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1.
以马来酸酐为原料与水合肼反应得到哒嗪酮,再与三氯氧磷反应制备3,6-二氯哒嗪中间体,哒嗪中间体与间氨基苯酚通过亲核取代反应合成了一种新的二胺单体——3,6-二(3-氨基苯氧基)哒嗪.通过1HNMR,FTIR及HPLC-MS确证了哒嗪二胺及中间体的结构.这种哒嗪二胺单体与6种芳香二酐单体——均苯四甲酸二酐(PMDA)、3,3',4,4'-联苯四甲酸二酐(BPDA)、4,4-六氟异丙基邻苯二甲酸酐(6FDA)、3,3',4,4'-二苯甲酮四甲酸二酐(BTDA)、3,3',4,4'-二苯醚四甲酸二酐(ODPA)和双酚A型二醚二酐(BPADA)通过两步法聚合制备了一系列的聚酰亚胺,并对其结构和性能进行了研究.结果表明,聚酰胺酸的比浓对数黏度为0.37~0.50 dL/g,该系列聚酰亚胺膜具有良好的热稳定性和机械性能,玻璃化温度(Tg)为188~241℃,氮气氛围下5%和10%热失重分别为421~448℃和447~473℃,拉伸强度(TS)高达102 MPa,断裂伸长率(EB)为2.0%~6.5%.紫外可见光谱测试得到的截止波长(λcut-off)为367~389 nm.  相似文献   

2.
合成了一种刚性芳香二胺单体3,3',5,5'-四甲基-4,4'-二胺基苯基甲苯(BDAP),与6-氨基苯基-2-氨基苯并咪唑(BIA)组成混合二胺,分别与4种商品化的二酐单体(均苯四酸二酐(PMDA)、联苯四酸二酐(BPDA)、二苯酮四酸二酐(BTDA)和二苯醚四酸二酐(ODPA))一步法缩聚合成了一系列可溶性聚酰亚胺.采用FTIR,1H-NMR,UV-Vis,DMA和TGA等测试方法对所制备的聚酰亚胺进行了表征.结果表明,所制备的聚酰亚胺具有良好的溶解性能,能够在NMP和DMAc等常规溶剂中溶解;耐热性及力学性能优良,玻璃化转变温度超过410℃,分解温度在500℃以上.  相似文献   

3.
基于苯醚型含氟二胺的聚酰亚胺膜材料的合成与表征   总被引:5,自引:0,他引:5  
4,4′-二羟基二苯醚和2-氯-5-硝基三氟甲苯经Williamson反应得到4,4′-双(4-硝基-2-三氟甲基苯氧基)二苯醚;在Pd/C-水合肼还原作用下得到4,4′-双(4-氨基-2-三氟甲基苯氧基)二苯醚(p-6FAPE).采用3种苯醚型含氟二胺1,4-双(3-氨基-5-三氟甲基苯氧基)苯、1,4-双(4-氨基-2-三氟甲基苯氧基)苯和p-6FAPE分别与3,3′,4,4′-二苯醚四酸二酐(ODPA)和均苯四甲酸二酐通过两步法制备出6种含氟聚酰亚胺(PI),对其溶解性、热性能和光学性能进行研究.这些PI具有较好的溶解性,且具有良好的热稳定性;ODPA基PI在可见光波长范围具有优良的透明性,450 nm处的透光率超过80%.  相似文献   

4.
DDBT类可溶性聚酰亚胺的合成与性能研究   总被引:1,自引:0,他引:1  
由二甲基-5,5'-3,7-二苯并噻吩二胺(DDBT)和3,3',4,4'-二苯砚四羧酸二酐(DSDA)、2,2'-双(3,4-二羧酸)六氟丙烷二酐(……FDA)、均苯四羧酸二酐(PMDA)、联苯四羧酸二酐(BPDA)等多种二酐单体进行缩聚反应制备了新型可溶性聚酰亚胺。测定了其特性粘度为0.6-0.9dL/g;DDBT与DSDA、6FDA反应得到的聚酰亚胺在非质子强极性溶剂中具有良好的溶解性。用IR、热力学分析等手段对DDBT类聚酰亚胺进行了表征,并对可溶性DDBT-DSDA聚酰亚胺膜作了进一步的研究,推导出了苯在DDBT-DSDA聚酰亚胺膜中动态吸附初期的吸附方程。实验结果表明DDBT-DSDA聚酰亚胺膜对苯具有特殊的亲和力。  相似文献   

