苯乙炔封端的BTDA系列酰亚胺预聚体的研究

合成了具有苯侧基的二胺单体1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ), 并与3,3',4,4'-苯酮四羧酸二酐(BTDA)进行缩聚反应, 分别以4-苯乙炔苯酐(PEPA)和4-苯乙炔-1,8-萘二甲酸酐(PENA)作为封端剂, 合成了两个系列的苯乙炔封端的酰亚胺预聚体. DSC测试结果表明, 此类预聚体具有比PETI-5更宽的加工窗口; 利用所合成的预聚体制成了具有较高热分解温度热固性交联PI薄膜. 结果表明, PI预聚体加工性能良好, 其交联后具有优异的力学和热学性能; 同时PEPA封端的预聚体树脂具有比PENA封端的树脂更为优异的综合性能.     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

新型乙炔封端聚酰亚胺的制备及性能

用双酚A型二醚二酐(BPADA)和3-乙炔基苯胺(m-APA)进行缩聚反应合成了乙炔基封端的聚酰亚胺预聚体, 并对预聚体的熔体黏度、稳定性和热性能等进行研究. 结果表明, 此类预聚体具有较宽的加工窗口和较低的加工温度, 适合模压成型工艺制备树脂基复合材料. 预聚体经250 ℃固化后显示了优异的热性能, 动态力学分析显示其玻璃化转变温度为363 ℃, 在氮气和空气气氛下5%热失重温度分别为490和492 ℃.     

Synthesis and Characterization of 4,4'-Di (p-aminophenylethynyl)-6,6'-bis[ N,N-bis(ethoxycarbonylmethyi) amino methyl ]-2,2'-bipyridine

以4,4'-二硝基-2,2'-联吡啶-6,6'-二亚甲基双三氟乙酸酯作为起始原料,经水解、溴化、酯化和对氨基苯乙炔取代4步反应合成了4,4'-二.(对氨基苯乙炔基)-6,6'-二[N,N-二(乙氧基羰甲基)氨甲基]-2,2'-联吡啶.通过红外光谱、核磁共振波谱、高分辨质谱等表征了该化合物的结构.该化合物经水解后与铕离子形成稀土荧光螯合物,在紫外光激发下,发射出具有铕离子特征的荧光光谱.     

4,4'-二(对氨基苯乙炔基)-6,6'-二[N,N-二(乙氧基羰甲基)氨甲基]-2,2'-联吡啶的合成与表征

以4,4'-二硝基-2,2'-联吡啶-6,6'-二亚甲基双三氟乙酸酯作为起始原料, 经水解、 溴化、 酯化和对氨基苯乙炔取代4步反应合成了4,4'-二(对氨基苯乙炔基)-6,6'-二[N,N-二(乙氧基羰甲基)氨甲基]-2,2'-联吡啶. 通过红外光谱、 核磁共振波谱、 高分辨质谱等表征了该化合物的结构. 该化合物经水解后与铕离子形成稀土荧光螯合物, 在紫外光激发下, 发射出具有铕离子特征的荧光光谱.     

沉淀剂对含有氨侧基的聚苯撑乙炔发光性能的影响

通过单体4-[(2,5-二溴苯)乙炔基]苯胺和1,4-二乙炔基-2,5-二戊氧基苯之间的Sonogashira偶合反应合成了带有p-氨基苯乙炔基共轭侧基的聚对苯撑乙炔（(PAnPE）). 该共轭聚合物的THF溶液（(2××10-－5 mol•·L-－1）)在473和519 nm处呈现两个比较强的荧光发射峰. 通过调节在聚合物PAnPE-THF溶液中所加入三种沉淀剂（(甲醇、乙酸、稀盐酸溶液）)的体积比例, 来改变PAnPE分子链的聚集态结构, 进而研究对其发光性能的影响规律. 实验结果表明: 由于沉淀剂与聚合物PAnPE分子链之间相互作用能力与方式的不同, PAnPE两个荧光峰的发射强度因聚合物分子链聚集结构不同而呈现不同的变化规律, 这有助于实现在化学传感器中的应用.     

