Highly regular nanometer-sized hexagonal pipes in 6H-SiC(0001)

An array of troughs was prepared on a 6H-SiC(0001) surface using focused ion beam (FIB) patterning. Troughs were etched with various ion doses and close-to-circular voids of increasing depths for larger ion doses were obtained. The samples were then etched in a hot-wall reactor at a hydrogen partial pressure of 13 mbar at 1800 °C. The resulting morphological reorganizations have been studied by scanning electron and atomic force microscopy. Very regular hexagonal voids with facets oriented perpendicular to the surface were obtained after hydrogen etching. The voids were surrounded by regular secondary facets of lower inclination. Whereas the depth of the voids increases with ion dose, the void diameter and facet sizes stay constant. This effect is explained by surface diffusion during hydrogen etching. The FIB technique in combination with hydrogen etching allows the preparation of very regular surface patterns and highly ordered wells and tubes for nanometer-sized sieves and photonic crystals. PACS 47.70.Fw; 68.37.-d; 68.37.Hk; 68.37.Ps; 81.65.Cf     

Development of the Technique for Fabricating Submicron Moire Gratings on Metal Materials Using Focused Ion Beam Milling

A focused gallium ion （Ga＋） beam is used to fabricate micro/submicron spacing gratings on the surface of porous NiTi shape memory alloy （SMA ）. The crossing type of gratings with double-frequency （25001/mm and 50001/mm） using the focused ion beam （FIB） milling are successfully produced in a combination mode or superposition mode. Based on the double-frequency gratings, high-quality scanning electron microscopy （SEM） Moird patterns are obtained to study the micro-scale deformation of porous NiTi SMA. The grating fabrication technique is discussed in detail. The experimental results verify the feasibility of fabricating high frequency grating on metal surface using FIB milling.     

InGaAs circular-grating-coupled surface emitting laser with focusing function fabricated by electron beam writing with circular scanning

We report the design, fabrication and operation of an InGaAs QW circular-grating-coupled surface emitting laser (CGCSEL) which can focus the output laser beam. Circular distributed Bragg reflector and circular chirped grating coupler were fabricated by electron beam lithography employing smooth circular scanning and two step reactive ion etching. Single-mode-like lasing at a wavelength of 978.3 nm was accomplished. Focusing function was confirmed and the focused spot size around 80 μm was obtained.     

Wavelength stabilization of a distributed Bragg reflector laser diode by use of complementary current injection

We have demonstrated wavelength stabilization in an 821-nm AlGaAs three-section tunable distributed Bragg reflector (DBR) semiconductor laser diode (LD) that consists of active, phase-controlled, and DBR regions. We injected two separate, complementary currents into the active and the phase-controlled regions in the DBR-LD to suppress wavelength shift. This modulation method was applied to the LD fundamental wave in a second-harmonic-generation (SHG) laser, and the oscillating wavelength was maintained within the phase-matching acceptance range of the SHG device during modulation. A peak blue-violet light power of 62 mW was obtained for the ideal modulation waveform.     

Accurate detection of interface between SiO2 film and Si substrate

Accurate end point detection of interface for multilayers using focused ion beam (FIB) is important in nanofabrication and IC modification. Real-time end point graph shows sample absorbed current as a function of sputtering time during FIB milling process. It is found that sample absorbed current increases linearly with ion beam current for the same material and changes when ion beam is milling through a different material. Investigation by atomic force microscope (AFM) and FIB cross-sectioning shows that accurate SiO₂/Si interface occurs to where the maximum sample absorbed current occurs. Since sample absorbed current can be real-time monitored in focused ion beam machine, the paper provides a viable and simple method for accurately determining the interface during FIB milling process for widely used SiO₂/Si system.     

