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1.
A novel series of colorless and highly organosoluble poly(ether imide)s were prepared from 3,3‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]phthalide dianhydride with various fluorinated aromatic bis(ether amine)s via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by cyclodehydration to produce the polymer films. The poly(ether imide)s showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents, in ether‐type solvents, and even in chlorinated solvents. Their films had a cutoff wavelength between 358 and 373 nm, and the yellowness index ranged from 3.1 to 9.5. The glass‐transition temperatures of the poly(ether imide) series were recorded between 237 and 297 °C, the decomposition temperatures at 10% weight loss were all above 494 °C, and the residue was more than 54% at 800 °C in nitrogen. These films showed high tensile strength and also were characterized by higher solubility, lighter color, and lower dielectric constants and moisture absorption than an analogous nonfluorinated polyimide series. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3140–3152, 2006  相似文献   

2.
A novel bis(ether anhydride) monomer, 3,6‐bis(3,4‐dicarboxyphenoxy)benzonorbornane dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile with 3,6‐dihydroxybenzonorbornane in the presence of potassium carbonate, followed by the alkaline hydrolysis of the intermediate bis(ether dinitrile) and the cyclodehydration of the resulting bis(ether diacid). A series of poly(ether imide)s bearing pendant norbornane groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were 0.81–1.81 dL/g. The poly(ether imide) with m‐phenylenediamine as a diamine showed good organosolubility. Most of the cast poly(ether imide) films have had high tensile strengths and moduli. The glass‐transition temperatures of these poly(ether imide)s, except for those from rigid p‐phenylenediamine and benzidine, were recorded between 211 and 246 °C by differential scanning calorimetry. The softening temperatures of all the poly(ether imide) films stayed within 210–330 °C according to thermomechanical analysis. No polymers showed significant decomposition before 500 °C in a nitrogen or air atmosphere. A comparative study of the properties with the corresponding poly(ether imide)s without pendant substituents was also made. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1712–1725, 2002  相似文献   

3.
A new adamantane‐based bis(ether anhydride), 2,2‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]adamantane dianhydride, was prepared in three steps starting from nitrodisplacement of 4‐nitrophthalonitrile with the potassium phenolate of 2,2‐bis(4‐hydroxyphenyl)adamantane. A series of adamantane‐containing poly(ether imide)s were prepared from the adamantane‐based bis(ether anhydride) and aromatic diamines by a conventional two‐stage synthesis in which the poly(ether amic acid)s obtained in the first stage were heated stage‐by‐stage at 150–270°C to give the poly(ether imide)s. The intermediate poly(ether amic acid)s had inherent viscosities between 0.56 and 1.92 dL/g. Except for those from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all the poly(ether amic acid) films could be thermally converted into transparent, flexible, and tough poly(ether imide) films. All the poly(ether imide)s showed limited solubility in organic solvents, although they were amorphous in nature as evidenced by X‐ray diffractograms. Glass transition temperatures of these poly(ether imide)s were recorded in the range of 242–317°C by differential scanning calorimetry and of 270–322°C by dynamic mechanical analysis. They exhibited high resistance to thermal degrdation, with 10% weight loss temperatures being recorded between 514–538°C in nitrogen and 511–527°C in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1619–1628, 1999  相似文献   

4.
The synthesis of aromatic poly(ether imide)s containing spirobifluorene units in the polymer backbone is described. 2,2′‐Bis(3,4‐dicarboxyphenoxy)‐9,9′‐spirobifluorene dianhydride, which was used as a new monomer, was synthesized with 2,2′‐dihydroxy‐9,9′‐spirobifluorene as the starting material. In the spiro‐segment, the rings of the connected bifluorene were orthogonally arranged. This bis(ether anhydride) monomer was employed in reactions with a variety of aromatic diamines to furnish poly(ether imide)s, involving an initial ring‐opening polycondensation and subsequent chemically induced cyclodehydration. Excellent solubility in common organic solvents at room temperature, good optical transparency, and high thermal stability are the prominent characteristic features of these new polymers, which can be attributed to the presence of spiro‐fused orthogonal bifluorene segments along the polymer chain. The glass‐transition temperatures of the polyimides were 240–293 °C, and the 5% weight‐loss temperatures were greater than 500 °C. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 262–268, 2002  相似文献   