4,4′-二乙炔二苯甲烷与苯乙炔的共聚及共聚物的表征研究

本文做了4,4′-二乙炔二苯甲烷的本体热均聚和催化均聚,并用(Ph_3P)_2PdCl_2为催化剂做了4,4′-二乙炔二苯甲烷与苯乙炔的共聚,对均聚和共聚物中的不溶不熔组分测定了密度、溶胀度、Huggins参数以及交联点间的平均分子量(?)_c。实验表明,该交联聚合物的最良溶剂是四氢呋喃,溶度参数为9.9ca1~0.5。cm~(-1.5),当用四氢呋喃为溶剂时的Huggins参数为0.34,并且在单体摩尔比中4,4′-二乙炔二苯甲烷用量越多,溶胀度越小,交联度越大。红外光谱分析表明,所有均聚及共聚物都为反式结构。     

基于乙炔基-苯并噁嗪单元双重交联反应的聚酰亚胺树脂的制备与性能

为开发可低温固化的聚酰亚胺树脂, 通过分子结构设计将苯并噁嗪单元引入聚酰亚胺树脂中, 合成了含苯并噁嗪单元及乙炔基封端的双官能化新型聚酰亚胺预聚体(PIBzA). 经高温处理, 苯并噁嗪单元发生开环交联, 同时, 乙炔基端基发生三聚成环反应, 从而在固化树脂中形成双重交联网络结构. 苯并噁嗪单元的引入使聚酰亚胺树脂最快固化反应温度降低约32 ℃, 有效降低了固化温度. 同时, 苯并噁嗪单元的引入未大幅度降低树脂的耐热稳定性, 其玻璃化转变温度(T_g)介于266~290 ℃之间, 5%热失重温度(T_d,5%)接近500 ℃, 依然可以满足耐高温复合材料的应用需求. 此外, PIBzA固化树脂具有低介电特性, 其介电常数k介于2.3~3.0, 介电损耗介于0.002~0.008, 可满足透波复合材料及先进微电子封装材料的应用需求.     

4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

Thermal analysis of phenylethynyl end-capped fluorinated imide oligomer afr-pepa-4

Thermal analysis of phenylethynyl end-capped imide oligomer AFR-PEPA-4 was performed to characterize cure reaction, thermal stabilities and semicrystalline behavior of AFR-PEPA-4 oligomer and its cured polyimide. Cured AFR-PEPA-4 polyimide showed high T _gs up to 418°C. Both AFR-PEPA-4 oligomer and polyimide exhibit excellent thermal stabilities comparable to PETI-5 polyimides. AFR-PEPA-4 imide oligomer has a T _m of 330°C and exhibits spherulite crystalline morphology in the film. The crystallinity in AFR-PEPA-4 films could not be regenerated under any annealing conditions after the initial melt.     

Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride

Phenylethynyl containing imide oligomers have been under investigation as part of an effort to develop resins for non-autoclave composite fabrication processes such as resin transfer molding (RTM). These high performance/high temperature composites are potentially useful on advanced aerospace vehicles such as reusable launch vehicles (RLVs). New phenylethynyl terminated imide oligomers (PETI) based upon 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) were prepared and characterized primarily by rheological behavior and cured glass transition temperature (Tg). In comparison to resins from the symmetrical isomer (3,3′,4,4′-biphenyltetracarboxylic dianhydride, s-BPDA), a-BPDA afforded corresponding resins with lower melt viscosities and upon curing, higher Tgs. Several resins exhibited an attractive combination of properties such as low and stable melt viscosities required for RTM composite fabrication, high cured Tgs, and moderate toughness. One resin (P10) was used to fabricate flat, void free laminates by RTM. The laminates exhibited high mechanical properties at temperatures to 288°C. The chemistry and physical properties of these new PETIs and the laminate properties of one composition are discussed.     

Development of novel cardo‐containing phenylethynyl‐terminated polyimide with high thermal properties

A phenylethynyl‐terminated reactive diluent [Card‐4‐phenylethynylphthalic anhydride (PEPA)], which contained fluorenyl cardo structures, was successfully synthesized and used as a modifier for flexible phenylethynyl‐terminated imide oligomer (PEI‐PEPA). The chemical structure, crosslink characterization, molecular weights, and thermal properties of the products were characterized. The imide systems with addition of 10, 20, 30, and 40 wt% Card‐PEPA to PEI‐PEPA (PEI‐PEPA‐Card) and their cured resin systems were prepared. The thermal curing behaviors of imide systems at different heating rates were analyzed by using differential scanning calorimetry. Thermal properties such as glass transition temperature (T_g) and char yield at 800°C of the resultant resin systems were studied by differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The rheological properties were also investigated using a dynamic rheometry. These properties were found to be outstanding compared with pure PEI‐PEPA. The uncured imide systems exhibited lower T_g and lower isothermal viscosity with addition of Card‐PEPA. Furthermore, the T_g and char yield of the cured resin systems increased with addition of Card‐PEPA. The cured resin systems containing 40 wt% Card‐PEPA exhibited the highest T_g of 359°C and char yield at 800°C of 66.5%. Copyright © 2016 John Wiley & Sons, Ltd.     

