Effect of AlN Interlayer on α-plane AlGaN Grown by MOCVD

采用有机金属化学气相沉积(MOCVD)在r面蓝宝石村底上生长α-AlGaN外延膜,研究了AlN插入层对 α-AlGaN外延膜的应力和光学性质的影响.根据高分辨X射线衍射(HRXRD)技术和扫描电子显微镜( SEM)我们可以得到,AlN插入层有效地提高了a-AlGaN外延膜的晶体质量并减小了外延膜材料结构的各向异性.由拉曼光谱得到MlN插入层的引入减小了a-AlGaN外延膜的面内压应力,其原因是AlN插入层可以当作衬底有效的调制与减小α-AlGaN外延膜与r面蓝宝石村底的晶格失配,从而使α-AlGaN的面内应力得到适当释放.对室温下的光致发光进行测量得到AlN插入层的使用使近带边发射峰(NBE)发生了红移,这可能是由于残余应力的减小引起.     

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

预通三甲基铝对AlN薄膜的结构与应变的影响

采用有机金属化学气相沉积设备用两步生长法在(0001)蓝宝石衬底上制备AlN薄膜。研究了预通三甲基铝(TMAl)使衬底铝化对外延AlN的影响。利用高分辨X射线衍射(XRD)技术和扫描电子显微镜(SEM) 分析了样品的结晶质量以及外延膜中的残余应力。通过SEM观察发现,短时间的预通TMAl处理对AlN薄膜表面的影响不大;但随着预通时间的增加,表面会出现六角形的岛。通过优化TMAl的预通时间可以保护衬底被氮化有利于Al极性面AlN的生长,从而得到的Al极性面AlN表面比较平整;但是预通TMAl时间过长会使衬底表面沉积金属态铝而不容易形成平整的表面。X射线双晶摇摆曲线结果表明:样品的(0002)和(101 2)面的X射线双晶摇摆曲线的半峰宽随着预通TMAl时间的不断增加,由此得出薄膜的晶体质量不断下降。这可以解释为:预通TMAl使形成的晶核不再规则,从而在成核层形成了很多亚颗粒降低了晶体质量。进一步对XRD结果分析,我们也发现了这样的应力变化。这种应力的变化起源可以归结于内应力(岛的合并在其晶界引入的应力)与外应力(晶格失配与热失配引起的应力)共同作用的结果。     

利用MOCVD在r面蓝宝石上生长的α面GaN中两步AlN缓冲层的优化

采用两步AlN缓冲层(一层低温AlN和一层高温AlN)在r面蓝宝石衬底上生长了非极性的α面GaN,并利用高分辨X射线衍射和光致荧光谱对所生长的材料进行了研究.两步AIN缓冲层在我们之前的工作中已被证明比单步高温AlN或低温GaN缓冲层更有利于减小材料各向异性和提高晶体质量,本文进一步优化了两步AlN缓冲层的结构,并得到...     

利用MOCVD在r面蓝宝石上生长的α面GaN中两步AlN缓冲层的优化

采用两步AlN缓冲层(一层低温AlN和一层高温AlN)在r面蓝宝石衬底上生长了非极性的α面GaN,并利用高分辨X射线衍射和光致荧光谱对所生长的材料进行了研究.两步AIN缓冲层在我们之前的工作中已被证明比单步高温AlN或低温GaN缓冲层更有利于减小材料各向异性和提高晶体质量,本文进一步优化了两步AlN缓冲层的结构,并得到了各向异性更小,晶体质量更好的α面GaN薄膜.分析表明,两步AlN缓冲层中的低温AlN层在减小各向异性中起着关键作用.低温AlN层能抑制了优势方向(c轴)的原子迁移,有利于劣势方向(m轴)的原子迁移,从而减小了Al原子在不同方向迁移能力的差异,并为其后的高温AlN缓冲层和GaN层提供"生长模板",以得到各向异性更小、晶体质量更好的α面GaN材料.     

