载气环境对液态空心玻璃微球运动状态的影响

 研究了载气组份、温度、压力以及微球直径和壁厚对液态空心玻璃微球在炉内运动状态的影响。结果表明：在用干凝胶法制备空心玻璃微球工艺的常用载气组份、温度和压力范围内,载气的组份、温度和压力对相同直径和壁厚的液态玻璃微球在炉内运动速度的影响小于8.3%,但载气组份和压力对液态玻璃微球运动雷诺数和韦伯数的影响很显著。玻璃微球的直径和壁厚是液态玻璃微球运动速度、雷诺数和韦伯数的重要影响因素。提高载气中的氦气含量或降低载气压力可以降低载气对液态玻璃微球的非球形化作用,提高载气温度可以降低其球形化的阻力。     

相移干涉法测量ICF微球内表面粗糙度

 通过分析光线通过微球壳层后各界面的相位分布,讨论了相移干涉法测量微球内表面粗糙度的基本原理,研究了微球上部壳层对内表面粗糙度测量的影响,得到了聚苯乙烯,聚a甲基苯乙烯微球的内表面形貌特征图像,测量数据与原子力显微镜测量数据在同一量级。以微球壳层对超光滑碳化硅及单晶硅片表面形貌的调制作用为研究对象,讨论了微球的外表面粗糙度以及微球壁厚对内表面粗糙度测量结果的影响,确定了相移干涉法测量微球内表面粗糙度的不确定度,实验结果表明：对于表面粗糙度小于30 nm、厚度小于9 mm的微球,测量不确定度小于0.4 nm。     

ITER第一壁实验件的铍-铜连接界面分析

在ITER第一壁实验件的研究中,采用热等静压扩散连接技术对Be与Cu Cr Zr合金进行连接实验,对完成扩散连接的部分连接件采用退火处理。对所有连接件进行超声波无损探伤后,检测到未退火的连接件Be/Cu连接界面存在缺陷。为分析扩散界面缺陷产生原因,从连接件的无缺陷区取样并进行界面微观分析。通过观察微观形貌和分析界面扩散层合金元素的变化,发现退火处理过的Be-Cu扩散界面的Cu-Ti扩散层和未扩散的Ti层厚度增加,中间层中Be与Cu元素形成脆性相的几率降低,整个扩散层厚度变大,扩散范围加大。实验表明退火工艺能改变Be/Cu热等静压扩散层连接结构组成,扩大扩散连接范围。     

Al/Cu阻抗匹配状态方程测试靶制备工艺研究

 采用轧制技术和真空扩散连接技术,成功实现了Al/Cu阻抗匹配状态方程测试靶的制备,通过原子力显微镜（AFM）、扫描电镜（SEM）、X射线衍射（XRD）、台阶仪等测试方法,对样品结构及表面质量进行分析。结果表明：通过轧制技术制备的金属薄膜表面质量较好,表面粗糙度小于25 nm;扩散连接铝铜薄膜界面结合良好,为连续连接,扩散界面控制在150 nm以内。     

ITER第一壁实验件的铍-铜连接界面分析

在ITER第一壁实验件的研究中,采用热等静压扩散连接技术对Be与CuCrZr合金进行连接实验,对完成扩散连接的部分连接件采用退火处理。对所有连接件进行超声波无损探伤后,检测到未退火的连接件Be/Cu连接界面存在缺陷。为分析扩散界面缺陷产生原因,从连接件的无缺陷区取样并进行界面微观分析。通过观察微观形貌和分析界面扩散层合金元素的变化,发现退火处理过的Be-Cu扩散界面的Cu-Ti扩散层和未扩散的Ti层厚度增加,中间层中Be与Cu元素形成脆性相的几率降低,整个扩散层厚度变大,扩散范围加大。实验表明退火工艺能改变Be/Cu热等静压扩散层连接结构组成,扩大扩散连接范围。     

热膨胀系数异性轴夹角优化分析

高超声速飞行器需要先进的材料进行热防护,比如增强碳/碳材料.有两种将碳纤维制作成碳/碳球锥外形的工艺,研究表明在每种工艺中,碳/碳块体或碳纤维热膨胀系数异性轴角度对结构热应力影响很大,为此本文发展了一套优化设计方法,对给定的对流加热温度场可以实现球锥热应力的最小化.分析结果表明对于热膨胀系数异性轴角度,存在某些取值点,那时结构热应力分别达到最大和最小值.在异性轴模晕小于同性平面模量的条件下,对于工艺1,如果将球锥对称轴设置成垂直于碳/碳块体的同性平面,可以将热应力减至最小;对于工艺2,如果能将编制面内的碳纤维束异性轴角度取成负值(即指向来流方向),则球锥热应力也可以得到相当程度的减小.     

