ⁻¹ s⁻¹ was obtained for 800 nm thick InN layers with dislocation densities of 3×10⁹ cm⁻².     

Time- and frequency-domain measurements of carrier lifetimes in GaN epilayers

Results on time-resolved study of GaN photoluminescence (PL) in a power density range from 0.5 mW/cm² under CW excitation by ultraviolet light emitting diode (UV LED) to 1 GW/cm² under pulsed excitation by YAG:Nd laser in the temperature range from 8 to 300 K are presented. Measurements of PL response in the frequency domain by using amplitude-modulated emission of a UV LED as well as time-resolved PL measurements using a streak camera and light-induced transient grating technique have been used in the study. Yellow luminescence (YL) intensity increases with increasing temperature up to 120 K and faster components in YL decay switch to slower components with increasing temperature under UV LED excitation. At low carrier densities, the trapping decreases the carrier lifetime below 250 ps, while the carrier lifetime in the same GaN sample under excitation ensuring saturation of the traps equals 2 ns.     

Morphological properties of AlN and GaN grown by MOVPE on porous Si(111) and Si(111) substrates

Metal Organic Vapour Phase Epitaxy (MOVPE) of AlN and GaN layers at a temperature of 1080 C were performed on porous Si(111) and Si(111) substrates. The thermal stability of porous silicon (PS) is studied versus growth time under AlN and GaN growth conditions. The surface morphology evolution of the annealed PS is revealed by scanning electron microscopy (SEM). Porous Si(111) with low porosity (40%) is more thermally stable than porous Si(100) with relatively high porosity (60%).AlN layers with various thicknesses were grown under the same conditions on the two substrates. Morphological properties of AlN were studied by atomic force microscopy (AFM) and compared taking into account the two different surfaces of the substrates. The two growth kinetics of AlN were found to be different due to the initial surface roughness of the PS substrate. The effect of AlN buffer morphology on the qualities of subsequent GaN layers is discussed. Morphological qualities of GaN layers grown on PS are improved compared to those obtained on porous Si(100) but are still less than those grown on Si substrate.     

Electrical characterisation of phosphorus-doped ZnO thin films grown by pulsed laser deposition

Phosphorus-doped ZnO films were grown by pulsed laser deposition using a ZnO:P₂O₅-doped target as the phosphorus source with the aim of producing p-type ZnO material. ZnO:P layers (with phosphorus concentrations of between 0.01 to 1 wt%) were grown on a pure ZnO buffer layer. The electrical properties of the films were characterised from temperature dependent Hall-effect measurements. The samples typically showed weak n-type conduction in the dark, with a resistivity of 70 Ω cm, a Hall mobility of μ_n0.5 cm² V ⁻¹ s⁻¹ and a carrier concentration of n3×10¹⁷ cm⁻³ at room temperature. After exposure to an incandescent light source, the samples underwent a change in conduction from n- to p-type, with an increase in mobility and decrease in concentration for temperatures below 300 K.