HR-coated facet effect on the spectral characteristics of a three-section DBR tunable laser

High-relfection (HR)-coated facet effects on the spectral characteristics of a three-section distributed Bragg reflector (DBR) tunable laser are investigated theoretically, in which the output power emits to the DBR section. It is found that the output power to the DBR sectionP _DBR compared to the cleaved facet output powerP ₀ is nearly constant to some degree with increasing tuning current. Owing to the high-Q resonator, the HR-coated DBR laser showed a decrease in spectral linewidth. However, there is still linewidth broadening of the HR-coated DBR laser even though the rate of increase is smaller than that of the cleaved-facet DBR laser. In the case of output power emission to the DBR section, it is thought that the HR-coated effect can overcome the decrease in output power under frequency tuning, which is one of the most important drawbacks of DBR laser performance.     

Occurrence of particle debris field during focused Ga ion beam milling of glassy carbon

To explore the machining characteristics of glassy carbon by focused ion beam (FIB), particles induced by FIB milling on glassy carbon have been studied in the current work. Nano-sized particles in the range of tens of nanometers up to 400 nm can often be found around the area subject to FIB milling. Two ion beam scanning modes - slow single scan and fast repetitive scan - have been tested. Fewer particles are found in single patterns milled in fast repetitive scan mode. For a group of test patterns milled in a sequence, it was found that a greater number of particles were deposited around sites machined early in the sequence. In situ EDX analysis of the particles showed that they were composed of C and Ga. The formation of particles is related to the debris generated at the surrounding areas, the low melting point of gallium used as FIB ion source and the high contact angle of gallium on glassy carbon induces de-wetting of Ga and the subsequent formation of Ga particles. Ultrasonic cleaning can remove over 98% of visible particles. The surface roughness (R_a) of FIB milled areas after cleaning is less than 2 nm.     

Circuit model for absorption grating gain-coupled distributed feedback semiconductor lasers

A circuit model for absorption grating (AG) gain-coupled (GC) distributed feedback (DFB) semiconductor laser diodes (LD) is presented, based on the rate equations of carrier densities in active region and absorption grating, as well as the photon density. The relation of photon lifetime to cavity loss and facet loss, and the relation of light power to average photon density are derived. As an example, self-pulsation in AG–GC–DFB–LD is studied.     

Micromachining of semiconductor by femtosecond laser for integrated circuit defect analysis

The latest International Technology Roadmap for Semiconductors (ITRS) has highlighted the detection and analysis of defects in Integrated Circuits (IC) as a major challenge faced by the semiconductor industry.Advanced tools used today for defect cross sectioning include dual beams (focused ion- and electron-beam technologies) with resolution down to the sub-Angstrom level. However ion milling an IC with a FIB is time consuming because of the need to open wide cavities in front of the cross-sections that need to be analyzed. Therefore the use of a femtosecond laser as a tool for direct material removal is discussed in this paper. Experiments were performed on IC structures to reveal the different layers of fabrication: selective or total ablation can occur depending on the laser energy density, without delamination of the layers. Different laser irradiation conditions like pressure (air, vacuum), polarization, beam shaping, and scanning parameters have been used to produce different types of cavities. The femtosecond laser engraving of silicon-based structures could be useful for cross-sectioning devices but also for other applications like direct-write lithography, photomask repair, maskless implantation or reverse engineering/restructuring.     

Lateral characteristics improvements of DBR laser diode with tapered Bragg grating

Broad area semiconductor laser (BAL) has poor lateral beam quality due to lateral mode competition, which limits its application as a high-power optical source. In this work, the distributed Bragg reflector laser diode with tapered grating (TDBR-LD) is studied. By changing the lateral width, the tapered grating increases the loss of high-order lateral modes, thus improving the lateral characteristics of the laser diode. The measuring results show that the TDBR-LD can achieve a single-lobe output under 0.9 A. In contrast to the straight distributed Bragg reflector laser diode (SDBR-LD), the lateral far field divergence of TDBR-LD is measured to be 5.23° at 1 A, representing a 17% decline. The linewidth of TDBR-LD is 0.4 nm at 0.2 A, which is reduced by nearly 43% in comparison with that of SDBR-LD. Meanwhile, both of the devices have a maximum output power value of approximate 470 mW.     