5.
A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004  相似文献   

6.
In this research, a new fluorinated diamine based on 2,2′‐substituted 1,1′‐binaphthyl units, 2,2′‐bis(2‐amino‐4‐trifluoromethylphenoxy)‐1,1′‐binaphthyl (AFPBN) was synthesized and then used to prepare the corresponding ortho‐linked poly(ether‐imide)s via chemical polyimidization with several aromatic carboxylic dianhydrides. The resulting poly(ether‐imide)s were fully characterized by FT‐IR, NMR, viscosity measurements, gel‐permeation chromatography, UV–vis, X‐ray diffraction, organo‐solubility, thermogravimetric analysis (TGA), and differential scanning calorimetry. Probing optical behavior of the colorless films prepared from these poly(ether‐imide)s demonstrated that they possess a high degree of optical transparency, and UV–visible absorption cut‐off wavelength values were found to be in the range of 404–471 nm. The resulting polymers exhibited excellent organo‐solubility in polar solvents such as dimethylformamide, dimethyl sulfoxide, pyridine, and even tetrahydrofuran. To investigate the heat stability of the samples, their thermograms obtained from TGA were plotted, and for example, it is found that the 10% weight loss temperature of representative polymer AFPBN/3,3′,4,4′‐benzophenonetetracarboxylic dianhydride occurred at 532°C in nitrogen. These poly(ether‐imide)s had glass‐transition temperatures (Tg's) up to 280°C. Two previously prepared analogues of AFPBN, i.e. nonfluorinated diamine DAM1 and para‐linked fluorinated diamine DAM2 used to prepare the corresponding poly(ether‐imide)s, were also considered to compare the results obtained. Copyright © 2012 John Wiley & Sons, Ltd.  相似文献   

7.
A series of novel aromatic poly(ether imide)s (PEI) containing ortho‐catenated phenylene rings and pendant trifluoromethyl group have been prepared from 1,2‐bis(3,4‐dicarboxyphenoxy)benzene dianhydride (1) with seven trifluoromethyl‐substituted aromatic bis(ether amine)s ( 2a‐g ) via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by chemical imidization to the polyimides. These PEIs had inherent viscosities in the range of 0.45–1.17 dL/g that corresponded to weight–average and number–average molecular weights (by gel‐permeation chromatography) of 42,000–102,000 and 28,500–67,500, respectively. All the PEIs were readily soluble in many organic solvents and could be solution‐cast into transparent, flexible, and strong films. These films were essentially colorless; they had a very low yellowness index of 4.34–6.55 and an UV–vis absorption cut‐off wavelength at 361–370 nm. The PEIs exhibited moderate‐to‐high glass‐transition temperatures (Tg) in the range of 185–270 °C, softening temperatures (Ts) in the range of 184–275 °C, and 10% weight loss temperatures higher than 466 °C in nitrogen or in air. They also showed low moisture absorptions of 0.49–0.70% and low dielectric constants of 2.78–3.26 (measured at 10 kHz). © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3092–3102, 2006  相似文献   

8.
A new bis(ether anhydride), 3,3′,5,5′‐tetramethyl‐2,2‐bis[4‐(4‐dicarboxyphenoxy)phenyl]propane dianhydride ( 3 ), was prepared in three steps: the nitro displacement of 4‐nitrophthalonitrile with 2,2‐bis(4‐hydroxy‐3,5‐dimethylphenyl)propane, the alkaline hydrolysis of the intermediate bis(ether dinitrile), and the subsequent dehydration of the resulting bis(ether diacid). A series of new highly soluble poly(ether imide)s with tetramethyl and isopropylidene groups were prepared from the bis(ether anhydride) 3 with various diamines by a conventional two‐stage synthesis including polyaddition and chemical cyclodehydration. The resulting poly(ether imide)s had inherent viscosities of 0.54–0.73 dL g?1. Gel permeation chromatography measurements revealed that the polymers had number‐average and weight‐average molecular weights of up to 54,000 and 124,000, respectively. All the polymers showed typical amorphous diffraction patterns. All of the poly(ether imide)s showed excellent solubility and were readily dissolved in various solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, N,N‐dimethylformamide, pyridine, cyclohexanone, tetrahydrofuran, and even chloroform. Most of the polymers could be dissolved with chloroform concentrations as high as 30 wt %. These polymers had glass‐transition temperatures of 244–282 °C. Thermogravimetric analysis showed that all polymers were stable, with 10% weight losses recorded above 463 °C in nitrogen. These transparent, tough, and flexible polymer films were obtained through solution casting from N,N‐dimethylacetamide solutions. These polymer films had tensile strengths of 81–102 MPa and tensile moduli of 1.8–2.0 GPa. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2556–2563, 2002  相似文献   

