Low‐thermal budget flash light annealing for Al2O3 surface passivation

This value is achieved due to a very low interface trap density of below 10¹⁰ eV^–1 cm^–2 and a fixed charge density of (2–3) × 10¹² cm^–2. In contrast, plasma ALD‐grown Al₂O₃ layers only reach carrier lifetimes of about 1 ms. This is mainly caused by a more than 10 times higher density of interface traps, and thus, inferior chemical passivation. The strong influence of the deposition parameters is explained by the limitation of hydrogen transport in Al₂O₃ during low‐thermal budget annealing. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Effective silicon surface passivation by atomic layer deposited Al2O3/TiO2 stacks

In this work atomic layer deposition of Al₂O₃ and TiO₂ has been used to obtain dielectric stacks for passivation of silicon surfaces. Our experiments on n‐ and p‐type silicon wafers deposited by thin Al₂O₃/TiO₂ stacks show that a considerably improved passivation is obtained compared to the Al₂O₃ single layer. For Al₂O₃ films thinner than 20 nm the emitter saturation current density decreases with increasing TiO₂ thickness. Especially the passivation of ultrathin (～5 nm) Al₂O₃ is very effectively enhanced by TiO₂ due to a decreased interface defect density as well as an increased fixed negative charge in the stacks. Hence, the thin Al₂O₃/TiO₂ stacks developed in this work can be used as a passivation coating for Si‐based solar cells. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Al2O3介质层厚度对AlGaN/GaN金属氧化物半导体-高电子迁移率晶体管性能的影响

在蓝宝石衬底上采用原子层淀积法制作了三种不同Al₂O₃介质层厚度的绝缘栅高电子迁移率晶体管.通过对三种器件的栅电容、栅泄漏电流、输出和转移特性的测试表明：随着Al₂O₃介质层厚度的增加,器件的栅控能力逐渐减弱,但是其栅泄漏电流明显降低,击穿电压相应提高.通过分析认为薄的绝缘层能够提供大的栅电容,因此其阈值电压较小,但是绝缘性能较差,并不能很好地抑制栅电流的泄漏;其次随着介质厚度的增加,可以对栅极施加更高的正偏压,因此获 关键词： 2O₃')" href="#">Al₂O₃ 金属氧化物半导体-高电子迁移率晶体管 介质层厚度 钝化     

Silicon surface passivation by atomic‐layer‐deposited Al2O3 facilitated in situ by the combination of H2O and O3 as reactants

We investigate the effect of O₃ and H₂O oxidant pre‐pulse prior to Al₂O₃ atomic layer deposition for Si surface passivation. Interfacial oxide SiO_x formed by the O₃ pre‐pulse is more beneficial than that by H₂O to a high level of surface passivation. The passivation of thinner H₂O–Al₂O₃ films is more improved by this O₃ pre‐pulse. O₃ pre‐pulse for 10 nm H₂O–Al₂O₃ reduces saturation current density in boron emitter to 18 fA cm^–2 by a factor of 1.7. Capacitance–voltage measurements reveal this interfacial oxide plays a role of decreasing interface trap density without detrimental effect to negative charge density of Al₂O₃. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Influences of high-temperature annealing on atomic layer deposited Al2 O3/4H-SiC

High-temperature annealing of the atomic layer deposition (ALD) of Al2O3 films on 4H-SiC in O 2 atmosphere is studied with temperature ranging from 800℃ to 1000℃. It is observed that the surface morphology of Al2O3 films annealed at 800℃ and 900℃ is pretty good, while the surface of the sample annealed at 1000℃ becomes bumpy. Grazing incidence X-ray diffraction (GIXRD) measurements demonstrate that the as-grown films are amorphous and begin to crystallize at 900℃. Furthermore, C-V measurements exhibit improved interface characterization after annealing, especially for samples annealed at 900℃ and 1000℃. It is indicated that high-temperature annealing in O2 atmosphere can improve the interface of Al2O3 /SiC and annealing at 900℃ would be an optimum condition for surface morphology, dielectric quality, and interface states.     