初始化生长条件对a-GaN中应变的影响

利用高分辨X射线衍射(HRXRD)与拉曼散射光谱(Raman scattering spectra)研究了氮化处理与低温AlN缓冲层对低压金属有机化学气相沉积(LP-MOCVD)在r面蓝宝石衬底上外延的a面GaN薄膜中的残余应变的影响。实验结果表明:与氮化处理后生长的a-GaN相比,使用低温AlN缓冲层后生长的a-GaN具有较小的摇摆曲线的半高宽和较低的残余应变,而且其结构各向异性和残余应变各向异性也均有一定程度的降低。因此,与氮化处理相比,低温AlN缓冲层更有利于a-GaN的生长。     

用MOVPE和RF-MBE方法极性控制生长GaN

本文报道了用低压MOVPE和RF-分子束外延法在蓝宝石衬底上作极性控制的GaN生长.以“双Al单层”模型讨论了用MOVPE和MBE法在蓝宝石衬底上生长GaN的极性选择的机理,并对AlN在极性转换过程中的作用给出了适当的解释.通过极性控制的生长,使MBE法生长的GaN的表面形貌和电学特性都得到了改善;并对LP-MOVPE生长开发出了一种“三步生长法”,这样就可以用更多的外延方式在蓝宝石衬底上生长出高质量的GaN膜.     

在6H-SiC衬底上用低压MOVPE法生长AlN和GaN的过程中用(AlN/GaN)多层缓冲层来控制残余应力

人们已提出用BAlGaN四元系材料制备紫外光谱区的光发射器件.GaN和AlN二元系是这种四元材料在器件应用中的基础材料.6H-SiC衬底在氮化物生长中因其晶格失配小是一大优势,而且SiC衬底的热膨胀系数也和AlN的很接近.然而,对于AlN外延层来说,需要控制其中的残余应力,因为在SiC衬底上直接生长的AlN外延层中存在着因晶格失配所产生的压缩应力.另一方面,在SiC衬底上直接生长的GaN外延层中存在着拉伸应力.这种拉伸应力起源于GaN比衬底有着更大的热膨胀系数.本文讨论了在6H-SiC衬底上生长的氮化物外延层中残余应力的类型、数量及控制.为此目的,提出了在6H-SiC衬底上,无论是生长AlN,还是生长GaN,都可以采用(GaN/AlN)多层缓冲层的办法,作为控制残余应力的有效方法.我们还讨论了AlN和GaN外延层的结晶质量和残余应力间的关系.     

分子束外延生长的极性与非极性BeZnO薄膜的比较研究

采用分子束外延设备在不同晶面蓝宝石衬底上(c面,a面,r面)生长BeZnO薄膜。使用复合缓冲层生长得到了高质量的BeZnO薄膜,X射线衍射半高宽达到600 arcsec。在c面与a面蓝宝石衬底上生长得到了极性BeZnO薄膜,在r面蓝宝石上生长得到了非极性BeZnO薄膜。共振拉曼光谱测试结果表明薄膜中的Be含量在同一水平。相对于c面与a面蓝宝石上的极性BeZnO薄膜,生长在r面蓝宝石衬底上的非极性BeZnO薄膜具有较大的表面粗糙度以及较大的半高宽,但是其光致发光谱中的紫外发光峰远远强于极性BeZnO薄膜,并且黄绿光发光峰弱于极性BeZnO薄膜。     

SiO2对多层GaN外延片热应力分布影响的仿真分析

为了研究SiO2对多层结构GaN外延片的热应力的影响,以直径d为40 mm的GaN外延片为研究对象,利用有限元分析法分别对蓝宝石/AlN/GaN和蓝宝石/SiO2/AlN/GaN这两种光阴极组件外延片表面热应力进行理论计算和仿真。在其他结构参数相同的情况下,分别分析了两种光阴极组件外延片径向和厚度方向的应力分布,分析了外延片热应力分布及影响因素。分析结果显示:在1 200 ℃的生长温度下,径向区域内的热应力分布比较均匀,厚度方向的热应力均在衬底和外延层的界面上发生突变。最后分析了外延片生长温度、蓝宝石衬底和GaN、AlN过渡层厚度对表面热应力的影响。     

The influence of SixNy interlayer on GaN film grown on Si(111) substrate

A method to drastically reduce dislocation density in a GaN film grown on an Si(111) substrate is newly developed. In this method, the Si_xN_y interlayer which is deposited on an AlN buffer layer in situ is introduced to grow the GaN film laterally. The crack-free GaN film with thickness over 1.7 micron is grown on an Si(111) substrate successfully. Synthesized GaN epilayer is characterized by X-ray diffraction (XRD), atomic force microscope (AFM), and Raman spectrum. The test results show that the GaN crystal reveals a wurtzite structure with the <0001> crystal orientation and the full width at half maximum of the X-ray diffraction curve in the (0002) plane is as low as 403 arcsec for the GaN film grown on the Si substrate with an Si_xN_y interlayer. In addition, Raman scattering is used to study the stress in the sample. The results indicate that the Si_xN_y interlayer can more effectively accommodate the strain energy. So the dislocation density can be reduced drastically, and the crystal quality of GaN film can be greatly improved by introducing Si_xN_y interlayer.     

