高温预生长对图形化蓝宝石衬底GaN薄膜质量的提高

在图形化蓝宝石衬底生长低温缓冲层之前,通入少量三甲基镓（TMGa）和大量氨气进行短时间的高温预生长,通过改变TMGa流量制备了4个蓝光LED样品。MOCVD外延生长时使用激光干涉仪实时监测薄膜反射率,外延片使用高分辨率X射线衍射（002）面和（102）面摇摆曲线估算位错密度,并使用光致发光谱表征发光性能,制备成芯片后测试了正向电压和输出光功率。结果表明,高温预生长可促进薄膜的横向外延,使得三维岛状GaN晶粒在较小的薄膜厚度内实现岛间合并,有利于降低位错密度,提高外延薄膜质量,LED芯片的输出光功率的增强幅度达29.1%,而电学性能无恶化迹象;但高温预生长工艺中TMGa的流量应适当控制,过量的TMGa导致GaN晶粒过大,将延长岛间合并时间,降低晶体质量。     

蓝宝石邻晶面衬底MBE生长GaN薄膜的瞬态光电导弛豫特性研究

在实验优化MBE工艺条件的基础上，采用蓝宝石(0001)邻晶面衬底制备出了具有较高质量的GaN薄膜.XRD分析表明邻晶面衬底生长的GaN薄膜晶体结构质量明显提高，AFM表征结果显示邻晶面生长的样品表面形貌显著改善.蓝宝石衬底GaN薄膜的瞬态光电导弛豫特性对比实验研究发现，常规衬底生长的GaN薄膜光电导弛豫特性出现双分子复合、单分子复合和弛豫振荡三个过程，持续时间分别为0.91，7.7和35.5ms；蓝宝石邻晶面衬底生长的GaN薄膜光电导弛豫过程主要是双分子复合和单分子复合过程，持续时间分别为0.78和14ms.理论分析表明MBE生长GaN薄膜的持续光电导效应主要起源于本生位错缺陷引发的深能级. 关键词： 邻晶面蓝宝石衬底 GaN薄膜 瞬态光电导 弛豫特性     

SiO2图形化蓝宝石衬底对GaN生长及LED发光性能的影响

为了提高氮化镓(GaN)基发光二极管(LEDs)的发光性能,采用等离子体增强化学气相沉积(PECVD)在蓝宝石衬底上沉积SiO2薄膜,经过光刻和干法刻蚀技术制备了SiO2图形化蓝宝石衬底(SiO2 patterned sap-phire substrate,SPSS),利用LED器件的外延生长和微纳加工技术获得了基于S...     

蓝宝石衬底上RF-MBE生长的GaN中的极性控制和螺旋位错的降低

近年来人们报道了用MBE方法生长GaN的飞速进展,利用RF-MBE方法可以获得高的GAN生长速率和高的电子迁移率.本文讨论了用RF-MBE方法在蓝宝石衬底上生长GaN过程中的极性控制和螺旋位错的降低.在充分氮化的蓝宝石衬底上直接生长GaN,使GaN的极性控制为N-极性,并用高温生长的AlN核化层实现GaN的Ga-极性.对于N-和Ga-极性的GaN这两种情况,高温生长的AlN中间迭层的引入,可以有效地抑制螺旋位错的扩散.位错的降低使GaN的室温电子迁移率得到提高,对于Ga-极性的GaN,其值为332cm²/V·s;而对于N-极性的GaN,其值为688cm²/V·s.     