9.
A new bulky pendent bis(ether anhydride), 1,1‐bis[4‐(4‐dicarboxyphenoxy)phenyl]‐4‐phenylcyclohexane dianhydride, was prepared in three steps, starting from the nitrodisplacement of 1,1‐bis(4‐hydroxyphenyl)‐4‐phenylcyclohexane with 4‐nitrophthalonitrile to form bis(ether dinitrile), followed by alkaline hydrolysis of the bis(ether dinitrile) and subsequent dehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s were prepared from the bis(ether anhydride) with various diamines by a conventional two‐stage synthesis including polyaddition and subsequent chemical cyclodehydration. The resulting poly(ether imide)s had inherent viscosities of 0.50–0.73 dL g?1. The gel permeation chromatography measurements revealed that the polymers had number‐average and weight‐average molecular weights of up to 57,000 and 130,000, respectively. All the polymers showed typical amorphous diffraction patterns. All of the poly(ether imide)s showed excellent solubility in comparison with the other polyimides derived from adamantane, norbornane, cyclododecane, and methanohexahydroindane and were readily dissolved in various solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide (DMAc), N,N‐dimethylformamide, pyridine, cyclohexanone, tetrahydrofuran, and even chloroform. These polymers had glass‐transition temperatures of 226–255 °C. Most of the polymers could be dissolved in chloroform in as high as a 30 wt % concentration. Thermogravimetric analysis showed that all polymers were stable up to 450 °C, with 10% weight losses recorded from 458 to 497 °C in nitrogen. These transparent, tough, and flexible polymer films could be obtained by solution casting from DMAc solutions. These polymer films had tensile strengths of 79–103 MPa and tensile moduli of 1.5–2.1 GPa. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2066–2074, 2002  相似文献   

10.
A fluorinated diamine monomer containing flexible ether linkage and bulky trifluoromethyl substituents, namely, bis(4‐amino‐2‐trifluoromethylphenyl) ether (a), is employed to react with nonfluorinated 1,4‐bis(3,4‐dicarboxyphenoxy) benzene dianhydride (3) and CF3‐free 2,2‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl] propane dianhydride (4), respectively, to prepare 2 novel soluble and optically transparent semi‐fluorinated poly (ether imide)s (PEIs; 3a and 4a). Compared with the corresponding PEIs based on nonfluorinated 4,4′‐diaminodiphenyl ether (b) and CF3‐free pyromellitic dianhydride (5), the novel semifluorinated PEIs 3a and 4a not only display better solubility in some organic solvents and higher optical transparency with cutoff absorption wavelength (λ0) below 370 nm but also maintain outstanding mechanical properties and thermal stability. 3a and 4a have tensile strength beyond 80 MPa and possess glass‐transition temperatures (Tg) beyond 210°C, coupled with the temperatures of 5% weight loss (T5%) exceeding 500°C. It is also found that 3a and 4a exhibit contact angles against water beyond 110° and water absorptions below 0.8% together with dielectric constants less than 3.2.  相似文献   

11.
A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003  相似文献   

12.
A bis(ether anhydride) monomer, 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride ( IV‐A ), was synthesized from the nitro displacement of 4‐nitrophthalodinitrile by the phenoxide ion of 1,1‐bis(4‐hydroxyphenyl)cyclohexane ( I‐A ), followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and dehydration of the resulting bis(ether acid). A novel series of organosoluble poly(ether imide)s ( VI a–i )(PEIs) bearing cyclohexylidene cardo groups was prepared from the bis(ether anhydride) IV‐A with various aromatic diamines V a–i via a conventional two‐stage process. The PEIs had inherent viscosities in the range of 0.48–1.02 dL/g and afforded flexible and tough films by solution‐casting because of their good solubilities in organic solvents. Most PEIs showed yield points in the range of 89–102 MPa at stress‐strain curves and had tensile strengths of 78–103 MPa, elongations at breaks of 8–62%, and initial moduli of 1.8–2.2 GPa. The glass‐transition temperatures (Tg's) of these PEIs were recorded between 200–234 °C. Decomposition temperatures of 10% weight loss all occurred above 490 °C in both air and nitrogen atmospheres, and their residues were more than 43% at 800 °C in nitrogen atmosphere. The cyclohexane cardo‐based PEIs exhibited relatively higher Tg's, better solubilities in organic solvents, and better tensile properties as compared with the corresponding Ultem® PEI system. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 788–799, 2001  相似文献   

