Low dielectric thermoset. IV. Synthesis and properties of a dipentene‐containing cyanate ester and its copolymerization with bisphenol A dicyanate ester

A 2,6‐dimethylphenol‐dipentene dicyanate ester ( DPCY ) was synthesized from the reaction of 2,6‐dimethylphenol‐dipentene adduct and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared (FTIR), elemental analysis, mass, and nuclear magnetic resonance (NMR) spectra. DPCY was then cured by itself or cured with bisphenol A dicyanate ester ( BADCY ). Thermal properties of cured epoxy resins were studied using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermogravimetric analysis (TGA). These data are compared with those of BADCY . The cured DPCY exhibits a lower dielectric constant (2.61 at 1 MHz), dissipation factor (29.3 mU at 1 MHz), thermal stability (5% degradation temperature and char yield are 429 °C and 17.64%, respectively), glass transition temperature (246 °C by TMA and 258 °C by DMA), coefficient of thermal expansion (33.6 ppm before Tg and 134.1 ppm after Tg), and moisture absorption (0.95% at 48 h) than those of BADCY , but higher moduli (5.12 GPa at 150 °C and 4.60 GPa at 150 °C) than those of the bisphenol A system. The properties of cured cocyanate esters lie between cured BADCY and DPCY , except for moduli. Moduli of some cocyanate esters are even higher than those of cured BADCY and DPCY . A positive deviation from the Fox equation was observed for cocyanate esters. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3986–3995, 2004     

Synthesis and properties of flame‐retardant benzoxazines by three approaches

We propose three approaches to obtain flame‐retardant benzoxazines. In the first approach, we synthesize a novel benzoxazine (dopot‐m) from a phosphorus‐containing triphenol (dopotriol), formaldehyde, and methyl amine. Dopot‐m is copolymerized with a commercial benzoxazine [6′,6‐bis(3‐phenyl‐3,4‐dihydro‐2H‐1,3‐benzoxazineyl)methane (F‐a)] or diglycidyl ether of bisphenol A (DGEBA). The thermal properties and flame retardancy of the F‐a/dopot‐m copolymers increase with the content of dopot‐m. As for the dopot‐m/DGEBA curing system, the glass‐transition temperature of the dopot‐m/DGEBA copolymer is 252 °C, which is higher than that of poly(dopot‐m). The 5% decomposition temperature of the dopot‐m/DGEBA copolymer increases from 323 to 351 °C because of the higher crosslinking density caused by the reaction of phenolic OH and epoxy. In the second approach, we incorporate the element phosphorus into benzoxazine via the curing reaction of dopotriol and F‐a. After the curing, the thermal properties of the F‐a/dopotriol copolymers are almost the same as those of neat poly(F‐a), and this implies that we can incorporate the flame‐retardant element phosphorus into the polybenzoxazine without sacrificing any thermal properties. In the third approach, we react dopo with electron‐deficient benzoxazine to incorporate the element phosphorus. After the curing, the glass‐transition temperatures of polybenzoxazines decrease slightly with the content of dopo, mainly because of the smaller crosslinking density of the resultant polybenzoxazines. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3454–3468, 2006     

Synthesis and characterization of novel low‐dielectric cyanate esters

For the purpose of increasing the mobility of residual bisphenol A dicyanate ester (BADCY) during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of monofunctional phenol was added to BADCY to form an imidocarbonate, or a small quantity of monofunctional cyanate esters was added to form cyanate ester copolymers. The proposed structures were confirmed with Fourier transform infrared, elemental analysis, mass spectrometry, and NMR spectroscopy. The thermal properties of the cured cyanate esters were measured with dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis. These data were compared with those for the cured BADCY resin. The cured modified cyanate esters exhibited a lower dielectric constant, a lower dissipation factor, and lower moisture absorption than the cured BADCY system. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2589–2600, 2004     

Thermal properties and fracture toughness of epoxy resins cured by phosphonium and pyrazinium salts as latent cationic initiators

In this work, the latent thermal cationic initiators triphenyl benzyl phosphonium hexafluoroantimonate (TBPH) and benzyl‐2‐methylpyrazinium hexafluoroantimonate (BMPH) were newly synthesized and characterized with IR, ¹H NMR, and P NMR spectroscopy. The thermal and mechanical properties of difunctional epoxy [diglycidyl ether of bisphenol A (DGEBA)] resins cured by 1 phr of either TBPH or BMPH were investigated. The DGEBA/TBPH system showed a higher curing temperature and a higher critical stress intensity factor than the epoxy/BMPH system. This could be interpreted in terms of the slow thermal diffusion rate and bulk structure of the four phenyl groups in TBPH. However, the decomposition activation energy derived from the Coats–Redfern method was lower for epoxy/TBPH. This result was probably due to the fact that a broken short‐chain structure was developed by the steric hindrance of TBPH in the difunctional epoxy resin. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2393–2403, 2003     