Watt-level red-emitting diode lasers and modules for display applications

Red-emitting lasers for display applications require high output powers and a high visibility. We demonstrate diode lasers and modules in the red spectral range based on AlGaInP with optical output powers up to 1 W and a nearly diffraction limited beam. These high-luminance light sources based on tapered lasers are well suited for laser TVs and projectors for virtual reality simulators based on the flying spot technology. Additionally, we developed diode lasers with internal distributed Bragg reflector (DBR) surface gratings. These DBR tapered lasers and master-oscillator power-amplifiers based on DBR ridge-waveguide lasers and tapered amplifiers feature high power, single mode emission with coherence lengths up to several meters, which are suitable for the next-generation 3D displays based on holography.     

The application of FIB milling for specimen preparation from crystalline germanium

The effectiveness of focused ion beam (FIB) for preparation of crystalline germanium specimens has been studied. FIB milling results in strong cellular relief of the germanium surfaces on bulk specimens. This cellular relief, associated with the generation of high densities of point defects during interaction of the specimen with the high-energy gallium beam, can be reduced by using either a lower ion beam currents or a lower beam energy. Even under these milling conditions the cellular relief is, however, still evident on the surface of the TEM specimens as evidenced by so-called 'curtaining' relief. Nevertheless good quality specimens for both conventional and high-resolution imaging may be prepared using FIB milling if low currents are employed for final milling.     

Long-life bismuth liquid metal ion source for focussed ion beam micromachining application

Liquid metal ion sources (LMISs) with Ga as ion species are widely used in focused ion beam (FIB) technology for micromachining and surface treatment on the sub-micron and nano-scale. Key features of a LMIS for investigating mechanical properties and 3D-microfabrication of materials are long life-time, high brightness, stable ion current and a highly effective milling ability for the material to be modified. In order to increase the material removal rate, heavier ions than Ga and their clusters should be applied. Bismuth (Bi) is the heaviest, non-radio-active element in the periodic table, is non-toxic and exhibits a low melting point. We have thus produced a long-life (about 1000 h) Bi LMIS with a good beam performance, applicable in any FIB system. Since Bi is the only element in this source, it is not necessary to separate it from other ions by a mass filter. Investigation of the sputtering rate of NiTi shape memory alloys using Ga and Bi LMIS showed that, for the same experimental conditions, the material removal rate with using of Bi_n^k+ ions in a standard FIB machine without a mass separator is about five times larger compared to Ga⁺ ions. This use of Bi as LMIS-species is the ultimate breakthrough in sputtering applications.     

Ordering of Ge nanocrystals using FIB nanolithography

Formation and ordering of Ge nanocrystals (NC) are studied on Si(0 0 1) and SiO₂/Si(0 0 1) substrates patterned by focused ion beam (FIB). In both cases we use a three step process consisting of FIB milling of hole patterns with various periodicities, ex-situ substrate cleaning to remove Ga contamination and Ge NC growth by molecular beam epitaxy (MBE). We show that Ge NC can be ordered between or inside the holes on patterned Si(0 0 1) substrates and inside the holes on patterned SiO₂/Si(0 0 1) substrates.     

Antimonide-based lasers and DFB laser diodes in the 2–2.7 μm wavelength range for absorption spectroscopy

We report on Fabry–Pérot semiconductor lasers and single frequency distributed feedback lasers based on GaInAsSb/AlGaAsSb quantum wells. The laser structures were grown by molecular beam epitaxy on GaSb substrates. The devices were etched either by wet process or by inductively coupled plasma (ICP) process. Electron-beam lithography was used to deposit a metal Bragg grating on each side of the laser ridge to fabricate the DFB lasers. The devices all operate in the continuous wave regime at room temperature with a single frequency emission above 2.6 μm and good tuning properties, making them well adapted to tunable diode laser absorption spectroscopy. PACS 42.55.Px; 42.62.Fi     