The effect of single A1GaN interlayer on the structural properties of GaN epilayers grown on Si （111） substrates

High-quality and nearly crack-free GaN epitaxial layer was obtained by inserting a single AlGaN interlayer between GaN epilayer and high-temperature AlN buffer layer on Si (111) substrate by metalorganic chemical vapor deposition. This paper investigates the effect of AlGaN interlayer on the structural properties of the resulting GaN epilayer. It confirms from the optical microscopy and Raman scattering spectroscopy that the AlGaN interlayer has a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and transmission electron microscopy analysis reveal that a significant reduction in both screw and edge threading dislocations is achieved in GaN epilayer by the insertion of AlGaN interlayer. The process of threading dislocation reduction in both AlGaN interlayer and GaN epilayer is demonstrated.     

Influence of AlN buffer layer thickness on structural properties of GaN epilayer grown on Si (111) substrate with AlGaN interlayer

We present the growth of GaN epilayer on Si (111) substrate with a single AlGaN interlayer sandwiched between the GaN epilayer and AlN buffer layer by using the metalorganic chemical vapour deposition. The influence of the AlN buffer layer thickness on structural properties of the GaN epilayer has been investigated by scanning electron microscopy, atomic force microscopy, optical microscopy and high-resolution x-ray diffraction. It is found that an AlN buffer layer with the appropriate thickness plays an important role in increasing compressive strain and improving crystal quality during the growth of AlGaN interlayer, which can introduce a more compressive strain into the subsequent grown GaN layer, and reduce the crack density and threading dislocation density in GaN film.     

Control of polarity and defects in the growth of AlN films on Si (111) surfaces by inserting an Al interlayer

We discuss the role of the Al interlayer in the suppression of pinhole formations and also look at the polarity transition of the AlN layers from N-polarity to Al-polarity when this Al interlayer is present. The AlN layers were grown by molecular beam epitaxy on an AlN nucleation layer. A thin Al interlayer was deposited on the initial nucleated AlN layer after the nitridation of the Al-soaked Si (111) substrates. The AlN layer with an Al interlayer showed a relatively smooth surface with a reduced density of pinholes compared with the AlN layer grown without an Al interlayer. In addition, the AlN layer with an Al interlayer showed some stacking faults in the interface between the Si substrate and the A1N layer. We also identify the polarity change of the AlN layer after the insertion of a thin Al interlayer from N-polarity to Al-polarity by chemical etching. A simple model is constructed to explain the polarity change and the pinhole suppression due to the Al interlayer.     

AlGaN/AlN/GaN结构中二维电子气的输运特性

对使用金属有机物汽相沉积法生长的AlGaN/AlN/GaN结构进行的变温霍尔测量，测量结果指出在AlN/GaN界面处有二维电子气存在且迁移率和浓度在2K时分别达到了1.4×10⁴cm²·V^-1·s^-1和9.3×10¹²cm^-2，且在200K到2K范围内二维电子气的浓度基本不变，变磁场霍尔测量发现只有一种载流子(电子)参与导电.在2K温度下，观察到量子霍尔效应，Shubnikov-de Haas (SdH) 振荡在磁场约为3T时出现，证明了此结构呈现了典型的二维电子气行为.通过实验数据对二维电子气散射过程的半定量分析，推出量子散射时间为0.23ps，比以往报道的AlGaN/GaN结构中的散射时间长，说明引入AlN层可以有效减小合金散射，进一步的推断分析发现低温下以小角度散射占主导地位.     

InGaN/GaN多量子阱热退火的拉曼光谱和荧光光谱

通过拉曼光谱及荧光光谱测量研究了采用低压金属有机化学沉积(MOCVD)方法生长的InGaN／GaN多量子阱高温快速热退火处理对量子阱光学性质的影响。观测到退火后InGaN／GaN量子阱的拉曼光谱E2,A1(LO)模式的峰位置出现了红移,而且该振动峰的半高宽也有微小变化。温度升高退火效果更明显。退火使量子阱内应力部分消除,同时In,Ga原子扩散出现相分离使拉曼谱表现出变化。在常温和低温下的光荧光谱表明,退火处理的量子阱发光主峰都出现了红移;而且低温退火出现红移,退火温度升高相对低温退火出现蓝移;同时在低温荧光光谱里看到经过退火处理后原发光峰中主峰旁边弱的峰消失了。讨论了退火对多量子阱光学性质的影响。     

