Rodlike/flexible polyimide composite films prepared from soluble poly(amic diethyl ester) precursors: Miscibility,structure, and properties

Homogeneous precursor/precursor solutions with various compositions were obtained with appreciably high solid contents in N-methyl-2-pyrrolidone from soluble poly(amic diethyl ester) precursors of rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) and flexible poly(4,4′-oxydiphenylene biphenyltetracarboximide) (BPDA-ODA), which are hydrolytically more stable as well as more soluble than the corresponding poly(amic acid)s being equilibrated with the constituent monomers. Both optical microscopic and light scattering measurements showed that the dried precursor blend films and resultant polyimide composite films were optically transparent, regardless of compositions and process conditions. The composite films showed a single T_g behavior. However, for the composite of 30 wt % BPDA-PDA dispersed in the matrix of 70 wt % BPDA-ODA, a smectic crystalline-like aggregation of the BPDA-PDA component was detected on wide-angle x-ray diffraction patterns, indicative of microscopic phase separation between the two components. This phase separation was not detected on the optical microscopy, light scattering, and dynamic mechanical thermal analysis because of their resolution limits: Optical microscopy has a resolution of submicrometers, whereas dynamic mechanical thermal analysis and light scattering have a resolution of ca. 50 Å. Therefore, it is speculated that in the composite films BPDA-PDA and BPDA-ODA polyimide molecules have demixed on the scale of a few nanometers. The mean long periodicity, which was estimated from the small-angle x-ray scattering pattern, varied from 134 to 170 Å as the content of BPDA-ODA component increased. In addition, mechanical properties of the composite films were characterized. ©1995 John Wiley & Sons, Inc.     

Synthesis and properties of new polyimides derived from 1,5-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

Novel aromatic polyimides containing bis(phenoxy)naphthalene units were synthesized from 1,5-bis(4-aminophenoxy)naphthalene (APN) and various aromatic tetracarboxylic dianhydrides by the usual two-step procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by cyclodehydration to polyimides. The poly(amic acid)s had inherent viscosities between 0.72 and 1.94 dL/g, depending on the tetracarboxylic dianhydrides used. Excepting the polyimide IVb obtained from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), all other polyimides formed brown, flexible, and tough films by casting from the poly(amic acid) solutions. The polyimide synthesized from BPDA was characterized as semicrystalline, whereas the other polyimides showed amorphous patterns as shown by the x-ray diffraction studies. Tensile strength, initial moduli, and elongation at break of the APN-based polyimide films ranged from 105–135 MPa, 1.92–2.50 GPa, and 6–7%, respectively. These polyimides had glass transition temperatures between 228 and 317°C. Thermal analyses indicated that these polymers were fairly stable, and the 10% weight loss temperatures by TGA were recorded in the range of 543–574°C in nitrogen and 540–566°C in air atmosphere, respectively. © 1993 John Wiley & Sons, Inc.     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

Residual stress and optical properties of fully rod-like poly(p-phenylene pyromellitimide) in thin films: Effects of soft-bake and thermal imidization history

A soluble poly(amic acid) precursor solution of fully rod-like poly(p-phenylene pyromellitimide) (PMDA-PDA) was spin cast on silicon substrates, followed by soft bake at 80–185°C and subsequent thermal imidization at various conditions over 185–400°C in nitrogen atmosphere to be converted to the polyimide in films. Residual stress generated at the interface was measured in situ during imidization. In addition, the imidized films were characterized in the aspect of polymer chain orientation and ordering by prism coupling and X-ray diffraction. The soft-baked precursor film revealed a residual stress of 16–28 MPa at room temperature, depending on the soft bake condition: higher temperature and longer time in the soft bake gave higher residual stress. The stress variation in the soft-baked precursor film was not significantly reflected in the final stress in the resultant polyimide film. However, the residual stress in the polyimide film varied sensitively with variations in imidization process parameters, such as imidization temperature, imidization steps, heating rate, and film thickness. The polyimide film exhibited a wide range of residual stress, −7 MPa to 8 MPa at room temperature, depending on the imidization condition. Both rapid imidization and low-temperature imidization generated high stress in the tension mode in the polyimide film, whereas slow imidization as well as high temperature imidization gave high stress in the compression mode. Thus, a moderate imidization condition, a single- or two-step imidization at 300°C for 2 h with a heating rate of < 10 K/min was proposed to give a relatively low stress in the polyimide film of < 10 μm thickness. However, once a precursor film was thermally imidized at a chosen process condition, the residual stress–temperature profile was insensitive to variations in the cooling process. All the films imidized were optically anisotropic, regardless of the imidization history, indicating that rod-like PMDA-PDA polyimide chains were preferentially aligned in the film plane. However, its degree of in-plane chain orientation varied on the imidization history. It is directly correlated to the residual stress in the film, which is an in-plane characteristic. For films with residual stress in the tension mode, higher stress films exhibited lower out-of-plane birefringence, that is, lower in-plane chain orienta-tion. In contrast, in the compression mode, higher stress films showed higher in-plane chain orientation. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1261–1273, 1998     