5.
合成了一种含磷二胺单体, 二(4-胺基苯氧基)苯基膦氧(DAPOPO). 该单体与4,4'-二胺基二苯醚(ODA)、 均苯四酸二酐(PMDA)和3,3',4,4'-联苯四酸二酐(BPDA)共聚得到聚酰胺酸溶液, 通过干喷湿纺法纺丝得到聚酰胺酸纤维, 聚酰胺酸纤维经过热亚胺化和热牵伸得到含磷的聚酰亚胺纤维. 利用纤维强度仪、 扫描电子显微镜、 热失重分析仪和氧指数测定仪等研究了含磷聚酰亚胺纤维的力学性能、 形貌、 热稳定性能和阻燃性能. 结果表明, 随着含磷量的增加, 纤维的热稳定性明显提高, 而极限氧指数从35上升到了45, 说明纤维的阻燃性能得到很大提高.  相似文献   

6.
以o-羟基苯乙酮、对氯硝基苯和苯甲醛为原料,通过亲核取代反应、改进的Chichibabin反应以及水合肼催化还原合成了一种新型含邻位取代单元及吡啶环的芳香二胺4-苯基-2,6-双[3-(4-氨基苯氧基)苯基]吡啶(o,p-PAPP).以N,N-二甲基甲酰胺(DMF)为溶剂,将o,p-PAPP分别与3,3',4,4'-二苯醚四羧酸二酐(ODPA)、2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)、3,3',4,4'-二苯酮四甲酸二酐(BTDA)及均苯四甲酸二酐(PMDA)通过常规的两步法,合成了4种聚酰亚胺.用FTIR、DSC、TGA、XRD、溶解性测试、UV-Vis和荧光光谱对聚合物的结构和性能进行了表征.FTIR结果表明,所得的聚合物在1780,1720和1380cm-1左右出现了聚酰亚胺的特征吸收峰.实验所得的PI能很好地溶解于常见有机溶剂(如DMF,DMAC,DMSO,NMP,THF,CHCl3),在氮气氛中,PI的10%失重温度(T10)为444.2~467.5℃,800℃时的残余质量(Rw)为49.6%~58.3%.同时PI分子主链中的吡啶环结构使其具有良好的紫外光吸收性能,经HCl质子化后,在460 nm附近出现非常强的荧光发射峰.  相似文献   

7.
以乙酰氨基苯酚为原料,经过BrCF2CF2Br氟烷基化、Zn催化脱卤、热环化二聚,以及水解去保护,合成了一种含全氟环丁烷环的二胺单体1,2,3,3,4,4-六氟-1,2-双[4-(氨基)苯氧基]环丁烷.用该单体分别与酯环二酐双环[2·2·1]辛烷-2,3,5,6-四羧基2,3,5,6-二酐(BHDA)、芳香性二酐3,3′,4,4′-联苯四酸二酐(BPDA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)通过“一步法”制备了3种新型含全氟环丁烷环聚酰亚胺.通过粘度测试、溶解性实验、FT-IR、热失重分析(TGA)和差热扫描量热(DSC)分析等手段,对所合成的聚酰亚胺的结构与性能进行了表征.结果显示该类聚酰亚胺可溶于大多数常用极性有机溶剂,热分解温度高于480℃,其中两种聚合物玻璃化温度低于150℃,表明含全氟环丁烷环聚酰亚胺具有良好的溶解性和可加工性.  相似文献   

8.
参照文献[1]介绍的邻苯二甲酸酐的极谱测定法的原理,拟定下述方法,以应用于工业级(或其粗制品)的邻苯二甲酸(或其酐)、1,2,4-苯三甲酸(即偏苯三甲酸,或其单酐)、1,2,4,5-苯四甲酸(即均苯四甲酸或其二酐)、3,3',4,4'-二苯醚四甲酸(或其二酐)、3,3',4,4'-二苯甲酮四甲酸(或其二酐)、菸酸、喹啉酸的极  相似文献   