13.
A new trifluoromethyl‐substituted bis(ether amine) monomer, 2,7‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene, was synthesized. It led to a series of novel fluorinated polyimides by thermal and chemical imidization routes when reacted with various commercially available aromatic tetracarboxylic dianhydrides. Most of the polyimides obtained from both routes were soluble in many organic solvents, such as N,N‐dimethylacetamide. All the polyimides could afford transparent, flexible, and strong films with low moisture absorptions of 0.3–0.6%, low dielectric constants of 2.52–3.27 at 10 kHz, and an ultraviolet–visible absorption cutoff wavelength at 377–436 nm. The glass‐transition temperatures of the polyimides were in the range of 244–297 °C, and the 5% weight‐loss temperatures were higher than 550 °C. For a comparative study, a series of analogous polyimides based on 2,7‐bis(4‐aminophenoxy)naphthalene were also prepared and characterized. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2001–2018, 2003  相似文献   

14.
A naphthalene unit-containing bis(ether anhydride), 2,7-bis(3,4-dicarboxyphenoxy)naphthalene dianhydride, was prepared in three steps starting from the nucleophilic nitrodisplacement reaction of 2,7-dihydroxynaphthalene and 4-nitrophthalonitrile in N,N-dimethylformamide (DMF) solution in the presence of potassium carbonate followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and subsequent dehydration of the resulting bis(ether diacid). High-molar-mass aromatic poly(ether imide)s were synthesized using a conventional two-stage polymerization process from the bis(ether anhydride) and ten aromatic diamines. The intermediate poly(ether amic acid)s had inherent viscosities of 0.95–2.67 dL/g. The films of poly(ether imide)s derived from two rigid diamines, that is, p-phenylenediamine and benzidine, crystallized and embrittled during the thermal imidization process. The other poly(ether imide)s belonged to amorphous materials and could be fabricated into transparent, flexible, and tough films. These poly(ether imide) films had yield strengths of 91–115 MPa, tensile strengths of 89–136 MPa, elongation to break of 11–45%, and initial moduli of 1.7–2.2 GPa. The Tgs of poly(ether imide)s were recorded in the range of 222–256°C depending on the nature of the diamine moiety. All polymers were thermally stable up to 500°C, with 10% weight loss being recorded above 540°C in air and nitrogen atmospheres. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2281–2287, 1997  相似文献   

15.
A new naphthalene unit-containing bis(ether anhydride), 2,6-bis(3,4-dicarboxyphenoxy)naphthalene dianhydride, was synthesized in three steps starting from the nucleophilic nitrodisplacement reaction of 2,6-dihydroxynaphthalene and 4-nitrophthalonitrile in N,N-dimethylformamide (DMF) solution in the presence of potassium carbonate, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and subsequent dehydration of the resulting bis(ether diacid). High-molar-mass aromatic poly(ether imide)s were prepared using a conventional two-step polymerization process from the bis(ether anhydride) and various aromatic diamines. The intermediate poly(ether amic acid)s had inherent viscosities of 0.65–2.03 dL/g. The films of poly(ether imide)s derived from two rigid diamines, i.e. p-phenylenediamine and benzidine, crystallized during the thermal imidization process. The other poly(ether imide)s belonged to amorphous materials and could be fabricated into transparent, flexible, and tough films. These aromatic poly(ether imide) films had yield strengths of 104–131 MPa, tensile strengths of 102–153 MPa, elongation to break of 8–87%, and initial moduli of 1.6–3.2 GPa. The glass transition temperatures (Tg's) of poly(ether imide)s were recorded in the range of 220–277°C depending on the nature of the diamine moiety. All polymers were stable up to 500°C, with 10% weight loss being recorded above 550°C in both air and nitrogen atmospheres. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1657–1665, 1998  相似文献   

16.
A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (Tg) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (Ts) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999  相似文献   