Structure and properties of thin films of binary rodlike/flexible polyimide mixtures

Binary mixtures of a rodlike poly(p-phenylene pyromellitimide) (PMDA-PDA) and a flexible 6F-BDAF polyimide synthesized from hexafluoroisopropylidene diphthalic anhydride and 2,2-bis(4-aminophenoxy-p-phenylene) hexafluoropropane were prepared by solution-blending of the meta-PMDA-PDA poly(amic ethyl ester) and 6F-BDAF poly(amic acid) precursors, followed by solvent evaporation and thermal imidization. Mixtures containing different molecular weights of 6F-BDAF poly(amic acid) were studied. The size scale of the phase separation, as measured by light scattering, is ca. 1 μm or smaller in most cases. The domain size is primarily set by the demixing of the precursor polymers during solvent evaporation, with no significant coarsening observed during the thermal imidization. The observed variation of the domain size with molecular and process parameters such as composition, molecular weight, and film thickness is discussed in terms of the miscibility of the precursor polymers, rate of solvent evaporation, and solidification. Dynamic mechanical thermal analysis and dielectric relaxation measurements indicate that the glass transition temperature of 6F-BDAF is unaffected in all of the mixtures studied, indicating complete demixing of rodlike and flexible polyimides in agreement with theory. X-ray photoelectron spectroscopy results show a strong surface segregation of 6F-BDAF in mixtures containing as low as 10% by weight of the 6F-BDAF component in the bulk. The mixtures with PMDA-PDA as the major matrix component therefore exhibit excellent mechanical toughness, dimensional stability up to 500°C, low coefficients of thermal expansion (< ca. 10 ppm/°C), and low dielectric constants (<3.0). On the other hand, the surface properties of the mixtures are dominated by the flexible 6F-BDAF, resulting in excellent polymer/polymer self-adhesion (lamination) properties between fully imidized films.     

Synthesis and properties of polyimides derived from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene

Novel aromatic polyimides containing symmetric, bulky di-tert-butyl substituents unit were synthesized from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene (BADTB) and various aromatic tetracarboxylic dianhydrides by the conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide to give poly(amic acid)s, followed by cyclodehydration to polyimides. The diamine was prepared through the nucleophilic displacement of 2,5-di-tert-butylhydroquinone with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.83–1.88 dL g⁻¹. Most of the polyimides formed transparent, flexible, and tough films. Tensile strength and elongation at break of the BADTB-based polyimide films ranged from 68–93 MPa and 7–11%, respectively. The polyimide derived from 4,4′-hexafluoro-isopropylidenebisphathalic anhydride had better solubility than the other polyimides. These polyimides had glass transition temperatures between 242–298°C and 10% mass loss temperatures were recorded in the range of 481–520°C in nitrogen. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1527–1534, 1997     

Synthesis and properties of polyimides derived from 1,7-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