聚-α-甲基苯乙烯空心微球制备过程中的缺损研究

基于二次乳化技术产生W1/O/W2双重乳液,采用乳液微封装技术制备聚--甲基苯乙烯(PAMS)空心微球,研究了部分工艺参数对PAMS微球缺损形态和比例的影响。实验结果表明:薄壁微球的低强度导致了微球表面缺损。当微球壁厚一定时,有3个因素影响缺损微球比例:W2相中聚乙烯醇质量分数、CaCl2质量分数和O/W2的相比,当它们分别为1.0%,1.5%,0.01时,薄壁(2 m)微球的缺损比例低于40%,球壳内也无气泡存在。     

磁控溅射制备微球表面金属Mo涂层的研究

利用磁控溅射制备了各种工艺参数不同的微球表面金属Mo涂层样品,并通过白光干涉仪和扫描电子显微镜对样品的表面及剖面进行了系统的测试分析。分别探究了溅射工作气压和沉积制备时间对微球表面Mo涂层表面形貌以及结晶质量的影响规律。结果表明通过优化工艺参数可制备微球直径约为800μm、涂层厚度为3.5μm到14.1μm、厚度均匀性良好的微球表面Mo涂层。Mo涂层中的晶粒呈现出柱状结构致密堆积在一起,且随涂层的厚度增加晶粒间空隙增大。     

搅拌法制备聚合物微球中油水相对壁厚的影响

为了研究乳液微封装技术中油水相对微球壁厚的影响,推导了在理想状态下微球壁厚、油相质量分数和油水相比这三者之间的函数关系。结果表明:当内相水滴半径和油相质量分数为常数时,微球壁厚是油水相比的单增函数;而当内相水滴半径和油水相比为常数时,微球壁厚是油相质量分数的单增函数。即提高油相质量分数或增大油水相比对增加壁厚而言具有等效性。根据此规律,在搅拌法制备小直径聚苯乙烯微球中,通过调整油水相的各参数,确定了制备小直径厚壁聚苯乙烯微球的关键工艺参数。实验表明:采用搅拌法制备10~25 m壁厚的小直径聚苯乙烯微球时,油相质量分数宜配制为5.3%~7.0%,油水相比宜控制在1.6~2.2之间,而外水相中聚乙烯醇质量分数宜控制在1%~3%之内。     

X射线法测量ICF靶丸参数中表面轮廓法的应用

 在ICF靶参数测量中,用接触X射线显微辐射照相法记录微球X射线图像,采用精密表面轮廓仪处理微球X射线图像,直接测量了单层微球壁厚。与光干涉法比较,两种方法测量结果相差小于0.3μm。     

点火黑腔用铝铜复合芯轴的制备及性能

选取纯度较高的1100铝棒作为加工模芯的原材料,利用金刚石车床精加工出表面粗糙度均方根值小于20 nm的铝模芯,采用磁控溅射的方法在铝模芯上制备厚度大于5 m的铜防护层,得到铝铜复合芯轴。对制备的铜防护层的表面微观结构、结晶性能、厚度一致性进行了分析测试,结果表明磁控溅射法制备的铜防护层沿(111)面择优生长,表面粗糙度均方根值小于30 nm,厚度一致性优于95%,圆柱度小于1 m。镀层与基底结合力强,可满足大厚度黑腔涂层的制备需求。     

Cu/Al引线键合界面金属间化合物生长过程的原位实验研究

铜引线键合由于在价格、电导率和热导率等方面的优势有望取代传统的金引线键合, 然而Cu/Al引线键合界面的金属间化合物(intermetallic compounds, IMC)的过量生长将增大接触电阻和降低键合强度, 从而影响器件的性能和可靠性. 针对以上问题, 本文基于原位高分辨透射电子显微镜技术, 研究了在50–220 ℃退火温度下, Cu/Al引线键合界面IMC的生长问题, 实时观测到了Cu/Al IMC的动态生长及结构演变过程. 实验结果表明, 退火前颗粒状的Cu/Al IMC 分布在键合界面, 主要成分为Cu₉Al₄, 少量成分为CuAl₂. 退火后Cu/Al IMC的成分是: 靠近Cu一端为Cu₉Al₄, 远离Cu的一端为CuAl₂. 同时基于原位观测Cu/Al IMC的动态生长过程, 计算得到了Cu/Al IMC 不同温度下的反应速率和激活能, 给出了基于原位实验结果的Cu/Al IMC的生长公式, 为优化Cu/Al引线键合工艺和提高Cu/Al引线键合的可靠性提供了指导.     