蓝宝石衬底上GaN/AlxGa1-xN超晶格插入层对AlxGa1-xN外延薄膜应变及缺陷密度的影响

室温300K下,由于Al_xGa_1-xN的带隙宽度可以从GaN的3.42eV到AlN的6.2eV之间变化,所以Al_xGa_1-xN是紫外光探测器和深紫外LED所必需的外延材料.高质量高铝组分Al_xGa_1-xN材料生长的一大困难就是Al_xGa_1-xN与常用的蓝宝石衬底之间大的晶格失配和热失配.因而采用MOCVD在GaN/蓝宝石上生长的Al_xGa_1-xN薄膜由于受张应力作用非常容易发生龟裂.GaN/Al_xGa_1-xN超晶格插入层技术是释放应力和减少Al_xGa_1-xN薄膜中缺陷的有效方法.研究了GaN/Al_xGa_1-xN超晶格插入层对GaN/蓝宝石上Al_xGa_1-xN外延薄膜应变状态和缺陷密度的影响.通过拉曼散射探测声子频率从而得到材料中的残余应力是一种简便常用的方法,Al_xGa_1-xN外延薄膜的应变状态可通过拉曼光谱测量得到.Al_xGa_1-xN外延薄膜的缺陷密度通过测量X射线衍射得到.对于具有相同阱垒厚度的超晶格,例如4nm/4nm,5nm/5nm,8nm/8nm的GaN/Al_0.3Ga_0.7N超晶格,研究发现随着超晶格周期厚度的增加Al_xGa_1-xN外延薄膜缺陷密度降低,Al_xGa_1-xN外延薄膜处于张应变状态,且5nm/5nmGaN/Al_0.3Ga_0.7N超晶格插入层Al_xGa_1-xN外延薄膜的张应变最小.在保持5nm阱宽不变的情况下,将垒宽增大到8nm,即十个周期的5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层使Al_xGa_1-xN外延层应变状态由张应变变为压应变.由X射线衍射结果计算了Al_xGa_1-xN外延薄膜的刃型位错和螺型位错密度,结果表明超晶格插入层对螺型位错和刃型位错都有一定的抑制效果.透射电镜图像表明超晶格插入层使位错发生合并、转向或是使位错终止,且5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层导致Al_xGa_1-xN外延薄膜中的刃型位错倾斜30°左右,释放一部分压应变.     

The effect of low temperature AlN interlayers on the growth of GaN epilayer on Si (111) by MOCVD

Low temperature (LT) AlN interlayers were used to effectively reduce the tension stress and micro-cracks on the surface of the GaN epilayer grown on Si (111) substrate. Optical Microscopy (OM), Atomic Force Microscopy (AFM), Surface Electron Microscopy (SEM) and X-Ray Diffraction (XRD) were employed to characterize these samples grown by metal-organic chemical vapor deposition (MOCVD). In addition, wet etching method was used to evaluate the defect of the GaN epilayer. The results demonstrate that the morphology and crystalline properties of the GaN epilayer strongly depend on the thickness, interlayer number and growth temperature of the LT AlN interlayer. With the optimized LT AlN interlayer structures, high quality GaN epilayers with a low crack density can be obtained.     

The influence of an SixNy interlayer on a GaN film grown on an Si（lll） substrate

<正>A method to drastically reduce dislocation density in a GaN film grown on an Si(111) substrate is newly developed. In this method,the Si_xN_y interlayer which is deposited on an A1N buffer layer in situ is introduced to grow the GaN film laterally.The crack-free GaN film with thickness over 1.7 micron is successfully grown on an Si(111) substrate. A synthesized GaN epilayer is characterized by X-ray diffraction(XRD),atomic force microscope(AFM),and Raman spectrum.The test results show that the GaN crystal reveals a wurtzite structure with the(0001) crystal orientation and the full width at half maximum of the X-ray diffraction curve in the(0002) plane is as low as 403 arcsec for the GaN film grown on the Si substrate with an Si_xN_y interlayer.In addition,Raman scattering is used to study the stress in the sample.The results indicate that the Si_xN_y interlayer can more effectively accommodate the strain energy.So the dislocation density can be reduced drastically,and the crystal quality of GaN film can be greatly improved by introducing an Si_xN_y interlayer.