The novel diamine, 1,7-bis(4-aminophenoxy)naphthalene (1,7-BAPON), was synthesized and used to prepared polyimides. 1,7-BAPON was synthesized through the nucleophilic displacement of 1,7-dihydroxynaphthalene with p-fluoronitrobenzene in the presence of K₂CO₃ followed by catalytic-reduction. Polyimides were prepared from 1,7-BAPON and various aromatic tetracarboxylic dianhydrides by the usual two-step procedure that included ring-opening polyaddition to give poly(amic acid)s, followed by cyclodehydration to polyimides. The poly(amic acid)s had inherent viscosities of 0.74-2.48 dL/g. Most of the polyimides formed tough, creasible films. These polyimides had glass transition temperatures between 247–278°C and their 10% weight loss temperatures were recorded in the range of 515–575°C in nitrogen atmosphere. © 1995 John Wiley & Sons, Inc.     

Poly(ether‐imide) and related sepiolite nanocomposites: investigation of physical,thermal, and mechanical properties

Novel poly(ether‐imide) and sepiolite nanocomposites were synthesized based on a unique diamine monomer with the aim of improving physical and mechanical properties of final polyimide films. The diamine was polycondensed with 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride to produce related poly(ether amic acid) prepolymer. Pure poly(ether‐imide) and nanocomposite films were prepared via thermal imidization process of poly(ether amic acid). Coexistence of ether, pyridine, and phenylene functional groups in the diamine chemical structure resulted in flexible polyimide films with significant thermal, physical, and mechanical properties. Thermal stability, glass‐transition temperature, dimensional stability, and tensile properties of polymer and nanocomposites were studied and compared. Morphology of nanocomposites was also investigated using scanning and transmission electron microscopic methods to study the distribution and dispersion behavior of sepiolite nanofibers in the polyimide matrix. By introduction of sepiolite nanoparticles, overall improvement of properties was observed in respect to pure polyimides. Copyright © 2015 John Wiley & Sons, Ltd.     

Chain orientation and anisotropies in optical and dielectric properties in thin films of stiff polyimides

Thin films of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the precursor poly(amic acid) on substrates, have been investigated by optical waveguide, ultraviolet-visible (UV-VIS), infrared (IR), and dielectric spectroscopies. The polyimide films exhibit an extraordinarily large anisotropy in the refractive indices with the in-plane index n_∥ = 1.806 and the out-of-plane index n_⊥ = 1.589 at 1064 nm wavelength. No discernible effect of the film thickness on this optical anisotropy is found between films of ca. 2.1 and ca. 7.8 μm thickness. This large birefringence is attributed to the preferential orientation of the biphenyltetracarboximide moieties with their planes parallel to the film surface, coupled with the strong preference of BPDA-PDA chains to align along the film plane. The frequency dispersion of the in-plane refractive index n_∥ is consistent with the results calculated by the Lorentz–Lorenz equation from the UV-visible spectrum exhibiting several absorption bands in the 170–500 nm region. The contribution from the IR absorption in the range 7000–400 cm,^?1 computed by the Spitzer-Kleinmann dispersion relations from the measured spectra, adds ca. 0.046 to the in-plane refractive index n_∥. Tilt-angle–dependent polarized IR results indicate nearly the same increase for the out-of-plane index n_⊥. Application of the Maxwell relation then leads to the out-of-plane dielectric constant ε^⊥ ? 2.7 at 1.2 × 10¹³ Hz, as compared with the measured value of ca. 3.0 at 10⁶ Hz. Assuming this small difference to remain the same for the in-plane dielectric constants ε_∥, we obtain a very large anisotropy in the dielectric properties of these polyimide films with the estimated in-plane dielectric constant ε_∥ ? 3.4 at 1.2 × 10¹³ Hz, and ε_∥ ? 3.7 at 10⁶ Hz. © 1992 John Wiley & Sons, Inc.     