Synthesis and characterization of an epoxy based thermoset containing a fluorinated thermoplastic

A novel fluorinated thermoplastic (FT) was synthesized from diglycidyl ether of bisphenol A (DGEBA), and 3‐(trifluoromethyl)aniline. FT was found to be miscible with DGEBA as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. On the basis of several experimental techniques, it was found that upon heating etherification reaction takes place between FT and DGEBA. A DGEBA‐aromatic diamine (4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline) formulation was modified with the FT. The influence of FT on the epoxy‐amine kinetics was investigated. Both structural parameters, gelation, and vitrification, were found to be affected by etherification reaction between epoxy and hydroxyls groups belonging to FT. The presence of ether linkages induced system stoichiometry modification. In addition, the curing conditions influence on FT migration towards the surface was studied on samples prepared with 20 wt % of modifier. SEM–EDX analysis confirmed that modified systems exhibits notable fluorine enrichment within the uppermost 200 μm. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2781–2792, 2007     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Novel,environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy

Tryptophan, an amino acid, has been used as a novel, environmentally friendly curing agent instead of toxic curing agents to crosslink the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The curing reaction of tryptophan/DGEBA mixtures of different ratios and the effect of the imidazole catalyst on the reaction have been evaluated. The optimum reaction ratio of DGEBA to tryptophan has been determined to be 3:1 with 1 wt % catalyst, and the curing mechanism of the novel reaction system has been studied and elucidated. In situ Fourier transform infrared spectra indicate that with the extraction of a hydrogen from NH₃⁺ in zwitterions from tryptophan, the formed nucleophilic primary amine and carboxylate anions of the tryptophan can readily participate in the ring‐opening reaction with epoxy. The secondary amine, formed from the primary amine, can further participate in the ring‐opening reaction with epoxy and form the crosslinked network. The crosslinked structure exhibits a reasonably high glass‐transition temperature and thermal stability. A catalyst‐initiated chain reaction mechanism is proposed for the curing reaction of the epoxy with zwitterion amino acid hardeners. The replacement of toxic curing agents with this novel, environmentally friendly curing agent is an important step toward a next‐generation green electronics industry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 181–190, 2007     

Near‐infrared spectroscopic studies on the cure behaviors of the CAE/DGEBA blend system initiated by a thermal latent catalyst

The latent properties and cure behaviors of an epoxy blend system based on cycloaliphatic epoxy (CAE) and diglycidyl ether of bisphenol A (DGEBA) epoxy containing N‐benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator were investigated with near‐infrared (N‐IR) spectroscopy. The assignments of the latent properties and cure kinetics were performed by the measurements of the N‐IR reflectance for epoxide and hydroxyl functional groups at different temperatures and compositions. As a result, this system showed more than one type of reaction, and BPH was an excellent thermal latent catalyst without any coinitiator. The cure behaviors were identified by the changes in the absorption intensity of the hydroxyl groups at 7100 cm⁻¹ with different composition ratios. Moreover, characteristic N‐IR band assignments were used to evaluate the reactive kinetics and were shown to be an appropriate method for studying the cure behaviors of the CAE/DGEBA blend system containing a thermal latent catalyst. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 326–331, 2001     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

Flame retardant epoxy resins based on diglycidyloxymethylphenylsilane

Silicon‐containing epoxy resins were prepared from diglycidyloxymethylphenyl silane (DGMPS) and diglycidylether of bisphenol A (DGEBA) by crosslinking with 4,4′‐diaminodiphenylmethane (DDM). Several DGMPS/DGEBA molar ratios were used to obtain materials with different silicon contents. Their thermal, dynamomechanical, and flame‐retardant properties were evaluated and related to the silicon content. The weight loss rate of the silicon‐containing resins is lower than that of the silicon free resin. Char yields under nitrogen and air atmospheres increase with the silicon content. The LOI (limited oxygen index) values increased from 24 for a standard commercial resin to 36 for silicon‐containing resins, demonstrating improved flame retardancy. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5580–5587, 2006     

New poly(ether‐ester) thermosets obtained by cationic curing of DGEBA and 7,7‐dimethyl‐6,8‐dioxaspiro[3.5] nonane‐5,9‐dione with several Lewis acids as initiators