17.
A novel triphenylamine (TPA)‐containing bis(ether anhydride) monomer, namely 4,4′‐bis(3,4‐dicarboxyphenoxy)triphenylamine dianhydride, was synthesized and reacted with various aromatic diamines leading to a series of new poly(ether‐imide)s (PEI). Most of these PEIs were soluble in organic solvents and could be easily solution cast into flexible and strong films. The polymer films exhibited good thermal stability with glass‐transition temperatures in the range 211–299 °C. The polymer films exhibited reversible electrochemical processes and stable color changes (from transparent to navy blue) with high coloration efficiency and contrast ratio upon electro‐oxidation. During the electrochemical oxidation process, a crosslinked polymer structure was developed due to the coupling reaction between the TPA radical cation moieties in the polymer chains. These polymers can be used to fabricate electrochromic devices with high coloration efficiency, high redox stability, and fast response time. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 825–838  相似文献   

18.
A diimide dicarboxylic acid, 1,4‐bis(4‐trimellitimidophenoxy)naphthalene (1,4‐BTMPN), was prepared by condensation of 1,4‐bis(4‐aminophenoxy)naphthalene and trimellitic anhydride at a 1 : 2 molar ratio. A series of novel poly(amide‐imide)s (IIa–k) with inherent viscosities of 0.72 to 1.59 dL/g were prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid 1,4‐BTMPN with various aromatic diamines (Ia–k) in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. The poly(amide‐imide)s showed good solubility in NMP, N,N‐dimethylacetamide, and N,N‐dimethylformamide. The thermal properties of the obtained poly(amide‐imide)s were examined with differential scanning calorimetry and thermogravimetry analysis. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures in the range of 215 to 263°C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses at temperatures in the range of 538 to 569°C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s also is presented. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1–8, 2000  相似文献   

19.
A series of poly(ether imide)s (PEIs), III a–k , with light color and good physical properties were prepared from 1,4‐bis(3,4‐dicarboxypheoxy)‐2,5‐di‐tert‐butylbenzene dianhydride ( I ) with various aromatic diamines ( II a–k ) via a conventional two‐stage procedure that included a ring‐opening polyaddition to yield poly(amic acid)s (PAA), followed by thermal imidization to the PEI. The intermediate PAA had inherent viscosities in the range of 1.00–1.53 dL g?1. Most of the PEIs showed excellent solubility in chlorinated solvents such as dichloromethane, chloroform, and m‐cresol, but did not easily dissolve in dimethyl sulfoxide and amide‐type polar solvents. The III series had tensile strengths of 96–116 MPa, an elongation at break of 7–8%, and initial moduli of 2.0–2.5 GPa. The glass‐transition temperatures (Tg) and softening temperatures (Ts's) of the III series were recorded between 232 and 285 °C and 216–279 °C, respectively. The decomposition temperatures for 10% weight loss all occurred above 511 °C in nitrogen and 487 °C in air. The III series showed low dielectric constants (2.71–3.54 at 1 MHz), low moisture absorption (0.18–0.66 wt %), and was light‐colored with a cutoff wavelength below 380 nm and a low yellow index (b*) values of 7.3–14.8. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 1270–1284, 2005  相似文献   

20.
A series of novel polyimides (PIs) ( 3a–d ) were prepared from 3,3′,5,5′‐tetramethyl‐4,4′‐diaminodiphenyl‐4 ″ ‐isopropyltoluene ( 1 ) with four aromatic dianhydrides via a one‐step high temperature polycondensation procedure. The obtained PIs showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents and chlorinated solvents. Their films were nearly colorless and exhibited high‐optical transparency, with the UV cutoff wavelength in the range of 328–353 nm and the transparency at 450 nm >80%. They also showed low‐dielectric constant (2.49–2.94 at 1 MHz) and low‐water absorptions (0.44–0.65%). Moreover, these PIs possessed high‐glass transition temperatures (Tg) beyond 327 °C and excellent thermal stability with 10% weight loss temperatures in the range of 530–555 °C in nitrogen atmosphere. In comparison with some fluorinated poly(ether imide)s derived from the trifluoromethyl‐substituted bis(ether amine)s, the resultant PIs 3a–d showed better solubility, lower cutoff wavelength, and higher Tg. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3309–3317, 2009  相似文献   

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