Nanoindentation and optical properties of poly(4,4′-oxydiphenylene p-phenylene pyromellitimide) copolyimide thin films according to the p-phenylene diamine content

Poly(p-phenylene pyromellitimide) (PMDA-PDA), poly(oxydiphenylene pyromellitimide) (PMDA-ODA), and poly(4,4′-oxydiphenylene p-phenylene pyromellitimide) random copolyimide thin films with different p-phenylene diamine (PDA) contents were prepared. Nanoindentation was used to characterize the mechanical properties (hardness and modulus), and a prism coupler was used for measuring the optical properties (refractive index and birefringence). The hardness and modulus were calculated from curves of the nanoindentation load versus the displacement. The effect of the PDA content on the hardness and modulus was studied. The hardness of the polyimide thin films varied from 0.248 to 0.613 GPa, and the modulus varied from 3.78 to 6.75 GPa at a load of 0.127 mN. The hardness and modulus increased with increasing PDA content, whereas the penetration depth and plastic deformation decreased. As the load increased, the penetration depth increased. The hardness of PMDA-ODA films remained constant, whereas that of PMDA-PDA and PMDA-ODA/PDA films decreased with increasing load. The in-plane refractive index varied from 1.7219 to 1.8244, and the out-of-plane refractive index varied from 1.6390 to 1.5827, as a function of the PDA content. The birefringence varied with the PDA content from 0.0829 to 0.2417. The morphological structure of the prepared polyimide thin films was investigated with wide-angle X-ray diffraction. The mechanical properties and optical properties of the polyimide thin films were strongly dependent on the changes in the morphological structure, which originated from the variation of the composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2202–2214, 2004     

Synthesis and characterization of polyimides based on new fluorinated 3,3′-diaminobiphenyls

Two new fluorinated diamine monomers, 3,3′-diamino-5,5′-bis(trifluoromethyl)biphenyl and 3,3′-diamino-6,6′-bis(trifluoromethoxy)biphenyl, as well as a known nonfluorinated analog, 3,3′-diaminobiphenyl, were synthesized. Reaction of these diamines with rigid, highly rod-like dianhydrides produced poly(amic acid)s and polyimides, which were spin coated and thermally treated to produce polyimide films for evaluation in electronics applications. It was hoped that these polyimide films would exhibit an ideal combination of low thermal expansion, reduced water absorption, and low dielectric constant but with improved elongation due to the “crankshaft” nature of the 3,3′-biphenyl unit. Unlike polyimide films from analogous 4,4′-diaminobiphenyls, however, the 3,3′-diaminobiphenyl-based polyimides did not yield low in-plane thermal expansion coefficient in spin-coated films. In some cases high elongation was achieved, but with high thermal expansion. These new diamines may nevertheless find utility in polyimides and polyaramides for membrane, fiber, and other applications. Additionally, they may be useful in modifying the properties of polymer backbones via copolymerization. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2441–2451, 1997     

Synthesis and properties of polyimides derived from 1,6-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

1,6-Bis(4-aminophenoxy)naphthalene ( I ) was used as a monomer with various aromatic tetracarboxylic dianhydrides to synthesize polyimides via a conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclodehydration to polyimides. The diamine ( I ) was prepared through the nucleophilic displacement of 1,6-dihydroxynaphthal-ene with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.73–2.31 dL/g. All the poly(amic acid)s could be solution cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimide films had a tensile modulus range of 1.53–1.84 GPa, a tensile strength range of 95–126 MPa, and an elongation range at break of 9–16%. The polyimide derived from 4,4′-sulfonyldiphthalic anhydride (SDPA) had a better solubility than the other polyimides. These polyimides had glass transition temperatures between 248–286°C (DSC). Thermogravimetric analyses established that these polymers were fairly stable up to 500°C, and the 10% weight loss temperatures were recorded in the range of 549–595°C in nitrogen and 539–590°C in air atmosphere. © 1995 John Wiley & Sons, Inc.     