HL-2M偏滤器CFC/CuCrZr靶板的非晶钎焊工艺研究

在采用商用的STEMET-1101非晶钎料、温度为710~750°C的真空钎焊下,对CFC/OFC(氯氟烃/无氧铜)复合块与CuCrZr(铬锆铜)的钎焊进行了研究。首先,通过X-射线衍射(XRD)和差式扫描量热分析对钎料的结构和熔化行为进行了表征;然后,通过光学显微镜、电子探针微分析和拉伸试验等方法对焊缝的组织形貌、元素成分分布、相结构和力学性能进行了分析;最后,通过高热负荷装置对CFC/OFC/CuCrZr钎焊模块的热疲劳性能进行测试。结果表明,在710~750°C钎焊温度内焊缝由Cu固溶体、(Cu, Ni)3P和Ni(Cu ,Cr)2P金属间化合物组成,焊缝平整无裂纹;特别是在750°C/15min情况下,抑制了焊缝金属间化合物的连续分布,OFC/CuCrZr的焊接强度大于OFC的抗拉强度,CuCrZr/CuCrZr的结合强度为210MPa,并呈现部分韧性断裂。在750°C/15min情况下制备的CFC/Cu/CuCrZr模块可以承受1000次7MW·m^-2的循环热负荷。     

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The brazing process of chlorofluorocarbon/oxygen-free-copper (CFC/OFC) composite mockup and CuCrZr at 710~750°C by vacuum brazing and with STEMET-1101 amorphous filler is studied. Firstly, the microstructure and melt behaviors of the filler are characterized by means of XRD and differential scanning calorimetry and then the organism form, elemental distributions, phase structures, and mechanical property in the bonding seams are studied by using optical microscopy, electron probe microanalysis and tensile tests. The thermal fatigue property of CFC/OFC/CuCrZr brazing mockup is measured with the high heat flux facility. The results show that the bonding seam consists of Ni(Cr, Cu)2P particles, Cu(Ni)3P phase and Cu matrix in brazing temperature of 710~750°C, which is smooth and crack-free. Especially, a continued intermetallic phase network in the bonding seam is depressed in the case of 750°C/15min treatment. The welding strength of the OFC/CuCrZr is higher than tensile strength of OFC. The bonding strength of CuCrZr/CuCrZr joint is 210MPa and fracture is partly ductile. The CFC/Cu/CuCrZr mockup prepared in the case of 750°C/15min treatment can tolerate 7MW·m^-2 high heat flux under 1000 cycles.     

Diffusion and precipitation phenomena across layer interfaces in a roll bonding composite of Al(Si) and Al(Cu)

Layered composite structures can be generated in metallic sheets by roll bonding of dissimilar metals/alloys. In this investigation, heat treatable (Al(Cu)) and non-heat treatable (Al(Si)) aluminium alloys are roll bonded in sheet form. Large hardness differences between layers poses significant bonding challenges in the form of multiple necking within the hard Al(Cu) layers. For successful processing, it is vital to choose the candidate materials in a state of marginal hardness differences during rolling, but being capable of altering properties through subsequent heat treatments. Atomic diffusion takes place during heat treatment of the composite sheet and results in gradual hardness variation across sheet thickness. The Al(Cu) layers contribute to strength, whereas the Al(Si) layers provide protection from corrosion/wear-related degradation in the newly developed hybrid sheet. The overall mechanical properties of the heat-treated composite fall between the base alloys. The bonding interfaces are noted as the potential spots for initiating failure.     