Scandium, ytterbium, and lanthanum triflates and boron trifluoride monoethylamine were used as cationic initiators to cure a mixture 2:1 (mol/mol) of diglycidylether of bisphenol A (DGEBA) and 7,7‐dimethyl‐6,8‐dioxaspiro[3.5]nonane‐5,9‐dione (MCB). The evolution of the epoxy and lactone during curing and the linear ester groups in the final materials were evaluated by Fourier Transform Infrared in the attenuated‐total‐reflection mode. The kinetic parameters of the curing process were calculated from DSC analysis applying isoconversional procedures. The shrinkage on curing and the thermal degradability of the materials on varying the initiator used were evaluated. The expandable character of MCB was confirmed. The materials obtained were more degradable than conventional epoxy resins due to the tertiary ester groups incorporated in the network by copolymerization. © 2008 Wiley Periodicals, Inc J Polym Sci Part A: Polym Chem 46: 1229–1239, 2008     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

Molecular motion,morphology, and thermal properties of multiwall carbon nanotube/polysilsesquioxane composite

Diglycidyl ether of bisphenol A (DGEBA)‐bridged polyorganosiloxane precursors have been prepared successfully by reacting diglycidyl ether of bisphenol A epoxy resin with 3‐aminopropyltriethoxysilane. Acid‐modified and unmodified multiwalled carbon nanotube (MWCNT) were dispersed in the diglycidyl ether of bisphenol A‐bridged polyorganosiloxane precursors and cured to prepare the carbon nanotube/diglycidyl ether of bisphenol A‐bridged polysilsesquioxane (MWCNT/DGEBA‐PSSQ) composites. The molecular motion of MWCNT/DGEBA‐PSSQ nanocomposites was studied by high‐resolution solid‐state ¹³C NMR. Acid‐modification can improve the affinity between MWCNT and the polymer matrix. The molecular motion of the DGEBA‐PSSQ decreased with acid‐modified MWCNT content. However, when unmodified MWCNT was used, the molecular motion of the DGEBA‐PSSQ was increased. SEM and TEM microphotographs confirm that acid‐modified MWCNT exhibits better dispersion than unmodified MWCNT in DGBEA‐PSSQ. The dynamic mechanical properties of acid‐modified MWCNT/DGBEA‐PSSQ composites are more favorable than those of unmodified MWCNT. T_g of the DGEBA‐PSSQ decreased from 174.0 °C (neat DGEBA‐PSSQ) to 159.0 °C (1 wt % unmodified MWCNT) and 156.0 °C (1 wt % acid‐modified MWCNT). The storage modulus (at 30 °C) of the DGEBA‐PSSQ increased from 1.23 × 10⁹ Pa (neat DGEBA‐PSSQ) to 1.65 × 10⁹ Pa (1 wt % acid‐modified MWCNT). However, when unmodified MWCNT was used, the storage modulus of the DGEBA‐PSSQ decreased to 6.88 × 10⁸ Pa (1 wt % unmodified MWCNT). At high temperature, above 150 °C, storage modulus of nanocomposites was higher than that of neat polymer system. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 472–482, 2008     

Copolymer networks from carboxyl‐containing polyaryletherketone and diglycidyl ether of bisphenol‐A: Preparation and properties

This article presents a new type of epoxy‐toughening system, in which high‐T_g polyaryletherketone (PEK‐L) containing one carboxyl group per repeating unit was utilized to randomly copolymerize with epoxy resin (DGEBA) to form crosslinking network. Compared to the neat epoxy resin, the PEK‐L/DGEBA copolymers showed simultaneous enhancement in flexural strains at break by 282%, G_IC value by 193%, and flexural strength by 14%. The reason was attributed to the uniform three‐dimensional copolymer network interweaved by PEK‐L and DGEBA segments through strong covalent bonds. The copolymerization process were monitored and examined by FTIR spectra. The effect of copolymer composition on the thermal and mechanical properties as well as toughening mechanism were also investigated and discussed in detail. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Novel flame‐retardant thermosets: Diglycidyl ether of bisphenol A as a curing agent of boron‐containing phenolic resins

Boron‐containing novolac resins were synthesized by the modification of a commercial novolac resin with different contents of bis(benzo‐1,3,2‐dioxaborolanyl)oxide. These novolac resins were crosslinked with diglycidyl ether of bisphenol A (DGEBA), and their thermal, thermodynamomechanical, and flame‐retardant properties were evaluated. The boron‐containing novolac resins were less thermally stable than the unmodified novolac resin. Their modification degree and DGEBA content were related to the crosslinking density of the materials. The boron‐containing novolac resins generated boric acid at high temperatures and gave an intumescent char that slowed down the degradation and prevented it from being total. They also showed good flame‐retardant properties. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1701–1710, 2006     

Synthesis and properties of biobased epoxy resins. part 1. Glycidylation of flavonoids by epichlorohydrin