GaN外延衬底LiGaO2晶体的生长和缺陷

ＬｉＧａＯ２与ＧａＮ的晶格失配率只有０．２％，是一种很有潜力的蓝光衬底材料。通过多次实验，用提拉法生长了尺寸为１５×６０ｍｍ的高质量ＬｉＧａＯ２单晶。利用化学侵蚀、光学显微镜、透射电子显微镜对晶体中的缺陷进行了分析，研究了生长参数、原料化学配比对晶体质量的影响。ＬｉＧａＯ２晶体在〈１００〉方向生长速率最快，在〈００１〉方向上生长较慢。由于原料按非化学计量比挥发致使组份偏离，容易产生γ－Ｇａ２Ｏ３包裹物。包裹物和位错的形成具有一定的相互促进作用，往往形成平行于（００１）面的亚晶界。通过调整原料配比、生长工艺参数可克服上述问题。     

高质量GaN外延薄膜的生长

综述了高质量ＧａＮ外延薄膜的生长研究工作的最新重要进展．主要采用的新工艺为：在较低温度下生长ＧａＮ缓冲层后再高温生长ＧａＮ外延薄膜,双气流金属有机化合物气相沉积（ＭＯＣＶＤ）,以及用开有窗口的ＳｉＯ２膜截断穿过位错后横向覆盖外延生长（ｅｐｉｔａｘｉａｌｙｌａｔｅｒａｌｏｖｅｒｇｒｏｗｔｈ）．Ｘ射线衍射和高分辨电镜研究证实,上述工艺使ＧａＮ外延薄膜质量得到显著提高．利用这种薄膜研制成的蓝色激光管即将投放市场．     

国产SiC衬底上利用AIN缓冲层生长高质量GaN外延薄膜

采用高温AlN作为缓冲层在国产SiC衬底上利用金属有机物化学气相外延技术生长GaN外延薄膜.通过优化AlN缓冲层的生长参数得到了高质量的GaN外延薄膜,其对称(0002)面和非对称(1012)面X射线衍射摇摆曲线的半峰宽分别达到130 arcsec和252 arcsec,这是目前报道的在国产SiC衬底上生长GaN最好的...     

硅衬底GaN基LED薄膜芯片的应力调制

将Si衬底GaN基LED外延薄膜经晶圆键合、去硅衬底等工艺制作成垂直结构GaN基LED薄膜芯片,并对其进行不同温度的连续退火,通过高分辨X射线衍射(HRXRD)研究了连续退火过程中GaN薄膜芯片的应力变化。研究发现:垂直结构LED薄膜芯片在160~180℃下退火应力释放明显,200℃时应力释放充分,GaN的晶格常数接近标准值。继续升温应力不再发生明显变化,GaN薄膜的晶格常数只在标准晶格常数值附近波动。扫描电子显微镜给出的bonding层中Ag-In合金情况很好地解释了薄膜芯片应力的变化。     

石英衬底上GaN薄膜沉积及其光学性能的研究

GaN薄膜材料广泛应用于发光二极管(LED),激光二极管(LD)等光电器件。但是GaN基器件的制备与应用以及器件推广很大一部分取决于其器件的价格,常用的方式是在单晶蓝宝石衬底上沉积制备GaN薄膜样品,单晶蓝宝石衬底晶向择优,可以制备出高质量的GaN薄膜样品,但是单晶蓝宝石衬底价格昂贵,一定程度上限制了其GaN基器件推广使用。如何在廉价衬底上直接沉积高质量的GaN薄膜,满足器件的要求成为研究热点。石英玻璃价格廉价,但是属于非晶体,没有择优晶向取向,很难制备出高质量薄膜样品。本研究采用等离子体增强金属有机物化学气相沉积系统在非晶普通石英衬底上改变氮气反应源流量低温制备GaN薄膜材料。制备之后采用反射高能电子衍射谱、X射线衍射光谱、室温透射光谱和光致光谱对制备的薄膜进行系统的测试分析。其结果表明：在氮气流量适当的沉积参数条件下,所制备的薄膜具有高C轴的择优取向,良好的结晶质量以及优异的光学性能。     

