具有部分超结的新型SiC SBD特性分析

提出了一种具有部分超结（super junction, SJ）结构的新型SiC肖特基二极管,命名为SiC Semi-SJ-SBD结构,通过将常规SBD耐压区分为常规耐压区和超结耐压区来减小导通电阻,改善正向特性.利用二维器件模拟软件MEDICI仿真分析,研究了不同超结深度和厚度时击穿电压(V_B)和比导通电阻(R_on-sp),与常规结构的SBD比较得出,半超结结构可以明显改善SiC肖特基二极管特性,并得到优化的设计方案,选择超结宽度2< 关键词： SiC肖特基二极管 super junction 导通电阻 击穿电压     

未耗尽载流子对P-N结反向特性的影响

本文研究了P⁺-N结中载流子未耗尽时的二极管反向伏安特性和在大电流密度下合金晶体管集电极特性。首先,对雪崩击穿的机构,推导了载流子未耗尽时的P⁺-N结反向电流与电压的关系式。结果指出,倍增因子M不仅和加在结上的电压大小有关系,而且和流过结的电流J有关系。理论分析可以证明,当二极管几何结构满足一定条件时,可以观察到由于载流子对空间电荷的贡献不能忽略时所导致的等效电阻对P⁺-N结反向伏安特性的影响。用脉冲方法测量了锗合金二极管反向击穿后的伏安特性,实测结果和理论值很符合。其次,从理论上考虑了集电结中未耗尽载流子作用后,推导了P-N-P合金晶体管在大电流密度下集电结的雪崩倍增特性。由结果可见,晶体管在大电流密度下,集电结的倍增因子M不仅和电压有关系,而且和发射极的电J_e有关系。分析指出,由于P-N结中未耗尽载流子的作用,在共发射极线路、基极断路时,若合金管电流放大系数α₀在1/2.3～1范围内将会出现负阻。这个负阻已经被实验所证实。实验得至的整个负阻范围内的伏安特性与理论值符合较好。实验是在脉冲电流下进行的。并且在不同的环境温度下进行了测量。实验结果表明,随温度的升高整个负阻区的伏安曲线向电压高的方向有很微小的移动。这说明负阻的产生不是由于热效应引起,而是由于在大电流密度下的合金管的集电结中载流子不耗尽的结果。     

电容-电压法研究AlxGa1-xN/GaN异质结压电极化效应

制备了基于调制掺杂Al0.22Ga0.78N/GaN异质结的Pt/Al0.22Ga0.78N/GaN肖特基二极管.由于Al0.22Ga0.78N势垒层中的极化场不同,不同Al0.22Ga0.78N势垒层厚度的二极管的电容-电压特性显著不同.根据对样品电容-电压特性的数值模拟,在Al0.22Ga0.78N势垒层厚度为30nm和45nm的样品中,异质界面的极化电荷面密度为6.78×1012cm-2.在Al0.22Ga0.78N势垒层厚度为75nm的样品中,极化电荷面密度降为1.30×1012cm-2.这种极化电荷面密度的降低是由于GaN上Al0.22Ga0.78N势垒层由于厚度增加而产生应变的部分弛豫.本工作也提供了一种定量表征AlxGa1-xN/GaN异质结中极化电荷面密度的方法.     

势垒可调的氧化镓肖特基二极管

氧化镓作为新一代宽禁带材料,其器件具有优越的性能.本文仿真研究了n~+高浓度外延薄层对氧化镓肖特基二极管的势垒调控.模拟结果显示,当n型氧化镓外延厚度为5 nm、掺杂浓度为2.6×10¹⁸ cm^-3时,肖特基二极管纵向电流密度高达496.88 A/cm~2、反向击穿电压为182.30 V、导通电阻为0.27 mΩ·cm~2,品质因子可达123.09 MW/cm~2.进一步研究发现肖特基二极管的性能与n~+外延层厚度和浓度有关,其电流密度随n~+外延层的厚度和浓度的增大而增大.分析表明,n~+外延层对势垒的调控在于镜像力、串联电阻及隧穿效应综合影响,其中镜像力和串联电阻对势垒的降低作用较小,而高电场下隧穿效应变得十分显著,使得热发射电流增大的同时,隧穿电流得到大幅度提升,从而进一步提升了氧化镓肖特基二极管的性能.     