Nanoporous Al sandwich foils using size effect of Al layer thickness during Cu/Al/Cu laminate rolling

The roll bonding technique is one of the most widely used methods to produce metal laminate sheets. Such sheets offer interesting research opportunities for both scientists and engineers. In this paper, we report on an experimental investigation of the ‘thickness effect’ during laminate rolling for the first time. Using a four-high multifunction rolling mill, Cu/Al/Cu laminate sheets were fabricated with a range of thicknesses (16, 40, 70 and 130 μm) of the Al layer. The thickness of the Cu sheets was a constant 300 μm. After rolling, TEM images show good bonding quality between the Cu and Al layers. However, there are many nanoscale pores in the Al layer. The fraction of nanoscale pores in the Al layer increases with a reduction in the Al layer thickness. The finite element method was used to simulate the Cu/Al/Cu rolling process. The simulation results reveal the effect of the Al layer thickness on the deformation characteristics of the Cu/Al/Cu laminate. Finally, we propose that the size effect of the Al layer thickness during Cu/Al/Cu laminate rolling may offer a method to fabricate ‘nanoporous’ Al sandwich laminate foils. Such foils can be used in electromagnetic shielding of electrical devices and noisy shielding of building.     

Update on design simulations for NIF ignition targets, and the rollup of all specifications into an error budget

Targets intended to produce ignition on NIF are being simulated and the simulations are used to set specifications for target fabrication and other program elements. Recent design work has focused on designs that assume only 1.0 MJ of laser energy instead of the previous 1.6 MJ. To perform with less laser energy, the hohlraum has been redesigned to be more efficient than previously, and the capsules are slightly smaller. Three hohlraum designs are being examined: gas fill, SiO₂ foam fill, and SiO₂ lined. All have a cocktail wall, and shields mounted between the capsule and the laser entrance holes. Two capsule designs are being considered. One has a graded doped Be(Cu) ablator, and the other graded doped CH(Ge). Both can perform acceptably with recently demonstrated ice layer quality, and with recently demonstrated outer surface roughness. Complete tables of specifications are being prepared for both targets, to be completed this fiscal year. All the specifications are being rolled together into an error budget indicating adequate margin for ignition with the new designs. The dominant source of error is hohlraum asymmetry at intermediate modes 4–8, indicating the importance of experimental techniques to measure and control this asymmetry.     

Is the (hfac)Cu(I)–(tmvs) bond intrinsically weak?

Density functional theory studies were performed to study the structure and bonding of (hexafluoroacetylacetonate)-copper(I)-(trimethylvinylsilane) [Cu(hfac)(tmvs)], an ideal and important Cu(I)-CVD compound. A popular three-parameter hybrid density functional (B3LYP) with 6-311+G(d,p) and an effective core potential included LanL2DZ basis set was utilized for this purpose. The (hfac)Cu–(tmvs) bond energy of approximately 30?kcal?mol^?1 obtained at the B3LYP/6-311+G(d,p) level of theory reveals that the Cu–olefin bond in Cu(hfac)(tmvs) is not as weak as previously estimated/assumed and, hence, that the substrate plays a vital role in copper film formation from Cu(hfac)(tmvs). Bonding analysis reveals that fairly strong (hfac)Cu–(tmvs) bonding is the result of DCD-model σ-donation and π-back-bonding between the copper and tmvs in Cu(hfac)(tmvs).     

The chemisorption of CO on Cu(100) studied with angle resolved photoelectron spectroscopy

Using angle resolved UV photoelectron spectroscopy, coupled with the continuum of polarized light available with synchrotron radiation, we make an interpretation of the photoelectron spectrum of CO adsorbed on Cu(100). We point out that the bonding of CO on Cu as observed by photoemission is considerably different from the bonding of CO on Ni. These differences do not seem to be caused by bonding orientation differences, however, as the CO molecular axis is found to be very close to the surface normal, as was the case for CO on Ni(100). No evidence is found for a second phase of CO on Cu(100).     

Numerical simulation of deformation behavior of Al particles impacting on Al substrate and effect of surface oxide films on interfacial bonding in cold spraying

In this study, a comprehensive examination of the deformation behavior of Al particles impacting on Al substrate was conducted by using the Arbitrary Lagrangian Eulerian (ALE) method to clarify the deposition characteristics of Al powder and the effect of surface oxide films in cold spraying. It was found that the deformation behavior of Al particles is different from that of Cu particles under the same impact conditions owing to its lower density and thus less kinetic energy upon impact. The results indicated that a higher velocity was required for Al particles to reach the same compression ratio as that of Cu particles. On the other hand, the numerical results showed that the oxide films at particle surfaces influenced the deformation and bonding condition between the particle and substrate. The inclusions of the crushed oxide films at the interfaces between the depostied particles inhibit the deformation.