MOCVD生长的GaN单晶膜透射光谱研究

采用MOCVD技术在Al2O3(0001)衬底上生长了GaN薄膜，使用透射光谱、光致发光光谱和X射线双晶衍射三种技术测试了五类GaN薄膜样品，实验结果表明：GaN薄膜透射谱反映出的GaN质量与X射线双晶衍射测量的结果一致，即透射率越大，半高宽越小，结晶质量越好；而X射线双晶衍射峰半高宽最小的样品，其PL谱的带边峰却很弱，这说明PL谱反映样品的光学性能与X射线双晶衍射获得的结晶质量不存在简单的对应关系，同时还报导了一种特殊工艺生长的高阻GaN样品的RBS／沟道结果。     

The effects of vicinal sapphire substrates on the properties of AlGaN/GaN heterostructures

AlGaN/GaN heterostructures on vicinal sapphire substrates and just-oriented sapphire substrates (0001) are grown by the metalorganic chemical vapor deposition method. Samples are studied by high-resolution x-ray diffraction, atomic force microscopy, capacitance--voltage measurement and the Van der Pauw Hall-effect technique. The investigation reveals that better crystal quality and surface morphology of the sample are obtained on the vicinal substrate. Furthermore, the electrical properties are also improved when the sample is grown on the vicinal substrate. This is due to the fact that the use of vicinal substrate can promote the step-flow mode of crystal growth, so many macro-steps are formed during crystal growth, which causes a reduction of threading dislocations in the crystal and an improvement in the electrical properties of the AlGaN/GaN heterostructure.     

DLTS study of n-type GaN grown by MOCVD on GaN substrates

Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm² of substrate A and on an area of 1×1 cm² of substrate B. Two traps labeled B1 and B2 are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.     

Characterization of the N-polar GaN film grown on C-plane sapphire and misoriented C-plane sapphire substrates by MOCVD

Gallium nitride (GaN) thin film of the nitrogen polarity (N-polar) was grown on C-plane sapphire and misoriented C-plane sapphire substrates respectively by metal-organic chemical vapor deposition (MOCVD). The misorientation angle is off-axis from C-plane toward M-plane of the substrates, and the angle is 2° and 4° respectively. The nitrogen polarity was confirmed by examining the images of the scanning electron microscope before and after the wet etching in potassium hydroxide (KOH) solution. The morphology was studied by the optical microscope and atomic force microscope. The crystalline quality was characterized by the x-ray diffraction. The lateral coherence length, the tilt angle, the vertical coherence length, and the vertical lattice-strain were acquired using the pseudo-Voigt function to fit the x-ray diffraction curves and then calculating with four empirical formulae. The lateral coherence length increases with the misorientation angle, because higher step density and shorter distance between adjacent steps can lead to larger lateral coherence length. The tilt angle increases with the misorientation angle, which means that the misoriented substrate can degrade the identity of crystal orientation of the N-polar GaN film. The vertical lattice-strain decreases with the misorientation angle. The vertical coherence length does not change a lot as the misorientation angle increases and this value of all samples is close to the nominal thickness of the N-polar GaN layer. This study helps to understand the influence of the misorientation angle of misoriented C-plane sapphire on the morphology, the crystalline quality, and the microstructure of N-polar GaN films.     

Comparative study of different properties of GaN films grown on(0001) sapphire using high and low temperature AlN interlayers

Comparative study of high and low temperature AlN interlayers and their roles in the properties of GaN epilayers prepared by means of metal organic chemical vapour deposition on (0001) plane sapphire substrates is carried out by high resolution x-ray diffraction, photoluminescence and Raman spectroscopy. It is found that the crystalline quality of GaN epilayers is improved significantly by using the high temperature AlN interlayers, which prevent the threading dislocations from extending, especially for the edge type dislocation. The analysis results based on photoluminescence and Raman measurements demonstrate that there exist more compressive stress in GaN epilayers with high temperature AlN interlayers. The band edge emission energy increases from 3.423~eV to 3.438~eV and the frequency of Raman shift of $E_{2 }$(TO) moves from 571.3~cm$^{ - 1}$ to 572.9~cm$^{ - 1}$ when the temperature of AlN interlayers increases from 700~$^{\circ}$C to 1050~$^{\circ}$C. It is believed that the temperature of AlN interlayers effectively determines the size, the density and the coalescence rate of the islands, and the high temperature AlN interlayers provide large size and low density islands for GaN epilayer growth and the threading dislocations are bent and interactive easily. Due to the threading dislocation reduction in GaN epilayers with high temperature AlN interlayers, the approaches of strain relaxation reduce drastically, and thus the compressive stress in GaN epilayers with high temperature AlN interlayers is high compared with that in GaN epilayers with low temperature AlN interlayers.     