9.
采用原位一步自金属化的方法制备了具有反射性和导电性的表面银(Ag)化的聚酰亚胺(PI)薄膜,PI是由一种二酐(3,3′,4,4′-四羧基二苯酮酐,BTDA)和两种二胺(4,4′-二氨基二苯醚,4,4′-ODA与4,4′-二氨基二苯硫醚,4,4′-SDA)三元共聚而得,系统研究了4,4′-SDA的引入对薄膜性能及相态结构的影响.结果表明,4,4′-SDA的加入有助于银的还原和迁移,并利于薄膜导电性的提高,薄膜的反射率在两种二胺单体4,4′-ODA与4,4′-SDA的摩尔比为1比1时达到最佳.  相似文献   

10.
采用原位一步自金属化的方法制备了具有反射性和导电性的表面银(Ag)化的聚酰亚胺(PI)薄膜,PI是由一种二酐(3,3′,4,4′-四羧基二苯酮酐,BTDA)和两种二胺(4,4′-二氨基二苯醚,4,4′-ODA与4,4′-二氨基二苯硫醚,4,4′-SDA)三元共聚而得,系统研究了4,4′-SDA的引入对薄膜性能及相态结构的影响.结果表明,4,4′-SDA的加入有助于银的还原和迁移,并利于薄膜导电性的提高,薄膜的反射率在两种二胺单体4,4′-ODA与4,4′-SDA的摩尔比为1比1时达到最佳.  相似文献   

11.
Novel anhydride‐terminated fluorinated hyperbranched polyimides (FHBPIs) were successfully prepared by condensation of a triamine monomer, 1,3,5‐tris(2‐trifluoromethyl‐4‐aminopheoxy) benzene (TFAPOB), and various aromatic dianhydride monomers with different linear length. UV–vis spectra indicate high optical transparency of FHBPI films with a UV–vis absorption edge of 350–395 nm. FHBPIs show increased mechanical properties with the linear length of dianhydride monomer. Young's moduli of FHBPI range from 2.37 to 2.56 Gpa, similar to those of their linear analogs. These FHBPI films also present a minimum birefringence value as low as 0.0025 at 650 nm and have low optical absorption in the optical communication wavelengths of 1310 and 1550 nm. Rib‐type optical waveguide device fabricated by FHBPI‐4d demonstrated an obvious near‐field mode pattern of the waveguide. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 6269–6279, 2009  相似文献   

12.
Three types of new bis(ether dianhydride) monomers, [4,4′‐(2‐(3′‐methylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4a)], [4,4′‐(2‐(3′‐trifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4b)], and [4,4′‐(2‐(3′,5′‐ditrifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4c)] were prepared via a multistep reaction sequence. Three series of soluble poly(ether imide)s (PEIs) were prepared from the obtained dianhydrides by a two‐step chemical imidization method. Experimental results indicated that all the PEIs had glass transition temperature in the range of 200–230 °C and the temperature of 5% weight loss in the range of 520–590 °C under nitrogen. The PEIs showed excellent solubility in a variety of organic solvents due to introduction of the bulky pendant groups and were capable of forming tough films. The casting films of PEIs (80–91 μm in thickness) had tensile strengths in the range from 88 to 117 MPa, tensile modulus from 2.14 to 2.47 GPa, and elongation at break from 15 to 27%. The casting films showed UV‐Vis absorption edges at 357–377 nm, low dielectric constants of 2.73–2.82, and water uptakes lower than 0.66 wt %. The spin‐coated films of PEIs presented a minimum birefringence value as low as 0.0122 at 650 nm and low optical absorption at the optical communication wavelengths of 1310 and 1550 nm. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 3281–3289, 2010  相似文献   

13.
Two types of novel fluorinated diimide‐diacid monomers—[2,2′‐(4,4′‐(3′‐methylbiphenyl‐2,5‐diyl)bis(oxy)bis(3‐(trifluoromethyl)‐4,1‐phenylene))bis(1,3‐dioxoisoindoline‐5‐carboxylic acid)] (III) and [2,2′‐(4,4′‐(3′‐(trifluoromethyl)biphenyl‐2,5‐diyl)bis(oxy)bis(3‐(trifluoromethyl)‐4,1‐phenylene))bis(1,3‐dioxoisoindoline‐5‐carboxylic acid)] (IV)—were respectively designed and prepared by the condensation of diamines I and II with two molar equivalents of trimellitic anhydride. From both diimide‐diacids, two series of novel poly(amide‐imide)s (PAIs) (IIIa–IIIe and IVa–IVe) bearing different pendant groups were prepared by direct polymerization with various aromatic diamines (a–e). All the PAIs had a high glass transition temperatures (Tgs, 232–265 °C), excellent thermal stability (exhibiting only 5% weight loss at 493–542 °C under nitrogen) and good solubility in various organic solvents due to the introduction of the bulky pendant groups. The cast films of these PAIs (80–90 μm) had good optical transparency (73–81% at 450 nm, 85–88% at 550 nm and 87–89% at 800 nm) and low dielectric constants (2.65–2.98 at 1 MHz). The spin‐coated films of these PAIs presented a minimum birefringence value as low as 0.0077–0.0143 at 650 nm and low optical absorption at the near‐infrared optical communication wavelengths of 1310 and 1550 nm. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 3243–3252  相似文献   