Biobased epoxy resins were synthesized from a catechin molecule, one of the repetitive units in natural flavonoid biopolymers also named condensed tannins. The reactivity of catechin toward epichlorohydrin to form glycidyl ether derivatives was studied using two model compounds, resorcinol and 4‐methylcatechol, which represent the A and B rings of catechin, respectively. These model molecules clearly showed differences in reactivity upon glycidylation, explaining the results found with catechin monomer. The reaction products were characterized by both FTIR and NMR spectroscopy and chemical assay. The glycidyl ether of catechin (GEC) was successfully cured in various epoxy resin formulations. The GECs thermal properties showed that these new synthesized epoxy resins displayed interesting properties compared to the commercial diglycidyl ether of bisphenol A (DGEBA). For instance, when incorporated up to 50% into the DGEBA resin, GEC did not modify the glass‐transition temperature. Epoxy resins formulated with GEC had slightly lower storage moduli but induced a decrease of the swelling percentage, suggesting that GEC‐enhanced crosslinking in the epoxy resin networks. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Curing studies of epoxy resins with phosphorus‐containing amines

The curing system of diglycidyl ether of bisphenol A (DGEBA) with two phosphorus‐containing amine compounds—bis(3‐aminophenyl)methyl phosphine oxide and bis(4‐aminophenyl)‐bis(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl)methane—was studied with differential scanning calorimetry under isothermal and nonisothermal conditions and compared with the DGEBA/diamino diphenyl methane system. The isoconversional method was used to evaluate the dependence of the effective activation energy on the extent of conversion. Modulated differential scanning calorimetry and dynamic mechanical thermal analysis were used to study the phenomena of vitrification and gelation. The thermal and flame‐retardant properties were evaluated, and the limiting oxygen index values of the phosphorylated resins, above 30, confirmed that phosphorus‐containing epoxy resins are effective flame retardants. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1676–1685, 2006     

Novel quaternary ammonium borates as latent catalysts for epoxy–phenolic resins

Novel tetrabutylammonium tetrakis(substituted benzoyloxy)borate salts ( 1a – 1d ) were synthesized by the reaction of tetrabutylammonium tetraphenylborate and corresponding substituted benzoic acids. Polyaddition reactions of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐bisphenol F (44BPF) or bisphenol F (BPF‐D) with the ammonium borates were investigated as model reactions of epoxy/phenol–novolac resin systems with respect to the thermal latency and storage stability of the catalyst. The polyaddition of DGEBA/44BPF with the ammonium borates in diglyme at 150 °C for 6 h proceeded up to 84–94% conversions and gave polymers with number‐average molecular weights of 3750–5750, whereas the polyaddition at 80 °C for 6 h gave less than 9% conversions. The catalytic activity of ammonium borates 1a – 1d depended on the substituent of the phenyl group of the borates, and the order of activity was 1b (p‐OMe) > 1a (? H) > 1c (p‐NO₂) > 1d [3,5‐(NO₂)₂]. The ammonium borate catalyst with the substituent that yielded lower acidity of the corresponding substituted benzoic acid tended to reveal higher activity. In comparison with tetrabutylammonium bromide (TBAB) as a conventional ammonium salt, 1a – 1d revealed better thermal latency. The storage stability of DGEBA/BPF‐D with the ammonium borate catalysts in bulk at 40 °C was better than that with TBAB. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2689–2701, 2002     

Synthesis of a benzoxazine with precisely two phenolic OH linkages and the properties of its high‐performance copolymers

A phenolic OH‐containing benzoxazine ( F‐ap ), which cannot be directly synthesized from the condensation of bisphenol F, aminophenol, and formaldehyde by traditional procedures, has been successfully prepared in our alternative synthetic approach. F‐ap was prepared by three steps including (a) condensation of 4‐aminophenol and 5,5'‐methylenebis(2‐hydroxybenzaldehyde) (1) , (b) reduction of the resulting imine linkage by sodium borohydride, and (c) ring closure condensation by formaldehyde. The key starting material, (1) , was prepared from 2‐hydroxybenzaldehyde and s‐trioxane in the presence of sulfuric acid. F‐ap is structurally similar to bis(3,4‐dihydro‐2H‐3‐phenyl‐1,3‐benzoxazinyl)methane ( F‐a, a commercial benzoxazine based on bisphenol F/aniline/formaldehyde) except for two phenolic OHs. The phenolic OHs can provide reaction sites with epoxy and 1,1'‐(methylenedi‐p‐phenylene)bismaleimide (BMI). The structure–property relationships between the thermosets of F‐ap /epoxy, F‐a /epoxy, F‐ap /BMI, and F‐a /BMI were discussed. Experimental data showed that thermosets based on F‐ap /epoxy and F‐ap /BMI provided much better thermal properties than those based on F‐a /epoxy and F‐a /BMI. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013, 51, 2686–2694