Stacked and nanolaminated Al2O3/TiO2 for surface passivation and encapsulation of silicon

Silicon solar cells passivated with Al₂O₃ require a capping layer that protects the passivation layer from humidity because of sensitivity of Al₂O₃ to moisture. Al₂O₃/TiO₂ stacks obtained by atomic layer deposition have been known to provide a high level of passivation layers because of their excellent field‐effect passivation. In this work, degradation of this Al₂O₃/TiO₂ stack, when exposed to humidity, is examined, and an attempt is made for a humidity‐resistant encapsulation layer by adding Al₂O₃/TiO₂ nanolaminates that can be deposited in‐situ without breaking vacuum. Placing the nanolaminate on top of the TiO₂ and Al₂O₃ stack is found to lead to almost no degradation even after 10 days of humidity exposure. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Thermal instability of HfO2 on InP structure with ultrathin Al2O3 interface passivation layer

We studied the thermal stability of HfO₂ on an InP structure when an Al₂O₃ interface passivation layer (PL) was introduced. In contrast to the thick (～4 nm) Al₂O₃‐PL, an almost complete disappearance of the thin (～1 nm) Al₂O₃‐PL was observed after a post‐deposition anneal at 600 °C. Based on various chemical and electrical analyses, this was attributed to the intermixing of the thin Al₂O₃‐PL with HfO₂, which might have been accompanied by the out‐diffusion of a substantial amount of substrate elements. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

甲烷部分氧化制合成气Pt/Al_2O_3催化剂的表征及其反应性能评价

采用浸渍法制备了3种不同负载量的Pt/Al2O3催化剂,考察了催化剂的甲烷选择氧化性能,并用程序升温还原技术,程序升温脱附技术以及微型脉冲催化色谱技术对催化剂进行表征。结果表明,随着Pt的负载量升高,甲烷催化氧化的性能也越好,对CO与H2的选择性也越高。其中,在750℃原料气组成CH4/O2为2∶1,4%Pt负载量的催化剂,甲烷转化率达到98%以上。     

Improved performance of MoS2 FET by in situ NH3 doping in ALD Al2O3 dielectric

Since defects such as traps and oxygen vacancies exist in dielectrics, it is difficult to fabricate a high-performance MoS$_{2}$ field-effect transistor (FET) using atomic layer deposition (ALD) Al$_{2}$O$_{3}$ as the gate dielectric layer. In this paper, NH$_{3}$ in situ doping, a process treatment approach during ALD growth of Al$_{2}$O$_{3}$, is used to decrease these defects for better device characteristics. MoS$_{2}$ FET has been well fabricated with this technique and the effect of different NH$_{3}$ in situ doping sequences in the growth cycle has been investigated in detail. Compared with counterparts, those devices with NH$_{3}$ in situ doping demonstrate obvious performance enhancements: $I_{\rm on}/I_{\rm off}$ is improved by one order of magnitude, from $1.33\times 10^{5}$ to $3.56\times 10^{6}$, the threshold voltage shifts from $-0.74 $ V to $-0.12$ V and a small subthreshold swing of 105 mV/dec is achieved. The improved MoS$_{2}$ FET performance is attributed to nitrogen doping by the introduction of NH$_{3}$ during the Al$_{2}$O$_{3}$ ALD growth process, which leads to a reduction in the surface roughness of the dielectric layer and the repair of oxygen vacancies in the Al$_{2}$O$_{3}$ layer. Furthermore, the MoS$_{2}$ FET processed by in situ NH$_{3}$ doping after the Al and O precursor filling cycles demonstrates the best performance; this may be because the final NH$_{3}$ doping after film growth restores more oxygen vacancies to screen more charge scattering in the MoS$_{2}$ channel. The reported method provides a promising way to reduce charge scattering in carrier transport for high-performance MoS$_{2 }$ devices.     

关于MgB2/Al2O3超导薄膜电阻转变和各向异性的研究

利用电子束蒸发方法将MgB2超导薄膜沉积到Al2O3(001)衬底上.采用标准的四引线法研究了磁场平行和垂直超导薄膜ab平面下的电阻转变.一个激活能模型 U(T,H)= U0(1-T/(Tc+δ))n (1-H/Hc2(0))m被建立用来分析超导薄膜磁通线的激活能和电阻转变,结果表明该模型能够在整个转变温度范围描述超导体磁通线的激活能和电阻转变.另外,利用多项式Hc2(t)=Hc2(0)+At+Bt2分析了MgB2/Al2O3超导薄膜的上临界磁场,获得了该超导薄膜的各向异性参数γ=Hc2ab(0)/Hc2c(0)= 2.26.     