14.
Novel sul-containing fluorinated polyimides have been synthesized by the reaction of 2,2′-bis-(trifluoromethyl)-4,4′-diaminodiphenyl sulfide (TFDAS) with 1,4-bis-(3,4-dicarboxyphenoxy)benzene dianhydride (HQDPA), 2,2′-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), 4,4′-oxydiphthalicanhydride (ODPA) or 3,4,3′,4′-biphenyl-tetracarboxylic acid dianhydride (s-BPDA). The fluorinated polyimides, prepared by a one-step polycondensation procedure, have good solubility in many solvents, such as N-methyl-2-pyrrolidinone (NMP), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), cyclohexanone, tetrahydrofuran (THF) and m-cresol. The molecular weights (Mn's) and polydispersities (Mn/Mw's) of polyimides were in the range of 1.24 × 105 to 3.21 × 105 and 1.59–2.20, respectively. The polymers exhibit excellent thermal stabilities, with glass-transition temperatures (Tg) at 221–275 °C and the 5% weight-loss temperature are above 531 °C. After crosslinking, these polymers show higher thermal stability. The films of polymers have high optical transparency. The novel sul-containing fluorinated polyimides also have low absorption at both 1310 and 1550 nm wavelength windows. Rib-type optical waveguide device was fabricated using the fluorinated polyimides and the near-field mode pattern of the waveguide was demonstrated.  相似文献   

15.
合成了一系列基于4,4-′ODPA,3,4-′ODPA以及3,3-′ODPA 3种异构二苯醚二酐单体的异构聚酰亚胺,以苯酐(PA)作为封端剂来控制分子量.用DSC和WAXD为主要手段研究了这几种异构聚酰亚胺的结晶行为.研究发现聚酰亚胺4,4-′ODPA/ODA(二苯醚二胺)在分子量较低的情况下能够在热处理,退火或剪切作用下结晶.并且升高热处理温度和延长热处理时间有利于结晶的完善,在玻璃化温度以上施加剪切能够加速聚酰亚胺的结晶.而对于其他的两种异构体3,4-′ODPA/ODA以及3,3-′ODPA/ODA无论是经过热处理还是施加外力剪切都未能使其结晶.  相似文献   

16.

Four new poly(etherimide)s have been synthesized by reaction with commercially available bisphenol‐A‐(diphthaleic anhydride) (BPADA) with four different kinds of diamines, namely 4,4′‐bis(p‐aminophenoxy‐3,3″‐trifluoromethyl) terphenyl,4,4′‐bis(3″‐trifluoromethyl‐p‐aminobiphenyl ether)biphenyl,2,6‐bis(3′‐trifluoromethyl‐p‐aminobiphenyl ether)pyridine, 2,5‐bis(3′‐trifluoromethyl‐p‐aminobiphenylether)thiopene. The poly(etherimide)s are named as 1a, 1b, 1c and 1d, respectively. The synthesized polyimides show good solubility in various organic solvents. The polyimide films had low water absorption of 0.19–0.30% and low dielectric constant of 2.79–3.1 at 1 MHz. These polyimides showed very high thermal stability with decomposition temperature (5% wt loss) up to 522°C in nitrogen. Transparent thin films of these polyimides exhibited tensile strength up to 97 MPa, a modulus of elasticity up to 1.56 GPa and elongation at break up to 20%.  相似文献   

17.
聚酰亚胺(PI)是一类综合性能优异的功能性材料,广泛应用于航天、航空及电子工业等领域[1].感光聚酰亚胺可以采用光刻工艺,大大简化了其应用加工程序[2,3],因而备受人们所青睐.含查尔酮结构的聚合物对UV辐射敏感度高和化学稳定性好,最近被广泛的研究和应用[4~7].主链含查尔酮结  相似文献   