Optimization of facet coating for highly strained InGaAs quantum well lasers operating at 1200 nm

The optical output power of a laser diode can be enhanced by anti-reflection (AR) and high-reflection (HR) facet coatings, respectively, at the front and back facet. AR and HR coatings also serve the purpose of protection and passivation of laser diode facets. In this work, we have designed and optimized a single layer λ/4 thick Al₂O₃ film for the AR coating and a stack of λ/4 thick Al₂O₃/λ/4 thick Si bi-layers for the HR coating for highly strained InGaAs quantum-well edge emitting broad area (BA) laser diodes. Effect of the front and back facet reflectivities on output power of the laser diodes has been studied. The light output versus injected current (L–I characteristics) measurements were carried out on selected devices before and after the facet coatings. We have also carried out the numerical simulation and analysis of L–I characteristics for this particular diode structure. The experimental results have been compared and verified with the numerical simulation.     

Integrated waveguide Fabry-Perot microcavities with silicon/air Bragg mirrors

We demonstrate in-plane microfabricated Fabry-Perot cavities with cryogenically etched silicon/air distributed Bragg reflector (DBR) mirrors and integrated silicon-on-insulator rib waveguides. Several DBR configurations and cavity lengths were measured. Various devices exhibit Q=26963, FWHM=0.060 nm, finesse F=489, free spectral range FSR=81.7 nm, and DBR mirror reflectance R=99.4%. Thermo-optic tuning over 6.7 nm is also demonstrated.     

Beam concentration and homogenization for high power laser diode bar

A novel optical element is presented and applied for beam concentration and homogenization of laser diode (LD) bar. It consists of a tapered SiO₂-rod with twisted surfaces which is designed and optimized by the optical system design software and fabricated by a curved surface grinder and an optical polishing lathe. Results show that a rectangular output beam spot with uniform intensity distributions both at slow and fast axis is obtained at the output facet of the rod and the beam size is only 1.3 mm ∗ 0.8 mm.     

Integration of correlative Raman microscopy in a dualbeam FIB SEM

We present an integrated confocal Raman microscope in a focused ion beam scanning electron microscope (FIB SEM). The integrated system enables correlative Raman and electron microscopic analysis combined with focused ion beam sample modification on the same sample location. This provides new opportunities, for example the combination of nanometer resolution with Raman advances the analysis of sub‐diffraction‐sized particles. Further direct Raman analysis of FIB engineered samples enables in situ investigation of sample changes. The Raman microscope is an add‐on module to the electron microscope. The optical objective is brought into the sample chamber, and the laser source, and spectrometer are placed in a module attached onto and outside the chamber. We demonstrate the integrated Raman FIB SEM function with several experiments. First, correlative Raman and electron microscopy is used for the investigation of (sub‐)micrometer‐sized crystals. Different crystals are identified with Raman, and in combination with SEM the spectral information is combined with structurally visible polymorphs and particle sizes. Analysis of sample changes made with the ion beam is performed on (1) structures milled in a silicon substrate and (2) after milling with the FIB on an organic polymer. Experiments demonstrate the new capabilities of an integrated correlative Raman–FIB–SEM. Copyright © 2016 John Wiley & Sons, Ltd.     

新型多有源区隧道再生光耦合大功率半导体激光器

针对大功率半导体激光器面临的主要困难,提出并实现了一种隧道再生多有源区耦合大光腔 高效大功率半导体激光器机理.该机理能有效地解决光功率密度过高引起的端面灾变性毁坏 、热烧毁和光束质量差等大功率激光器存在的主要问题.采用低压金属有机化合物气相淀积 方法生长了以碳和硅作为掺杂剂的GaAs隧道结、GaAs/InGaAs 应变量子阱有源区和新型多有 源区半导体激光器外延结构,并制备了高性能大功率980nm激光器件.三有源区激光器外微分 量子效率达2.2,2A驱动电流下单面未镀膜激光输出功率高达2.5W. 关键词： 半导体激光器 大功率 金属有机化合物气相沉积