原子层沉积Al2O3/n-GaN MOS结构的电容特性

利用原子层沉积技术制备了具有圆形透明电 极的Ni/Au/Al₂O₃/n-GaN金属-氧化物-半导体结构, 研究了紫外光照对样品电容特性及深能级界面态的影响, 分析了非理想样品积累区电容随偏压增加而下降的物理起源. 在无光照情形下, 由于极长的电子发射时间与极慢的少数载流子热产生速率, 样品的室温电容-电压扫描曲线表现出典型的深耗尽行为, 且准费米能级之上占据深能级界面态的电子状态保持不变. 当器件受紫外光照射时, 半导体耗尽层内的光生空穴将复合准费米能级之上的深能级界面态电子, 同时还将与氧化层内部的深能级施主态反应. 非理想样品积累区电容的下降可归因于绝缘层漏电导的急剧增大, 其诱发机理可能是与氧化层内的缺陷态及界面质量有关的“charge-to-breakdown”过程. 关键词： 原子层沉积 2O₃/n-GaN')" href="#">Al₂O₃/n-GaN 金属-氧化物-半导体结构 电容特性     

热原子层沉积氧化铝对硅的钝化性能及热稳定性

原子层沉积氧化铝已经成为应用于钝化发射极和背面点接触（PERC）型晶硅太阳能电池优异的钝化材料．对于基于丝网印刷技术的太阳能电池,钝化材料的钝化效果及其热稳定性是非常重要的．本文在太阳能级硅片上用热原子层沉积设备制备了20nm和30nm的氧化铝,少子寿命测试结果显示初始沉积的氧化铝薄膜具有一定的钝化效果,在退火后可达到100μs以上,相当于硅表面复合速度小于100cm／s．经过制备传统晶硅太阳能电池的烧结炉后,少子寿命能够保持在烧结前的一半以上,可应用于工业PERC型电池的制备．通过电子显微镜观察到了较厚的氧化铝薄膜有气泡,解释了30nm氧化铝比20nm氧化铝钝化性能和稳定性更差的异常表现．     

Dy含量对红色长余辉发光材料Sr3Al2O6:Eu2+,Dy3+性能的影响

采用溶胶凝胶法制备了Sr3Al2O6:Eu2+,Dy3+红色长余辉发光材料,利用X射线衍射仪对材料的物相进行了分析,结果表明,1200℃下制备的样品的物相为Sr3Al2O6,少量的Eu和Dy掺杂没有影响样品的相组成.采用荧光分光光度计、照度计测定了样品的发光特性.结果表明Sr3Al2O6:Eu2+和Sr3Al2O6:Eu2+,Dy3+的激发光谱均为激发峰位于473 nm的宽带谱.Sr3Al2O6:Dy3+的发射峰位于530.1 nm,对应于Dy3+代替Sr2+位置后基质中形成的施主-受主对Dy·Sr-V″Sr的重新组合.Sr3-0.02-yAl2O6:0.02Eu2+,yDy3+(0相似文献   

CuO/Al2O3、CuO/CeO2-Al2O3和CuO/La2O3-Al2O3催化剂中CuO物种被CO氧化的比较

用浸渍法制备了CuO/Al2O3 (Cu/Al)、CuO/CeO2- Al2O3 (Cu/CeAl)和CuO/La2O3-Al2O3(Cu/LaAl)催化剂. 通过原位XRD、Raman和H2-TPR方法， 对催化剂中的CuO物种以及CuO-Al2O3的固-固相反应进行了表征. 结果表明，对于Cu/Al催化剂，CuAl2O4存在于CuO与Al2O3层之间，CuO以高分散和晶相两种相态存在于催化剂的表层；对于Cu/CeAl催化剂，除了少量高分散和晶相的CuO存在于表层外，大部分CuO迁移到了CeO2的内层，     