18.
Two new fluorinated diamine monomers, 3,3′-diamino-5,5′-bis(trifluoromethyl)biphenyl and 3,3′-diamino-6,6′-bis(trifluoromethoxy)biphenyl, as well as a known nonfluorinated analog, 3,3′-diaminobiphenyl, were synthesized. Reaction of these diamines with rigid, highly rod-like dianhydrides produced poly(amic acid)s and polyimides, which were spin coated and thermally treated to produce polyimide films for evaluation in electronics applications. It was hoped that these polyimide films would exhibit an ideal combination of low thermal expansion, reduced water absorption, and low dielectric constant but with improved elongation due to the “crankshaft” nature of the 3,3′-biphenyl unit. Unlike polyimide films from analogous 4,4′-diaminobiphenyls, however, the 3,3′-diaminobiphenyl-based polyimides did not yield low in-plane thermal expansion coefficient in spin-coated films. In some cases high elongation was achieved, but with high thermal expansion. These new diamines may nevertheless find utility in polyimides and polyaramides for membrane, fiber, and other applications. Additionally, they may be useful in modifying the properties of polymer backbones via copolymerization. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2441–2451, 1997  相似文献   

19.
A novel fluorinated aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FMA), was synthesized by the coupling reaction of 3′,5′‐ditrifluoromethyl‐2,2,2‐trifluoroacetophenone with 2,6‐dimethylaniline under the catalysis of 2,6‐dimethylaniline hydrochloride. A series of fluorinated aromatic polyimides were synthesized from 9FMA and various aromatic dianhydrides, including pyromellitic dianhydride, 3,3′4,4′‐biphenyl tetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature, one‐stage imidization process. The inherent viscosities of the polyimides ranged from 0.37 to 0.74 dL/g. All the polyimides were quickly soluble in many low‐boiling‐point organic solvents such as tetrahydrofuran, chloroform, and acetone as well as some polar organic solvents such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, and N,N′‐dimethylformamide. Freestanding fluorinated polyimide films could be prepared and exhibited good thermal stability with glass‐transition temperatures of 298–334 °C and outstanding mechanical properties with tensile strengths of 69–102 MPa and elongations at break of 3.3–9.9%. Moreover, the polyimide films possessed low dielectric constants of 2.70–3.09 and low moisture absorption (<0.58%). The films also exhibited good optical transparency with a cutoff wavelength of 303–351 nm. One polyimide (9FMA/BTDA) also exhibited an intrinsic negative photosensitivity, and a fine pattern could be obtained with a resolution of 5 μm after exposure at the i‐line (365‐nm) wavelength. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2665–2674, 2006  相似文献   

20.
A new kink diamine with trifluoromethyl group on either side, bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]diphenylmethane (BTFAPDM) , was reacted with various aromatic dianhydrides to prepare polyimides via poly (amic acid) precursors followed by thermal or chemical imidization. Polyimides were prepared using 3,3′, 4,4′-biphenyltetracarboxylic dianhydride(1), 4,4′-oxydiphthalic anhydride(2), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (3), 4,4′-sulfonyldiphthalic anhydride(4), and 4,4′-hexafluoroisopropylidene-diphathalic anhydride(5). The fluoro-polyimides exhibited low dielectric constants between 2.46 and 2.98, light color, and excellent high solubility. They exhibited glass transition temperatures between 227 and 253°C, and possessed a coefficient of thermal expansion (CTE) of 60-88 ppm/°C. Polymers PI-2, PI-3, PI-4, PI-5 showed excellent solubility in the organic solvents: N-methyl-2-pyrrolidinone (NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridkie and tetrahydrofuran (THF). Inherent viscosity of the polyimides were found to range between 0.58 and 0.72 dLg-1. Thermogravimetric analysis of the polyimides revealed a high thermal stability decomposition temperature in excess of 500°C in nitrogen. Temperature at 10 % weight loss was found to be in the range 506-563°C and 498-557°C in nitrogen and air, respectively. The polyimide films had a tensile strength in the range 75-87 MPa; tensile modulus, 1.5-2.2 GPa; and elongation at break, 6-7%.  相似文献   

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