半导体断路开关数值模拟

 为了研究半导体断路开关(SOS)的截断过程及其在脉冲功率系统中的工作特性,建立了半导体断路开关的电流控制模型,对p⁺-p-n-n⁺掺杂结构的半导体断路开关进行了数值模拟研究。通过数值模拟,给出了p⁺-p-n-n⁺型半导体断路开关在正、反向泵浦过程中的载流子及电场分布,并获得了电流截断效应。计算结果表明,半导体断路开关的截断过程首先发生在p区。     

复合漏电模型建立及阶梯场板GaN肖特基势垒二极管设计

准垂直GaN肖特基势垒二极管(SBD)因其低成本和高电流传输能力而备受关注.但其主要问题在于无法很好地估计器件的反向特性,从而影响二极管的设计.本文考虑了GaN材料的缺陷以及多种漏电机制,建立了复合漏电模型,对准垂直Ga N SBD的特性进行了模拟,仿真结果与实验结果吻合.基于此所提模型设计出具有高击穿电压的阶梯型场板结构准垂直GaN SBD.根据漏电流、温度和电场在反向电压下的相关性,分析了漏电机制和器件耐压特性,设计的阶梯型场板结构准垂直GaN SBD的Baliga优值BFOM达到73.81 MW/cm~2.     

掺铁InP肖特基势垒增强InGaAs MSM光电探测器

采用LP-MOVPE方法及常规器件工艺制成了InP:Fe肖特基势垒增强InGaAsMSM光电探测器。用自建测试系统对其直流和瞬态特性进行了测试,测试结果表明,器件的击穿电压大于10V,2V偏压下暗电流为170nA,对应的暗电流密度约为3mA/cm²;瞬态响应中上升时间tr为21ps,半高宽FWHM为75ps.     

1000 V p-GaN混合阳极AlGaN/GaN二极管

GaN材料具有优异的电学特性,如大的禁带宽度(3.4 eV)、高击穿场强(3.3 MV/cm)和高电子迁移率(600 cm~2/(V·s)). AlGaN/GaN异质结由于压电极化和自发极化效应,产生高密度(1×10~(13)cm~(-2))和高迁移率(2000 cm~2/(V·s))的二维电子气(2DEG),在未来的功率系统中, AlGaN/GaN二极管具有极大的应用前景.二极管的开启电压和击穿电压是影响其损耗和功率处理能力的关键参数,本文提出了一种新型的具有高阻盖帽层(high-resistance-cap-layer, HRCL)的p-GaN混合阳极AlGaN/GaN二极管来优化其开启电压和击穿特性.在p-GaN/AlGaN/GaN材料结构基础上,通过自对准的氢等离子体处理技术,在沟道区域形成高阻盖帽层改善电场分布,提高击穿电压,同时在阳极区域保留p-GaN结构,用于耗尽下方的二维电子气,调控开启电压.制备的p-GaN混合阳极(p-GaN HRCL)二极管在阴阳极间距Lac为10μm时,击穿电压大于1 kV,开启电压+1.2 V.实验结果表明, p-GaN混合阳极和高阻GaN盖帽层的引入,有效改善AlGaN/GaN肖特基势垒二极管电学性能.     

电荷失配对SiC半超结垂直双扩散金属氧化物半导体场效应管击穿电压的影响

Si C半超结垂直双扩散金属氧化物半导体场效应管(VDMOSFET)相对于常规VDMOSFET在相同导通电阻下具有更大击穿电压.在N型外延层上进行离子注入形成半超结结构中的P柱是制造Si C半超结VDMOSFET的关键工艺.本文通过二维数值仿真研究了离子注入导致的电荷失配对4H-Si C超结和半超结VDMOSFET击穿电压的影响,在电荷失配程度为30%时出现半超结VDMOSFET的最大击穿电压.在本文的器件参数下,P柱浓度偏差导致击穿电压降低15%时,半超结VDMOSFET柱区浓度偏差范围相对于超结VDMOSFET可提高69.5%,这意味着半超结VDMOSFET对柱区离子注入的控制要求更低,工艺制造难度更低.     