Simple and easy recycling of poly(amic acid) gels through microwave irradiation

Poly(amic acid)s (PAAs), which are precursors of polyimides, often undergo gel formation during their synthesis or storage, and these insoluble gels have been discarded. In this work, we discovered that the gels could be converted to homogeneous PAA solutions by fast and simple microwave (MW) irradiation. The PAA gels were placed inside a domestic MW oven, and MW irradiation was carried out with 240 W for 2 min. The recycled PAA solutions afforded polyimide films, coatings, and powders. The polyimides prepared from the recycled PAA solutions exhibited higher glass transition temperatures (T_gs), decomposition temperatures, and char yields than comparison polyimides obtained from ordinary PAA solutions. Flexible free‐standing polyimide films were obtained by drop‐casting of the MW‐treated solutions and subsequent thermal imidization. Mechanical properties and dielectric constants were measured for the polyimide films and coatings, respectively. This new method has significant advantages for the environment, economy, and industry. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 981–987     

Synthesis and characterization of new cardo polyimides prepared from 5,5-Bis[4-(4-aminophenoxy)phenyl]-4,7-methanohexahydroindane

A new cardo diamine monomer, 5,5-bis[4-(4-aminophenoxy)phenyl]-4,7-methanohexahydroindane (II), was prepared in two steps with high yield. The monomer was reacted with six different aromatic tetracarboxylic dianhydrides in N,N-dimethylacetamide (DMAc) to obtain the corresponding cardo polyimides via the poly(amic acid) precursors and thermal or chemical imidization. All the poly(amic acid)s could be cast from their DMAc solutions and thermally converted into transparent, flexible, and tough polyimide films which were further characterized by x-ray and mechanical analysis. All of the polymers were amorphous and the polyimide films had a tensile strength range of 89–123 MPa, an elongation at break range of 6–10%, and a tensile modulus range of 1.9–2.5 GPa. Polymers V_c, V_e, and V_f exhibited good solubility in a variety of solvents such as N-methyl-2-pyrrolidinone (NMP), DMAc, N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridine, γ-butyrolactone, and even in tetrahydrofuran and chloroform. These polyimides showed glass-transition temperatures between 274 and 299°C and decomposition temperatures at 10% mass loss temperatures ranging from 490 to 521°C and 499 to 532°C in nitrogen and air atmospheres, respectively. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2815–2821, 1999     

聚酰胺酸结构及其亚胺化的红外光谱分析

利用变温透射红外光谱方法,通过跟踪聚酰胺酸（PAA）的亚胺化过程,对由均苯四酸二酐和4,4′-二氨基二苯醚合成的聚酰胺酸及经过加热亚胺化后生成的聚酰亚胺(PI)的红外吸收光谱进行分析,对聚酰胺酸和聚酰亚胺的红外谱峰进行合理的归属,发现聚酰胺酸在亚胺化过程中有-COO-和-NH+2存在,-COO-中羰基的对称与反对称伸缩振动分别位于1607和1406 cm-1,NH+2的伸缩振动则有3200、3133、2938、2880、2820和2610 cm-1等多个精细谱带。 并根据对-COO-和-NH+2谱峰的归属,提出聚酰胺酸生成聚酰亚胺的机理为聚酰胺酸中COOH的H+转移到聚酰胺酸中的NH上,形成NH+2,然后脱水环化生成聚酰亚胺。     

Preparation, characterization and dielectric properties of 4,4-diphenylmethane diisocyanate (MDI) based cross-linked polyimide films

Four different types of cross-linked polyimides based on 4,4-diphenylmethane diisocyanate (MDI) were prepared by the reaction of different types of conventional poly(amic acid) intermediates with MDI as a cross-linking agent. Subsequently, they were thermally imidized in order to obtain corresponding cross-linked polyimide structure. The results of FTIR-ATR showed that MDI can effectively react with carboxylic acid groups of PAA to form cross-linked polyimide films. TGA, FTIR-ATR and SEM analyses were carried out for characterization of cross-linked polyimide (CPI) films. Moreover, the electrical properties such as dielectric breakdown strength, dielectric constant, I-V characteristics and loss factor of MDI based cross-linked polyimides have been checked. In addition, some physical properties such as water uptake, adhesion, hardness and solubility properties of the films were investigated.The results showed that all CPI films have good insulating properties such as high dielectric breakdown voltage, low loss factor (tan δ), leakage density and excellent physical properties.     