Benzocyclobutene in polymer synthesis. II. Solid state diels–alder polymerization utilizing an in situ generated diene and an alkyne

A novel class of aromatic imide AB-monomers with benzocyclobutene and an alkyne (primarily phenylethynyl group) as the reactive units have been prepared. The monomers have been utilized in thermally induced Diels–Alder polymerizations. The differential scanning calorimetric study of the AB-monomers provided two observations: (i) primary acetylene began its homopolymerization (202°C max.) before the electrocyclic ring opening of benzocyclobutene (270°C max.); (ii) the phenoxy group connecting between phenylacetylenyl group and the aromatic imide fragment suppressed polymerization in Diels–Alder fashion. Furthermore, thermoxidative stability evaluation on the cured samples (250°C for 8 h and then 350°C for another 8 h under N₂ atmosphere), carried out at 650°F (air) for 200 h, indicated the more rigid phenylethynyl phthalimide system was the most heat-resistant.     

Synthesis and characterization of phenylethynyl-terminated polyimide oligomers derived from 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride and 3,4′-oxydianiline

With the goal of improving processability of imide oligomers and achieving high toughness of thermosetting polyimides, a series of 4-phenylethynylphthalic anhydride(PEPA)-terminated imide oligomers prepared by the reaction of 2,3,3',4'-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA) and 3,4'-oxydianiline(3,4'-ODA) with different molecular weights(degree of polymerization: n = 1?9) were formed. The resultant oligomers with different molecular weights were characterized for their chemical architecture, cure behavior, thermal properties, solubility in organic solvents and rheological characteristics. Besides, the thermal properties and tensile test of cured polyimide films were also evaluated. The imide oligomer(degree of polymerization: n = 1) has some somewhat crystalline phase, and imide oligomers(degree of polymerization: n = 2?9) showed excellent solubility(40 wt%) in N-methyl-2-pyrrolidone(NMP) and N,Ndimethylacetamide(DMAc) at room temperature. Furthermore, the rheological properties of imide oligomers showed very low melt viscosity and wider processing window. The cured films exhibited good thermal properties with the glass transition temperatures of 282?373 ?C and 5 wt% thermal decomposition temperatures higher than 551 ?C in nitrogen atmosphere. The elongation at break of the prepared films was found to be high(almost 9.3%).     

Curing chemistry of phenylethynyl‐terminated imide oligomers: Synthesis of 13C‐labeled oligomers and solid‐state NMR studies

4‐(Phenylethynyl‐α,β‐¹³C)phthalic anhydride (PEPA) and ¹³C‐labeled phenylethynyl‐terminated imide (PETI) oligomers were synthesized, and solid‐state ¹³C nuclear magnetic resonance (NMR) spectroscopy was used to determine the structure of cured oligomers. Solid‐state ¹³C NMR spectra were collected before and after thermal curing. Using solid‐state ¹³C NMR difference spectroscopy, several cure products were identified. The observed ¹³C NMR resonances were assigned to four different classes of cure products: aromatics, products from backbone addition (substituted stilbenes and tetraphenylethanes), polyenes, and cyclobutadiene cyclodimers. The effects of postcuring and oligomer chain length on the structure of the cured resins were examined. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3486–3497, 2000     

含苯乙炔的可自交联高温高性能聚芳醚酮的合成与性能

将可交联的苯乙炔结构引入到热塑性聚芳醚酮链中, 并对其交联前后的性能进行了深入研究.     

3‐Phenylethynyl phthalimide end‐capped imide oligomers and the cured polymers

In the past decades, 4‐phenylethynyl phthalic anhydride (4‐PEPA) has been the most important endcapper used for thermoset polyimide. As the isomer of4‐PEPA, 3‐phenylethynyl phthalic anhydride (3‐PEPA) has attracted our interest. In this article, 3‐PEPA was synthesized and a comparative study with 4‐PEPA on curing temperature, curing rate, thermal and mechanical properties of oligomers and cured polymers was presented. The new phenylethynyl endcapped model compound, N‐phenyl‐3‐phenylethynyl phthalimide, was synthesized and characterized. The molecular structure of model compound was determined via single‐crystal X‐ray diffraction and the thermal curing process was investigated by Fourier transform infrared. Differential scanning calorimetry clearly showed that the model compound from 3‐PEPA had about 20 °C higher curing onset and peak temperature than the 4‐PEPA analog. This result was further proved by the dynamic rheological analysis that the temperature of minimum viscosity for oligomers end‐capped with 3‐PEPA was above 20 °C higher than that of the corresponding 4‐PEPA endcapped oligomers with the same calculated number average molecular weight. The cured polymer from 3‐PEPA displayed slightly higher thermal oxidative stability than those from 4‐PEPA by thermogravimetric analysis. The thermal curing kinetics of 3‐PEPA endcapped oligomer (OI‐5) and 4‐PEPA endcapped oligomer (OI‐6) fitted a first‐order rate law quite well and revealed a similar rate acceleration trend. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4227–4235, 2008