InAs量子点在肖特基势垒二极管输运特性中的影响

在77到292K的范围内,系统研究了含InAs自组装量子点的金属-半导体-金属双肖特基势垒二极管的输运特性.随着温度上升,量子点的存储效应引起的电流回路逐渐减小.在测试温度范围内,通过量子点的共振隧穿过程在电流电压(I-V)曲线中造成台阶结构,且使电流回路随温度的上升急剧减小.根据肖特基势垒的反向I-V曲线,计算了势垒的反向饱和电流密度和平均理想因子.发现共振随穿效应使肖特基势垒在更大的程度上偏离了理想情况,而量子点的电子存储效应主要改变了肖特基势垒的有效势垒高度,从而影响了势垒的反向饱和电流密度 关键词： 自组装量子点 肖特基势垒 电流-电压特性     

Modeling of 4H--SiC multi-floating-junction Schottky barrier diode

This paper develops a new and easy to implement analytical model for the specific on-resistance and electric field distribution along the critical path for 4H-SiC multi-floating junction Schottky barrier diode. Considering the charge compensation effects by the multilayer of buried opposite doped regions, it improves the breakdown voltage a lot in comparison with conventional one with the same on-resistance. The forward resistance of the floating junction Schottky barrier diode consists of several components and the electric field can be understood with superposition concept, both are consistent with MEDICI simulation results. Moreover, device parameters are optimized and the analyses show that in comparison with one layer floating junction, multilayer of floating junction layer is an effective way to increase the device performance when specific resistance and the breakdown voltage are traded off. The results show that the specific resistance increases 3.2 mΩ·cm 2 and breakdown voltage increases 422 V with an additional floating junction for the given structure.     

Study and optimal simulation of 4H-SiC floating junction Schottky barrier diodes’ structures and electric properties

This paper stuides the structures of 4H-SiC floating junction Schottky barrier diodes. Some structure parameters of devices are optimized with commercial simulator based on forward and reverse electrical characteristics. Compared with conventional power Schottky barrier diodes, the devices are featured by highly doped drift region and embedded floating junction layers, which can ensure high breakdown voltage while keeping lower specific on-state resistance, and solve the contradiction between forward voltage drop and breakdown voltage. The simulation results show that with optimized structure parameter, the breakdown voltage can reach 4.36 kV and the specific on-resistance is 5.8 mΩ·cm2 when the Baliga figure of merit value of 13.1 GW/cm2 is achieved.     

Design optimization of high breakdown voltage vertical GaN junction barrier Schottky diode with high-K/low-K compound dielectric structure

A vertical junction barrier Schottky diode with a high-$K$/low-$K$ compound dielectric structure is proposed and optimized to achieve a high breakdown voltage (BV). There is a discontinuity of the electric field at the interface of high-$K$ and low-$K$ layers due to the different dielectric constants of high-$K$ and low-$K$ dielectric layers. A new electric field peak is introduced in the n-type drift region of junction barrier Schottky diode (JBS), so the distribution of electric field in JBS becomes more uniform. At the same time, the effect of electric-power line concentration at the p-n junction interface is suppressed due to the effects of the high-$K$ dielectric layer and an enhancement of breakdown voltage can be achieved. Numerical simulations demonstrate that GaN JBS with a specific on-resistance ($R_{\rm on, sp}$) of 2.07 m$\Omega\cdot$cm$^{2}$ and a BV of 4171 V which is 167% higher than the breakdown voltage of the common structure, resulting in a high figure-of-merit (FOM) of 8.6 GW/cm$^{2}$, and a low turn-on voltage of 0.6 V.     

A super junction SiGe low-loss fast switching power diode

This paper proposes a novel super junction (SJ) SiGe switching power diode which has a columnar structure of alternating p^- and n^- doped pillar substituting conventional n^- base region and has far thinner strained SiGe p⁺ layer to overcome the drawbacks of existing Si switching power diode. The SJ SiGe diode can achieve low specific on-resistance, high breakdown voltages and fast switching speed. The results indicate that the forward voltage drop of SJ SiGe diode is much lower than that of conventional Si power diode when the operating current densities do not exceed 1000 A/cm², which is very good for getting lower operating loss. The forward voltage drop of the Si diode is 0.66V whereas that of the SJ SiGe diode is only 0.52 V at operating current density of 10 A/cm². The breakdown voltages are 203 V for the former and 235 V for the latter. Compared with the conventional Si power diode, the reverse recovery time of SJ SiGe diode with 20 per cent Ge content is shortened by above a half and the peak reverse current is reduced by over 15%. The SJ SiGe diode can remarkably improve the characteristics of power diode by combining the merits of both SJ structure and SiGe material.     