Thianthrene-containing polyimides with monomer formation via nucleophilic aromatic substitution

Thianthrene-2,3,7,8-tetracarboxylic dianhydride was synthesized via nucleophilic aromatic substitution of N-phenyle-4,5-dichlorophthalimide with thiobenzamide, thioacetamide, and sodium sulfide. This monomer was then polymerized with aromatic diamines by the con-ventional low temperature technique in N,N-dimethylacetamide (DMAc) to yield soluble poly(amic acid)s. Polyimides were obtained by thermal cyclization of the poly(amic acid) films. Polymers obtained formed creasable thin films and had excellent thermal stability in air and nitrogen. The bent thianthrene structure limited crystallization and chain packing, as indicated by x-ray analysis. The amorphous thianthrene-containing polyimides were only soluble in H₂SO₄. © 1995 John Wiley & Sons, Inc.     

Polyimides with alicyclic diamines. I. Syntheses and thermal properties

The polyaddition reactions of alicyclic diamines such as 1,4-diaminocyclohexane (1,4-CHDA) or 4,4′-diaminodicyclohexylmethane (DCHM) and configurational isomers of 1,4-CHDA or DCHM with tetracarboxylic aromatic anhydrides in aprotic solvents were carried out to prepare high molecular weight poly(amic acid)s. Through the thermal imidization of poly(amic acid)s, several flexible polyimide films were prepared. Because of the stiffness of the alicyclic moieties in diamines, the resulting polyimides exhibit high glass transition temperatures (220–340°C) almost similar to those for corresponding aromatic polyimides which have phenylene groups in place of cyclohexyl groups, and show good thermal stability. The partial crystallization was observed for polyimides with trans-cyclohexyl moiety during the heating in differential scanning calorimetry and ascertained by wide-angle x-ray diffraction. Thus, the inhibition of the occurrence of charge transfer in polyimides is accomplished by introducing alicyclic diamines in place of aromatic diamines without reducing their thermal stability. © 1993 John Wiley & Sons, Inc.     

Thermal behavior of aromatic polyamic acids and polyimides containing oxadiazole rings

Two aromatic polyimides and the corresponding poly(amic acid)s, with oxadiazole and para/meta phenoxyphenylene rings in the backbone, were synthesized and the structure — thermal properties correlation was followed by dynamic mechanical analysis. Concerning the poly(amic acid)s, the glass transition domain was emphasized only for the compound with meta-oriented rings because the process of imidization takes place with increasing temperature. A multiplex experiment was performed to calculate the activation energy of the transition localized under 200°C. Consecutive heating-cooling-heating cycles were accomplished. All phenomena are discussed by cross-examination of the storage modulus (E′), loss modulus (E″) and loss factor tanδ variation with temperature.     

A novel type of Si-containing poly(urethane-imide)s: synthesis, characterization and electrical properties

A novel type of a Si-containing poly(urethane-imide) (PUI) was prepared by two different methods. In the first method, Si-containing polyurethane (PU) prepolymer having isocyanate end groups was prepared by the reaction of diphenylsilanediol (DSiD) and toluene diisocyanate (TDI). Subsequently the PU prepolymer was reacted with pyromellitic dianhydride (PMDA) or benzophenonetetracarboxylic dianhydride (BTDA) in N-methyl pyrolidone (NMP) to form Si-containing modified polyimide directly. In the second method, PU prepolymer was reacted with diaminodiphenylether (DDE) or diaminodiphenylsulfone (DDS) in order to prepare an amine telechelic PU prepolymer. Finally, the PU prepolymer having diamine end groups was reacted with PMDA or BTDA to form a Si-containing modified polyimide. Cast films prepared by second method were thermally treated at 160 °C to give a series of clear, transparent PUI films. Thermogravimetric analysis indicated that the thermal degradation of PUI starts at 265 °C which is higher than degradation temperature of conventional PU, confirming that the introduction of imide groups improved the thermal stability of PU.To characterize the modified polyimides and their films, TGA, FTIR, SEM and inherent viscosity analyses were carried out. The dielectrical properties were investigated by the frequency-capacitance method. Dielectric constant, dielectric breakdown strength, moisture uptake and solubility properties of the films were also investigated.