常压MOCVD生长ZnO/GaN/Al2O3薄膜及其性能

以去离子水（H2O）和二乙基锌（DEZn）为源材料,生长温度是680℃时,利用常压MOCVD在GaN／Al2O3模板上成功生长了ZnO单晶薄膜,用原子力显微镜（AFM）、X射线双晶衍射（DCXRD）、光致发光谱（PL）对ZnO薄膜的表面形貌、结晶学性质、光学性质作了综合研究。双晶衍射表明,ZnO非对称（1012）面ω扫描的半峰全宽（FWHM）仅为420arcsec,估算所生长ZnO膜的位错密度大约为10^3／cm^2量级,这与具有器件质量的GaN材料的位错密度相当。在ZnO薄膜的低温15K光荧光谱中,观察到很强的自由激子和束缚激子发射以及自由激子与束缚激子的多级声子伴线。     

强冲击压缩下LiF,Al2O3和LiTaO3 单晶的透光性

在二级轻气炮上,用高速电子相机扫描照相技术和改进的Mallory实验装置,对z切LiF,Al2O3(蓝宝石)和LiTaO3单晶材料的冲击透光性进行了对比测量,并用黑密度计提取出动态图像定量化的光强对比度变化曲线.结果表明,LiF单晶在102GPa压强下能够保持长时间的初始透光性不变,与公认的LiF具有优良的高压下透明性的认识一致.LiTaO3单晶在实验压力(139GPa)下变成基本不透明.而Al2O3单晶在131GPa冲击压力下则表现为透明性逐渐下降直至完全不透明.     

三价镧系离子掺杂的Cd3Al2 Ge3O12的长余辉发光

系统地研究了三价镧系离子在Cd3Al2Ge3O12基质中的长余辉发光。总结了余辉性能与激活离子电负性的关系。研究发现该体系中易失电子的激活离子产生的余辉效果较好。在254nm紫外光激发下,基质和所有镧系离子(Pm除外)掺杂的样品都有发光和余辉。按照发光和余辉性质的不同可以将激活离子分为三类：Pr^3 、Tb^3 和Dy^3 等是有特征余辉发光的离子;Eu^3 和Sm^3 等是有特征发射,但没有特征余辉发光的离子;Ce^4 、La^3 、Nd^3 以及其他是没有特征发光的镧系离子。长余辉的产生是由缺陷引起的。由于Cd^2 离子在高温下容易挥发,基质中存在大量的Cd^2 离子空位,这种空位可以作为俘获电子的陷阱。同时为了补偿Cd^2 所产生的正电荷,在Cd^2 离子空位周围会有相应的负离子空位产生,比如氧离子空位。这种补偿作用的存在使得基质本身的缺陷种类和数量十分丰富,使得该体系的余辉性能比较优越。     

Si掺杂Al_2O_3电子结构的第一性原理计算

本文采用第一性原理对纯Al2O3和Si掺杂的Si0.167Al0.833O1.5,Si0.25Al0.75O1.5晶体体系的能带结构、态密度进行了计算分析.结果发现:随着Si在Al2O3晶体中所占比例的增加,体系能隙变小,在Si0.25Al0.75O1.5晶体体系中能隙已降到2.5 e V,表明该体系为半导体材料;而在掺杂的体系中有数条分散的能带穿过了费米能级,即可以预测该掺杂体系有特别的光电性质;同时对比纯Al2O3和Si掺杂的Si0.167Al0.833O1.5,Si0.25Al0.75O1.5晶体体系的总态密度,发现掺杂体系的价带和导带向低能区域移动.     

Si掺杂Al2O3电子结构的第一性原理计算

本文采用第一性原理对纯Al2O3和Si掺杂的Si 0.167Al0.833O1.5, Si 0.25Al0.75O1.5晶体体系的能带结构、态密度进行了计算分析. 结果发现：随着Si在Al2O3晶体中所占比例的增加,体系能隙变小,在Si 0.25Al0.75O1.5晶体体系中能隙已降到2.5eV,表明该体系为半导体材料;而在掺杂的体系中有数条分散的能带穿过了费米能级,即可以预测该掺杂体系有特别的光电性质;同时对比纯Al2O3和Si掺杂的Si 0.167Al0.833O1.5, Si 0.25Al0.75O1.5晶体体系的总态密度,发现掺杂体系的价带和导带向低能区域移动.