The influence of pressure on the growth of a-plane GaN on r-plane sapphire substrates by MOCVD

Nonpolar a-plane (110) GaN films have been grown on r-plane (102) sapphire by metal-organic chemical vapor deposition (MOCVD) under different growth pressures. The as-grown films are investigated by optical microscopy, high-resolution X-ray diffraction (HRXRD) and Raman scattering. As growth pressure rises from 100 mbar to 400 mbar, the surface gets rougher, and the in-plane XRD full width at half maximum (FWHM) along the c-axis [0001] increases while that along the m-axis [100] decreases. Meanwhile, res...     

Structural properties of GaN(0001) epitaxial layers revealed by high resolution X-ray diffraction

High-resolution X-ray diffraction has been used to analyze GaN(0001) epitaxial layers on sapphire substrates. Several structural properties of GaN, including the lattice constants, strains, and dislocation densities are revealed by the technique of X-ray dffraction (XRD). Lattice constants calculated from the omega/2theta scan are c=0.5185 nm and a=0.3157 nm. Also, the in-plane strain is -1.003%, while out of the plane, the epitaxial film is almost relaxed. Several methods are used to deduce the mosaicity a...     

Synthesis of single crystalline GaN nanoribbons on sapphire (0001) substrates

Single crystalline GaN nanoribbons were synthesized through nitriding Ga₂O₃ thin films deposited on sapphire (0001) substrates by radio frequency magnetron sputtering. The component and structure of nanoribbons were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive X-ray (EDX), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The flat and smooth ribbon-like nanostructures are high quality single crystalline hexagonal wurtzite GaN. The thickness and width-to-thickness ratio of the grown GaN nanoribbons are in the range of 8-15 nm and ∼5-10, respectively.     

Structural and optical characterization of GaN heteroepitaxial films on SiC substrates

We have estimated the threading dislocation density and type via X-ray diffraction and Williamson-Hall analysis to elicit qualitative information directly related to the electrical and optical quality of GaN epitaxial layers grown by PAMBE on 4H- and 6H-SiC substrates. The substrate surface preparation and buffer choice, specifically: Ga flashing for SiC oxide removal, controlled nitridation of SiC, and use of AlN buffer layers all impact the resultant screw dislocation density, but do not significantly influence the edge dislocation density. We show that modification of the substrate surface strongly affects the screw dislocation density, presumably due to impact on nucleation during the initial stages of heteroepitaxy.     

柱状与孔状图形衬底对MOVPE生长GaN体材料及LED器件的影响

在柱状图形蓝宝石衬底（PSS-p）和孔状图形蓝宝石衬底（PSS-h）上外延了GaN体材料和LED结构并进行了详细对比和分析.X射线衍射仪（XRD）和原子力显微镜（AFM）测试结果表明,PSS-h上体材料的晶体质量和表面形貌都优于PSS-p上体材料的特性,通过断面扫面电子显微镜（SEM）照片看出PSS-h上GaN的侧向生长是导致这种差异的原因.另外,基于PSS-p和PSS-h上外延的LED材料制作而成的器件结果表明,其20?mA下光功率水平相比普通蓝宝石衬底（CSS）分别提高了46%和33%.通过变温光荧光 关键词： 蓝宝石图形衬底 氮化镓 发光二极管 侧向生长