Research on high-voltage 4H-SiC P-i-N diode with planar edge junction termination techniques

The planar edge termination techniques of junction termination extension (JTE) and offset field plates and field-limiting rings for the 4H-SiC P-i-N diode were investigated and optimized by using a two-dimensional device simulator ISE-TCAD10.0. By experimental verification, a good consistency between simulation and experiment can be observed. The results show that the reverse breakdown voltage for the 4H-SiC P-i-N diode with optimized JTE edge termination can accomplish near ideal breakdown voltage and much lower leakage current. The breakdown voltage can be near 1650 V, which achieves more than 90 percent of ideal parallel plane junction breakdown voltage and the leakage current density can be near 3 × 10-5 A/cm2.     

n,p柱宽度对超结SiGe功率二极管电学特性的影响

结合SiGe材料的优异性能与超结结构在功率器件方面的优势,提出了一种超结SiGe功率二极管.该器件有两个重要特点:一是由轻掺杂的p型柱和n型柱相互交替形成超结结构,取代传统功率二极管的n^-基区;二是阳极p⁺区采用很薄的应变SiGe材料.该二极管可以克服常规Si p⁺n^-n⁺功率二极管存在的一些缺陷,如阻断电压增大的同时,正向导通压降随之增大,反向恢复时间也变长.利用二维器件模拟软件MEDICI仿真 关键词： 超结 锗硅二极管 n p柱宽度 电学特性     

Study of 4H-SiC junction barrier Schottky diode using field guard ring termination

This paper reports that the 4H-SiC Schottky barrier diode, PiN diode and junction barrier Schottky diode terminated by field guard rings are designed, fabricated and characterised. The measurements for forward and reverse characteristics have been done, and by comparison with each other, it shows that junction barrier Schottky diode has a lower reverse current density than that of the Schottky barrier diode and a higher forward drop than that of the PiN diode. High-temperature annealing is presented in this paper as well to figure out an optimised processing. The barrier height of 0.79 eV is formed with Ti in this work, the forward drop for the Schottky diode is 2.1 V, with an ideality factor of 3.2, and junction barrier Schottky diode with blocking voltage higher than 400 V was achieved by using field guard ring termination.     

Simulation study of a mixed terminal structure for 4H-SiC merged PiN/Schottky diode

In this paper, a mixed terminal structure for the 4H-SiC merged PiN/Schottky diode (MPS) is investigated, which is a combination of a field plate, a junction termination extension and floating limiting rings. Optimization is performed on the terminal structure by using the ISE-TCAD. Further analysis shows that this structure can greatly reduce the sensitivity of the breakdown voltage to the doping concentration and can effectively suppress the effect of the interface charge compared with the structure of the junction termination extension. At the same time, the 4H-SiC MPS with this termination structure can reach a high and stable breakdown voltage.     

Edge termination study and fabrication of a 4Hben SiC junction barrier Schottky diode

The 4H-SiC junction barrier Schottky (JBS) diodes terminated by field guard rings and offset field plate are designed, fabricated and characterized. It is shown experimentally that a 3-μm P-type implantation window spacing gives an optimum trade-off between forward drop voltage and leakage current density for these diodes, yielding a specific on-resistance of 8.3 mΩ·cm². A JBS diode with a turn-on voltage of 0.65 V and a reverse current density less than 1 A/cm² under 500 V is fabricated, and the reverse recovery time is tested to be 80 ns, and the peak reverse current is 28.1 mA. Temperature-dependent characteristics are also studied in a temperature range of 75 ℃-200 ℃. The diode shows a stable Schottky barrier height of up to 200 ℃ and a stable operation under a continuous forward current of 100 A/cm².     

Comparison of electrical characteristic between AlN/GaN and AlGaN/GaN heterostructure Schottky diodes

Ni/Au Schottky contacts on AlN/GaN and AlGaN/GaN heterostructures are fabricated.Based on the measured current–voltage and capacitance–voltage curves,the electrical characteristics of AlN/GaN Schottky diode,such as Schottky barrier height,turn-on voltage,reverse breakdown voltage,ideal factor,and the current-transport mechanism,are analyzed and then compared with those of an AlGaN/GaN diode by self-consistently solving Schrdinger’s and Poisson’s equations.It is found that the dislocation-governed tunneling is dominant for both AlN/GaN and AlGaN/GaN Schottky diodes.However,more dislocation defects and a thinner barrier layer for AlN/GaN heterostructure results in a larger tunneling probability,and causes a larger leakage current and lower reverse breakdown voltage,even though the Schottky barrier height of AlN/GaN Schottky diode is calculated to be higher that of an AlGaN/GaN diode.